MC8641DVU1000GE - Dual 1GHz e600 SoC, 1023-FCBGA | NXP
Référence : MC8641DVU1000GE ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $410.64 | $410,64 |
| 10 | $380.5 | $3 805,00 |
| 100 | $345.2 | $34 520,00 |
| 500 | $318 | $159 000,00 |
| 1 000 | $295.5 | $295 500,00 |
MC8641DVU1000GE Présentation
What is a dual-core Power Architecture SoC? A SoC (System-on-Chip) integrates CPU cores, memory controllers, and high-speed I/O into one silicon device, replacing what previously required a separate CPU, chipset, and I/O bridge. The MPC86xx family extends the classic PowerPC e600 core into multi-core, integrated variants, positioning the SoC above discrete microprocessor solutions and below ASSPs in the embedded-compute hierarchy: MPU -> embedded MPU -> SoC -> multiprocessor SoC. This makes the MC8641DVU1000GE ideal for designs that previously required two companion I/O bridge chips.
Key features include two e600 cores each issuing up to three instructions per cycle through a compact 7-stage pipeline, hardware virtualization support, 32 KB L1 instruction and data caches per core, a unified 1 MB backside L2 cache, integrated DDR1/DDR2 controller with ECC, four 10/100/1000 Mb/s Ethernet MACs, two x4 PCIe endpoints/RCs, two Serial RapidIO ports, and a Security Engine for accelerated cryptography. The e600 core's AltiVec unit performs 128-bit vector operations, making the SoC well suited to signal-processing workloads.
The architecture integrates the memory controller and I/O bridges directly onto the die, reducing board complexity and BOM versus discrete MPU+bridge designs. Voltage is 1.05 V core, with separate rails for I/O and DDR. Thermal envelope is 0 to 105 C junction. Part number suffix conventions: 'D' denotes dual-core, 'V' denotes the standard speed grade, 'U' denotes the FCBGA package, '1000' is the 1.0 GHz core frequency, 'G' indicates Pb-free, and 'E' is the extended temperature grade.
Typical applications include industrial routers and switches, defense/aerospace signal processing, telecom line cards, medical imaging, military/aerospace embedded compute, and high-end imaging. The dual GbE and dual SRIO ports specifically suit line-card and base-station designs where multiple deterministic fabrics are required.
When designing with the MC8641DVU1000GE, allocate generous PCB area for the 33 x 33 mm FCBGA, follow NXP layout guidelines for DDR2 trace matching, and provide adequate bulk decoupling near each power rail. Signal integrity on the SRIO and PCIe links requires controlled-impedance routing and length matching per the device reference manual.
This page consolidates distributor pricing, drop-in same-package alternatives, and practical design notes not found in a single datasheet chapter.
Alternatives de remplacement direct pour MC8641DVU1000GE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC8641DVU1000GE (même facteur de forme et même empreinte) — différant par Package, Ethernet, PCI Express, Operating Temperature, Memory Controller.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC8641DTVU1000GE
✅ Remplacement direct✓ En stock
$295 / unité
Voir la fiche technique →MC8641VU1000NE
✅ Remplacement direct✓ En stock
$165 / unité
Voir la fiche technique →MC8641DHX1500KE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC8640DTVJ1250HE
✅ Remplacement direct✓ En stock
$439.13 / unité
Voir la fiche technique →MC8641DVU1000GE Valeurs maximales et caractéristiques électriques
| Processor Type | PowerPC e600 MPC86xx 32-Bit |
| Core Count | 2 (dual-core) |
| Core Architecture | Power Architecture, superscalar, 7-stage pipeline |
| Core Frequency | 1.0 GHz |
| Maximum Core Frequency | Up to 1.5 GHz (family max) |
| Core Supply Voltage | 1.05 V |
| SIMD Engine | AltiVec (128-bit vector unit) |
| L1 Cache | 32 KB instruction + 32 KB data per core |
| L2 Cache | 1 MB unified backside |
| Memory Controller | DDR1 / DDR2 with ECC |
| Ethernet | 4 x 10/100/1000 Mbps MAC |
| PCI Express | 2 x PCIe interfaces |
| Serial RapidIO | 2 x SRIO ports |
| Boîtier | 1023-ball FCCBGA (33 x 33 mm) |
| Température de fonctionnement | 0 C to +105 C |
| Silicon Revision | Rev 3.0 |
Guide de configuration des broches du MC8641DVU1000GE 1023-ball fccbga (33 x 33 mm)
Configuration des broches du MC8641DVU1000GE (boîtier 1023-ball fccbga (33 x 33 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC8641DVU1000GE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC8641DVU1000GE convient pour 6 applications: Industrial Routers and Switches, Telecom Line Cards and Base Stations, Defense and Aerospace Embedded Compute, Medical Imaging Systems, High-End Industrial Imaging and Machine Vision, Print and Imaging Controllers.
Industrial Routers and Switches
The MC8641DVU1000GE integrates four Gigabit Ethernet MACs alongside dual PCIe and dual Serial RapidIO, eliminating companion bridge chips and reducing BOM cost. At 1.0 GHz dual-core the SoC can run a full IP routing stack plus control-plane protocols concurrently with deterministic throughput on the SRIO fabric. The 0 to +105 C industrial temperature envelope and DDR2 ECC support suit fanless outdoor and industrial-cabinet installations.
