MC34PF4210A1ES - 14-Ch PMIC for i.MX 8M | NXP QFN-56
N.º da peça: MC34PF4210A1ES ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.533 | $7,53 |
| 10 | $6.78 | $67,80 |
| 100 | $6.12 | $612,00 |
| 500 | $5.65 | $2.825,00 |
| 1.000 | $5.2 | $5.200,00 |
MC34PF4210A1ES Visão geral
A PMIC (Power Management Integrated Circuit) is a single silicon device that consolidates multiple voltage regulators and power sequencing functions previously implemented as discrete DC-DC converters and LDOs. PMICs sit at the top of the power-management hierarchy, sitting above buck converters, LDOs, and battery chargers in the typical SoC power tree. The PF4210 specifically targets multimedia SoCs that require audio subsystem rails, SoC core/memory rails, and I/O rails generated from a single Li-ion cell or 5V system supply.
Key features of the PF4210 include a 10-bit ADC for system monitoring, programmable output voltages, hardware reset and power-good signals, integrated power sequencing for the i.MX 8M boot order, and thermal shutdown protection. The pre-programmed OTP variant eliminates the need for external configuration components and reduces time-to-market for consumer audio/video applications. The device supports dynamic voltage scaling (DVS) on selected buck outputs for energy-efficient SoC operation.
Architecturally, the PF4210 uses buck converters with internal MOSFETs for the high-current rails (core, memory, GPU) and low-noise LDOs for noise-sensitive analog and audio subsystems. The boost converters support displays and USB OTG. The on-chip OTP stores the default voltage setpoints and the i.MX 8M power-up sequence, allowing the PMIC to bring the entire SoC up from a single button press.
Typical applications include smart speakers with voice UI, streaming set-top boxes, infotainment head units, single-board computers (SBC) with the i.MX 8M, and any consumer audio/video device requiring a pre-validated multi-rail power tree. Designers can leverage the included reference design and Board Support Package (BSP) to accelerate hardware bring-up.
When designing with this PMIC, follow the NXP reference design layout for the 56-QFN-EP package - thermal performance depends heavily on the exposed pad soldering to a sufficient copper area. The OTP variant must be ordered as the specific pre-programmed version (A1ES) matching your i.MX 8M variant, since the OTP configuration cannot be changed in the field.
This page synthesizes distributor pricing, drop-in alternatives from the NXP PF family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MC34PF4210A1ES — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC34PF4210A1ES (mesmo formato e footprint) — diferindo em ADC, Boost Converters, Buck Converters, Package, Target Processor.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MMPF0100NPAES
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MMPF0100F0AEP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MMPF0100F1AEP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MMPF0100F2AEP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MMPF0100F3EP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC34PF4210A1ES Classificações máximas e características elétricas
| Função | 14-channel PMIC for i.MX 8M |
| Topologia | 4/6 Buck + 7 LDO + 5 Boost |
| Buck Converters | 4 (configurable to 6) |
| LDOs | 7 |
| Boost Converters | 5 |
| ADC | 10-bit on-chip monitoring ADC |
| On-Chip Memory | One-Time Programmable (OTP), pre-programmed |
| Target Processor | NXP i.MX 8M family application processors |
| Encapsulamento | 56-QFN-EP (8x8 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant (per distributor listings) |
| Categoria | Power Management - Specialized (PMIC) |
| Manufacturer | NXP USA Inc. |
Configuração de pinos do MC34PF4210A1ES
| Pino 1 | PVIN1 — Power input for buck converter 1 |
| Pino 2 | SW1 — Switch node for buck converter 1 |
| Pino 3 | PGND1 — Power ground for buck converter 1 |
| Pino 4 | LX2 — Switch node for buck converter 2 |
| Pino 5 | PVIN2 — Power input for buck converter 2 |
| Pino 6 | BST2 — Bootstrap for buck converter 2 high-side driver |
| Pino 7 | VLDO1 — LDO 1 output voltage |
| Pino 8 | VLDO2 — LDO 2 output voltage |
| Pino 9 | VLDO3 — LDO 3 output voltage |
