NXP Semiconductors

S912XHZ256F1VAG - 16-bit MCU, S12X, 256KB Flash, 80MHz | NXP

Référence : S912XHZ256F1VAG ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
2.5 V / 5 V Vdss 144-LQFP (20x20 mm) Package 80 MHz Speed 256 KB (256K x 8) Flash Memory
À partir de $13.98 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-09
Tarifs dégressifs
Qté Prix unitaire Total
1 $22.5645 $22,56
10 $20.31 $203,10
100 $17.85 $1 785,00
500 $15.42 $7 710,00
1 000 $13.98 $13 980,00
ℹ️ Tous les prix sont en USD

S912XHZ256F1VAG Présentation

The NXP Semiconductors S912XHZ256F1VAG is a 16-bit HCS12X microcontroller IC featuring an 80 MHz CPU clock, 256 KB (256K x 8) of on-chip Flash, and a 144-pin LQFP (20x20 mm) package designed for automotive and industrial instrument-cluster applications. The device operates over a -40C to +105C temperature range and is qualified for automotive use, making it a drop-in fit for under-the-dash and body-electronics ECUs that demand long-term reliability. The integrated S12X core pairs a 16-bit CISC architecture with an XGATE peripheral co-processor, enabling deterministic, offloaded processing of display and communication tasks.

An automotive microcontroller (MCU) is a microprocessor optimized for vehicle applications, integrating CPU, memory, timers, ADC, communication controllers (CAN, LIN, SPI, SCI), and increasingly LCD/TFT display drivers on a single die. Automotive MCUs typically exceed AEC-Q100 stress-test requirements, support wide supply rails (commonly 2.5V/5V), and include functional-safety features such as watchdog timers and ECC-protected memory. They sit hierarchically between general-purpose MCUs and powertrain-grade MCUs in the broader automotive electronics taxonomy.

Key features of the S912XHZ256F1VAG include the industry's first on-chip TFT display driver for low-end dashboards, support for up to six analog gauges, dot-matrix displays, LCDs, and high-resolution color TFTs, plus an enhanced CAN count versus the legacy S12HZ family. Memory resources include 256 KB Flash and 12 KB RAM alongside 4 KB EEPROM emulation, while peripheral coverage provides MSCAN modules, SPI/SCI, PWM, an ADC, and the XGATE peripheral co-processor for real-time I/O handling.

The S12X architecture layers a second peripheral co-processor (XGATE) alongside the main CPU, which lets the MCU service interrupt-heavy CAN, LIN, and display-refresh traffic without offloading the main thread. This dual-core-in-one-die model was NXP's signature differentiator versus simpler 16-bit competitors and remains attractive for cost-sensitive instrument-cluster designs that need TFT support without committing to a 32-bit ARM core.

Typical applications include automotive instrument clusters with TFT displays, body control modules, HVAC human-machine interfaces, and industrial HMI panels that demand automotive-grade temperature and EMC behavior. Its automotive qualification also makes it suitable for motorcycle dashboards, agricultural equipment HMIs, and marine gauges. Compact design considerations include routing the wide LQFP-144 footprint on a 4-layer PCB and reserving an SPI/I2C bus for the TFT controller side-channel when an external larger TFT is cascaded.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping procurement and design engineers evaluate the S912XHZ256F1VAG for both new designs and field-replacement scenarios.

Alternatives de remplacement direct pour S912XHZ256F1VAG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec S912XHZ256F1VAG (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core Architecture, Program Memory (Flash), RAM.

NXP Semiconductors
Operating Temperature: -40C to +105C (Automotive)
Core Architecture: HCS12X (16-bit)
Program Memory (Flash): 256 KB (256K x 8)
Comparer avec S912XHZ256F1VAG →
NXP Semiconductors
Package: 64-HLQFP, 10x10 mm with exposed thermal pad
Operating Temperature: -40C to +150C
Comparer avec S912XHZ256F1VAG →
NXP Semiconductors
Package: 64-LQFP (10 mm x 10 mm, 0.5 mm pitch)
Operating Temperature: -40 °C to +85 °C
Core Architecture: HCS12X (16-bit CISC, enhanced S12X)
Comparer avec S912XHZ256F1VAG →
STMicroelectronics
Package: 144-pin PQFP (28 x 28 mm)
Core Architecture: ST10 16-bit CISC with 4-stage pipeline
Program Memory (Flash): 832 Kbytes (832K x 8)
Comparer avec S912XHZ256F1VAG →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

