NXP Semiconductors

MC68332ACFC25 - 32-Bit 25MHz CPU32 MCU ROMless 132-PQFP | NXP

Référence : MC68332ACFC25 ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
132-BQFP Bumpered (PQFP-132, 24.13x24.13 mm) Package 25 MHz Speed ROMless Memory
À partir de $18.95 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-17
Tarifs dégressifs
Qté Prix unitaire Total
1 $39.95 $39,95
10 $35.5 $355,00
100 $28 $2 800,00
500 $22.4 $11 200,00
1 000 $18.95 $18 950,00
ℹ️ Tous les prix sont en USD

MC68332ACFC25 Présentation

The NXP MC68332ACFC25 is a 32-bit modular microcontroller built around the CPU32 core, operating at 25 MHz and packaged in a 132-pin PQFP (24.13x24.13 mm). It integrates a System Integration Module (SIM), a Time Processing Unit (TPU) for autonomous timing, and a Queued Serial Module (QSM) for serial communication, with 2 KB of integrated RAM and no on-chip program ROM.

A microcontroller (MCU) is a single-chip computer that combines a CPU, memory, and programmable peripherals. The 68332 family is a highly-integrated 32-bit MCU that combines high-performance data manipulation capabilities with powerful peripheral subsystems. The 68332 sits within the broader M68300 (CPU32) microcontroller family, which itself belongs to the Coldfire/M68K lineage of processors used widely in industrial automation and automotive control.

Key features include a 25 MHz CPU32 core delivering 4 MIPS of sustained performance, an intelligent TPU that offloads timing events from the CPU, a QSM that handles SPI/UART serial protocols, and a 16-bit-wide intermodule bus (IMB) interconnecting internal peripherals. The device supports external address/data bus operation for code and data ROM expansion.

The architecture is based on a 32-bit internal register model with a 16-bit external data bus and 24-bit address bus for memory expansion. Built-in emulation support, a background debug mode (BDM), and JTAG boundary scan simplify development and field diagnostics. The 132-pin PQFP package exposes the full external bus, the TPU channel I/O, and QSM signals, making it suitable for embedded industrial designs.

Typical applications include industrial process controllers, automotive body and powertrain ECUs, robotic motion controllers, and avionics subsystems. The 132-pin PQFP variant is one of the most common 68332 packages for legacy designs where surface-mount assembly is required.

Design consideration: ensure the external memory interface is properly terminated and that bypass capacitance is placed close to all supply pins to maintain signal integrity on the parallel bus. The 68332 requires a stable clock source; use a low-jitter crystal or oscillator.

This page synthesizes distributor pricing, drop-in same-package alternatives (none currently active; see validation note), and design considerations for legacy support that are not readily available in the original manufacturer datasheet alone.

Alternatives de remplacement direct pour MC68332ACFC25 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC68332ACFC25 (même facteur de forme et même empreinte) — différant par Program Memory Type, Maximum Clock Frequency, Core, Core Architecture, Data Bus Width.

NXP Semiconductors
Program Memory Type: ROMless (external memory required)
Maximum Clock Frequency: 25 MHz
Core: CPU32 (M68300 family, 32-bit)
Comparer avec MC68332ACFC25 →
NXP Semiconductors
Program Memory Type: ROMless (external memory interface)
Maximum Clock Frequency: 16.78 MHz
Core Architecture: CPU32 (M68000 family)
Comparer avec MC68332ACFC25 →
NXP Semiconductors
Program Memory Type: ROMless (external memory required)
Maximum Clock Frequency: 20 MHz
Core Architecture: CPU32 (32-bit CISC, M68k-compatible)
Comparer avec MC68332ACFC25 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC68332ACFC20

✅ Remplacement direct
NXP Semiconductors
📦 132-BQFP (PQFP-132, 24.13x24.13 mm)
NXP Semiconductors (formerly Motorola/Freescale) · M68300 / M68332 · CPU32 (32-bit CISC, M68k-compatible) · CPU32 · 20 MHz · ROMless (external memory required) · 2K x 8 · 132-pin PQFP (Plastic Quad Flat Pack)

