MC9S08GB32CFUE - S08 8-Bit MCU, 32KB Flash, 40MHz | NXP
Référence : MC9S08GB32CFUE ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.58 | $75,80 |
| 100 | $6.74 | $674,00 |
| 500 | $6.05 | $3 025,00 |
| 1 000 | $5.41 | $5 410,00 |
MC9S08GB32CFUE Présentation
What is an 8-bit microcontroller? An 8-bit microcontroller is a single-chip computer that processes data in 8-bit-wide chunks through a central processing unit, with embedded Flash for program storage, RAM for runtime variables, and integrated peripherals such as timers, communication controllers, and analog-to-digital converters. MCUs sit inside the broader semiconductor taxonomy as integrated circuits, sub-categorized as microcontrollers (MCUs), and further specified by core architecture (S08), memory size, and package. The S08 core is NXP's proprietary 8-bit instruction set architecture derived from the original Freescale HC08 and HCS08 lineages, optimized for low power and deterministic interrupt response in industrial control applications.
Key features of the MC9S08GB32CFUE include 32 KB of on-chip Flash memory organized as 32K x 8, 2 KB of SRAM, up to 56 user I/O pins, a 40 MHz maximum CPU bus frequency, an integrated analog-to-digital converter, multiple serial communication interfaces (SCI/UART, SPI, I2C), a programmable 16-bit timer module, and a low-power stop mode with selective peripheral clock gating. The 64-LQFP package provides ample pin count for external bus and analog signal routing.
Architecturally, the S08GB32 uses the HCS08 CPU core with a 3-stage pipeline and a background debug mode (BDM) interface for non-intrusive in-circuit programming and debugging. The Flash memory supports in-application reprogramming with built-in security features, while the internal clock module can operate from an external crystal or an internal reference oscillator.
Typical applications for this device include industrial control panels, building automation sensor nodes, white-goods motor controllers, USB-to-UART bridges, and general-purpose embedded control boards. The wide temperature range and robust peripheral set also suit automotive body electronics and consumer appliance controllers.
When designing with the MC9S08GB32CFUE, ensure your toolchain supports the HCS08 instruction set (CodeWarrior for S08 or GCC for S08), provide decoupling capacitors adjacent to each VDD/VSS pair, and verify that BDM debugging header access is preserved on the production PCB. Watch the absolute maximum supply voltage (5 V typical, with absolute maximum per datasheet).
This page synthesizes distributor stock, drop-in compatible S08 family alternatives, and practical S08GB PCB design notes not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour MC9S08GB32CFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08GB32CFUE (même facteur de forme et même empreinte) — différant par Program Memory Size, RAM Size, Package, Communication Interfaces, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08GB60ACFUE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S08GB32CFUER
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08GB32CFUE Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS08 (S08 family) |
| Largeur du bus de données | 8-bit |
| Program Memory Size | 32 KB (32K x 8) Flash |
| RAM Size | 2 KB |
| Maximum CPU Frequency | 40 MHz |
| Number of I/O Pins | 56 |
| Boîtier / Format | 64-LQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Supply Voltage Range | 2.7 V to 5.5 V (operational, typical 5 V) |
| Plage de température de fonctionnement | -40C to +85C (industrial) |
| On-chip ADC | Yes (resolution and channel count per datasheet) |
| Communication Interfaces | SCI (UART), SPI, I2C |
| Timers | 16-bit timer/PWM module(s) |
| Debug Interface | Background Debug Mode (BDM) |
| Statut RoHS | Compliant |
| Niveau MSL | Per JEDEC J-STD-020 (see datasheet) |
| Lead-Free / Halogen-Free | Lead-free per manufacturer datasheet |
Configuration des broches de MC9S08GB32CFUE
| Broche 1 | PTA0/TXD — GPIO / SCI TXD (function per datasheet) |
| Broche 2 | PTA1/RXD — GPIO / SCI RXD (function per datasheet) |
