MC34PF4210A1ES - 14-Ch PMIC for i.MX 8M | NXP QFN-56
Référence : MC34PF4210A1ES ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.533 | $7,53 |
| 10 | $6.78 | $67,80 |
| 100 | $6.12 | $612,00 |
| 500 | $5.65 | $2 825,00 |
| 1 000 | $5.2 | $5 200,00 |
MC34PF4210A1ES Présentation
A PMIC (Power Management Integrated Circuit) is a single silicon device that consolidates multiple voltage regulators and power sequencing functions previously implemented as discrete DC-DC converters and LDOs. PMICs sit at the top of the power-management hierarchy, sitting above buck converters, LDOs, and battery chargers in the typical SoC power tree. The PF4210 specifically targets multimedia SoCs that require audio subsystem rails, SoC core/memory rails, and I/O rails generated from a single Li-ion cell or 5V system supply.
Key features of the PF4210 include a 10-bit ADC for system monitoring, programmable output voltages, hardware reset and power-good signals, integrated power sequencing for the i.MX 8M boot order, and thermal shutdown protection. The pre-programmed OTP variant eliminates the need for external configuration components and reduces time-to-market for consumer audio/video applications. The device supports dynamic voltage scaling (DVS) on selected buck outputs for energy-efficient SoC operation.
Architecturally, the PF4210 uses buck converters with internal MOSFETs for the high-current rails (core, memory, GPU) and low-noise LDOs for noise-sensitive analog and audio subsystems. The boost converters support displays and USB OTG. The on-chip OTP stores the default voltage setpoints and the i.MX 8M power-up sequence, allowing the PMIC to bring the entire SoC up from a single button press.
Typical applications include smart speakers with voice UI, streaming set-top boxes, infotainment head units, single-board computers (SBC) with the i.MX 8M, and any consumer audio/video device requiring a pre-validated multi-rail power tree. Designers can leverage the included reference design and Board Support Package (BSP) to accelerate hardware bring-up.
When designing with this PMIC, follow the NXP reference design layout for the 56-QFN-EP package - thermal performance depends heavily on the exposed pad soldering to a sufficient copper area. The OTP variant must be ordered as the specific pre-programmed version (A1ES) matching your i.MX 8M variant, since the OTP configuration cannot be changed in the field.
This page synthesizes distributor pricing, drop-in alternatives from the NXP PF family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC34PF4210A1ES — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC34PF4210A1ES (même facteur de forme et même empreinte) — différant par ADC, Boost Converters, Buck Converters, Package, Target Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MMPF0100NPAES
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MMPF0100F0AEP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MMPF0100F1AEP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MMPF0100F2AEP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MMPF0100F3EP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC34PF4210A1ES Valeurs maximales et caractéristiques électriques
| Fonction | 14-channel PMIC for i.MX 8M |
| Topologie | 4/6 Buck + 7 LDO + 5 Boost |
| Buck Converters | 4 (configurable to 6) |
| LDOs | 7 |
| Boost Converters | 5 |
| ADC | 10-bit on-chip monitoring ADC |
| On-Chip Memory | One-Time Programmable (OTP), pre-programmed |
| Target Processor | NXP i.MX 8M family application processors |
| Boîtier | 56-QFN-EP (8x8 mm) with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (per distributor listings) |
| Catégorie | Power Management - Specialized (PMIC) |
| Manufacturer | NXP USA Inc. |
Configuration des broches de MC34PF4210A1ES
| Broche 1 | PVIN1 — Power input for buck converter 1 |
| Broche 2 | SW1 — Switch node for buck converter 1 |
| Broche 3 | PGND1 — Power ground for buck converter 1 |
| Broche 4 | LX2 — Switch node for buck converter 2 |
| Broche 5 | PVIN2 — Power input for buck converter 2 |
| Broche 6 | BST2 — Bootstrap for buck converter 2 high-side driver |
| Broche 7 | VLDO1 — LDO 1 output voltage |
| Broche 8 | VLDO2 — LDO 2 output voltage |
| Broche 9 | VLDO3 — LDO 3 output voltage |
| Broche 10 | VLDO4 — LDO 4 output voltage |