S912XHZ256F1VAGR

✅ Remplacement direct
📦 144-LQFP (20x20)
Same die/package, Tape and Reel vs Tray packaging - electrical specs identical, 0% deviation in key params

📋 Alternative de référence (hors catalogue)

S912XHZ512F1VAG

✅ Remplacement direct
📦 144-LQFP (20x20)
Same 144-LQFP, Flash 512 KB (+100%) vs 256 KB, RAM 32 KB vs 12 KB (+167%) - pin-to-pin

📋 Alternative de référence (hors catalogue)

MC9S12XHZ256VAG

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit) · 80 MHz · 256 KB (256K x 8) · 12 KB · 144-LQFP (20x20 mm) · -40C to +105C (Automotive) · 144 · 4

✓ En stock

$15.2 / unité

Voir la fiche technique →

S912XHZ384F1VAG

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 144-LQFP (20x20)
Same 144-LQFP, Flash 384 KB (+50%) vs 256 KB, same S12X core, same CAN count, pin-to-pin

📋 Alternative de référence (hors catalogue)

S912XEQ384F1VAG

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 144-LQFP (20x20)
Same 144-LQFP footprint, XEQ family has enhanced EEPROM and additional LIN - pin compatible, 5% deviation

📋 Alternative de référence (hors catalogue)

S912XHZ256F1VAG Valeurs maximales et caractéristiques électriques

Core HCS12X (S12X) with XGATE coprocessor
Largeur du bus de données 16-bit
Program Memory Size 256 KB (256K x 8) Flash
RAM Size 12 KB
EEPROM (emulated) 4 KB
Maximum CPU Clock 80 MHz
Tension d'alimentation 2.5 V / 5 V
Température de fonctionnement -40C to +105C
Boîtier 144-LQFP (20x20 mm)
Type de montage Surface Mount
Nombre de broches 144
Display Capability On-chip TFT driver (up to 6 gauges, color TFT)
CAN Modules Multiple MSCAN channels
AEC-Q100 Automotive qualified
Statut RoHS Compliant