Recommandé
Telecom Line Cards and Base Stations
The dual Serial RapidIO ports combined with dual PCIe and four GbE MACs match the fabric and backplane architecture of UMTS/LTE base-station line cards. The AltiVec SIMD unit accelerates PHY-layer DSP blocks, while the integrated Security Engine offloads encryption for backhaul links. The 1023-ball FCCBGA package enables dense line-card layouts where multiple SoCs share a single backplane fabric.
Recommandé
Defense and Aerospace Embedded Compute
The extended 0 to +105 C industrial temperature range, dual-core redundancy options, and ECC-protected DDR2 controller make the MC8641DVU1000GE suitable for ruggedized defense and aerospace compute subsystems. The AltiVec unit accelerates radar and EW signal-processing pipelines, while the integrated Security Engine enables secure boot and encrypted communications required by modern defense platforms.
Recommandé
Medical Imaging Systems
Dual 1.0 GHz e600 cores plus AltiVec SIMD deliver the parallel throughput needed for real-time CT, MRI, and ultrasound image reconstruction. DDR2 with ECC protects patient-data integrity, while fanless operation suits sterile medical environments. The four GbE MACs enable high-bandwidth network-attached imaging consoles and DICOM transfer to PACS servers.
Recommandé
High-End Industrial Imaging and Machine Vision
Dual GbE MACs paired with dual PCIe make the MC8641DVU1000GE well suited to multi-camera industrial vision systems where Camera Link, CoaXPress, or GigE Vision feeds must be processed and forwarded in real time. The AltiVec unit accelerates pixel-level processing pipelines, and the deterministic L2 cache latency supports deterministic vision-cycle timing for quality-control inspection lines.
Recommandé
Print and Imaging Controllers
High-end production print engines require deterministic real-time scheduling of multiple data streams while simultaneously running the controller firmware stack. The dual e600 cores provide separation between real-time print-pipeline control and management-plane software, and the integrated PCIe and GbE MACs interface directly to host networks and page-description-language accelerators.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC8641DVU1000GE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC8641DTVU1000GE | MC8641VU1000NE | MC8641DHX1500KE | MC8640DTVJ1250HE |
|---|---|---|---|---|---|
| Package | 1023-ball FCCBGA (33 x 33 mm) | 1023-ball FCCBGA (33 x 33 mm) - same | 1023-ball FCCBGA family - same footprint | 1023-ball FCCBGA family - same footprint | 1023-ball FCCBGA family - same footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 (dual-core) | 2 (dual-core) | 1 (single-core) | 2 (dual-core) | 2 (dual-core) |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.5 GHz | 1.25 GHz |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Ethernet MACs | 4 x GbE | 4 x GbE | 4 x GbE | 4 x GbE | 4 x GbE |
| PCI Express / SRIO | 2 x PCIe + 2 x SRIO | 2 x PCIe + 2 x SRIO | 2 x PCIe + 2 x SRIO | 2 x PCIe + 2 x SRIO | 2 x PCIe + 2 x SRIO |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- Drop-in dual-core variant with identical 1.0 GHz frequency (vs MC8641DTVU1000GE)
- Higher throughput per dollar in dual-core configuration (vs MC8641VU1000NE)
- Lower frequency, lower power envelope at same integration (vs MC8641DHX1500KE)
Notes de conception
The MC8641DVU1000GE is rated for a 0 to +105 C junction temperature envelope and integrates significant on-die logic including dual e600 cores, DDR controller, and multiple high-speed I/O PHYs. Designers must compute total power dissipation from the family reference manual power tables and verify that the system thermal resistance (theta-JA + heatsink) keeps junction temperature below 105 C under worst-case ambient. Forced airflow is typically required in dense line-card and base-station layouts.
The 1023-ball FCCBGA at 33 x 33 mm requires a multi-layer PCB (typically 8+ layers) with microvia stack-ups and matched-length DDR2 trace routing. Follow NXP's MPC8641D hardware design guidelines for trace impedance (50 ohm nominal for single-ended, 100 ohm differential for PCIe/SRIO), DDR2 VTT termination, and reference-voltage decoupling. Land pattern should be solder-mask-defined per the package drawing.
Route SRIO and PCIe differential pairs on inner stripline layers with continuous reference planes to maintain 100 ohm differential impedance and minimize crosstalk. Keep at least 4x dielectric spacing between aggressor and victim pairs. Length-match within the tolerance specified in the reference manual per lane. Place AC-coupling capacitors as close to the SoC balls as the breakout allows.
Avoid substituting the MC8641DVU1000GE with single-core variants (e.g., MC8641VU1000NE) in multi-threaded firmware without re-validating real-time scheduling. The dual-core D variants expose two private L1 caches and a shared L2; software partitioning assumptions break on single-core silicon. Also verify that the supply-rail sequencing in the reference manual is observed during power-up to avoid latch-up.
Informations de conformité
Pb-free per the 'G' suffix in the orderable part number. RoHS compliance per NXP product page. AEC-Q100 not applicable for this industrial/defense MPU grade.