| Broche 11 | VLDO5 — LDO 5 output voltage |
| Broche 12 | VLDO6 — LDO 6 output voltage |
| Broche 13 | VLDO7 — LDO 7 output voltage |
| Broche 14 | BST3 — Bootstrap for buck converter 3 high-side driver |
| Broche 15 | LX3 — Switch node for buck converter 3 |
| Broche 16 | PGND3 — Power ground for buck converter 3 |
| Broche 17 | PVIN3 — Power input for buck converter 3 |
| Broche 18 | BST4 — Bootstrap for buck converter 4 high-side driver |
| Broche 19 | LX4 — Switch node for buck converter 4 |
| Broche 20 | PGND4 — Power ground for buck converter 4 |
| Broche 21 | PVIN4 — Power input for buck converter 4 |
| Broche 22 | BST5 — Bootstrap for boost converter 5 |
| Broche 23 | BSTOUT5 — Boost converter 5 output |
| Broche 24 | BST6 — Bootstrap for boost converter 6 |
| Broche 25 | BSTOUT6 — Boost converter 6 output |
| Broche 26 | BST7 — Bootstrap for boost converter 7 |
| Broche 27 | BSTOUT7 — Boost converter 7 output |
| Broche 28 | BST8 — Bootstrap for boost converter 8 |
| Broche 29 | BSTOUT8 — Boost converter 8 output |
| Broche 30 | BST9 — Bootstrap for boost converter 9 |
| Broche 31 | BSTOUT9 — Boost converter 9 output |
| Broche 32 | SDA — I2C data line |
| Broche 33 | SCL — I2C clock line |
| Broche 34 | INTB — Interrupt output (active low) |
| Broche 35 | PWRON — Power-on input from push-button or system controller |
| Broche 36 | RESETB — Reset output (active low) to i.MX 8M |
| Broche 37 | PGOOD — Power-good indicator |
| Broche 38 | VSEL |
| Broche 39 | THRM — Thermal monitoring input |
| Broche 40 | VINDIG — Digital I/O supply input |
| Broche 41 | AGND — Analog ground |
| Broche 42 | AVIN — Analog supply input |
| Broche 43 | ADCIN1 — ADC input channel 1 |
| Broche 44 | ADCIN2 — ADC input channel 2 |
| Broche 45 | ADCIN3 — ADC input channel 3 |
| Broche 46 | ADCIN4 — ADC input channel 4 |
| Broche 47 | OTP_TEST — OTP test mode (factory only) |
| Broche 48 | NC — Not connected (per datasheet) |
| Broche 49 | NC — Not connected (per datasheet) |
| Broche 50 | NC — Not connected (per datasheet) |
| Broche 51 | NC — Not connected (per datasheet) |
| Broche 52 | NC — Not connected (per datasheet) |
| Broche 53 | NC — Not connected (per datasheet) |
| Broche 54 | NC — Not connected (per datasheet) |
| Broche 55 | NC — Not connected (per datasheet) |
| Broche 56 | EP — Exposed pad - thermal dissipation and ground |
Applications typiques
MC34PF4210A1ES convient pour 6 applications: Smart Speakers with Voice UI, Streaming Set-Top Boxes and Media Players, Single-Board Computers (SBC) and Development Kits, Industrial HMI and Infotainment Panels, Audio/Video Conferencing Endpoints, Consumer IoT Gateways and Edge Devices.
Smart Speakers with Voice UI
The MC34PF4210A1ES is purpose-built for i.MX 8M-based smart speakers and voice-assistant appliances. Its 4/6 buck converters provide high-current SoC core and DDR rails while seven LDOs deliver ultra-low-noise power for the audio CODEC and microphone-array ADCs. The pre-programmed OTP eliminates external voltage-set resistors, allowing engineers to bring up a smart-speaker reference design with a single PMIC. The integrated 10-bit ADC monitors battery and rail health for accurate voice-assistant status reporting.
Recommandé
Streaming Set-Top Boxes and Media Players
Streaming set-top boxes and Android-TV media players powered by i.MX 8M use the MC34PF4210A1ES to consolidate their entire multi-rail power tree. The five integrated boost converters drive HDMI level shifters and USB OTG supply rails, while the four buck converters power the SoC, DDR memory, and eMMC storage. The hardware-reset and power-good sequencing align with the i.MX 8M boot order, eliminating the need for an external power sequencer. This reduces PCB area and BOM cost for volume consumer media products.
Recommandé
Single-Board Computers (SBC) and Development Kits
Hobbyist and industrial SBC designs based on i.MX 8M benefit from the MC34PF4210A1ES's pre-validated reference design and Board Support Package (BSP). The PMIC integrates all required DC-DC and LDO rails from a 5V input, simplifying SBC schematic design and PCB layout. The on-chip OTP guarantees consistent rail voltages across manufactured boards, critical for developer-kit reproducibility. Engineers can use the BSP to configure dynamic voltage scaling for power-aware operating modes.
