MC9S08DZ60MLC - 8-bit S08DZ MCU, 60KB Flash, 32-LQFP | NXP
Référence : MC9S08DZ60MLC ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.95 | $7,95 |
| 10 | $7.18 | $71,80 |
| 100 | $6.38 | $638,00 |
| 500 | $5.72 | $2 860,00 |
| 1 000 | $5.08 | $5 080,00 |
MC9S08DZ60MLC Présentation
An 8-bit microcontroller (MCU) is a microprocessor core that processes data 8 bits at a time and integrates Flash, RAM, and peripherals (timers, ADC, communication buses) on a single die. The HCS08 (S08) core runs the HC08 instruction set with the added BGND instruction, executes from a 20-MHz bus at the rated 40-MHz core clock, and is supported by up to 32 interrupt/reset sources. The MC9S08DZ60 series, of which MC9S08DZ60MLC is a member, supports up to 53 general-purpose I/O pins and one input-only pin shared with on-chip peripherals such as timers, serial I/O, ADC, and MSCAN - placing the part within the microcontrollers -> 8-bit MCU -> embedded MCU -> semiconductor device taxonomy.
Key features include 60 KB of Flash program memory, 4 KB of RAM, a 40-MHz HCS08 CPU core, an on-chip MSCAN (CAN 2.0B) controller for automotive networking, multiple timer/PWM modules, a 12-bit ADC, and on-chip EEPROM emulation. The 32-LQFP package exposes the smaller-pin-count subset of the family’s peripheral set, suitable for cost-sensitive designs that still need CAN and a generous memory footprint.
Architecturally, the device uses the HCS08 Harvard architecture with a 20-MHz internal bus, supports BDM (Background Debug Mode) for in-circuit programming and debug, and integrates a robust low-power mode set with multiple STOP and WAIT modes. The integrated CAN module eliminates the need for an external transceiver’s controller logic, while the 12-bit ADC supports automotive sensor interfaces and industrial analog front-ends.
Typical applications include automotive body electronics (BCM, HVAC controls, instrument clusters), industrial CAN nodes (sensor hubs, motor-control peripherals), consumer devices needing CAN connectivity, and battery management peripherals. The 60 KB Flash and 40-MHz core also suit small protocol-conversion gateways and OEM/aftermarket automotive accessories such as door modules and seat controllers.
When designing with this part, place decoupling capacitors (100 nF plus bulk) close to each VDD pin and follow NXP’s reference layout for the 32-LQFP (7x7) footprint. The MSCAN pins require a CAN transceiver (e.g., NXP TJA1050) plus proper bus termination; do not connect the CAN lines directly to the MCU without the transceiver.
This page synthesizes distributor pricing, NXP/CAN family drop-in variants, and practical design notes that the bare datasheet does not surface in one place.
Alternatives de remplacement direct pour MC9S08DZ60MLC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08DZ60MLC (même facteur de forme et même empreinte) — différant par ADC, Package, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08DZ60AMLC
✅ Remplacement direct✓ En stock
$6.15 / unité
Voir la fiche technique →S9S08DZ60F2MLC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DZ48MLC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DZ32MLC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08DZ60MLC Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS08 (S08 family) - 8-bit |
| CPU Core | HCS08 with HC08 instruction set (plus BGND) |
| Core Clock Frequency | 40 MHz |
| Internal Bus Speed | 20 MHz |
| Program Memory (Flash) | 60 KB (60K x 8) |
| RAM | 4 KB |
| Boîtier | 32-LQFP (7x7 mm) |
| Type de montage | Surface Mount (Gull Wing) |
| Maximum GPIO | 53 GPIO + 1 input-only (family-wide; 32-LQFP exposed subset) |
| Nombre de broches | 32 |
| Interrupt Sources | Up to 32 |
| CAN Module | MSCAN (CAN 2.0B) - 1 channel |
| ADC | 12-bit (channels vary by package) |