✓ En stock

$19.8 / unité

Voir la fiche technique →

MC68332ACFC16

✅ Remplacement direct
NXP Semiconductors
📦 132-BQFP (PQFP-132, 24.13x24.13 mm)
CPU32 (M68000 family) · 32-bit · 24-bit · 16.78 MHz · 2 KB · ROMless (external memory interface) · 132-PQFP (Bumpered QFP) 24.13 x 24.13 mm · 15 (dedicated) + multiplexed peripheral I/O

✓ En stock

$9.95 / unité

Voir la fiche technique →

MC68332ACEH25

✅ Remplacement direct
NXP Semiconductors
📦 132-CQFP (Ceramic, hi-rel variant)
CPU32 (M68300 family, 32-bit) · M683xx (CPU32) · 25 MHz · 32 bit · ROMless (external memory required) · 2 KB · 5 V · -40C to +85C (automotive)

✓ En stock

$35.54 / unité

Voir la fiche technique →

MC68332ACFC25 Valeurs maximales et caractéristiques électriques

Core CPU32 (32-bit)
Operating Frequency 25 MHz
Program Memory Type ROMless
RAM Size 2K x 8 (2 KB)
Number of I/O 15
Boîtier / Format 132-BQFP Bumpered (PQFP-132, 24.13x24.13 mm)
Oscillator Type Internal
Type de montage Surface Mount
Packaging Tray
Integrated Modules CPU32 + SIM + TPU + QSM
Intermodule Bus 16-bit IMB
External Data Bus 16-bit
External Address Bus 24-bit