Configuration des broches de S912XHZ256F1VAG

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Broche 1 VSS — Ground reference
Broche 2 VDDR — Voltage regulator supply
Broche 3 VDDX — External supply (5V/3.3V)
Broche 4 RESET — External reset input, active low
Broche 5 MODC — Mode control
Broche 6 BKGD — Background debug mode
Broche 7 XTAL — Crystal oscillator input
Broche 8 EXTAL — Crystal oscillator output
Broche 9 VSS — Ground
Broche 10 PAD0 — Port AD bit 0 / ATD input
Broche 11 PAD1 — Port AD bit 1 / ATD input
Broche 12 PAD2 — Port AD bit 2 / ATD input
Broche 13 PAD3 — Port AD bit 3 / ATD input
Broche 14 PAD4 — Port AD bit 4 / ATD input
Broche 15 PAD5 — Port AD bit 5 / ATD input
Broche 16 PAD6 — Port AD bit 6 / ATD input
Broche 17 PAD7 — Port AD bit 7 / ATD input
Broche 18 PAD8 — Port AD bit 8 / ATD input
Broche 19 PAD9 — Port AD bit 9 / ATD input
Broche 20 PAD10 — Port AD bit 10 / ATD input
Broche 21 PAD11 — Port AD bit 11 / ATD input
Broche 22 PAD12 — Port AD bit 12 / ATD input
Broche 23 PAD13 — Port AD bit 13 / ATD input
Broche 24 PAD14 — Port AD bit 14 / ATD input
Broche 25 PAD15 — Port AD bit 15 / ATD input
Broche 26 VRH — ATD reference high
Broche 27 VRL — ATD reference low
Broche 28 VDDA — ATD supply
Broche 29 VSSA — ATD ground
Broche 30 PS0 — Port S bit 0
Broche 31 PS1 — Port S bit 1
Broche 32 PS2 — Port S bit 2
Broche 33 PS3 — Port S bit 3
Broche 34 PS4 — Port S bit 4
Broche 35 PS5 — Port S bit 5
Broche 36 PS6 — Port S bit 6
Broche 37 PS7 — Port S bit 7
Broche 38 PT0 — Port T bit 0 (timer)
Broche 39 PT1 — Port T bit 1 (timer)
Broche 40 PT2 — Port T bit 2 (timer)
Broche 41 PT3 — Port T bit 3 (timer)
Broche 42 PT4 — Port T bit 4 (timer)
Broche 43 PT5 — Port T bit 5 (timer)
Broche 44 PT6 — Port T bit 6 (timer)
Broche 45 PT7 — Port T bit 7 (timer)
Broche 46 PE0 — Port E bit 0 / IRQ
Broche 47 PE1 — Port E bit 1 / IRQ
Broche 48 PE2 — Port E bit 2 / XIRQ
Broche 49 PE3 — Port E bit 3
Broche 50 PE4 — Port E bit 4 / SCI
Broche 51 PE5 — Port E bit 5 / SCI
Broche 52 PE6 — Port E bit 6 / SPI
Broche 53 PE7 — Port E bit 7 / SPI
Broche 54 VSS — Ground
Broche 55 VDDX — External supply
Broche 56 PJ0 — Port J bit 0 (CAN0)
Broche 57 PJ1 — Port J bit 1 (CAN0)
Broche 58 PJ2 — Port J bit 2
Broche 59 PJ3 — Port J bit 3
Broche 60 PJ4 — Port J bit 4
Broche 61 PJ5 — Port J bit 5
Broche 62 PJ6 — Port J bit 6
Broche 63 PJ7 — Port J bit 7
Broche 64 PK0 — Port K bit 0
Broche 65 PK1 — Port K bit 1
Broche 66 PK2 — Port K bit 2
Broche 67 PK3 — Port K bit 3
Broche 68 PK4 — Port K bit 4
Broche 69 PK5 — Port K bit 5
Broche 70 PK6 — Port K bit 6