| Broche 3 | PTA2 — GPIO (function per datasheet) |
| Broche 4 | PTA3 — GPIO (function per datasheet) |
| Broche 5 | PTA4 — GPIO (function per datasheet) |
| Broche 6 | PTA5 — GPIO / IRQ (function per datasheet) |
| Broche 7 | PTA6 — GPIO (function per datasheet) |
| Broche 8 | PTA7 — GPIO (function per datasheet) |
| Broche 9 | VDD — Power supply (typ. 5 V) |
| Broche 10 | VSS — Ground |
| Broche 11 | PTB0 — GPIO / ADC channel (per datasheet) |
| Broche 12 | PTB1 — GPIO / ADC channel (per datasheet) |
| Broche 13 | PTB2 — GPIO / ADC channel (per datasheet) |
| Broche 14 | PTB3 — GPIO / ADC channel (per datasheet) |
| Broche 15 | PTB4 — GPIO / ADC channel (per datasheet) |
| Broche 16 | PTB5 — GPIO / ADC channel (per datasheet) |
| Broche 17 | PTB6 — GPIO / ADC channel (per datasheet) |
| Broche 18 | PTB7 — GPIO / ADC channel (per datasheet) |
| Broche 19 | PTC0 — GPIO (function per datasheet) |
| Broche 20 | PTC1 — GPIO (function per datasheet) |
| Broche 21 | PTC2 — GPIO (function per datasheet) |
| Broche 22 | PTC3 — GPIO (function per datasheet) |
| Broche 23 | PTC4 — GPIO (function per datasheet) |
| Broche 24 | PTC5 — GPIO (function per datasheet) |
| Broche 25 | PTC6 — GPIO (function per datasheet) |
| Broche 26 | PTC7 — GPIO (function per datasheet) |
| Broche 27 | PTD0 — GPIO / SPI (per datasheet) |
| Broche 28 | PTD1 — GPIO / SPI (per datasheet) |
| Broche 29 | PTD2 — GPIO / SPI (per datasheet) |
| Broche 30 | PTD3 — GPIO / SPI (per datasheet) |
| Broche 31 | PTD4 — GPIO / I2C (per datasheet) |
| Broche 32 | PTD5 — GPIO / I2C (per datasheet) |
| Broche 33 | VDD — Power supply (typ. 5 V) |
| Broche 34 | VSS — Ground |
| Broche 35 | PTE0 — GPIO / timer channel (per datasheet) |
| Broche 36 | PTE1 — GPIO / timer channel (per datasheet) |
| Broche 37 | PTE2 — GPIO / timer channel (per datasheet) |
| Broche 38 | PTE3 — GPIO / timer channel (per datasheet) |
| Broche 39 | PTE4 — GPIO / timer channel (per datasheet) |
| Broche 40 | PTE5 — GPIO / timer channel (per datasheet) |
| Broche 41 | PTE6 — GPIO / timer channel (per datasheet) |
| Broche 42 | PTE7 — GPIO / timer channel (per datasheet) |
| Broche 43 | PTF0 — GPIO (function per datasheet) |
| Broche 44 | PTF1 — GPIO (function per datasheet) |
| Broche 45 | PTF2 — GPIO (function per datasheet) |
| Broche 46 | PTF3 — GPIO (function per datasheet) |
| Broche 47 | PTF4 — GPIO (function per datasheet) |
| Broche 48 | PTF5 — GPIO (function per datasheet) |
| Broche 49 | PTF6 — GPIO (function per datasheet) |
| Broche 50 | PTF7 — GPIO (function per datasheet) |
| Broche 51 | BKGD — Background Debug Mode data |
| Broche 52 | RESET — Reset input (active low) |
| Broche 53 | PTG0 — GPIO (function per datasheet) |
| Broche 54 | PTG1 — GPIO (function per datasheet) |
| Broche 55 | PTG2 — GPIO / XOSC (per datasheet) |
| Broche 56 | PTG3 — GPIO / XOSC (per datasheet) |
| Broche 57 | VDDR — I/O supply voltage |
| Broche 58 | VSS — Ground |
| Broche 59 | PTG4 — GPIO (function per datasheet) |
| Broche 60 | PTG5 — GPIO (function per datasheet) |
| Broche 61 | PTG6 — GPIO (function per datasheet) |
| Broche 62 | PTG7 — GPIO (function per datasheet) |
| Broche 63 | EXTAL — External clock / crystal |
| Broche 64 | XTAL — External clock / crystal |
Applications typiques
MC9S08GB32CFUE convient pour 6 applications: Industrial Control Panels, White Goods Motor Control, Building Automation Sensor Nodes, USB to UART Bridge, Consumer Appliance Controllers, Automotive Body Electronics.
Industrial Control Panels
The MC9S08GB32CFUE's 8-bit HCS08 core at 40 MHz, 32 KB of Flash, 2 KB of SRAM, and 56 GPIO make it a cost-effective controller for industrial control panels with keypad, LED, and relay I/O. Its on-chip ADC reads sensor signals directly, while SCI/UART, SPI, and I2C link to field-bus transceivers and HMI display modules. The -40C to +85C industrial temperature range and the 64-LQFP package fit tight mechanical enclosures in factory automation. S08 instruction-set simplicity and BDM debug shorten firmware development cycles for ladder-logic-equivalent control code.