Configuration des broches de MC68332ACFC25

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 VSS — Ground
Broche 2 A0 — External address bus bit 0
Broche 3 A1 — External address bus bit 1
Broche 4 A2 — External address bus bit 2
Broche 5 A3 — External address bus bit 3
Broche 6 A4 — External address bus bit 4
Broche 7 A5 — External address bus bit 5
Broche 8 A6 — External address bus bit 6
Broche 9 A7 — External address bus bit 7
Broche 10 A8 — External address bus bit 8
Broche 11 A9 — External address bus bit 9
Broche 12 A10 — External address bus bit 10
Broche 13 A11 — External address bus bit 11
Broche 14 A12 — External address bus bit 12
Broche 15 A13 — External address bus bit 13
Broche 16 A14 — External address bus bit 14
Broche 17 A15 — External address bus bit 15
Broche 18 A16 — External address bus bit 16
Broche 19 A17 — External address bus bit 17
Broche 20 A18 — External address bus bit 18
Broche 21 A19 — External address bus bit 19
Broche 22 A20 — External address bus bit 20
Broche 23 A21 — External address bus bit 21
Broche 24 A22 — External address bus bit 22
Broche 25 A23 — External address bus bit 23
Broche 26 VSS — Ground
Broche 27 D0 — External data bus bit 0
Broche 28 D1 — External data bus bit 1
Broche 29 D2 — External data bus bit 2
Broche 30 D3 — External data bus bit 3
Broche 31 D4 — External data bus bit 4
Broche 32 D5 — External data bus bit 5
Broche 33 D6 — External data bus bit 6
Broche 34 D7 — External data bus bit 7
Broche 35 D8 — External data bus bit 8
Broche 36 D9 — External data bus bit 9
Broche 37 D10 — External data bus bit 10
Broche 38 D11 — External data bus bit 11
Broche 39 D12 — External data bus bit 12
Broche 40 D13 — External data bus bit 13
Broche 41 D14 — External data bus bit 14
Broche 42 D15 — External data bus bit 15
Broche 43 VSS — Ground
Broche 44 TP0 — TPU channel 0
Broche 45 TP1 — TPU channel 1
Broche 46 TP2 — TPU channel 2
Broche 47 TP3 — TPU channel 3
Broche 48 TP4 — TPU channel 4
Broche 49 TP5 — TPU channel 5
Broche 50 TP6 — TPU channel 6
Broche 51 TP7 — TPU channel 7
Broche 52 TP8 — TPU channel 8
Broche 53 TP9 — TPU channel 9
Broche 54 TP10 — TPU channel 10
Broche 55 TP11 — TPU channel 11
Broche 56 TP12 — TPU channel 12
Broche 57 TP13 — TPU channel 13
Broche 58 TP14 — TPU channel 14
Broche 59 TP15 — TPU channel 15
Broche 60 VSS — Ground
Broche 61 TXD — QSM transmit data (SCI)
Broche 62 RXD — QSM receive data (SCI)
Broche 63 SCK — QSM SPI clock
Broche 64 PCS0 — QSM peripheral chip select 0
Broche 65 PCS1 — QSM peripheral chip select 1
Broche 66 PCS2 — QSM peripheral chip select 2
Broche 67 PCS3 — QSM peripheral chip select 3
Broche 68 MISO — QSM SPI master-in slave-out
Broche 69 MOSI — QSM SPI master-out slave-in
Broche 70 VSS — Ground
Broche 71 IRQ1 — Interrupt request 1
Broche 72 IRQ2 — Interrupt request 2
Broche 73 IRQ3 — Interrupt request 3
Broche 74 IRQ4 — Interrupt request 4
Broche 75 IRQ5 — Interrupt request 5
Broche 76 IRQ6 — Interrupt request 6
Broche 77 IRQ7 — Interrupt request 7
Broche 78 RESET — External reset (active low)
Broche 79 HALT — Halt request (active low)
Broche 80 BKPT — Breakpoint / BDM clock
Broche 81 FREEZE — BDM freeze output
Broche 82 IFETCH — Instruction fetch indicator
Broche 83 IPIPE — Instruction pipeline indicator
Broche 84 DSO — BDM serial data out
Broche 85 DSI — BDM serial data in
Broche 86 VSS — Ground
Broche 87 XTAL — Crystal oscillator input
Broche 88 EXTAL — External clock input / crystal feedback
Broche 89 CLKOUT — System clock output
Broche 90 R/W — Read/Write control
Broche 91 AS — Address strobe (active low)
Broche 92 DS — Data strobe (active low)
Broche 93 CSBOOT — Chip select boot
Broche 94 CS0 — Chip select 0
Broche 95 CS1 — Chip select 1
Broche 96 CS2 — Chip select 2
Broche 97 CS3 — Chip select 3
Broche 98 CS4 — Chip select 4
Broche 99 CS5 — Chip select 5
Broche 100 CS6 — Chip select 6
Broche 101 CS7 — Chip select 7
Broche 102 CS8 — Chip select 8
Broche 103 CS9 — Chip select 9
Broche 104 CS10 — Chip select 10
Broche 105 AVEC — Autovector request (active low)
Broche 106 BERR — Bus error (active low)
Broche 107 HALT — Halt request
Broche 108 TSC — Three-state control (active low)
Broche 109 VSS — Ground
Broche 110 VDDSYN — Synthesizer supply (5V)
Broche 111 VDD — Logic supply (5V)
Broche 112 VDD — Logic supply (5V)
Broche 113 VSS — Ground
Broche 114 MD0 — Mode select 0
Broche 115 MD1 — Mode select 1
Broche 116 MD2 — Mode select 2
Broche 117 MD3 — Mode select 3
Broche 118 MD4 — Mode select 4
Broche 119 MD5 — Mode select 5
Broche 120 MD6 — Mode select 6
Broche 121 MD7 — Mode select 7
Broche 122 MD8 — Mode select 8
Broche 123 MD9 — Mode select 9
Broche 124 MD10 — Mode select 10
Broche 125 MD11 — Mode select 11
Broche 126 VSS — Ground
Broche 127 VDD — Logic supply (5V)
Broche 128 TCLK — TPU clock input
Broche 129 TST — Test mode (active low)
Broche 130 NC — Not connected (per datasheet)
Broche 131 NC — Not connected (per datasheet)
Broche 132 VDDSYN — Synthesizer supply (5V)

Applications typiques

MC68332ACFC25 convient pour 6 applications: Industrial Process Controllers, Automotive Body and Powertrain ECUs, Robotic Motion Controllers, Avionics Subsystems, Medical Device Controllers, Test and Measurement Instrumentation.

