MC34PF4210A1ES - 14-Ch PMIC for i.MX 8M | NXP QFN-56
部品番号: MC34PF4210A1ES ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7.533 | $7.53 |
| 10 | $6.78 | $67.80 |
| 100 | $6.12 | $612.00 |
| 500 | $5.65 | $2,825.00 |
| 1,000 | $5.2 | $5,200.00 |
MC34PF4210A1ES 概要
A PMIC (Power Management Integrated Circuit) is a single silicon device that consolidates multiple voltage regulators and power sequencing functions previously implemented as discrete DC-DC converters and LDOs. PMICs sit at the top of the power-management hierarchy, sitting above buck converters, LDOs, and battery chargers in the typical SoC power tree. The PF4210 specifically targets multimedia SoCs that require audio subsystem rails, SoC core/memory rails, and I/O rails generated from a single Li-ion cell or 5V system supply.
Key features of the PF4210 include a 10-bit ADC for system monitoring, programmable output voltages, hardware reset and power-good signals, integrated power sequencing for the i.MX 8M boot order, and thermal shutdown protection. The pre-programmed OTP variant eliminates the need for external configuration components and reduces time-to-market for consumer audio/video applications. The device supports dynamic voltage scaling (DVS) on selected buck outputs for energy-efficient SoC operation.
Architecturally, the PF4210 uses buck converters with internal MOSFETs for the high-current rails (core, memory, GPU) and low-noise LDOs for noise-sensitive analog and audio subsystems. The boost converters support displays and USB OTG. The on-chip OTP stores the default voltage setpoints and the i.MX 8M power-up sequence, allowing the PMIC to bring the entire SoC up from a single button press.
Typical applications include smart speakers with voice UI, streaming set-top boxes, infotainment head units, single-board computers (SBC) with the i.MX 8M, and any consumer audio/video device requiring a pre-validated multi-rail power tree. Designers can leverage the included reference design and Board Support Package (BSP) to accelerate hardware bring-up.
When designing with this PMIC, follow the NXP reference design layout for the 56-QFN-EP package - thermal performance depends heavily on the exposed pad soldering to a sufficient copper area. The OTP variant must be ordered as the specific pre-programmed version (A1ES) matching your i.MX 8M variant, since the OTP configuration cannot be changed in the field.
This page synthesizes distributor pricing, drop-in alternatives from the NXP PF family, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: MC34PF4210A1ES — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MC34PF4210A1ES （同一形状・フットプリント） — 相違点: ADC, Boost Converters, Buck Converters, Package, Target Processor.
クイック比較ツール — 並列比較する代替部品を選択:
MMPF0100NPAES
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MMPF0100F0AEP
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MMPF0100F1AEP
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MMPF0100F2AEP
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MMPF0100F3EP
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC34PF4210A1ES 最大定格＆電気的特性
| 機能 | 14-channel PMIC for i.MX 8M |
| トポロジー | 4/6 Buck + 7 LDO + 5 Boost |
| Buck Converters | 4 (configurable to 6) |
| LDOs | 7 |
| Boost Converters | 5 |
| ADC | 10-bit on-chip monitoring ADC |
| On-Chip Memory | One-Time Programmable (OTP), pre-programmed |
| Target Processor | NXP i.MX 8M family application processors |
| パッケージ | 56-QFN-EP (8x8 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant (per distributor listings) |
| カテゴリ | Power Management - Specialized (PMIC) |
| Manufacturer | NXP USA Inc. |
MC34PF4210A1ES ピン構成
| ピン 1 | PVIN1 — Power input for buck converter 1 |
| ピン 2 | SW1 — Switch node for buck converter 1 |
| ピン 3 | PGND1 — Power ground for buck converter 1 |
| ピン 4 | LX2 — Switch node for buck converter 2 |
| ピン 5 | PVIN2 — Power input for buck converter 2 |
| ピン 6 | BST2 — Bootstrap for buck converter 2 high-side driver |
| ピン 7 | VLDO1 — LDO 1 output voltage |
| ピン 8 | VLDO2 — LDO 2 output voltage |
| ピン 9 | VLDO3 — LDO 3 output voltage |
| ピン 10 | VLDO4 — LDO 4 output voltage |
