MC34702EKR2 - 3A Switch-Mode PMIC with LDO | NXP
Référence : MC34702EKR2 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.9 | $8,90 |
| 10 | $8.05 | $80,50 |
| 100 | $7.2 | $720,00 |
| 500 | $6.45 | $3 225,00 |
| 1 000 | $5.75 | $5 750,00 |
MC34702EKR2 Présentation
A switch-mode power supply (SMPS) with integrated linear regulator is a hybrid power management IC that combines a high-efficiency step-down switching converter for bulk current delivery with a low-noise linear regulator for noise-sensitive downstream rails. In the system hierarchy it sits within power management ICs (PMICs) -> DC-DC converters -> synchronous buck regulators -> microcontroller companion supplies, providing both the high-current core rail and a clean auxiliary rail from a single IC.
Key features include a wide 2.8 V to 6 V supply input range, 60 mA typical quiescent current, 3.0 A peak switch current capability, and built-in power sequencing that follows the supply rail during power-up and power-down in line with microcontroller requirements. The linear regulator channel provides a low-noise post-regulated output, while the switching channel handles bulk load transients efficiently.
The device uses a peak current-mode control architecture with internal compensation, eliminating most external compensation components and simplifying the LC filter design. During power-up and power-down, both the switcher and linear regulator outputs follow the supply rail within the microcontroller power-sequencing specification shown in figures 17 through 19 of the manufacturer datasheet.
Typical applications include Power QUICC I and II microprocessor supplies, networking and telecom cards, DSP core and I/O rails, single-board computer point-of-load stages, and embedded computing platforms that need both a high-current switching rail and a quiet linear rail.
When designing with this part, place the input bulk capacitors close to the PVCC pin and keep the bootstrap capacitor (BST to SW) trace short to minimize switching-node ringing. The exposed pad must be soldered to a sufficiently large copper pour to keep junction temperature within the SOIC-32 thermal limits at 3 A peak switch current.
This page synthesizes distributor stock, parametric equivalents, and design notes not aggregated in any single manufacturer datasheet, helping procurement and design engineers evaluate MC34702EKR2 in context.
Alternatives de remplacement direct pour MC34702EKR2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC34702EKR2G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC34702EK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC34702EFR2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC34703EK
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC34702EKR2 Valeurs maximales et caractéristiques électriques
| Fonction | Switch-mode power supply with integrated linear regulator |
| Topologie | Buck (step-down) switcher + LDO post-regulator |
| Supply Voltage Range | 2.8 V to 6 V |
| Supply Current (Quiescent) | 60 mA (typical) |
| Peak Switch Current | 3.0 A |
| Output Voltage Channels | Switcher output + Linear regulator output |
| Control Architecture | Peak current-mode with external compensation |
| Power Sequencing | Outputs track supply rail during power-up/power-down |
| Boîtier / Format | 32-SOIC (0.295 inch / 7.50 mm width) |
| Type de montage | Surface Mount |
| Packaging | Cut Tape (CT) / Tape & Reel |
| Statut RoHS | Compliant (per distributor listing) |
| Target Processors | Freescale Power QUICC I, II and related families |
Configuration des broches de MC34702EKR2
| Broche 1 | PVCC1 — Power input to internal switcher 1 |
| Broche 2 | SW1 — Switch node 1 to external LC filter |
| Broche 3 | BST1 — Bootstrap capacitor for high-side gate drive 1 |
| Broche 4 | VCC — Internal analog supply decoupling |
| Broche 5 | DRVCC — Gate drive supply decoupling |
| Broche 6 | PWRGD — Power-good output flag |
| Broche 7 | SS — Soft-start programming input |
| Broche 8 | RT — Timing resistor / oscillator frequency set |
| Broche 9 | FB — Feedback input from switcher output |
| Broche 10 | COMP — Compensation network node |
| Broche 11 | LDOIN — Linear regulator input |
| Broche 12 | LDOOUT — Linear regulator output |
| Broche 13 | LDOSNS — Linear regulator sense / feedback |
| Broche 14 | EN — Enable input |
| Broche 15 | SYNC — Synchronization input (per datasheet) |
| Broche 16 | NC — Not connected (per datasheet) |
| Broche 17 | PGND — Power ground |
| Broche 18 | PGND — Power ground |
| Broche 19 | SW2 — Switch node 2 / additional switcher |
| Broche 20 | BST2 — Bootstrap capacitor 2 |
| Broche 21 | NC — Not connected (per datasheet) |
| Broche 22 | NC — Not connected (per datasheet) |
| Broche 23 | AGND — Analog ground |
| Broche 24 | AGND — Analog ground |
| Broche 25 | NC — Not connected (per datasheet) |
| Broche 26 | NC — Not connected (per datasheet) |
| Broche 27 | NC — Not connected (per datasheet) |
| Broche 28 | NC — Not connected (per datasheet) |
| Broche 29 | NC — Not connected (per datasheet) |
| Broche 30 | NC — Not connected (per datasheet) |
| Broche 31 | PGND — Power ground |
| Broche 32 | PVCC2 — Power input to internal switcher 2 |
Applications typiques
MC34702EKR2 convient pour 6 applications: Freescale Power QUICC I / II Processor Supply, Telecom and Networking Line Cards, DSP Core and I/O Voltage Rails, Single-Board Computer Point-of-Load, Industrial Embedded Control Platforms, Automotive and Transportation Embedded Modules.
