MC8640DTVJ1250HE - Dual-Core 1.25GHz PowerPC e600 SoC | NXP
MPN: MC8640DTVJ1250HE ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $731.88 | $731.88 |
| 10 | $658.69 | $6,586.90 |
| 100 | $585.5 | $58,550.00 |
| 500 | $512.31 | $256,155.00 |
| 1,000 | $439.13 | $439,130.00 |
MC8640DTVJ1250HE Overview
A microprocessor SoC (System-on-Chip) integrates one or more CPU cores, memory controllers, and I/O peripherals onto a single silicon die, replacing what would otherwise require a discrete chipset. The MC8640D family sits in the high-performance tier of NXP's PowerPC QorIQ portfolio, providing a multi-core embedded computing platform for line-rate packet processing and signal aggregation where deterministic performance and long-life industrial-grade reliability are mandatory.
Key features include two PowerPC e600 cores with AltiVec vector processing, integrated DDR1/DDR2 controller with ECC, four Gigabit Ethernet ports, dual PCI Express controllers, dual Serial RapidIO ports, dual DMA engines, and -40C to +105C industrial operating temperature range. The 1023-ball FCCBGA package provides high I/O density required for the integrated peripheral set.
Architecturally, the MC8640D leverages the e600 core, which combines a 32-bit PowerPC instruction set with AltiVec SIMD extensions, delivering strong performance per watt for data-plane workloads. The integrated northbridge-style memory controller reduces external chipset cost and latency, while the high-bandwidth SerDes fabric supports multiple concurrent high-speed links.
Typical applications include embedded networking routers and switches, telecom base-station controllers, aerospace and defense signal-processing platforms, RAID storage controllers, industrial automation, and high-performance computing appliances. The wide industrial temperature range and long-term NXP product support make it suitable for long-life programs requiring 10+ year supply continuity.
When designing with the MC8640DTVJ1250HE, allocate proper PCB layer count for the FCCBGA escape routing - typically 8 to 12 layers with microvia stackups - and provide matched-length impedance control for the SerDes lanes. The industrial-grade junction temperature window permits fanless or conduction-cooled deployments.
This page consolidates distributor pricing, drop-in alternative cross-references, and practical design guidance not found in the manufacturer datasheet alone, helping engineers verify second sources and design-in decisions for long-lifecycle embedded systems.
Drop-in alternatives for MC8640DTVJ1250HE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC8640DTVJ1250HE (same form factor and footprint) — differing in Ethernet, Operating Temperature, Core Architecture, Package, Core Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC8640DTVJ1066HE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8640DTVJ1500HE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8640DTHX1250HE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8640VJ1000HE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8641DHX1250HE
✅ Drop-In📋 Reference alternative (not in catalog)
MC8640DTVJ1250HE Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e600 |
| Number of Cores | 2 |
| Core Frequency | 1.25 GHz (per core, 2 x 1.25 GHz) |
| Data Bus Width | 32-bit |
| Operating Temperature | -40C to +105C (industrial) |
| Memory Controller | DDR1/DDR2 with ECC |
| SIMD Engine | AltiVec |
| Ethernet | Gigabit Ethernet (multi-port) |
| PCI Express | Yes (integrated controllers) |
| Serial RapidIO | Yes (integrated) |
| Package | 1023-ball FCCBGA (33x33 mm) |
| Mounting Type | Surface Mount |
| Silicon Revision | Rev 3 |
MC8640DTVJ1250HE 1023-ball fccbga (33x33 mm) Pin Configuration Guide
Pin configuration for MC8640DTVJ1250HE (1023-ball fccbga (33x33 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC8640DTVJ1250HE.
Refer to the datasheet for full pin configuration.
Typical Applications
MC8640DTVJ1250HE is suitable for 6 applications: Embedded Networking Routers and Switches, Telecom Base-Station Controllers, Aerospace and Defense Signal Processing, RAID Storage Controllers, Industrial Automation Controllers, High-Performance Embedded Computing Appliances.
Embedded Networking Routers and Switches
The MC8640DTVJ1250HE's dual PowerPC e600 cores at 1.25 GHz combined with four integrated Gigabit Ethernet MACs and PCI Express controllers make it a strong fit for Layer 2/3 routing and switching platforms. AltiVec SIMD accelerates packet-header processing, IPsec encryption, and deep-packet inspection at line rate. The integrated DDR1/DDR2 controller with ECC provides reliable buffering for packet queues without an external northbridge, reducing BOM cost. In a 1U/2U router, it typically pairs with PHY transceivers and a switching fabric via PCIe or Serial RapidIO.
Recommended
Telecom Base-Station Controllers
Telecom base-station controllers require deterministic performance, long-life silicon, and industrial-grade temperature operation - all met by the MC8640DTVJ1250HE's -40C to +105C industrial window and dual-core 1.25 GHz performance. The AltiVec engine accelerates DSP-like baseband processing, while Serial RapidIO enables tight coupling to DSP clusters and RF front-end ICs. The integrated memory controller with ECC supports reliable operation under continuous load. PCI Express provides connectivity to baseband ASICs and network processors, enabling scalable multi-sector base-station architectures.
Recommended
Aerospace and Defense Signal Processing
Aerospace and defense signal-processing platforms demand extended temperature operation, long-term silicon availability, and high compute density - the MC8640DTVJ1250HE delivers all three via its -40C to +105C industrial grade, PowerPC e600 radiation-tolerant architecture, and dual-core 1.25 GHz AltiVec performance. Applications include radar front-end processing, electronic warfare preprocessing, and secure communications gateways. The integrated multi-gigabit SerDes interfaces (PCIe + SRIO) connect to FPGA co-processors and high-speed ADCs/DACs, while DDR2 with ECC supports reliable signal buffers in ruggedized enclosures.
