MC9S08AW60MFDE - 8-bit HCS08 MCU 60KB Flash 40MHz | NXP
부품 번호: MC9S08AW60MFDE ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.17 | $7.17 |
| 10 | $6.45 | $64.50 |
| 100 | $5.73 | $573.00 |
| 500 | $5.02 | $2,510.00 |
| 1,000 | $4.46 | $4,460.00 |
MC9S08AW60MFDE 개요
An MCU (microcontroller unit) is a single-chip computer that combines a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of on-chip peripherals such as timers, ADC, communication controllers, and GPIO. Within the semiconductor taxonomy the MC9S08AW60MFDE belongs to the HCS08 8-bit microcontroller family, sitting under the broader category of embedded microcontrollers, which in turn belong to microprocessors and digital logic ICs. The HCS08 family is an enhanced evolution of the legacy HC08 core, adding the BGND instruction for background debug, improved instruction throughput, and lower active/idle current draws.
Key features include 60 KB of embedded Flash with in-application programmability, an internal clock generator with options for an external crystal or resonator, multiple 16-bit timer/PWM channels, up to 16 channels of 10-bit ADC, SCI (UART), SPI, and I2C peripherals, plus a real-time counter and a watchdog timer for safety-critical control loops. The device supports both industrial and automotive-grade application profiles per its family datasheet.
The HCS08 core uses a von Neumann architecture with a 16-bit stack pointer, 16-bit index register (H:X), and a compact CISC instruction set that is largely source-compatible with HC08 assembly while delivering roughly 50% better performance per clock cycle. The integrated voltage regulator and brown-out reset block simplify 3.3 V and 5 V single-rail designs, while the BDM single-wire debug interface eliminates the need for an expensive in-circuit emulator during prototype development.
Typical applications include industrial sensor conditioning, white-goods motor control, automotive body controllers, HVAC blower/fan controllers, low-end graphical display panels, and small-form-factor consumer appliances. The wide 2.7 V to 5.5 V input range makes it compatible with both 3.3 V and 5 V sensor and actuator systems.
When designing with this part, pay close attention to decoupling: place a 100 nF X7R bypass capacitor within 1-2 mm of each power pin and a bulk 4.7 uF to 10 uF tantalum or ceramic capacitor near the package exposed pad. Also ensure the BDM pin is routed to a header or test pad for in-system debug, and verify that the IRQ pin has a proper pull-up if unused.
This page synthesizes distributor pricing, drop-in alternatives from the same AW60/AW48/AW32/AW16 family, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: MC9S08AW60MFDE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08AW60MFDE (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, ADC, Communication Interfaces, Debug Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08AW48CFDE
✅ 드롭인✓ 재고 있음
$5.02 / 개
데이터시트 보기 →MC9S08AW48MFDE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC9S08AW32MFDE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC9S08AW16MFDE
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC9S08AC60CFDE
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.6 / 개
데이터시트 보기 →MC9S08AW60MFDE 최대 정격 & 전기적 특성
| Core Architecture | HCS08 (8-bit CISC, enhanced HC08) |
| CPU Speed | 40 MHz (20 MHz internal bus) |
| Program Memory | 60 KB Flash |
| RAM | 2 KB |
| 공급 전압 | 2.7 V to 5.5 V |
| I/O Ports | 38 |
| 패키지 | 48-pin QFN-EP (7x7 mm, MO-220VKKD-2, 0.5 mm pitch) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (industrial) |
| ROM Type | Flash (in-application programmable) |