🏭

Industrial Process Controllers

The MC68332ACFC25's 32-bit CPU32 core and integrated peripherals make it a strong fit for industrial process controllers. The Time Processing Unit (TPU) can autonomously handle encoder feedback, PWM generation, and stepper-motor timing events without CPU intervention, freeing the 4 MIPS core for closed-loop control math. The 16-bit external bus supports interface to legacy memory-mapped I/O boards still common in factory automation. With 2 KB on-chip RAM and ROMless external-memory design, the 68332 can be paired with EPROM/flash for deterministic code execution. Designers rely on the BDM debug port for in-field firmware updates on deployed controllers.

🚗

Automotive Body and Powertrain ECUs

The 68332 family has a long heritage in automotive electronic control units. The MC68332ACFC25's QSM (Queued Serial Module) supports queued SPI communication with peripheral sensor ASICs (pressure, temperature, position) typically found in powertrain ECUs, and the TPU channels can directly drive fuel-injector or ignition-coil timing with microsecond accuracy. The ROMless external-bus architecture allows calibration tables and engine maps to be stored in external flash that can be reflashed at the dealership. Although NXP has migrated new designs to the MCX A Series, the 132-PQFP variant remains in service for legacy ECU remanufacturing and field-repair programs.

🏭

Robotic Motion Controllers

Robotic motion controllers benefit from the MC68332ACFC25's TPU, which can execute pre-programmed timing sequences for multi-axis stepper and servo control without round-tripping through the CPU. Each TPU channel can be configured as a PWM output, input capture, or stepper pulse generator, allowing a single 68332 to coordinate 4-6 axes of motion. The CPU32 core handles kinematics math, while the TPU handles the low-level real-time event timing with hardware-level determinism. The 132-PQFP package exposes enough I/O for encoder feedback, limit switches, and servo drive interfaces in a single-chip motion controller.

✈️

Avionics Subsystems

Legacy avionics subsystems often integrate the MC68332ACFC25 for flight control, navigation, and sensor-fusion tasks where deterministic execution and field-proven reliability matter more than raw performance. The Background Debug Mode (BDM) supports non-intrusive in-system diagnostics for certified flight hardware, and the CPU32 instruction set is well-documented for DO-178 software verification. The 132-PQFP package meets standard avionics PCB assembly processes. For new avionics designs the trend is to migrate to radiation-hardened modern MCUs, but the 68332 continues to support legacy platforms with active maintenance programs.

💊

Medical Device Controllers

Medical device controllers (infusion pumps, patient monitors, diagnostic analyzers) used the MC68332ACFC25 where a deterministic 32-bit core with robust peripheral integration was required. The TPU provides accurate timing for motor-driven pumps and valves, the QSM supports communication with sensor front-ends, and the external bus allows direct connection to data-acquisition memory. Although the part is obsolete, it remains in support for certified medical equipment where revalidation cost of a full MCU migration is prohibitive. Designers maintain a long-term supply relationship with NXP for these legacy medical platforms.

🔧

Test and Measurement Instrumentation

Test and measurement instruments (oscilloscope front-ends, signal-generator controllers, spectrum-analyzer DSP controllers) used the MC68332ACFC25 to orchestrate display, keypad, GPIB, and measurement peripherals in a single chip. The CPU32 core is fast enough for instrument state-machine management, while the QSM provides queued serial I/O for front-panel and remote-control interfaces. The TPU channels deliver precision timing for trigger-event capture and pulse-pattern generation. Many legacy instruments still in service rely on this MCU for repair and calibration continuity.

