MC9S08GB60ACFUE - 8-bit 40MHz 60KB Flash MCU | NXP | LQFP-64
MPN: MC9S08GB60ACFUE ✗ End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MC9S08GB60ACFUE Overview
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a processor core, program and data memory, and peripheral functions such as timers, serial interfaces, and analog-to-digital converters. Within the embedded-systems hierarchy, the S08GB60 belongs to the HCS08 family of the broader MC9S08 / Freescale-NXP 8-bit MCU lineage, positioned for cost-sensitive embedded control where CAN networking and moderate analog integration are required on a single device.
Key features include the integrated CAN 2.0 A/B controller (msCAN), two SCI (UART) interfaces, an SPI interface, an 8-channel 10-bit ADC, an internal oscillator option that reduces external component count, and an operating supply range of 1.8 V to 3.6 V. Per the NXP product page, the device integrates CAN, SPI, and SCI interfaces and was designed for automotive and industrial control applications.
The HCS08 core uses a CISC architecture with a rich instruction set, background debug mode (BDM) for non-intrusive flash programming and debugging, and low-power wait and stop modes. The 10-bit ADC supports sequential conversions across 8 multiplexed channels, suitable for sensor front-ends such as throttle position, temperature, and battery-voltage monitoring. The on-chip flash supports in-circuit reprogramming through the single-wire background debug interface.
Typical applications include automotive body electronics and gateway nodes, industrial control systems, motor control auxiliaries, and CAN-networked sensor modules, where the msCAN block provides a standards-based serial network without an external CAN controller.
Design consideration: this part is NRND (Not Recommended for New Designs) per NXP, so new designs should evaluate successor devices; existing designs should secure last-time-buy stock or qualify a drop-in family variant. The 1.8 V to 3.6 V supply range requires a regulated rail with adequate decoupling on all VDD/VSS pairs.
This page synthesizes distributor availability data, datasheet-derived specifications, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for MC9S08GB60ACFUE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08GB60ACFUE (same form factor and footprint) — differing in Package, Core Processor, RAM, ADC, RAM Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08GB60CFU
✅ Drop-In✓ In Stock
$4.61 / Unit
View Datasheet →MC9S08GT60CFU
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC9S08GB32CFU
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.1 / Unit
View Datasheet →MC9S08GT16CFBE
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.65 / Unit
View Datasheet →MC9S08AW60CPUE
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →MC9S08GB60ACFUE Maximum Ratings & Electrical Characteristics
| Core Processor | HCS08 (8-bit CISC) |
| Core Size | 8-Bit |
| Maximum Clock Frequency | 40 MHz |
| Bus Clock Frequency | 20 MHz |
| Program Memory Size | 60KB (60K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 4K x 8 |
| Supply Voltage (Vcc/Vdd) | 1.8V ~ 3.6V |
| Data Converters | A/D 8x10b |
| Connectivity | CAN, SPI, SCI (UART) |
| Oscillator Type | Internal |
| Operating Temperature | -40C ~ 85C (TA) |
| Package | 64-LQFP (10x10 mm) |
| Mounting Type | Surface Mount |
| Series | S08, S08GB |
| EEPROM Size | - |
MC9S08GB60ACFUE 64-lqfp (10x10 mm) Pin Configuration Guide
Pin configuration for MC9S08GB60ACFUE (64-lqfp (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC9S08GB60ACFUE.
Refer to the datasheet for full pin configuration.
Typical Applications
MC9S08GB60ACFUE is suitable for 6 applications: Automotive Body Electronics, Industrial Control Systems, CAN Bus Sensor Modules, Motor Control Auxiliary Logic, Battery-Powered Portable Instruments, Legacy Maintenance and Migration.
Automotive Body Electronics
The MC9S08GB60ACFUE was explicitly designed for automotive applications per NXP, and its integrated msCAN controller (CAN 2.0 A/B) lets body modules such as door controllers, seat adjusters, lighting modules, and climate flaps communicate on the vehicle network without an external CAN controller. The -40C to +85C A-grade temperature rating matches under-dash and engine-bay-adjacent environments, while the 1.8V to 3.6V supply range supports load-dump-protected 3.3V rails. The 8-channel 10-bit ADC reads switch stacks, position sensors, and battery sense lines directly, and the 60KB FLASH accommodates full diagnostic stacks including UDS/KWP-lite message handling. Designers should budget CAN transceiver delay and use the internal oscillator only where bus timing tolerance allows.
Recommended
Industrial Control Systems
In factory and process control, the MC9S08GB60ACFUE serves as a node controller reading sensors and driving actuators over CAN or SCI links. The 20 MHz bus delivers adequate headroom for PID loops executing at 1 kHz, and the 8-channel 10-bit ADC (approximately 10-bit resolution, sequential scan) digitizes 0-3.3V transducer outputs such as pressure and temperature. The 60KB FLASH supports protocol stacks, calibration tables, and firmware-update bootloaders, while 4KB RAM holds loop state and communication buffers. Because the part is NRND, industrial new designs should consider the S08DZ/S08DV families; existing installed-base maintenance can continue sourcing this device while stock lasts. Use external watchcrystal timing when precise UART baud rates are required across temperature.
