MC68332ACAG25 - 32-bit 25MHz CPU32 MCU, 144-LQFP | NXP
Référence : MC68332ACAG25 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $54.82 | $54,82 |
| 10 | $51.1 | $511,00 |
| 100 | $46.5 | $4 650,00 |
| 500 | $42 | $21 000,00 |
| 1 000 | $38.75 | $38 750,00 |
MC68332ACAG25 Présentation
Key features include a 25 MHz CPU32 core with 32-bit data and address paths, 2 KB of on-chip SRAM, a programmable 16-channel TPU for complex timing, and a QSM that provides both queued SPI and SCI/UART channels. The device is ROMless, requiring external program memory, and supports a 5 V supply. Industrial-grade parts are specified for -40C to +85C operation, while automotive AEC-Q100 parts (suffix VAG) span -40C to +125C.
The MC68332 belongs to the M68300 microcontroller family, a 32-bit evolution of the 68000 architecture. It is built from standard modules communicating over a common Intermodule Bus (IMB), which lets designers add peripherals like the CAN module (MC68376) or enhanced TPU (MC68333) by family upgrade. Architecturally, the CPU32 core is binary-compatible with the 68000 instruction set and adds multiply/accumulate instructions for DSP-like workloads.
Typical applications include automotive body and chassis ECUs (via the VAG/AEC-Q100 variants), industrial motion and motor controllers that exploit the TPU, CAN-enabled networked sensors via QSM, and embedded control requiring a deterministic real-time executive. The ROMless design is favored when designers want a single MCU platform populated with custom boot firmware or when field upgradability via external flash is required.
When designing with the MC68332, plan for a minimum external bus cycle of 4 clocks at 25 MHz (160 ns) and ensure the VCO-based clock generator is configured per the datasheet for stable operation. For new production, prefer the VAG25 (AEC-Q100) or the newer ColdFire successors because the ACAG25 industrial variant is being discontinued by NXP.
This page consolidates distributor pricing, parameter-based drop-in alternatives, and practical design notes not available from the manufacturer datasheet alone, helping engineers evaluate lifecycle risk and pin-compatible replacements for legacy designs.
Alternatives de remplacement direct pour MC68332ACAG25 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC68332ACAG25 (même facteur de forme et même empreinte) — différant par Core, Program Memory Type, Mounting Type, Package, Data Bus Width.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC68332VAG25
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68332GVAG25
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →MC68332ACAG16
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC68332GCAG25
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.1 / unité
Voir la fiche technique →MC68332AVAG25
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68332ACAG25 Valeurs maximales et caractéristiques électriques
| Core | CPU32 (68000-compatible, 32-bit) |
| Fréquence d'horloge maximale | 25 MHz |
| Program Memory Type | ROMless (external) |
| On-chip SRAM | 2 KB |
| Tension d'alimentation | 5 V |
| Plage de température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 144-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Peripheral - Communication | QSM (SPI + SCI/UART) |
| Peripheral - Timing | TPU (16-channel Time Processing Unit) |
| On-chip Bus | IMB (Intermodule Bus) |
| AEC-Q100 Qualified | Not on AC variant (VAG variant is qualified) |
| Nombre de broches | 144 |
| Statut RoHS | Compliant (lead-free finish) |
Guide de configuration des broches du MC68332ACAG25 144-lqfp (20x20 mm)
Configuration des broches du MC68332ACAG25 (boîtier 144-lqfp (20x20 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC68332ACAG25.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC68332ACAG25 convient pour 6 applications: Automotive Body Electronics ECU, Industrial Motor and Motion Control, Industrial Fieldbus and Sensor Networks, Embedded Control with Custom Firmware, Legacy Medical Instrumentation Controllers, Building Automation and HVAC Control.
Automotive Body Electronics ECU
The MC68332ACAG25's 25 MHz CPU32 core, 16-channel TPU, and QSM (SPI+SCI/UART) make it a fit for body-electronics ECUs such as seat controllers, window-lift modules, and lighting controllers. The TPU generates precise PWM signals for LED dimming and motor drive, while the QSM provides diagnostics links to the body control module. With 2 KB of on-chip SRAM plus external flash, the CPU32 handles small RTOS workloads (OSEK/VDX-class) at 25 MHz. The ACAG25 industrial grade (-40C to +85C) is suitable for cabin applications; for under-hood or chassis, migrate to the MC68332VAG25 (AEC-Q100, -40C to +125C). ROMless boot from external flash is straightforward and enables firmware updates in the field. Design tip: keep TPU channel assignments separate from SCI/primary pins to ease PCB routing.
Recommandé
Industrial Motor and Motion Control
The 16-channel TPU delivers deterministic pulse generation for stepper, BLDC, and servo motor control loops, with sub-microsecond timing accuracy at 25 MHz. CPU32 executes position-loop math, while the TPU handles low-level commutation - freeing the core for trajectory planning and PLC-style logic. The MC68332ACAG25 supports encoder feedback via TPU channels and brake control via QSM GPIO, all on the same bus. With external flash, designers keep calibration tables off-chip for easy factory tuning. For multi-axis systems, designers often parallel multiple MC68332 chips over QSM SPI. Industrial-grade ACAG25 temperature range (-40C to +85C) covers cabinet-mounted installations. Design tip: dedicate TPU channels to PWM rather than capture for the lowest interrupt jitter.