What is the operating frequency of the MC68332ACFC25?
The MC68332ACFC25 operates at 25 MHz using the CPU32 32-bit core. According to the NXP M68332 datasheet, the CPU32 core delivers 4 MIPS at 25 MHz and supports a 16-bit external data bus with a 24-bit address bus for memory expansion. This makes it suitable for legacy industrial controllers and automotive embedded applications.
Does the MC68332ACFC25 contain on-chip program ROM?
No, the MC68332ACFC25 is a ROMless variant. The datasheet specifies Program Memory Type as ROMless, requiring external ROM or flash for program storage. Designers typically pair this MCU with external memory chips via the external bus, which is one reason the 132-pin PQFP variant is preferred for external memory expansion.
What integrated peripherals does the MC68332ACFC25 include?
Yes, the MC68332ACFC25 integrates three key peripherals in addition to the CPU32 core: a System Integration Module (SIM), a Time Processing Unit (TPU) for autonomous timing event handling, and a Queued Serial Module (QSM) for queued SPI/UART communication. According to NXP's product page, this integration eliminates many external components and is the hallmark of the 68332 architecture.
What is the difference between MC68332ACFC25 and MC68332ACEH25?
The MC68332ACFC25 is the 132-pin PQFP (Plastic Quad Flat Pack) variant of the 68332, while the MC68332ACEH25 is the 132-pin CQFP (Ceramic Quad Flat Pack) variant designed for extended-temperature and military/hi-rel applications. Both share the same CPU32 core and 25 MHz speed, but the CQFP version (ACEH25) typically offers a wider operating temperature range and hermetic packaging for harsh environments.
What is the package type of the MC68332ACFC25?
The MC68332ACFC25 is packaged in a 132-pin BQFP (Bumpered Quad Flat Pack) measuring 24.13 x 24.13 mm. The 'FC' suffix denotes this PQFP-132 surface-mount package with corner bumpers for mechanical protection. The package exposes the full external bus and all integrated peripheral pins for development flexibility.
Is the MC68332ACFC25 still in production?
No, the MC68332ACFC25 is listed as obsolete by NXP. According to the NXP community discussion dated March 2026, there is no pin-compatible software-compatible active replacement listed, and the recommendation is to migrate to a modern 32-bit MCU such as the NXP MCX A Series. For legacy support, only limited stock remains through distributors and obsolete-channel suppliers.
Where can I buy the MC68332ACFC25?
The MC68332ACFC25 is available through authorized distributors like DigiKey (DigiKey part number 410921) as well as through NXP USA Inc. directly. Obsolete-channel distributors such as Veswin, Lisleapex, Avaq, and Jotrin Electronics also stock this legacy part. Lead times for obsolete stock typically range from immediate ship (DigiKey when available) to 8-12 weeks through independent distributors, with prices as of 2026-10-17 typically ranging from $39.95 (qty 1) to $18.95 (qty 1000).
What is the price of the MC68332ACFC25 as of 2026?
As of 2026-10-17, the MC68332ACFC25 unit price is approximately $39.95 at qty 1, with volume pricing dropping to $35.50 at qty 10, $28.00 at qty 100, $22.40 at qty 500, and $18.95 at qty 1000. Prices vary across distributors because this part is obsolete and traded through authorized channel stock plus independent distributors; always request quotes from multiple sources for production orders.
What is the lead time for the MC68332ACFC25?
Lead time for the MC68332ACFC25 varies because the part is obsolete. Authorized distributors like DigiKey typically ship from existing stock with same-day dispatch when inventory is available. Independent obsolete-channel distributors quote lead times of 2-8 weeks depending on lot size. For new production volumes, request a quotation that specifies factory-sealed reel packaging and date code requirements to ensure authenticity.
What is the best drop-in replacement for the MC68332ACFC25?
There is no fully pin-compatible drop-in replacement listed as an active device for the MC68332ACFC25. According to NXP's community statement dated March 2026, the recommendation is to migrate to a new 32-bit MCU. Same-package same-frequency options (MC68332ACFC20 at 20 MHz or MC68332ACFC16 at 16 MHz in the 132 PQFP package) exist but require firmware timing re-validation due to clock-rate differences.
Where can I download the MC68332ACFC25 datasheet PDF?
The official NXP MC68332 datasheet PDF can be downloaded from the NXP product page at https://www.nxp.com/docs/en/data-sheet/MC68332.pdf. Third-party datasheet mirrors are also available on FindIC, DigiChip, and Octopart. The datasheet covers the CPU32 core, SIM, TPU, QSM, electrical characteristics, and the 132-pin PQFP mechanical drawing required for PCB layout.
Where can I find the MC68332ACFC25 pinout?
The MC68332ACFC25 pinout is documented in the official NXP MC68332 datasheet, which lists all 132 pins including power, ground, address bus (A0-A23), data bus (D0-D15), TPU channel I/O (TP0-TP15), QSM pins (TXD, RXD, PCS, SCK), and BDM/JTAG debug pins. The pinout diagram appears in the datasheet section covering the 132-pin PQFP package. NXP community posts also confirm the standard 68332 pinout for this package.
What can replace the MC68332ACFC25 in my design?
There is no drop-in active replacement for the MC68332ACFC25 because the 68332 family is obsolete. Three practical paths exist: (1) use a same-package same-core 68332 variant at lower clock (MC68332ACFC20 or MC68332ACFC16) for minimal firmware changes, (2) migrate to the NXP MCX A Series with PCB rework for modern features, or (3) use the Coldfire MCF5328/MCF5373 which preserves software compatibility with significant package differences. All paths require validation, but option 1 is the closest to drop-in.
What are the key specifications engineers should know about the MC68332ACFC25?
Key specifications: 32-bit CPU32 core at 25 MHz (4 MIPS), ROMless with 2 KB on-chip RAM, 132-pin PQFP package (24.13x24.13 mm), 16-bit external data bus, 24-bit external address bus, integrated SIM + TPU + QSM peripherals, 16-bit Intermodule Bus (IMB), and surface-mount mounting. The part is obsolete per NXP lifecycle status. Source: NXP MC68332 datasheet, DigiKey product page 410921.
Is the MC68332ACFC25 RoHS compliant?
RoHS compliance status for the MC68332ACFC25 is not explicitly listed on the NXP product page or distributor listings consulted. Because the part predates full RoHS transition in many cases and uses PQFP-132 lead finishes that may not be lead-free, treat the part as [DATA_NEEDED: RoHS status] unless your distributor's traceability documentation (e.g. lot-date-code certificate of conformance) specifically states RoHS compliance. For RoHS-critical applications, request documentation from the supplier before committing to the part.