Freescale Power QUICC I / II Processor Supply
The MC34702EKR2 was designed specifically as the power management companion for Freescale Power QUICC I, II, and adjacent microprocessor and DSP families per the NXP datasheet. Its integrated 3 A peak switch current handles the high transient core current demanded by these processors while the integrated LDO supplies a low-noise auxiliary rail from the same 32-SOIC device, eliminating two separate regulators and reducing PCB area. The 2.8 V to 6 V input range covers single-cell Li-ion, 3.3 V, and 5 V rails typical of communications-processor cards. Power-up and power-down sequencing tracks the input rail within the Power QUICC specification shown in figures 17 through 19 of the manufacturer datasheet, which is critical for non-deterministic processor boot behaviour if the rails sequence incorrectly.
Recommandé
Telecom and Networking Line Cards
Single-board computers and line cards in telecom and networking equipment historically used Power QUICC processors and needed both a high-current switching rail and a quiet linear rail on the same board. The MC34702EKR2's hybrid switcher-plus-LDO topology delivers both from a single 32-SOIC footprint, simplifying the BOM and the layout. According to the NXP datasheet, the device is rated for the 2.8 V to 6 V rails common in 3.3 V and 5 V backplane point-of-load designs, and its 3.0 A peak switch current supports the core inrush of communication processors during packet-processing bursts.
Recommandé
DSP Core and I/O Voltage Rails
DSPs such as the Freescale DSP563xx and DSP566xx families require a high-current core rail and a separate low-noise I/O or PLL rail, often at different voltages. The MC34702EKR2 supplies the high-current rail from its 3 A switcher and the noise-sensitive rail from its integrated LDO post-regulator, both from the same 2.8 V to 6 V input per the NXP datasheet. The integrated architecture removes the need for a separate LDO controller, reducing cost and board area in DSP-based embedded platforms. Designers should follow the datasheet sequencing figures so the LDO rail tracks the input during power-up and power-down within the DSP specification.
Recommandé
Single-Board Computer Point-of-Load
Single-board computers built around Power QUICC processors need compact multi-rail point-of-load conversion. The MC34702EKR2's hybrid switcher + LDO architecture supplies both core and auxiliary rails from a single 32-SOIC IC, ideal for densely populated VME, cPCI, or ATCA cards where PCB area is constrained. According to the NXP datasheet, the device handles 3.0 A peak switch current and the 2.8 V to 6 V input range covers common 3.3 V and 5 V backplane rails. The exposed copper pour under the 32-SOIC must be sized for continuous 2 A loads without exceeding the junction temperature rating.
Recommandé
Industrial Embedded Control Platforms
Long-lifecycle industrial embedded designs based on Power QUICC II processors benefit from the MC34702EKR2's hybrid switcher + linear regulator combination, delivering both high-current and low-noise rails from one IC. According to the NXP datasheet, the 2.8 V to 6 V input range accommodates 3.3 V and 5 V industrial backplanes, and the integrated LDO channel can power ADCs or sensors that demand a low-ripple rail. The 32-SOIC 7.5 mm package has a long track record in industrial designs and is straightforward to assemble on standard reflow profiles.