| Debug Interface | Single-wire BDM (background debug mode) |
| ADC | Up to 16-channel 10-bit |
| Timers | Multiple 16-bit timer/PWM channels |
| Communication | SCI (UART), SPI, I2C |
| RoHS 상태 | Compliant |
MC9S08AW60MFDE 핀 구성
| 핀 1 | PTD0/TxD1 — GPIO / SCI1 transmit |
| 핀 2 | PTD1/RxD1 — GPIO / SCI1 receive |
| 핀 3 | PTD2 — GPIO |
| 핀 4 | PTD3 — GPIO |
| 핀 5 | VSS — Ground |
| 핀 6 | VDD — Supply voltage (2.7-5.5 V) |
| 핀 7 | PTA0 — GPIO / ADC channel |
| 핀 8 | PTA1 — GPIO / ADC channel |
| 핀 9 | PTA2 — GPIO / ADC channel |
| 핀 10 | PTA3 — GPIO / ADC channel |
| 핀 11 | PTA4 — GPIO |
| 핀 12 | PTA5/IRQ — GPIO / external interrupt |
| 핀 13 | PTA6 — GPIO |
| 핀 14 | PTA7 — GPIO |
| 핀 15 | PTB0 — GPIO / ADC channel |
| 핀 16 | PTB1 — GPIO / ADC channel |
| 핀 17 | PTB2 — GPIO / ADC channel |
| 핀 18 | PTB3 — GPIO / ADC channel |
| 핀 19 | PTB4 — GPIO |
| 핀 20 | PTB5 — GPIO |
| 핀 21 | PTB6 — GPIO |
| 핀 22 | PTB7 — GPIO |
| 핀 23 | PTC0 — GPIO / timer channel |
| 핀 24 | PTC1 — GPIO / timer channel |
| 핀 25 | PTC2 — GPIO / timer channel |
| 핀 26 | PTC3 — GPIO / timer channel |
| 핀 27 | PTC4 — GPIO / SPI signal |
| 핀 28 | PTC5 — GPIO / SPI signal |
| 핀 29 | PTC6 — GPIO / SPI signal |
| 핀 30 | PTC7 — GPIO / SPI signal |
| 핀 31 | PTD4 — GPIO |
| 핀 32 | PTD5 — GPIO |
| 핀 33 | PTD6 — GPIO |
| 핀 34 | PTD7 — GPIO |
| 핀 35 | PTE0 — GPIO / I2C SDA |
| 핀 36 | PTE1 — GPIO / I2C SCL |
| 핀 37 | PTE2 — GPIO |
| 핀 38 | PTE3 — GPIO |
| 핀 39 | PTE4 — GPIO |
| 핀 40 | PTE5 — GPIO |
| 핀 41 | PTE6 — GPIO |
| 핀 42 | PTE7 — GPIO |
| 핀 43 | BKGD/MS — Background debug mode / mode select |
| 핀 44 | RESET — Reset input (active low) |
| 핀 45 | EXTAL — External clock/crystal input |
| 핀 46 | XTAL — External clock/crystal output |
| 핀 47 | VSS — Ground |
| 핀 48 | VDD — Supply voltage (2.7-5.5 V) |
일반적인 애플리케이션
MC9S08AW60MFDE 적합 용도: 6 애플리케이션s: Industrial Sensor Conditioning, White-Goods Motor Control, Automotive Body Controller, HVAC Blower and Fan Controller, Low-End Graphical Display Panel, Small Consumer Appliance Controller.
Industrial Sensor Conditioning
The MC9S08AW60MFDE fits industrial sensor conditioning because its 16-channel 10-bit ADC and 38 GPIO can interface directly with multi-sensor arrays while the 40 MHz HCS08 core provides ample cycles for filtering and linearization. Placed on a 3.3 V or 5 V sensor board, the MCU reads thermocouples, strain gauges, and pressure transducers via the ADC, then transmits processed values over SCI/SPI to a host PLC. The 60 KB Flash accommodates calibration tables for multi-point compensation, and the single-wire BDM allows in-line factory calibration during production.
추천
White-Goods Motor Control
The MC9S08AW60MFDE drives washing-machine, dishwasher, and refrigerator motors because its 16-bit timer/PWM channels deliver precise duty-cycle control for brushless DC and universal-motor commutation. With 60 KB Flash, the firmware can hold advanced trapezoidal or sinusoidal commutation algorithms and the 2.7 V to 5.5 V supply range accepts rectified mains directly. The 38 GPIO supports Hall-sensor inputs, fault indicators, and triac gating, while integrated watchdog and brown-out reset improve field reliability.
추천
Automotive Body Controller
The MC9S08AW60MFDE serves automotive body controllers (door modules, seat controllers, mirror adjusters) where moderate Flash and LIN-compatible SCI peripherals handle switch scanning, LED driving, and motor pulse-width control. The 48-pin QFN-EP (7x7) package fits the small PCB footprint typical of door-modules, and the -40C to +85C industrial temperature rating covers most cabin environments. The HCS08 BGND instruction and single-wire BDM enable efficient end-of-line programming in the factory.
