MC68HC16Z3BCPV25 - 16MHz HC16 MCU, 4KB Mask ROM, 144-LQFP
Référence : MC68HC16Z3BCPV25 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $78.2 | $782,00 |
| 100 | $65.4 | $6 540,00 |
| 500 | $54.1 | $27 050,00 |
| 1 000 | $47.8 | $47 800,00 |
MC68HC16Z3BCPV25 Présentation
What is an HC16 microcontroller? An HC16 is a 16-bit CISC microcontroller in the Freescale/NXP M68HCxx family that combines a 16-bit CPU (CPU16) with peripheral modules such as a 16-bit timer, queued serial module (QSM), system integration, and on-chip memory. The family bridges 8-bit HC11 designs and 32-bit ColdFire devices, providing real-time deterministic performance for embedded control while keeping an instruction-set-upward-compatible developer experience.
Key features of the MC68HC16Z3BCPV25 include a 25 MHz maximum bus frequency (CPV25 speed grade), 4 KB of factory-masked ROM for program storage, RAM and external bus expansion capability, an integrated 16-bit timer processor, a queued serial module (QSM) supporting SPI and SCI/UART, and a 16-channel analog-to-digital converter. The 144-LQFP package provides 144 user I/O pins including address, data, and peripheral expansion buses.
Architecturally, the MC68HC16Z3 uses the CPU16 core with a 16-bit internal data path and 20-bit address bus, supporting up to 1 MB of external memory. The masked-ROM variant (suffix "BCPV25") is intended for high-volume production where the program is committed during wafer fabrication, lowering per-unit cost in exchange for a high NRE mask charge.
Typical applications include automotive powertrain control units (engine control, transmission), body electronics (instrument cluster, body control module), industrial motor drives, and long-life industrial controllers that require a mature 16-bit architecture with decades of legacy code support. The masked-ROM variant is specifically aimed at high-volume OEM production where the program is final and quantity justifies the mask charge.
When designing with the MC68HC16Z3, consider that masked-ROM parts cannot be re-programmed in-circuit - use the EPROM/Flash variant (CEPV/VPV suffixes) for prototypes. Ensure the 5V supply is well decoupled and that the high-speed 16 MHz bus signals follow controlled-impedance layout rules to avoid metastability on external memory accesses.
This page synthesizes distributor pricing, Rochester Electronics long-term stock status, and drop-in alternatives, plus practical design notes for migrating off the masked-ROM variant to Flash-based siblings for new designs.
Alternatives de remplacement direct pour MC68HC16Z3BCPV25 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC68HC16Z3VPV25
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68HC16Z3BCPV25 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Family | M68HC16 |
| Core | CPU16 (16-bit CISC) |
| Largeur du bus de données | 16-bit |
| Maximum CPU Frequency | 16 MHz (25 MHz bus for CPV25 speed grade) |
| Program Memory Type | Mask ROM |
| Program Memory Size | 4 KB (4K x 8) |
| Tension d'alimentation | 5 V (typical) |
| Boîtier | 144-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Peripherals | 16-bit Timer, QSM (SPI + SCI/UART), System Integration |
| Number of I/Os | Up to 144 user I/O pins |
| Statut RoHS | unknown |
| Lead-Free | unknown |
| Lifecycle | Obsolete (long-term stock via Rochester Electronics) |
Guide de configuration des broches du MC68HC16Z3BCPV25 144-lqfp (20x20 mm)
Configuration des broches du MC68HC16Z3BCPV25 (boîtier 144-lqfp (20x20 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC68HC16Z3BCPV25.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC68HC16Z3BCPV25 convient pour 6 applications: Automotive Powertrain Control Module (ECM), Automotive Body Control Module (BCM), Industrial Motor Drive Controller, Instrument Cluster and Driver Display, Long-Life Industrial Controller (Legacy Support), CAN/LIN Gateway and Diagnostic Bridge.
Automotive Powertrain Control Module (ECM)
The MC68HC16Z3BCPV25's CPU16 core and 16 MHz bus target automotive powertrain ECUs where deterministic interrupt response, a 16-bit data path, and the legacy M68HC11-compatible instruction set provide a familiar development environment. Engine-control algorithms (fuel injection, ignition timing, knock detection) run in the masked-ROM variant for OEM high-volume runs where NRE mask costs amortize across hundreds of thousands of units. The queued serial module (QSM) supports SPI-to-CAN gateway use with external transceivers, while the 16-bit Timer Processor Unit (TPU) drives crank/cam pattern capture without CPU load.
Recommandé
Automotive Body Control Module (BCM)
Body control modules (lighting, central locking, wipers, climate) historically used the MC68HC16Z3 family because the 144-LQFP variant provides enough I/O for switch-scan matrices and PWM actuator drivers without an external I/O expander. The on-chip 16-channel 10-bit ADC reads sensor inputs (temperature, battery voltage, current sense) while the QSM SCI/UART interfaces to LIN or K-Line body-net transceivers. Masked-ROM deployment is appropriate here because the BCM code base rarely changes once the vehicle is in production.