Recommandé
Industrial HMI and Infotainment Panels
Industrial human-machine interfaces and infotainment head units built on i.MX 8M leverage the MC34PF4210A1ES to consolidate power delivery in compact, thermally-constrained enclosures. The 56-QFN-EP with exposed pad provides adequate thermal dissipation for continuous operation, while the 4/6 buck + 7 LDO + 5 boost channel count covers display backlight boost, touch-sensor analog rails, and SoC core rails simultaneously. The hardware reset and power-good interface integrates cleanly with industrial watchdog timers.
Recommandé
Audio/Video Conferencing Endpoints
Conference-room speakerphones and video-conferencing endpoints powered by i.MX 8M use the MC34PF4210A1ES to power their multi-microphone arrays, speaker amplifiers, and HD camera subsystems. The seven integrated LDOs deliver quiet rails for the audio ADCs and DACs, preserving the wide dynamic range required for full-duplex echo cancellation. The boost converters support PoE-derived 12V rails and the camera-module bias, eliminating external DC-DC stages.
Recommandé
Consumer IoT Gateways and Edge Devices
Edge AI gateways and consumer IoT hubs based on i.MX 8M leverage the MC34PF4210A1ES to generate every rail required by the SoC, memory, Wi-Fi/Bluetooth module, and sensor interfaces from a single 5V adapter input. The integrated 10-bit ADC monitors battery or USB-PD input current for accurate power-budget reporting. Dynamic voltage scaling on the buck outputs enables low-power standby modes critical for always-on IoT products targeting energy-star compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC34PF4210A1ES — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MMPF0100NPAES | MMPF0100F0AEP | MMPF0100F1AEP | MMPF0100F2AEP | MMPF0100F3EP |
|---|---|---|---|---|---|---|
| Package | 56-QFN-EP (8x8) | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Target Processor | i.MX 8M family | i.MX 6/7/8 families (configurable) | i.MX 6/7 (F0 OTP config) | i.MX 6/7 (F1 OTP config) | i.MX 6/7 (F2 OTP config) | i.MX 6/7 (F3 OTP config) |
| Buck Converters | 4/6 (configurable) | 4/6 (configurable) - same | 4/6 (configurable) - same | 4/6 (configurable) - same | 4/6 (configurable) - same | 4/6 (configurable) - same |
| LDOs | 7 | 7 - same | 7 - same | 7 - same | 7 - same | 7 - same |
| Boost Converters | 5 | 5 - same | 5 - same | 5 - same | 5 - same | 5 - same |
| OTP Pre-programmed | Yes (i.MX 8M config) | No (un-programmed, requires loading) | Yes (F0 config) | Yes (F1 config) | Yes (F2 config) | Yes (F3 config) |
| ADC | 10-bit | 10-bit - same | 10-bit - same | 10-bit - same | 10-bit - same | 10-bit - same |
Principaux différenciateurs
- Pre-programmed for i.MX 8M with on-chip OTP (vs MMPF0100NPAES)
- Verified 56-QFN-EP reference design available (vs MMPF0100F0AEP)
- i.MX 8M-specific OTP voltage setpoints (vs MMPF0100F1AEP)
Notes de conception
The 56-QFN-EP exposed pad is the primary thermal dissipation path for the integrated switching regulators. The PCB land pattern MUST include a copper pour directly under the EP with at least 25 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to an inner ground plane. Without proper EP soldering, junction temperature can rise by 30-40 C above the reference design, potentially triggering thermal shutdown during full-load operation.
Per the NXP reference design, place input capacitors within 2 mm of each PVIN pin and use a star-ground topology with the AGND/PGND separation recommended in the datasheet. The switching-node traces (SW1-SW4) should be kept short and routed on a layer adjacent to the EP ground plane to minimize radiated EMI. Place the I2C pull-up resistors close to the SDA/SCL pins.
Do not substitute the pre-programmed MC34PF4210A1ES OTP variant with a different suffix (e.g. A2ES or A0ES) without verifying that the default voltage setpoints match your specific i.MX 8M SKU. Each OTP variant is calibrated for a specific processor variant; mismatches can cause under-voltage or over-voltage faults on power-up. Use the NXP BSP and reference design to verify voltage targets before committing to a production order.
Informations de conformité
RoHS and REACH compliance per NXP product page and distributor listings (DigiKey, Mouser). AEC-Q100 not applicable - this is a consumer-focused PMIC, not an automotive-grade part. For automotive i.MX 8M applications, consult NXP for the equivalent automotive-qualified PMIC variant.