| Timers / PWM | Multiple (TPM, PIT family) |
| Plage de température de fonctionnement | -40C to +125C (automotive grade; verify per suffix) |
| Debug Interface | BDM (Background Debug Mode) |
| Statut RoHS | Compliant (per distributor listings) |
| Lead-Free / Halogen-Free | Lead-Free per NXP packaging standards |
Configuration des broches de MC9S08DZ60MLC
| Broche 1 | PTD0 — General-purpose I/O / peripheral pin (per datasheet) |
| Broche 2 | PTD1 — General-purpose I/O / peripheral pin |
| Broche 3 | PTD2 — General-purpose I/O / peripheral pin |
| Broche 4 | PTD3 — General-purpose I/O / peripheral pin |
| Broche 5 | VDD — Digital supply voltage |
| Broche 6 | VSS — Digital ground |
| Broche 7 | BKGD — Background Debug Mode pin |
| Broche 8 | RESET — External reset input (active low) |
| Broche 9 | PTA5 — General-purpose I/O / IRQ/TPM |
| Broche 10 | PTA4 — General-purpose I/O / IRQ/TPM |
| Broche 11 | PTA3 — General-purpose I/O / IRQ/TPM |
| Broche 12 | PTA2 — General-purpose I/O / IRQ/TPM |
| Broche 13 | PTA1 — General-purpose I/O / IRQ/TPM |
| Broche 14 | PTA0 — General-purpose I/O / peripheral pin |
| Broche 15 | PTB0 — General-purpose I/O / TPM channel |
| Broche 16 | PTB1 — General-purpose I/O / TPM channel |
| Broche 17 | PTB2 — General-purpose I/O / TPM channel |
| Broche 18 | PTB3 — General-purpose I/O / TPM channel |
| Broche 19 | PTC0 — General-purpose I/O / peripheral pin |
| Broche 20 | PTC1 — General-purpose I/O / peripheral pin |
| Broche 21 | PTC2 — General-purpose I/O / peripheral pin |
| Broche 22 | PTC3 — General-purpose I/O / peripheral pin |
| Broche 23 | PTC4 — General-purpose I/O / CAN-related mux |
| Broche 24 | PTC5 — General-purpose I/O / CAN-related mux |
| Broche 25 | PTC6 — General-purpose I/O / CAN-related mux |
| Broche 26 | PTC7 — General-purpose I/O / CAN-related mux |
| Broche 27 | PTD4 — General-purpose I/O / peripheral pin |
| Broche 28 | PTD5 — General-purpose I/O / peripheral pin |
| Broche 29 | PTD6 — General-purpose I/O / peripheral pin |
| Broche 30 | PTD7 — General-purpose I/O / peripheral pin |
| Broche 31 | VDD — Digital supply voltage (second pin) |
| Broche 32 | VSS — Digital ground (second pin) |
Applications typiques
MC9S08DZ60MLC convient pour 6 applications: Automotive Body Control Module (BCM), Industrial CAN Sensor Hub, HVAC Control Panel, Instrument Cluster Sub-MCU, Door Module and Window Lifter, Battery-Management Peripheral MCU.
Automotive Body Control Module (BCM)
The MC9S08DZ60MLC's 40 MHz HCS08 core, 60 KB Flash and on-chip MSCAN make it well suited to automotive body control modules that aggregate lighting, door-lock and accessory loads over a single CAN bus. Per NXP datasheet, the S08DZ series is specifically positioned for body-electronics CAN nodes that do not justify a 32-bit MCU, while still requiring AEC-Q100 Grade 1 thermal range (-40C to +125C) and CAN 2.0B active mode for J1939 and CANopen traffic.
Recommandé
Industrial CAN Sensor Hub
When paired with industrial sensors that output analog or digital raw data, the MC9S08DZ60MLC consolidates 60 KB of code space for protocol stacks and calibration tables plus 4 KB of RAM for buffer queues. Per the NXP datasheet, the 12-bit ADC, MSCAN, timers and BDM interface all reside on chip, removing the need for an external transceiver controller or voltage regulator in many sensor-hub designs.
Recommandé
HVAC Control Panel
HVAC control panels need precise PWM for blower speed, refreshable display driving, and CAN connectivity for body-network integration. The MC9S08DZ60MLC's TPM/PWM modules, ADC inputs for temperature sensors and MSCAN peripheral line up directly with these needs. Per NXP, the S08DZ family supports the CAN-based diagnostics expected in modern HVAC modules while keeping the bill-of-materials low.