| ピン 11 | VLDO5 — LDO 5 output voltage |
| ピン 12 | VLDO6 — LDO 6 output voltage |
| ピン 13 | VLDO7 — LDO 7 output voltage |
| ピン 14 | BST3 — Bootstrap for buck converter 3 high-side driver |
| ピン 15 | LX3 — Switch node for buck converter 3 |
| ピン 16 | PGND3 — Power ground for buck converter 3 |
| ピン 17 | PVIN3 — Power input for buck converter 3 |
| ピン 18 | BST4 — Bootstrap for buck converter 4 high-side driver |
| ピン 19 | LX4 — Switch node for buck converter 4 |
| ピン 20 | PGND4 — Power ground for buck converter 4 |
| ピン 21 | PVIN4 — Power input for buck converter 4 |
| ピン 22 | BST5 — Bootstrap for boost converter 5 |
| ピン 23 | BSTOUT5 — Boost converter 5 output |
| ピン 24 | BST6 — Bootstrap for boost converter 6 |
| ピン 25 | BSTOUT6 — Boost converter 6 output |
| ピン 26 | BST7 — Bootstrap for boost converter 7 |
| ピン 27 | BSTOUT7 — Boost converter 7 output |
| ピン 28 | BST8 — Bootstrap for boost converter 8 |
| ピン 29 | BSTOUT8 — Boost converter 8 output |
| ピン 30 | BST9 — Bootstrap for boost converter 9 |
| ピン 31 | BSTOUT9 — Boost converter 9 output |
| ピン 32 | SDA — I2C data line |
| ピン 33 | SCL — I2C clock line |
| ピン 34 | INTB — Interrupt output (active low) |
| ピン 35 | PWRON — Power-on input from push-button or system controller |
| ピン 36 | RESETB — Reset output (active low) to i.MX 8M |
| ピン 37 | PGOOD — Power-good indicator |
| ピン 38 | VSEL |
| ピン 39 | THRM — Thermal monitoring input |
| ピン 40 | VINDIG — Digital I/O supply input |
| ピン 41 | AGND — Analog ground |
| ピン 42 | AVIN — Analog supply input |
| ピン 43 | ADCIN1 — ADC input channel 1 |
| ピン 44 | ADCIN2 — ADC input channel 2 |
| ピン 45 | ADCIN3 — ADC input channel 3 |
| ピン 46 | ADCIN4 — ADC input channel 4 |
| ピン 47 | OTP_TEST — OTP test mode (factory only) |
| ピン 48 | NC — Not connected (per datasheet) |
| ピン 49 | NC — Not connected (per datasheet) |
| ピン 50 | NC — Not connected (per datasheet) |
| ピン 51 | NC — Not connected (per datasheet) |
| ピン 52 | NC — Not connected (per datasheet) |
| ピン 53 | NC — Not connected (per datasheet) |
| ピン 54 | NC — Not connected (per datasheet) |
| ピン 55 | NC — Not connected (per datasheet) |
| ピン 56 | EP — Exposed pad - thermal dissipation and ground |
主な用途
MC34PF4210A1ES の用途: 6 件s: Smart Speakers with Voice UI, Streaming Set-Top Boxes and Media Players, Single-Board Computers (SBC) and Development Kits, Industrial HMI and Infotainment Panels, Audio/Video Conferencing Endpoints, Consumer IoT Gateways and Edge Devices.
Smart Speakers with Voice UI
The MC34PF4210A1ES is purpose-built for i.MX 8M-based smart speakers and voice-assistant appliances. Its 4/6 buck converters provide high-current SoC core and DDR rails while seven LDOs deliver ultra-low-noise power for the audio CODEC and microphone-array ADCs. The pre-programmed OTP eliminates external voltage-set resistors, allowing engineers to bring up a smart-speaker reference design with a single PMIC. The integrated 10-bit ADC monitors battery and rail health for accurate voice-assistant status reporting.
おすすめ
Streaming Set-Top Boxes and Media Players
Streaming set-top boxes and Android-TV media players powered by i.MX 8M use the MC34PF4210A1ES to consolidate their entire multi-rail power tree. The five integrated boost converters drive HDMI level shifters and USB OTG supply rails, while the four buck converters power the SoC, DDR memory, and eMMC storage. The hardware-reset and power-good sequencing align with the i.MX 8M boot order, eliminating the need for an external power sequencer. This reduces PCB area and BOM cost for volume consumer media products.
おすすめ
Single-Board Computers (SBC) and Development Kits
Hobbyist and industrial SBC designs based on i.MX 8M benefit from the MC34PF4210A1ES's pre-validated reference design and Board Support Package (BSP). The PMIC integrates all required DC-DC and LDO rails from a 5V input, simplifying SBC schematic design and PCB layout. The on-chip OTP guarantees consistent rail voltages across manufactured boards, critical for developer-kit reproducibility. Engineers can use the BSP to configure dynamic voltage scaling for power-aware operating modes.