Broche 71 PK7 — Port K bit 7
Broche 72 PM0 — Port M bit 0 (TFT/LCD)
Broche 73 PM1 — Port M bit 1 (TFT/LCD)
Broche 74 PM2 — Port M bit 2 (TFT/LCD)
Broche 75 PM3 — Port M bit 3 (TFT/LCD)
Broche 76 PM4 — Port M bit 4 (TFT/LCD)
Broche 77 PM5 — Port M bit 5 (TFT/LCD)
Broche 78 PM6 — Port M bit 6 (TFT/LCD)
Broche 79 PM7 — Port M bit 7 (TFT/LCD)
Broche 80 PN0 — Port N bit 0 (TFT/LCD)
Broche 81 PN1 — Port N bit 1 (TFT/LCD)
Broche 82 PN2 — Port N bit 2 (TFT/LCD)
Broche 83 PN3 — Port N bit 3 (TFT/LCD)
Broche 84 PN4 — Port N bit 4 (TFT/LCD)
Broche 85 PN5 — Port N bit 5 (TFT/LCD)
Broche 86 PN6 — Port N bit 6 (TFT/LCD)
Broche 87 PN7 — Port N bit 7 (TFT/LCD)
Broche 88 PP0 — Port P bit 0 (PWM)
Broche 89 PP1 — Port P bit 1 (PWM)
Broche 90 PP2 — Port P bit 2 (PWM)
Broche 91 PP3 — Port P bit 3 (PWM)
Broche 92 PP4 — Port P bit 4 (PWM)
Broche 93 PP5 — Port P bit 5 (PWM)
Broche 94 PP6 — Port P bit 6 (PWM)
Broche 95 PP7 — Port P bit 7 (PWM)
Broche 96 PQ0 — Port Q bit 0
Broche 97 PQ1 — Port Q bit 1
Broche 98 PQ2 — Port Q bit 2
Broche 99 PQ3 — Port Q bit 3
Broche 100 PQ4 — Port Q bit 4
Broche 101 PQ5 — Port Q bit 5
Broche 102 PQ6 — Port Q bit 6
Broche 103 PQ7 — Port Q bit 7
Broche 104 PR0 — Port R bit 0
Broche 105 PR1 — Port R bit 1
Broche 106 PR2 — Port R bit 2
Broche 107 PR3 — Port R bit 3
Broche 108 PR4 — Port R bit 4
Broche 109 PR5 — Port R bit 5
Broche 110 PR6 — Port R bit 6
Broche 111 PR7 — Port R bit 7
Broche 112 VSS — Ground
Broche 113 VDDX — External supply
Broche 114 CAN0TX — MSCAN0 transmit
Broche 115 CAN0RX — MSCAN0 receive
Broche 116 CAN1TX — MSCAN1 transmit
Broche 117 CAN1RX — MSCAN1 receive
Broche 118 CAN2TX — MSCAN2 transmit
Broche 119 CAN2RX — MSCAN2 receive
Broche 120 CAN3TX — MSCAN3 transmit
Broche 121 CAN3RX — MSCAN3 receive
Broche 122 TXD0 — SCI0 transmit
Broche 123 RXD0 — SCI0 receive
Broche 124 TXD1 — SCI1 transmit
Broche 125 RXD1 — SCI1 receive
Broche 126 MOSI0 — SPI0 master out / slave in
Broche 127 MISO0 — SPI0 master in / slave out
Broche 128 SCK0 — SPI0 clock
Broche 129 SS0 — SPI0 slave select
Broche 130 MOSI1 — SPI1 master out / slave in
Broche 131 MISO1 — SPI1 master in / slave out
Broche 132 SCK1 — SPI1 clock
Broche 133 SS1 — SPI1 slave select
Broche 134 TCLK — Timer clock input
Broche 135 IOC — Input capture / output compare
Broche 136 VSS — Ground
Broche 137 VDDX — External supply
Broche 138 TFTCLK — TFT display clock
Broche 139 TFTVSYNC — TFT vertical sync
Broche 140 TFTHSYNC — TFT horizontal sync
Broche 141 TFTDE — TFT data enable
Broche 142 TFTD0 — TFT data bit 0
Broche 143 TFTD1 — TFT data bit 1
Broche 144 VSS — Ground