Recommended
CAN Bus Sensor Modules
Distributed sensor modules - tilt, level, proximity, and environmental sensing - benefit from the MC9S08GB60ACFUE's combination of an on-chip 10-bit ADC and msCAN controller in one 64-pin device. The sensor front-end connects directly to ADC channels, and the module transmits scaled engineering units on the CAN bus at 125 kbps to 1 Mbps (per msCAN capability), with hardware acceptance filters offloading the CPU. The internal oscillator option can clock non-CAN logic while a crystal clocks the CAN baud-rate generator, reducing BOM cost. With 60KB FLASH, the module can store calibration coefficients and a bootloader for field updates over CAN. Power budget is dominated by bus activity; enable stop modes between messages to cut average current significantly in battery-backup modules.
Recommended
Motor Control Auxiliary Logic
The MC9S08GB60ACFUE works well as auxiliary supervisory logic around a power stage: sequencing, fault latching, current and voltage telemetry via the 10-bit ADC, and operator-interface tasks, while a dedicated driver or DSP handles the PWM inner loop. The 20 MHz HCS08 bus executes housekeeping and CAN reporting concurrently, and timer resources generate slow PWM channels for fans, relays, and indicator LEDs. Its 1.8V to 3.6V range allows operation from the same rail as gate-driver logic. Because the ADC result registers are directly accessible in the HCS08 memory map, telemetry sampling adds minimal overhead. Designers should route ADC sense lines away from gate-drive switching nodes and average multiple samples to reject switching noise.
Recommended
Battery-Powered Portable Instruments
Handheld meters, dataloggers, and portable test instruments leverage the MC9S08GB60ACFUE's low-voltage operation (1.8V to 3.6V) and HCS08 low-power modes. In stop mode the core and clocks halt, allowing wake from keyboard or RTC interrupts, and wait mode keeps peripherals running with the CPU idle - suitable for periodic ADC scans in a logging loop. The 60KB FLASH stores logged datasets, lookup tables, and a USB- or UART-based firmware updater, while 4KB RAM buffers sample streams. The internal oscillator eliminates a crystal in coarse-timing designs, trimming BOM cost and board area on the 10x10 mm LQFP layout. Battery life estimates must include flash-erase/write energy when logging frequently to flash emulation pages.
Recommended
Legacy Maintenance and Migration
A major ongoing use of the MC9S08GB60ACFUE is sustaining existing products: NXP's NRND status means no new designs, yet automotive and industrial fleets in the field still require service spares and running repairs. Procurement teams should quantify remaining lifetime demand, place last-time-buy orders while distributor stock exists (DigiKey and Mouser listed availability as of 2026-10-18), and qualify a migration path. Same-family drop-ins (MC9S08GB60CFU, S08GT60 variants) reuse the PCB and firmware; the S08DZ/S08DV families need layout changes but remain in production. Maintain the BDM programming fixture and CodeWarrior toolchain licenses, and archive the MC9S08GB60/D Rev. 2.3 data sheet and mask-set documentation for long-term support.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08GB60ACFUE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08GB60CFU | MC9S08GT60CFU | MC9S08GB32CFU | MC9S08GT16CFBE | MC9S08AW60CPUE |
|---|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP - same footprint | 64-LQFP - same footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Program Memory (FLASH) | 60KB | 60KB | 60KB | 32KB | 16KB | 60KB |
| CAN Module | Yes (msCAN, CAN 2.0 A/B) | Yes (msCAN) | No | Yes (msCAN) | No | No |
Key Differentiators
- Integrated msCAN controller (vs MC9S08GT60CFU)
- Largest flash in the shared 64-LQFP footprint (vs MC9S08GB32CFU)
- Same-die family migration path (vs MC9S08GT16CFBE)
Design Notes
Supply the MC9S08GB60ACFUE from a regulated 3.3V rail within the 1.8V to 3.6V range. Decouple every VDD/VSS pin pair of the 64-LQFP with 100 nF ceramic capacitors placed within 2 mm of the pins, plus one 4.7 uF to 10 uF bulk capacitor near the package. Flash program/erase operations draw current pulses on VDD; undersupplied rails during flash writes cause write failures. If the CAN transceiver runs from 5V, level-shift RX/TX appropriately or choose a 5V-tolerant transceiver per its datasheet.
Provide the standard 6-pin (or 4-pin) BDM background debug header on every board, including production builds, for in-circuit flash programming of the HCS08 core. Keep the BKGD line short with a pull-up as specified in the MC9S08GB60/D data sheet. Route the CAN TX/RX to the transceiver with a series resistor (typically 10 to 100 ohm) to control edge rates and EMI. Reserve a crystal footprint even if the internal oscillator is used initially - UART baud accuracy and future CAN timing requirements often force a switch to crystal timing.
The device is NRND per NXP - do not start new designs on this part without a documented exit strategy. There is no dedicated EEPROM; flash-emulated parameter storage consumes endurance cycles, so wear-level writes across a 512-byte page sector and log erase counts. Analog readings suffer when switching nearby port outputs during ADC sampling - schedule conversions away from GPIO edges. Finally, verify the exact suffix decoding (ACFUE vs CFU) for temperature grade and packing before substitution; the orderable suffix encodes grading not visible from the base part number.
Compliance Information
Verified web data does not state RoHS/REACH/lead-free status for this exact ordering code. The NXP product page (nxp.com/part/MC9S08GB60ACFUE) lists Environmental Quality data; consult it or request a material declaration before regulated-market shipping. AEC-Q100 status not stated in provided data.