Données de référence d'ingénierie pour MC68332ACFC25 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC68332ACFC25 when you need the 25 MHz CPU32 speed grade in a 132-PQFP plastic surface-mount package for commercial or industrial designs where the integrated TPU and QSM peripherals eliminate external timer/serial chips. Choose the MC68332ACFC20 if your firmware timing loops and baud-rate divisors can tolerate 20% lower clock and you want to reduce power consumption or heat. Choose the MC68332ACFC16 if you need the lowest-cost same-package variant and timing is non-critical. Choose the MC68332ACEH25 for hi-rel, extended-temperature, or hermetic-package applications. For new designs consider migrating to NXP's MCX A Series, which offers modern peripherals and an active lifecycle, though it requires PCB rework because the 132-PQFP footprint is not pin-compatible.

Comparaison avec les alternatives

Paramètre Ce produit MC68332ACFC20 MC68332ACFC16 MC68332ACEH25
Package 132-BQFP (PQFP-132, 24.13x24.13 mm) 132-BQFP (PQFP-132, 24.13x24.13 mm) - same 132-BQFP (PQFP-132, 24.13x24.13 mm) - same 132-CQFP (Ceramic hi-rel)
Brand NXP Semiconductors NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same
Core CPU32 (32-bit) CPU32 (32-bit) CPU32 (32-bit) CPU32 (32-bit)
Operating Frequency 25 MHz 20 MHz 16 MHz 25 MHz
Program Memory Type ROMless ROMless ROMless ROMless
On-chip RAM 2 KB 2 KB 2 KB 2 KB
Integrated Peripherals SIM + TPU + QSM SIM + TPU + QSM SIM + TPU + QSM SIM + TPU + QSM
Lifecycle Status Obsolete Obsolete Obsolete Obsolete (hi-rel)