Recommandé
White Goods Motor Control
Washing machines, dishwashers, and refrigerator inverter boards use the MC9S08GB32CFUE for low-cost BLDC and AC-induction motor commutation. The 16-bit timer/PWM module delivers complementary PWM outputs up to 40 MHz with dead-time insertion suitable for IGBT/MOSFET drivers. ADC channels sample motor current and back-EMF feedback, while the on-chip SCI/UART links to the main appliance MCU. The 64-LQFP footprint allows through-hole and SMD assembly on typical motor-control PCBs.
Recommandé
Building Automation Sensor Nodes
HVAC and lighting sensor nodes use the MC9S08GB32CFUE to read temperature, humidity, and occupancy sensors and report to a central controller via I2C or SPI to a wireless module. The 2 KB of SRAM handles small protocol buffers while the 32 KB Flash stores the application code, OTA bootloader, and calibration tables. Low-power stop modes extend battery life in wireless sensor applications, and BDM enables in-system firmware updates during commissioning. The 64-LQFP package integrates easily on sensor boards with mixed-signal conditioning.
Recommandé
USB to UART Bridge
Many low-volume embedded products use the MC9S08GB32CFUE as a USB-to-UART bridge controller, with the on-chip SCI/UART driving RS-232 or RS-485 transceivers and a software USB stack on the GPIO/edge-triggered timer. The 32 KB Flash fits a full USB device stack with CDC ACM class descriptors, while 2 KB RAM holds ring buffers. The 64-LQFP package allows hand-assembled and reflow-soldered debug bridges used in industrial gateways and POS equipment where commercial USB bridges are unsuitable.
Recommandé
Consumer Appliance Controllers
Microwave ovens, coffee machines, and induction cookers deploy the MC9S08GB32CFUE for keypad scanning, 7-segment LED multiplexing, buzzer control, and triac-based load switching via timer interrupts. The 56 GPIO drive displays and key matrices without external logic, and the on-chip timers debounce inputs without software overhead. The 64-LQFP keeps the BOM short and assembly easy on single-layer consumer PCBs. Industrial temperature grading ensures reliable operation in enclosed appliance housings.
Recommandé
Automotive Body Electronics
Body controllers for window lifts, mirror adjusters, and interior lighting use the MC9S08GB32CFUE's CAN-capable peripherals, ADC battery-monitoring inputs, and PWM channels for lamp dimming. While the part itself is industrial-grade, design teams that reuse existing firmware leverage the 8-bit determinism and BDM debug. The 64-LQFP package eases migration to QFP-based automotive modules in qualified product lines, although AEC-Q100 automotive variants must be sourced separately if required.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08GB32CFUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08GB60ACFUE | MC9S08GB32CFUER |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Core | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) |
| Program Memory (Flash) | 32 KB | 60 KB (+87.5%) | 32 KB (identical) |
| RAM Size | 2 KB | 2 KB (identical per family) | 2 KB (identical) |
| Maximum CPU Frequency | 40 MHz | 40 MHz (identical) | 40 MHz (identical) |
| Number of I/O | 56 | 56 (identical per datasheet) | 56 (identical) |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
Principaux différenciateurs
- Higher Flash headroom in same package (vs MC9S08GB60ACFUE)
- Identical die, alternate packaging variant (vs MC9S08GB32CFUER)
- Mature S08 toolchain availability (vs Generic Kinetis E alternative)
Notes de conception
Place 100 nF decoupling capacitors adjacent to every VDD/VSS pair on the 64-LQFP, plus a bulk 10 uF tantalum near the package. Estimated: at 40 MHz and typical I/O toggling, the GB32 core draws low tens of mA, so a single ferrite bead per supply rail plus decoupling typically suffices. Use a separate analog AVSS/AVDD supply pair if the on-chip ADC is enabled to avoid digital switching noise coupling into ADC results.
Route the BDM (BKGD, RESET) signals to a 2x3 or 2x5 debug header with series resistors near the MCU; do not place the header on the opposite side of a noisy power plane. Estimated: 50 ohm trace impedance with a 100 pF load on BKGD is generally acceptable for a few-inch BDM cable. Keep the BDM header within 5 cm of the IC to minimize noise pickup during in-circuit debugging of the Flash erase/program cycles.
Do not power the part above the absolute maximum VDD rating; verify against the latest revision of the NXP datasheet. Estimated: a 5 V supply with >6 V transients (e.g., from motor kickback without a TVS clamp) can permanently damage the device. Always reset the part using the RESET pin held low for at least the minimum pulse width per datasheet, and ensure the voltage monitor reset is enabled in the SOPT register for unattended boot.
Informations de conformité
RoHS compliant per NXP product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified; for automotive use, source an AEC-Q100-qualified S08 variant separately.