Recommandé
Industrial Fieldbus and Sensor Networks
The QSM provides SCI (asynchronous UART) and SPI synchronous channels, allowing the MC68332ACAG25 to act as a sensor-interface gateway in PROFIBUS or RS-485-based fieldbus networks. At 25 MHz, the CPU32 easily handles MODBUS-RTU, custom industrial protocols, or simple HART state machines. The ROMless design lets integrators ship firmware supporting multiple fieldbus dialects from a single hardware platform. With 2 KB on-chip SRAM, packet buffers fit comfortably; larger queue tables reside in external memory. For CAN-based networks (CANopen, DeviceNet), the ACAG25 is not the best fit - migrate to MC68376 with on-chip CAN. Design tip: use QSM SPI to a standalone CAN transceiver (e.g., MCP2515) when only one CAN bus is needed.
Recommandé
Embedded Control with Custom Firmware
The ROMless MC68332ACAG25 is favored where field upgradability, security, or proprietary firmware matters. Designers boot from external 16-bit flash, where signed firmware and anti-rollback counters can be hosted. At 25 MHz, the CPU32 executes classic RTOS kernels (pSOS, VxWorks, RTEMS) in well under 1 ms scheduling latency, and the 32-bit data path simplifies IEEE-754 single-precision math. With 144-LQFP, the chip exposes enough GPIO (15+) for keypad or LCD panels in point-of-sale and instrumentation equipment. External SRAM (typically 256 KB to 1 MB) holds stack and data. Design tip: use a watchdog-enabled external supervisor (e.g., MAX706) for fail-safe boot.
Recommandé
Legacy Medical Instrumentation Controllers
Medical device designers often preserve proven CPU32 firmware for reliability and regulatory submissions. The MC68332ACAG25's deterministic TPU generates timing-precise signals for optical sensors, motor-driven pumps, and valve controls. The QSM SPI drives ADC front-ends (e.g., 24-bit sigma-delta converters) with deterministic latency. Industrial temperature range is acceptable for controlled-environment medical equipment. The 32-bit core simplifies CRC calculation for patient-data integrity checks. For new medical designs, IEC 60730 and IEC 60601 compliance should be evaluated on the specific variant. Design tip: place external watchdog and brown-out detector external to the MCU for FDA audit clarity.
Recommandé
Building Automation and HVAC Control
The MC68332ACAG25 fits HVAC controllers that combine analog sensor inputs, relay/valve drivers, and a fieldbus uplink. The TPU generates multi-channel PWM for damper and valve actuators, while QSM SCI communicates with the building-management system over RS-485. With external flash, manufacturers can ship multi-protocol firmware (BACnet, MODBUS, LonWorks) selectable at install time. At 25 MHz, the CPU32 runs PID loops for zone temperature control and air-quality calculations in real time. Industrial-grade -40C to +85C tolerates rooftop and plant-room environments. Design tip: assign TPU channels in pairs for differential valve drive to simplify firmware.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC68332ACAG25 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC68332VAG25 | MC68332GVAG25 | MC68332ACAG16 | MC68332GCAG25 | MC68332AVAG25 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | CPU32 (68000-compatible) | CPU32 | CPU32 | CPU32 | CPU32 | CPU32 |
| Maximum Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 16 MHz (-36%) | 25 MHz | 25 MHz |
| On-chip SRAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (AEC-Q100) | -40C to +125C (AEC-Q100) | -40C to +85C | -40C to +85C | -40C to +125C (AEC-Q100) |
| AEC-Q100 Qualified | No (AC variant only) | Yes | Yes | No | No | Yes |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Principaux différenciateurs
- Industrial temperature grade without AEC-Q100 overhead (vs MC68332VAG25)
- 25 MHz CPU32 - fastest in the same-package 144-LQFP family (vs MC68332ACAG16)
- Established 68000-compatible architecture with mature toolchain (vs MC68376BG25 (newer family member))
Notes de conception
The MC68332ACAG25 requires separate Vcc (5V core logic) and Vcch (5V bus driver) rails. Per the datasheet, decouple each Vcc/Vcch pair with 100 nF + 10 uF ceramic placed within 5 mm of the pin. A bulk 47 uF tantalum or polymer on each rail handles transient response. The ROMless external-bus switching produces 200-400 mA peak transients, so the regulator must source at least 600 mA. Use a ferrite bead between Vcc and Vcch to isolate bus-switching noise from the core. Do not rely on the internal POR - add an external voltage supervisor such as MAX706 for failsafe reset.
The most common pitfalls when designing with MC68332ACAG25 are: (1) forgetting that the data bus is multiplexed on the lower address byte in some modes - use the AS and DS strobes correctly; (2) leaving the TPU initialization sequence incomplete, which disables channel outputs - always run the TPU RAM microcode upload from the firmware init; (3) using a slow flash (>=120 ns access) at 25 MHz - the bus wait-state generator must be configured for the actual flash speed. Failure to set wait states results in corrupted instruction fetches that look like random firmware bugs.
Route the 16-bit external data bus (D0-D15) and upper address lines (A0-A15) on the top layer with matched lengths (delta < 2 mm) and a ground reference plane directly underneath. The 144-LQFP has 0.5 mm pitch; use 0.15 mm trace/space rules and escape the inner pads with micro-via-in-pad if your fab supports it. Place external flash and SRAM within 25 mm of the MCU to keep bus round-trip under 20 ns. Provide a 4-layer stackup (signal-GND-power-signal) for the cleanest bus signaling. Keep TPU channels assigned to dedicated PWM outputs and route them as differential pairs when driving long motor cables.
Informations de conformité
ACAG25 variant is not AEC-Q100 qualified - choose VAG25 for automotive. RoHS compliant per NXP product page. REACH and halogen-free status not explicitly declared; verify via latest NXP PCN documentation.