おすすめ
Industrial HMI and Infotainment Panels
Industrial human-machine interfaces and infotainment head units built on i.MX 8M leverage the MC34PF4210A1ES to consolidate power delivery in compact, thermally-constrained enclosures. The 56-QFN-EP with exposed pad provides adequate thermal dissipation for continuous operation, while the 4/6 buck + 7 LDO + 5 boost channel count covers display backlight boost, touch-sensor analog rails, and SoC core rails simultaneously. The hardware reset and power-good interface integrates cleanly with industrial watchdog timers.
おすすめ
Audio/Video Conferencing Endpoints
Conference-room speakerphones and video-conferencing endpoints powered by i.MX 8M use the MC34PF4210A1ES to power their multi-microphone arrays, speaker amplifiers, and HD camera subsystems. The seven integrated LDOs deliver quiet rails for the audio ADCs and DACs, preserving the wide dynamic range required for full-duplex echo cancellation. The boost converters support PoE-derived 12V rails and the camera-module bias, eliminating external DC-DC stages.
おすすめ
Consumer IoT Gateways and Edge Devices
Edge AI gateways and consumer IoT hubs based on i.MX 8M leverage the MC34PF4210A1ES to generate every rail required by the SoC, memory, Wi-Fi/Bluetooth module, and sensor interfaces from a single 5V adapter input. The integrated 10-bit ADC monitors battery or USB-PD input current for accurate power-budget reporting. Dynamic voltage scaling on the buck outputs enables low-power standby modes critical for always-on IoT products targeting energy-star compliance.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MC34PF4210A1ES — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MMPF0100NPAES | MMPF0100F0AEP | MMPF0100F1AEP | MMPF0100F2AEP | MMPF0100F3EP |
|---|---|---|---|---|---|---|
| Package | 56-QFN-EP (8x8) | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same | 56-QFN-EP (8x8) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Target Processor | i.MX 8M family | i.MX 6/7/8 families (configurable) | i.MX 6/7 (F0 OTP config) | i.MX 6/7 (F1 OTP config) | i.MX 6/7 (F2 OTP config) | i.MX 6/7 (F3 OTP config) |
| Buck Converters | 4/6 (configurable) | 4/6 (configurable) - same | 4/6 (configurable) - same | 4/6 (configurable) - same | 4/6 (configurable) - same | 4/6 (configurable) - same |
| LDOs | 7 | 7 - same | 7 - same | 7 - same | 7 - same | 7 - same |
| Boost Converters | 5 | 5 - same | 5 - same | 5 - same | 5 - same | 5 - same |
| OTP Pre-programmed | Yes (i.MX 8M config) | No (un-programmed, requires loading) | Yes (F0 config) | Yes (F1 config) | Yes (F2 config) | Yes (F3 config) |
| ADC | 10-bit | 10-bit - same | 10-bit - same | 10-bit - same | 10-bit - same | 10-bit - same |
主な差別化要因
- Pre-programmed for i.MX 8M with on-chip OTP （vs MMPF0100NPAES)
- Verified 56-QFN-EP reference design available （vs MMPF0100F0AEP)
- i.MX 8M-specific OTP voltage setpoints （vs MMPF0100F1AEP)
設計ノート
The 56-QFN-EP exposed pad is the primary thermal dissipation path for the integrated switching regulators. The PCB land pattern MUST include a copper pour directly under the EP with at least 25 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to an inner ground plane. Without proper EP soldering, junction temperature can rise by 30-40 C above the reference design, potentially triggering thermal shutdown during full-load operation.
Per the NXP reference design, place input capacitors within 2 mm of each PVIN pin and use a star-ground topology with the AGND/PGND separation recommended in the datasheet. The switching-node traces (SW1-SW4) should be kept short and routed on a layer adjacent to the EP ground plane to minimize radiated EMI. Place the I2C pull-up resistors close to the SDA/SCL pins.
Do not substitute the pre-programmed MC34PF4210A1ES OTP variant with a different suffix (e.g. A2ES or A0ES) without verifying that the default voltage setpoints match your specific i.MX 8M SKU. Each OTP variant is calibrated for a specific processor variant; mismatches can cause under-voltage or over-voltage faults on power-up. Use the NXP BSP and reference design to verify voltage targets before committing to a production order.
コンプライアンス情報
RoHS and REACH compliance per NXP product page and distributor listings (DigiKey, Mouser). AEC-Q100 not applicable - this is a consumer-focused PMIC, not an automotive-grade part. For automotive i.MX 8M applications, consult NXP for the equivalent automotive-qualified PMIC variant.