추천
HVAC Blower and Fan Controller
The MC9S08AW60MFDE controls HVAC blower speeds and exhaust fans via closed-loop PWM where the 40 MHz core samples tachometer feedback and adjusts duty cycle within tight tolerance. Its 16-bit timers generate center-aligned PWM for low-acoustic-noise motor drive, and the 10-bit ADC monitors current sense for stall detection. The wide 2.7 V to 5.5 V supply accepts 5 V from rectified mains, while the integrated brown-out reset protects against brown-line voltage dips during motor inrush.
추천
Low-End Graphical Display Panel
The MC9S08AW60MFDE drives low-end graphical LCD or segment displays in appliances and instruments where the 60 KB Flash stores fonts, bitmaps, and menu trees while the SPI peripheral streams pixel data to the display controller. Its 38 GPIO provides direct connections to segment signals, keypads, and backlight PWM. The single-wire BDM lets production engineers update graphics firmware without disassembling the product, and the low active current draw supports battery-backed display modules.
추천
Small Consumer Appliance Controller
The MC9S08AW60MFDE embeds into small consumer appliances such as coffee makers, toasters, and rice cookers where the HCS08 core manages temperature profiling, timing sequences, and user-interface button scanning. The 60 KB Flash accommodates multi-language UI strings and recipe presets, and the integrated 16-bit timers drive Triac-phase-control heating elements safely. The exposed-pad QFN-EP package handles thermal dissipation when paired with heating MOSFETs.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08AW60MFDE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08AW48CFDE | MC9S08AW48MFDE | MC9S08AW32MFDE | MC9S08AW16MFDE | MC9S08AC60CFDE |
|---|---|---|---|---|---|---|
| Package | 48-pin QFN-EP (7x7) | 48-pin QFN-EP (7x7) - same | 48-pin QFN-EP (7x7) - same | 48-pin QFN-EP (7x7) - same | 48-pin QFN-EP (7x7) - same | 48-pin QFN-EP (7x7) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 60 KB | 48 KB | 48 KB | 32 KB | 16 KB | 60 KB |
| CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB | 2 KB |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| GPIO Count | 38 | 38 | 38 | 38 | 38 | 38 |
| Core Family | HCS08 (AW family) | HCS08 (AW family) | HCS08 (AW family) | HCS08 (AW family) | HCS08 (AW family) | HCS08 (AC family) |
주요 차별점
- Highest Flash density in the AW60 family (vs MC9S08AW48CFDE)
- Pin-compatible LQFP alternative available (vs MC9S08AW60MFGE)
- Industrial + automotive dual profile support (vs MC9S08AW32MFDE)
설계 노트
Place a 100 nF X7R 0603 ceramic bypass capacitor within 1-2 mm of each VDD pin (pins 6 and 48) and a bulk 4.7 uF to 10 uF tantalum or ceramic capacitor near the package exposed pad. The exposed pad (EP) must be soldered to a continuous ground plane for both thermal dissipation and electrical reference; otherwise the internal voltage regulator may oscillate and the ADC readings can drift. Decouple VREF separately if using the ADC reference feature.
Route the BKGD/MS pin to a 2x5 or 1x6 header for in-system debug. Place the header at the board edge for easy probe access during factory programming. Keep the RESET line short and add a 10 kohm pull-up to VDD plus a 100 nF capacitor to ground for noise immunity, per NXP hardware design guides for the HCS08 family. Route the XTAL/EXTAL traces symmetrically with a grounded guard ring to reduce EMI pickup.
Do not exceed 5.5 V on VDD or apply voltage to any pin before VDD ramps up; the HCS08 family lacks comprehensive parasitic-power robustness. Ensure the IRQ pin has a proper pull-up if unused (it is edge-sensitive by default). When migrating from the LQFP-48 (MFGE suffix) to this QFN-EP (MFDE suffix), the PCB land pattern is NOT drop-in compatible - the QFN-EP requires a center thermal pad and shorter lead lengths.
규정 준수 정보
RoHS compliant per NXP product page. Not AEC-Q100 qualified in the MFDE industrial-temperature variant; review NXP documentation for AEC-Q100 automotive variants within the AW60 family.