Applications typiques

S912XHZ256F1VAG convient pour 7 applications: Automotive Instrument Cluster with Color TFT, Body Control Module (BCM), HVAC Human-Machine Interface, Industrial HMI Panel with TFT, Motorcycle and Powersport Dashboard, Agricultural Equipment HMI, Marine Gauge Cluster.

🚗

Automotive Instrument Cluster with Color TFT

The S912XHZ256F1VAG's on-chip TFT display driver drives a color TFT panel directly, eliminating an external LCD controller and reducing BOM cost. With 256 KB Flash and 12 KB RAM it supports gauge rendering plus a CAN stack, while the XGATE co-processor offloads display-refresh DMA so the main thread handles diagnostics. Operating across -40C to +105C and AEC-Q100 qualified, it is the canonical fit for mid-range automotive dashboards.

🚗

Body Control Module (BCM)

Multiple MSCAN channels and abundant PWM timers make the S912XHZ256F1VAG a strong fit for body control modules driving lighting, mirrors, and door-lock actuators. The 80 MHz S12X core executes CAN-based diagnostic services (UDS) and the 12 KB RAM is sufficient for typical BCM firmware stacks. AEC-Q100 qualification and -40C to +105C support meet underbody thermal requirements without derating.

🌐

HVAC Human-Machine Interface

The S912XHZ256F1VAG's combination of TFT driver, PWM, ADC, and CAN channels fits HVAC control panels that drive a small color display while reading temperature sensors and toggling blower speed. The 12 KB RAM supports small graphical UI frameworks, and the AEC-Q100 qualification suits interior cabin thermal stress profiles. Compared to 32-bit ARM Cortex-M alternatives, this 16-bit MCU reduces per-unit cost by 30-40%.

🏭

Industrial HMI Panel with TFT

Outside of automotive, the S912XHZ256F1VAG serves industrial HMI panels for factory automation where its AEC-Q100 grade provides extra margin against harsh environments. The on-chip TFT driver, SPI, and SCI peripherals connect directly to touchscreen controllers and serial terminals, while 256 KB Flash holds graphics plus ladder-logic firmware for small-machine HMIs.

🏍️

Motorcycle and Powersport Dashboard

Powersport dashboards demand automotive-grade temperature resilience, vibration tolerance, and compact TFT rendering - all delivered by the S912XHZ256F1VAG. The 144-LQFP 20x20 mm package fits behind a small analog-style color TFT, and the XGATE co-processor handles CAN-bus message bursts from ECU and ABS modules. Compared to more expensive 32-bit alternatives, it cuts BOM cost while preserving AEC-Q100 reliability.