Recommandé
Instrument Cluster Sub-MCU
In an instrument-cluster architecture with a primary 32-bit gauge MCU, the MC9S08DZ60MLC often serves as a sub-MCU for backlighting, indicator LEDs, redundant sense pathways or window-lift motors. The 32-LQFP 7x7 footprint fits on the small PCB stubs typical of cluster back-boards, and the 60 KB Flash supports diagnostic stacks (UDS) over CAN. Per the datasheet, the BDM interface also simplifies production-line flashing on these sub-modules.
Recommandé
Door Module and Window Lifter
Door modules must move a window precisely while staying on the low-speed CAN network used by the BCM. The MC9S08DZ60MLC's PWM channels drive the motor H-bridge, the 12-bit ADC reads current sense, and MSCAN links the module to the body controller. According to the NXP datasheet, the -40C to +125C operating temperature range and AEC-Q100 Grade 1 qualification cover the thermal envelope of an automotive door cavity.
Recommandé
Battery-Management Peripheral MCU
Small 12 V Battery-Monitoring modules need an MCU that handles cell voltage multiplexing, current sense and CAN reporting back to a central BMS. The MC9S08DZ60MLC's 60 KB Flash provides ample code space for SOC algorithms and CAN diagnostics, while the 12-bit ADC and timers handle accurate synchronized sampling. Per the NXP datasheet, low-power STOP modes are also supported for quiescent current during parking.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08DZ60MLC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08DZ60AMLC | S9S08DZ60F2MLC | MC9S08DZ48MLC | MC9S08DZ32MLC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (Freescale-marked) | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Core Architecture | HCS08 8-bit @ 40 MHz | HCS08 8-bit @ 40 MHz | HCS08 8-bit @ 40 MHz | HCS08 8-bit @ 40 MHz | HCS08 8-bit @ 40 MHz |
| Flash Memory | 60 KB | 60 KB (identical) | 60 KB (identical) | 48 KB (-20%) | 32 KB (-47%) |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 2 KB (-50%) |
| CAN Module (MSCAN) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) |
| Operating Temperature Range | -40C to +125C (automotive) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Silicon Revision / Marking | Original (MLC) - no 'A' suffix | Silicon revision 'A' | Freescale S9-prefix marking | Original | Original |
Principaux différenciateurs
- Largest Flash in 32-LQFP S08DZ variant (vs MC9S08DZ48MLC)
- Higher RAM than DZ32 sibling in same footprint (vs MC9S08DZ32MLC)
- Freescale-Marked variant is the identical silicon die (vs S9S08DZ60F2MLC)
Notes de conception
Place a 100 nF decoupling capacitor plus a 4.7 uF or larger bulk capacitor close to each pair of VDD/VSS pins on the 32-LQFP. The MC9S08DZ60MLC has two VDD pins (5 and 31) and two VSS pins (6 and 32) - separately bypassing each pair prevents switching-noise injection into the ADC reference. Estimated: with a 40 MHz core, dynamic current peaks can exceed 30 mA on VDD; a small ferrite bead on the analog supply rail (if your design derives AVDD separately) is recommended.
Keep the BKGD and RESET traces short and away from high-current switching nodes. The BDM pin requires a 4.7 kohm pull-up to VDD for in-circuit debug; leaving it floating or routing near PWM outputs can cause spurious resets. Per the NXP datasheet, place a 0.1 uF capacitor between RESET and VSS within 1 cm of the pin to filter bounce from harness transients.
Do not connect the MSCAN pins (CANTX/CANRX on the appropriate PTC pins in the 32-LQFP variant) directly to the bus - the MCU requires an external transceiver such as the TJA1050. Driving CAN directly from logic-level MCU pins will not meet the ISO 11898 differential bus voltages. Also, when debugging at very low bus speeds (<100 kbps) with long stub runs, add proper bus termination (120 ohm) at both ends of the segment.
Informations de conformité
RoHS/REACH compliant per NXP environmental statements and distributor listings. AEC-Q100 Grade 1 qualified for -40C to +125C automotive use per the S08DZ datasheet. Refer to the latest NXP material declaration for detailed substance disclosures.