| Pino 10 | VLDO4 — LDO 4 output voltage |
| Pino 11 | VLDO5 — LDO 5 output voltage |
| Pino 12 | VLDO6 — LDO 6 output voltage |
| Pino 13 | VLDO7 — LDO 7 output voltage |
| Pino 14 | BST3 — Bootstrap for buck converter 3 high-side driver |
| Pino 15 | LX3 — Switch node for buck converter 3 |
| Pino 16 | PGND3 — Power ground for buck converter 3 |
| Pino 17 | PVIN3 — Power input for buck converter 3 |
| Pino 18 | BST4 — Bootstrap for buck converter 4 high-side driver |
| Pino 19 | LX4 — Switch node for buck converter 4 |
| Pino 20 | PGND4 — Power ground for buck converter 4 |
| Pino 21 | PVIN4 — Power input for buck converter 4 |
| Pino 22 | BST5 — Bootstrap for boost converter 5 |
| Pino 23 | BSTOUT5 — Boost converter 5 output |
| Pino 24 | BST6 — Bootstrap for boost converter 6 |
| Pino 25 | BSTOUT6 — Boost converter 6 output |
| Pino 26 | BST7 — Bootstrap for boost converter 7 |
| Pino 27 | BSTOUT7 — Boost converter 7 output |
| Pino 28 | BST8 — Bootstrap for boost converter 8 |
| Pino 29 | BSTOUT8 — Boost converter 8 output |
| Pino 30 | BST9 — Bootstrap for boost converter 9 |
| Pino 31 | BSTOUT9 — Boost converter 9 output |
| Pino 32 | SDA — I2C data line |
| Pino 33 | SCL — I2C clock line |
| Pino 34 | INTB — Interrupt output (active low) |
| Pino 35 | PWRON — Power-on input from push-button or system controller |
| Pino 36 | RESETB — Reset output (active low) to i.MX 8M |
| Pino 37 | PGOOD — Power-good indicator |
| Pino 38 | VSEL |
| Pino 39 | THRM — Thermal monitoring input |
| Pino 40 | VINDIG — Digital I/O supply input |
| Pino 41 | AGND — Analog ground |
| Pino 42 | AVIN — Analog supply input |
| Pino 43 | ADCIN1 — ADC input channel 1 |
| Pino 44 | ADCIN2 — ADC input channel 2 |
| Pino 45 | ADCIN3 — ADC input channel 3 |
| Pino 46 | ADCIN4 — ADC input channel 4 |
| Pino 47 | OTP_TEST — OTP test mode (factory only) |
| Pino 48 | NC — Not connected (per datasheet) |
| Pino 49 | NC — Not connected (per datasheet) |
| Pino 50 | NC — Not connected (per datasheet) |
| Pino 51 | NC — Not connected (per datasheet) |
| Pino 52 | NC — Not connected (per datasheet) |
| Pino 53 | NC — Not connected (per datasheet) |
| Pino 54 | NC — Not connected (per datasheet) |
| Pino 55 | NC — Not connected (per datasheet) |
| Pino 56 | EP — Exposed pad - thermal dissipation and ground |
Aplicações típicas
MC34PF4210A1ES é adequado para 6 aplicaçãos: Smart Speakers with Voice UI, Streaming Set-Top Boxes and Media Players, Single-Board Computers (SBC) and Development Kits, Industrial HMI and Infotainment Panels, Audio/Video Conferencing Endpoints, Consumer IoT Gateways and Edge Devices.
Smart Speakers with Voice UI
The MC34PF4210A1ES is purpose-built for i.MX 8M-based smart speakers and voice-assistant appliances. Its 4/6 buck converters provide high-current SoC core and DDR rails while seven LDOs deliver ultra-low-noise power for the audio CODEC and microphone-array ADCs. The pre-programmed OTP eliminates external voltage-set resistors, allowing engineers to bring up a smart-speaker reference design with a single PMIC. The integrated 10-bit ADC monitors battery and rail health for accurate voice-assistant status reporting.
Recomendado
Streaming Set-Top Boxes and Media Players
Streaming set-top boxes and Android-TV media players powered by i.MX 8M use the MC34PF4210A1ES to consolidate their entire multi-rail power tree. The five integrated boost converters drive HDMI level shifters and USB OTG supply rails, while the four buck converters power the SoC, DDR memory, and eMMC storage. The hardware-reset and power-good sequencing align with the i.MX 8M boot order, eliminating the need for an external power sequencer. This reduces PCB area and BOM cost for volume consumer media products.
Recomendado
Single-Board Computers (SBC) and Development Kits
Hobbyist and industrial SBC designs based on i.MX 8M benefit from the MC34PF4210A1ES's pre-validated reference design and Board Support Package (BSP). The PMIC integrates all required DC-DC and LDO rails from a 5V input, simplifying SBC schematic design and PCB layout. The on-chip OTP guarantees consistent rail voltages across manufactured boards, critical for developer-kit reproducibility. Engineers can use the BSP to configure dynamic voltage scaling for power-aware operating modes.