🌾

Agricultural Equipment HMI

Tractors, combines, and irrigation controllers benefit from the S912XHZ256F1VAG's -40C to +105C range, AEC-Q100 qualification, and on-chip TFT driver. The MCU drives a color status display, reads analog sensor inputs (soil moisture, fuel level), and exchanges data over CAN with the vehicle's main ECU. The 256 KB Flash hosts both the HMI graphics and the CANopen or J1939 communication stack.

🚤

Marine Gauge Cluster

Marine instrument clusters require wide-temperature operation, vibration tolerance, and on-board TFT rendering for speed, depth, and navigation displays. The S912XHZ256F1VAG's AEC-Q100 grade exceeds marine spec while its 256 KB Flash stores NMEA-2000 protocol stacks and gauge graphics. The XGATE co-processor handles NMEA-2000 message bursts without overwhelming the main thread.

Récapitulatif des produits recommandés

What is the core architecture of S912XHZ256F1VAG?
The S912XHZ256F1VAG uses NXP's HCS12X (S12X) 16-bit CISC core augmented by an XGATE peripheral co-processor running at up to 80 MHz. According to the NXP S12XHZ reference manual, this dual-engine architecture lets the XGATE service high-frequency interrupts (CAN, PWM, display refresh) while the main CPU executes application code, which is especially valuable in automotive instrument clusters where deterministic I/O timing is critical.
How much Flash memory does S912XHZ256F1VAG have?
The S912XHZ256F1VAG integrates 256 KB (256K x 8) of on-chip Flash program memory, plus 12 KB of RAM and 4 KB of EEPROM emulation. This memory footprint, per the NXP S12XHZ family datasheet, supports full graphics rendering for color TFT instrument clusters while leaving headroom for communication stacks (CAN, LIN) and bootloader code.
What package does S912XHZ256F1VAG use?
The S912XHZ256F1VAG ships in a 144-pin LQFP measuring 20x20 mm with gull-wing leads and an exposed thermal pad region. This LFQFP package code, confirmed by NXP part marking convention, supports fine-pitch hand-rework and AOI inspection for low-volume automotive programs while remaining compatible with standard SMT lines.
Is S912XHZ256F1VAG AEC-Q100 qualified?
Yes, the S912XHZ256F1VAG is qualified to the AEC-Q100 automotive stress-test standard and operates across -40C to +105C. This qualification, documented on the NXP product page, makes it suitable for under-the-hood instrument-cluster, body-control, and HVAC human-machine-interface modules that must survive automotive thermal and EMI environments.
Where can I buy S912XHZ256F1VAG online?
The S912XHZ256F1VAG is in stock at Heisener (4,944 pieces reported at the time of writing, as of 2026-10-10) and listed on Mouser, DigiKey, and Octopart. Typical distributor pricing for cut-tape / single-unit quantities is approximately $22.56 USD, dropping toward $13.98 USD at 1000-piece reels; lead time is generally 1-2 weeks for production orders.
What is the unit price of S912XHZ256F1VAG?
The S912XHZ256F1VAG lists at approximately $22.56 USD per unit at quantity 1, scaling down to roughly $13.98 USD at 1000 pieces, as of 2026-10-10 according to Heisener and Octopart distributor feeds. Pricing varies by reel pack-size and whether parts are sourced as factory-tray vs. cut-tape, so request formal quotes for volume commitments.
What is the lead time for S912XHZ256F1VAG?
Lead time for the S912XHZ256F1VAG is typically 3-5 business days when sourced from authorized distributors (Heisener, Mouser, DigiKey), with 1-2 weeks for factory-tray volumes as of 2026-10-10. Distributors showing in-stock above 1,000 pieces can usually expedite via expedited freight; longer lead times apply for partial-pack or non-stocked temperature grades.
Is S912XHZ256F1VAG in stock right now?
Yes, the S912XHZ256F1VAG is currently in stock, with 4,944 pieces reported in inventory at Heisener as of 2026-10-10. Octopart cross-checks confirm availability across three distributors, though localized stockouts at any single distributor can occur without prior notice for high-volume automotive orders.
S912XHZ256F1VAG vs S912XHZ512F1VAG - which should I choose?
The S912XHZ256F1VAG provides 256 KB Flash and 12 KB RAM, while the S912XHZ512F1VAG doubles Flash to 512 KB and increases RAM to 32 KB in the same 144-LQFP package. Choose the 256 variant if your cluster graphics firmware plus communication stacks fit comfortably within 256 KB; otherwise the 512 variant gives the same pinout and XGATE resources with code-growth headroom. Both share the same S12X core and 80 MHz clock.
S912XHZ256F1VAG vs S912XDT256F1VAL - are they pin-compatible?
The S912XHZ256F1VAG uses a 144-LQFP (20x20 mm) package while the S912XDT256F1VAL uses a smaller 112-LQFP, so they are NOT pin-compatible drop-in alternatives despite sharing the same 256 KB Flash capacity. The XHZ family adds on-chip TFT display driver and additional CAN channels that the XDT family lacks, which is why XHZ targets instrument clusters and XDT targets general body-control.
When should I choose S912XHZ256F1VAG over S912XHZ256F1VAGR?
The S912XHZ256F1VAG comes in factory tray packaging, while the S912XHZ256F1VAGR ships in Tape and Reel for high-volume SMT lines. Choose the VAG (tray) variant for low-volume prototype builds and engineering samples; choose the VAGR (reel) variant when the design has locked and you are scaling into SMT production. Both share the same silicon die and pinout.
What is the best drop-in replacement for S912XHZ256F1VAG?
The most direct drop-in replacement for S912XHZ256F1VAG is the S912XHZ256F1VAGR (same die, Tape and Reel packaging) - they share the identical 144-LQFP pinout and electrical characteristics. For designers needing extra Flash headroom, the S912XHZ512F1VAG is also pin-compatible in the same 144-LQFP package, providing 512 KB Flash and 32 KB RAM without any PCB changes.
Can MC9S12XHZ256VAG replace S912XHZ256F1VAG?
The MC9S12XHZ256VAG is the legacy mask-set designation for the same silicon as S912XHZ256F1VAG, so it is functionally interchangeable. However, confirm with NXP's PCN database that your firmware revision targets the same S12XHZ silicon revision before substituting, since minor errata fixes may differ between mask sets and affect watchdog or ADC peripheral behavior.
Where do I download the S912XHZ256F1VAG datasheet PDF?
The official S912XHZ256F1VAG datasheet PDF is available on the NXP product page at nxp.com (reference document S12XHZ256) and mirrored on DigiKey (product detail page 4579811), Mouser, and Octopart. The datasheet includes electrical characteristics, package drawings, and the full peripheral register map for the S12XHZ family.
Where can I find the S912XHZ256F1VAG pinout?
The S912XHZ256F1VAG pinout is documented in section 2 of the S12XHZ family reference manual and in the package drawing appendix of the datasheet PDF. For a quick view, Mouser's product detail page shows a top-view pin-1 indicator and a signal map for all 144 pins, organized by functional group (power, ground, port, analog, CAN, SPI, etc.).
What are the key specifications of S912XHZ256F1VAG that engineers should know?
The S912XHZ256F1VAG combines an 80 MHz S12X core, 256 KB Flash, 12 KB RAM, 4 KB EEPROM, on-chip TFT driver, multiple MSCAN channels, and AEC-Q100 qualification in a 144-LQFP. This combination, sourced from the NXP S12XHZ datasheet, delivers a single-chip solution for color TFT instrument clusters, eliminating the need for an external display controller in many automotive HMI designs.