Recommended
RAID Storage Controllers
RAID storage arrays benefit from the MC8640DTVJ1250HE's high-throughput dual-core compute and integrated multi-GbE ports for iSCSI/NFS front-end, plus PCI Express lanes to hardware RAID ASICs or NVMe controllers. AltiVec accelerates XOR parity calculations and Reed-Solomon erasure coding, while DDR2 with ECC ensures data integrity in the cache layer. The industrial temperature range supports deployment in dense storage enclosures. In a typical RAID-6 controller, the SoC orchestrates host I/O, manages the disk cache, and offloads the bulk data path to a hardware RAID engine over PCIe Gen1/Gen2.
Recommended
Industrial Automation Controllers
Industrial automation systems require reliable long-life silicon with deterministic real-time performance - the MC8640DTVJ1250HE's dual-core 1.25 GHz PowerPC and industrial -40C to +105C window meet these needs. The AltiVec engine accelerates motion-control loop calculations, while multi-gigabit Ethernet ports support EtherCAT, PROFINET, or EtherNet/IP industrial protocols via software stacks. PCI Express connects to FPGA I/O expanders and high-speed analog/digital converter modules. The integrated DDR2 controller with ECC provides reliable operation in noisy factory environments with electrical interference and thermal stress.
Recommended
High-Performance Embedded Computing Appliances
High-performance embedded computing appliances such as medical imaging processors, vision-inspection systems, and scientific instrumentation benefit from the MC8640DTVJ1250HE's dual-core AltiVec compute and high-bandwidth I/O. AltiVec accelerates FFT, convolution, and image-filtering kernels, while PCI Express and Serial RapidIO provide connectivity to FPGAs, GPUs, and high-speed sensors. The integrated DDR2 memory controller with ECC delivers low-latency, high-throughput memory access for compute-intensive workloads. Industrial temperature support enables deployment in factory-floor and outdoor installations.
Recommended
Recommended Products Summary
Engineering reference data for MC8640DTVJ1250HE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC8640DTVJ1066HE | MC8640DTVJ1500HE | MC8640DTHX1250HE | MC8640VJ1000HE | MC8641DHX1250HE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCCBGA (33x33 mm) | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same | 1023-FCCBGA (33x33 mm) - same family |
| Core Architecture | PowerPC e600 dual-core | PowerPC e600 dual-core | PowerPC e600 dual-core | PowerPC e600 dual-core | PowerPC e600 single-core | PowerPC e600 dual-core |
| Core Frequency | 2 x 1.25 GHz | 2 x 1.066 GHz (-15%) | 2 x 1.5 GHz (+20%) | 2 x 1.25 GHz (same) | 1 x 1.0 GHz (single-core) | 2 x 1.25 GHz (same) |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| SIMD Engine | AltiVec | AltiVec | AltiVec | AltiVec | AltiVec | AltiVec |
| Gigabit Ethernet | Multi-port integrated | Multi-port integrated | Multi-port integrated | Multi-port integrated | Multi-port integrated | Multi-port integrated |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C (different grade suffix) | -40C to +105C | -40C to +105C |
Key Differentiators
- Drop-in speed scaling within same FCCBGA footprint (vs MC8640DTVJ1066HE)
- Dual-core vs single-core throughput (vs MC8640VJ1000HE)
- Mature PowerPC e600 toolchain vs next-gen migration (vs LS1046A Layerscape)
Design Notes
The 1023-ball FCCBGA at 33x33 mm requires a high-density PCB stackup with at least 8 layers, microvia (laser-drilled) vias in the breakout region, and matched-length impedance control for the SerDes lanes. Route the DDR2 data/address/control signals as a matched-length group (within 25 mil), keep differential PCIe/SRIO pairs within 5 mil tolerance, and provide solid ground planes on layers 2 and the layer just below the BGA. Use a controlled-impedance stackup calculator to verify 85 ohm differential and 50 ohm single-ended targets before fab.
Estimated: at full dual-core 1.25 GHz load, the MC8640DTVJ1250HE may dissipate 15-25 W depending on SerDes utilization. The FCCBGA package requires a heatsink or heat-spreader attachment via thermal interface material (TIM), with at least 100 mm^2 of copper pour on top-side layers as a heat-spreading path. For conduction-cooled chassis (aerospace/industrial), mount a copper or aluminum cold-plate directly to the package lid using thermal epoxy. Verify junction temperature stays below 105C in worst-case ambient.
The MC8640DTVJ1250HE's PCI Express and Serial RapidIO SerDes require reference-clock jitter below 1 ps RMS for reliable Gen1/Gen2 link operation. Use a low-jitter clock generator IC (such as a CDCE62005 or equivalent) with dedicated PLL filtering, and route the reference clock as a 50 ohm controlled-impedance trace with no stubs. For DDR2, enable on-die termination (ODT) and follow the JEDEC DDR2 layout guideline for matched-length strobe routing.
Do not assume pinout compatibility across MC8640D family suffix variants without verifying against the specific datasheet - the 'TVJ', 'THX', and 'DHX' suffixes denote different temperature grades, I/O voltage configurations, and in some cases different peripheral mixes. Always order against the exact NXP part number and check the silicon revision (Rev 3 in this case) to match firmware boot ROM signatures. Mixing revisions can cause boot failures due to errata differences.
Compliance Information
Compliance flags not specified in the verified web data for this lot-specific EOL part; consult the NXP product change notice and the specific lot's Certificate of Compliance for definitive status.