Recommandé
Automotive and Transportation Embedded Modules
Although not automotive-qualified in the standard grade, the MC34702EKR2 has been used in non-safety transportation embedded modules that leverage Power QUICC processors for network and control functions. According to the NXP datasheet, the integrated switcher + LDO supplies both core and auxiliary rails from a single 32-SOIC IC, reducing component count in space-constrained automotive-grade assemblies. Designers must validate that the operating temperature envelope matches the target module's thermal profile before deployment in any safety-relevant system.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC34702EKR2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC34702EKR2G | MC34702EK | MC34702EFR2 | MC34703EK |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SOIC (7.50 mm) | 32-SOIC (7.50 mm) | 32-SOIC (7.50 mm) | 32-SOIC (7.50 mm) | 32-SOIC (7.50 mm) |
| Supply Voltage Range | 2.8 V to 6 V | 2.8 V to 6 V | 2.8 V to 6 V | 2.8 V to 6 V | 2.8 V to 6 V |
| Peak Switch Current | 3.0 A | 3.0 A | 3.0 A | 3.0 A | 3.0 A |
| Topology | Buck switcher + integrated LDO | Buck switcher + integrated LDO | Buck switcher + integrated LDO | Buck switcher + integrated LDO | Buck switcher + integrated LDO (Power QUICC III targeted) |
| Target Processor Family | Power QUICC I / II / DSP | Power QUICC I / II / DSP | Power QUICC I / II / DSP | Power QUICC I / II / DSP | Power QUICC III |
| Packaging Format | Tape & Reel (EKR2) | Tape & Reel RoHS (EKR2G) | Tube (EK) | Tape & Reel (EFR2) | Tube (EK) |
Principaux différenciateurs
- Hybrid switcher + LDO in a single 32-SOIC IC for Power QUICC I/II (vs Discrete buck + separate LDO regulator)
- 3.0 A peak switch current for Power QUICC core rails (vs MC34703EK)
- Drop-in 32-SOIC footprint across packaging suffixes (vs Tube (EK) vs Tape & Reel (EKR2/EKR2G) variants)
Notes de conception
The MC34702EKR2's 60 mA quiescent current from a 2.8 V to 6 V supply is consumed even when the host processor is idle; for battery-backed applications add an upstream load switch to fully cut input power during deep sleep. The buck channel's input bulk capacitance must be sized to handle the 3.0 A peak switch current pulses without violating input ripple spec; per the NXP datasheet, low-ESR ceramic input capacitors are recommended close to the PVCC pins.
Estimated: at VIN = 5 V, VOUT_CORE = 1.5 V and 3.0 A peak switch current, the buck channel dissipates approximately 10.5 W into the 32-SOIC package. With typical SOIC-32 theta_JA around 60 C/W on a 1 oz 4-layer board, the junction would rise ~630 C above ambient - well above the silicon limit. Continuous output must be limited to roughly 0.5 A to 1 A under natural convection, or a substantial copper heatsink / forced airflow is required at higher currents.
Keep the bootstrap capacitor (BST to SW) loop as short as possible, ideally within 5 mm of the IC, to minimize switching-node ringing and gate-drive noise. Place input bulk capacitors directly at the PVCC pins, route SW traces on an inner layer if possible, and use a continuous analog ground (AGND) island referenced to a single point on the power ground (PGND) plane to avoid ground bounce coupling into the LDO feedback.
Do not assume the MC34702EKR2's LDO channel can supply high current - it is intended for low-noise auxiliary rails only (PLL, ADC references). The high-current core must come from the switcher channel. Also verify that the host processor's sequencing specification is within the envelope shown in figures 17 through 19 of the manufacturer datasheet; out-of-spec sequencing can latch the processor or cause non-deterministic boot behaviour.
Informations de conformité
RoHS and lead-free per distributor listings and NXP datasheet ordering table. REACH, halogen-free, and conflict-mineral compliance not explicitly listed in the verified web data and set to 'unknown'. Not AEC-Q100 qualified; do not use the standard grade for automotive safety-relevant systems without further qualification.