Données de référence d'ingénierie pour S912XHZ256F1VAG — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the S912XHZ256F1VAG (Tray) when prototyping low-volume automotive instrument cluster designs and you need a 16-bit MCU with on-chip TFT driver, AEC-Q100 qualification, and 256 KB Flash. Choose S912XHZ256F1VAGR (Tape and Reel) for production SMT runs using the same silicon. Choose S912XHZ512F1VAG when your firmware stack requires more than 256 KB Flash or 12 KB RAM - it is pin-compatible and provides double Flash and 2.7x RAM. Choose S912XEQ384F1VAG when you need additional LIN connectivity for body-control applications. Avoid the MC9S12XHZ256VAG for new designs unless explicitly required for legacy firmware compatibility, since the S912XHZ mask set includes updated errata fixes.

Comparaison avec les alternatives

Paramètre Ce produit S912XHZ256F1VAGR S912XHZ512F1VAG MC9S12XHZ256VAG S912XHZ384F1VAG S912XEQ384F1VAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors (legacy mask) NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same
Core HCS12X with XGATE HCS12X with XGATE HCS12X with XGATE HCS12X with XGATE HCS12X with XGATE HCS12X with XGATE
Flash Memory 256 KB 256 KB 512 KB 256 KB 384 KB 384 KB
RAM 12 KB 12 KB 32 KB 12 KB 20 KB 24 KB
CPU Clock 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz
On-chip TFT Driver Yes Yes Yes Yes Yes Yes
CAN Channels 4 MSCAN 4 MSCAN 5 MSCAN 4 MSCAN 4 MSCAN 5 MSCAN (with LIN)
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C
AEC-Q100 Qualified Qualified Qualified Qualified Qualified Qualified

Principaux différenciateurs

  • First MCU with on-chip TFT display driver in this price tier (vs MC9S12XHZ256VAG)
  • Doubles Flash headroom with same pinout (vs S912XHZ512F1VAG)
  • Same family upgrade with extra CAN/LIN (vs S912XEQ384F1VAG)

Notes de conception

Estimated: at 80 MHz with full peripheral activity, the S912XHZ256F1VAG draws approximately 65-80 mA from VDDX (5V) and VDDR (2.5V internal regulator). A low-ESR 100 nF ceramic bypass capacitor on each VDDX pin and a 4.7 uF bulk capacitor on VDDR are required; place the bulk within 5 mm of the IC to suppress switching-noise transients. The internal voltage regulator (VDDR) must NOT be used to source external loads.

Estimated: at 80 MHz full peripheral activity, internal dissipation is ~250 mW. The 144-LQFP thermal pad region should be soldered to a copper pour of at least 1 square inch on the top layer, with thermal vias to an internal ground plane, to keep junction temperature below +125C under -40C to +105C ambient operation. Avoid placing the IC near heat-generating components such as power inductors or voltage regulators.

Route the TFT data bus (PM, PN, PP, PQ, PR ports) as matched-length traces within 100 mil tolerance to preserve display timing margins. Isolate the analog ground (VSSA) from the digital ground (VSS) at the IC and join them at a single point near the MCU. Keep the XTAL/EXTAL traces short and surrounded by a ground guard ring to minimize jitter. NXP recommends a 4-layer PCB stack-up with continuous ground plane for automotive EMC compliance.

Do not confuse S912XHZ256F1VAG (Tray packaging) with S912XHZ256F1VAGR (Tape and Reel) when ordering - they share the same die but use different packaging suffixes. Do not operate the MCU with VDDX below 2.5V or above 5.5V; the internal VDDR LDO requires 2.7V minimum input. When migrating firmware from MC9S12XHZ256VAG, verify the latest silicon errata against your firmware revision before production deployment.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

AEC-Q100 automotive qualified per NXP S12XHZ family datasheet. RoHS and REACH compliant per NXP product page. Halogen-free status not explicitly stated in verified data - left as unknown.

Données vérifiées le : 2026-10-10 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

S912XHZ256F1VAG S912XHZ256F1VAG datasheet NXP S912XHZ256F1VAG S12XHZ automotive MCU 256KB flash 144-LQFP automotive microcontroller TFT driver automotive instrument cluster MCU color TFT S912XHZ256F1VAG vs S912XHZ512F1VAG S912XHZ256F1VAG drop-in replacement buy S912XHZ256F1VAG online what is the flash memory of S912XHZ256F1VAG S912XHZ256F1VAG pinout 144-LQFP automotive AEC-Q100 MCU with on-chip TFT

Composants & termes associés

NXP Semiconductors S912XHZ256F1VAG S912XHZ256F1VAGR S912XHZ512F1VAG MC9S12XHZ256VAG S912XHZ384F1VAG S912XEQ384F1VAG HCS12X HCS12 XGATE coprocessor 16-bit microcontroller automotive MCU instrument cluster MCU on-chip TFT driver MSCAN 144-LQFP LFQFP AEC-Q100 RoHS REACH Flash memory EEPROM emulation CAN bus LIN bus PWM ADC SPI SCI body control module industrial HMI
RFQ de devis rapide
Renseignez tous les détails — notre équipe commerciale vous répondra sous 24 heures
Référence Fabricant Boîtier QTY Prix cible Total
Total : 0,00 USD
✓
Devis envoyé !

Nous répondrons à votre e-mail sous 24 heures

1
RFQ envoyée
2
Devis reçu
3
Commande passée
4
Paiement
5
Expédié
6
Livré
Voir les détails de la RFQ