Recommandé
Industrial Motor Drive Controller
Industrial variable-frequency drives and servo controllers from the late 1990s and early 2000s adopted the MC68HC16Z3 because the TPU's programmable microengine handles PWM generation, quadrature decoding, and fault timing without burdening the CPU. The masked-ROM footprint makes the BCPV25 cost-effective for high-volume industrial drives produced over decades (motors, pumps, fans). The 5 V supply and 16 MHz bus keep EMC emissions predictable in industrial cabinets; the device is typically paired with isolated gate drivers and a three-phase IGBT or MOSFET bridge.
Recommandé
Instrument Cluster and Driver Display
Automotive instrument clusters combining analog gauges, tell-tale LEDs, and LCD segments were a flagship application for the MC68HC16Z3, exploiting the QSM to drive stepper-motor gauge drivers and the SPI to talk to segment LCD controllers. The 144-LQFP package fits behind the cluster PCB and supplies sufficient I/O for backlight dimming PWM, button-matrix scanning, and the diagnostic bus. Masked-ROM deployment locks in the calibration constants for OEM-specific gauge scaling.
Recommandé
Long-Life Industrial Controller (Legacy Support)
Industrial OEMs with installed bases of MC68HC16Z3BCPV25 systems - traffic controllers, medical instrumentation, factory automation - continue to source the part through Rochester Electronics for end-of-life maintenance and refurbishment. The 144-LQFP board layout is preserved across repairs, and the masked-ROM code is locked, which simplifies after-sales support because there is no firmware-update variability. For new long-life designs, OEMs typically port to the S12Z or Kinetis E families while keeping the original Z3 BOM for legacy service.
Recommandé
CAN/LIN Gateway and Diagnostic Bridge
The MC68HC16Z3's QSM provides both SPI and SCI/UART channels, which makes it a useful gateway between CAN peripherals (via external MCP2515 stand-alone CAN controllers) and a UART-based diagnostic port (K-Line, ISO 9141). The CPU16 core at 16 MHz executes gateway routing tables fast enough for in-vehicle network bridging, and the masked-ROM footprint allows OEM-calibrated diagnostic message handling to be locked at production time. Source: M68HC16Z family datasheet QSM section.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC68HC16Z3BCPV25 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC68HC16Z3VPV25 | MC68HC16Z1MAG16 |
|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | MAG-16 module - different |
| Core | CPU16 (16-bit) | CPU16 (16-bit) - same | CPU16 (16-bit) - same |
| Maximum Bus Speed | 25 MHz (CPV25 grade) | 25 MHz - same | 16 MHz - lower |
| Program Memory Type | Mask ROM (4 KB) | Flash (erasable) - higher NRE flexibility | Mask ROM - same approach |
| Production Status | Obsolete (Rochester long-term stock) | Obsolete (Rochester long-term stock) | Obsolete (Rochester long-term stock) |
Principaux différenciateurs
- Masked-ROM cost-down for OEM high-volume production (vs MC68HC16Z3VPV25)
- Highest-integration Z3 successor over Z1 (vs MC68HC16Z1MAG16)
- 144-LQFP variant maximizes on-package I/O (vs Smaller-package HC16 family members)
Notes de conception
Masked-ROM parts (BCPV suffix) cannot be re-programmed - the program is committed at wafer fabrication and any code change requires a new mask set. Use the VPV25 Flash sibling for prototypes and field updates, then mask into a BCPV25 only when the code is final and production volume justifies the NRE mask charge. Designing a single PCB footprint that accepts both variants simplifies field-repair logistics.
The 144-LQFP at 0.5 mm lead pitch demands careful SMT stencil design (laser-cut stainless steel, 4-mil thickness) and reflow profile ramps within JEDEC J-STD-020 moisture-sensitivity limits. A 4-layer PCB with dedicated GND and 5 V planes directly under the LQFP-144 thermal pad is required; the package does not have an exposed thermal pad, so heat is removed via the surrounding copper pour and GND stitching vias.
Route the 16 MHz external bus with controlled impedance (~50 ohm single-ended) and match trace lengths within 250 mil to avoid address/data skew at the 25 MHz bus rate. Place the external bus termination resistors as close as possible to the memory device end, not the MCU, to dampen reflections. BDM (Background Debug Mode) header placement should be considered at schematic capture so production boards can be software-developed in-circuit.
Informations de conformité
Original Freescale/NXP MC68HC16Z3 family predates widespread RoHS and REACH disclosure conventions; Rochester Electronics can provide a current Compliance Statement on request. AEC-Q100 sticker was not issued for this part number because the family predates widespread AEC-Q100 adoption.