Recomendado
Industrial HMI and Infotainment Panels
Industrial human-machine interfaces and infotainment head units built on i.MX 8M leverage the MC34PF4210A1ES to consolidate power delivery in compact, thermally-constrained enclosures. The 56-QFN-EP with exposed pad provides adequate thermal dissipation for continuous operation, while the 4/6 buck + 7 LDO + 5 boost channel count covers display backlight boost, touch-sensor analog rails, and SoC core rails simultaneously. The hardware reset and power-good interface integrates cleanly with industrial watchdog timers.
Recomendado
Audio/Video Conferencing Endpoints
Conference-room speakerphones and video-conferencing endpoints powered by i.MX 8M use the MC34PF4210A1ES to power their multi-microphone arrays, speaker amplifiers, and HD camera subsystems. The seven integrated LDOs deliver quiet rails for the audio ADCs and DACs, preserving the wide dynamic range required for full-duplex echo cancellation. The boost converters support PoE-derived 12V rails and the camera-module bias, eliminating external DC-DC stages.
Recomendado
Consumer IoT Gateways and Edge Devices
Edge AI gateways and consumer IoT hubs based on i.MX 8M leverage the MC34PF4210A1ES to generate every rail required by the SoC, memory, Wi-Fi/Bluetooth module, and sensor interfaces from a single 5V adapter input. The integrated 10-bit ADC monitors battery or USB-PD input current for accurate power-budget reporting. Dynamic voltage scaling on the buck outputs enables low-power standby modes critical for always-on IoT products targeting energy-star compliance.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC34PF4210A1ES — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MMPF0100NPAES | MMPF0100F0AEP | MMPF0100F1AEP | MMPF0100F2AEP | MMPF0100F3EP |
|---|---|---|---|---|---|---|
| Package | 56-QFN-EP (8x8) | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Target Processor | i.MX 8M family | i.MX 6/7/8 families (configurable) | i.MX 6/7 (F0 OTP config) | i.MX 6/7 (F1 OTP config) | i.MX 6/7 (F2 OTP config) | i.MX 6/7 (F3 OTP config) |
| Buck Converters | 4/6 (configurable) | 4/6 (configurable) - same | 4/6 (configurable) - same | 4/6 (configurable) - same | 4/6 (configurable) - same | 4/6 (configurable) - same |
| LDOs | 7 | 7 - same | 7 - same | 7 - same | 7 - same | 7 - same |
| Boost Converters | 5 | 5 - same | 5 - same | 5 - same | 5 - same | 5 - same |
| OTP Pre-programmed | Yes (i.MX 8M config) | No (un-programmed, requires loading) | Yes (F0 config) | Yes (F1 config) | Yes (F2 config) | Yes (F3 config) |
| ADC | 10-bit | 10-bit - same | 10-bit - same | 10-bit - same | 10-bit - same | 10-bit - same |
Principais diferenciais
- Pre-programmed for i.MX 8M with on-chip OTP (vs MMPF0100NPAES)
- Verified 56-QFN-EP reference design available (vs MMPF0100F0AEP)
- i.MX 8M-specific OTP voltage setpoints (vs MMPF0100F1AEP)
Notas de projeto
The 56-QFN-EP exposed pad is the primary thermal dissipation path for the integrated switching regulators. The PCB land pattern MUST include a copper pour directly under the EP with at least 25 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to an inner ground plane. Without proper EP soldering, junction temperature can rise by 30-40 C above the reference design, potentially triggering thermal shutdown during full-load operation.
Per the NXP reference design, place input capacitors within 2 mm of each PVIN pin and use a star-ground topology with the AGND/PGND separation recommended in the datasheet. The switching-node traces (SW1-SW4) should be kept short and routed on a layer adjacent to the EP ground plane to minimize radiated EMI. Place the I2C pull-up resistors close to the SDA/SCL pins.
Do not substitute the pre-programmed MC34PF4210A1ES OTP variant with a different suffix (e.g. A2ES or A0ES) without verifying that the default voltage setpoints match your specific i.MX 8M SKU. Each OTP variant is calibrated for a specific processor variant; mismatches can cause under-voltage or over-voltage faults on power-up. Use the NXP BSP and reference design to verify voltage targets before committing to a production order.
Informações de conformidade
RoHS and REACH compliance per NXP product page and distributor listings (DigiKey, Mouser). AEC-Q100 not applicable - this is a consumer-focused PMIC, not an automotive-grade part. For automotive i.MX 8M applications, consult NXP for the equivalent automotive-qualified PMIC variant.