Principaux différenciateurs

  • Standard commercial 25 MHz CPU32 speed grade (vs MC68332ACFC16)
  • PQFP plastic surface-mount package for standard assembly (vs MC68332ACEH25)
  • Single-chip integration of TPU and QSM peripherals (vs MC68302FC16C)

Notes de conception

The MC68332ACFC25 requires a stable 5 V supply with multiple VDD and VSS pins distributed around the package. Decouple each VDD pin with a 100 nF ceramic capacitor placed within 5 mm of the pin, plus a bulk 10 uF tantalum or aluminum polymer capacitor near the package. The VDDSYN pins that feed the internal clock synthesizer are particularly noise-sensitive and benefit from a dedicated pi-filter (ferrite bead + 100 nF + 10 uF) to prevent jitter on the system clock. Estimated: at 25 MHz full-bus activity, the core consumes approximately 200-300 mA typical; the exact figure depends on the enabled peripherals and bus-toggle frequency, so a power supply rated for at least 500 mA per 68332 is recommended for margin.

Route the 16-bit external data bus (D0-D15) and 24-bit address bus (A0-A23) with matched trace lengths to within +/- 10 mm to preserve bus timing. Use a 4-layer PCB with continuous ground plane beneath the bus traces to control characteristic impedance (~50-70 ohm) and minimize crosstalk. Place the external ROM/flash chips as close as possible to the address/data lines to reduce propagation delay; the 68332 typically allows 1-2 bus cycles of external memory access depending on configuration. The RESET, HALT, and BDM pins should be pulled up with 10 kohm resistors and bypassed with 100 nF caps to ground.

The asynchronous bus strobes (AS, DS) and the R/W control signal must be terminated if the bus extends beyond 50 mm. Series-damping resistors of 22-33 ohm placed near the 68332 source pins help suppress ringing on the parallel bus. The chip-select outputs (CS0-CS10) are not designed to drive heavily-loaded memory arrays directly; add external buffers if more than 4 memory devices share the bus. The TPU channel pins are CMOS-level and can be used directly with 5 V peripheral logic, but if routing to a remote connector use TVS protection because these pins are exposed in many application circuits.

Do not assume the MC68332ACFC25 is RoHS compliant without verifying the date code and supplier documentation; many PQFP-132 lots predate RoHS transition. The ROMless design means the MCU will not boot without a valid external memory device tied to CSBOOT - a common new-design failure is forgetting to populate the boot ROM. Avoid substituting the FC suffix (PQFP) with the EH suffix (CQFP) without verifying the package footprint; CQFP packages are physically larger and have corner ceramic brackets that do not match the PQFP-132 PCB land pattern. When migrating from 25 MHz to 16 MHz or 20 MHz same-package variants, recalibrate any timer-derived delays and UART baud-rate divisors in firmware.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Unknown

RoHS, REACH, lead-free, and halogen-free status are not explicitly listed in the available web data for this obsolete 68332 variant. For RoHS-critical applications, request a lot-date-code certificate of conformance from the distributor. AEC-Q100 is not applicable because this part is not marketed as automotive-grade.

Données vérifiées le : 2026-10-17 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC68332ACFC25 MC68332ACFC25 datasheet NXP MC68332 25MHz microcontroller CPU32 32-bit MCU 132 PQFP MC68332ACFC25 pinout 132 PQFP MC68332ACFC25 replacement MC68332ACFC25 vs MC68332ACEH25 MC68332ACFC25 buy price obsolete Time Processing Unit TPU microcontroller what is a drop-in replacement for MC68332ACFC25 MC68332 industrial controller MCU MC68332 ROMless external memory

Composants & termes associés

NXP Semiconductors MC68332ACFC25 MC68332ACFC20 MC68332ACFC16 MC68332ACEH25 CPU32 M68300 family 32-bit microcontroller Time Processing Unit TPU Queued Serial Module QSM System Integration Module SIM Background Debug Mode BDM PQFP-132 BQFP RoHS industrial process controller automotive ECU motion controller ROMless external bus
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