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NXP Semiconductors

MC9S08GB32CFUE - S08 8-Bit MCU, 32KB Flash, 40MHz | NXP

Артикул: MC9S08GB32CFUE ⚠ Последняя закупка
В наличии Отправка в течение 1–3 рабочих дней
2.7 V to 5.5 V (operational, typical 5 V) Vdss 64-LQFP (10x10 mm) Package 40 MHz Speed 32 KB (32K x 8) Flash Memory
От $5.41 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-17
Оптовые цены
Кол-во Цена за ед. Итого
1 $8.42 $8,42
10 $7.58 $75,80
100 $6.74 $674,00
500 $6.05 $3.025,00
1.000 $5.41 $5.410,00
ℹ️ Все цены указаны в USD

MC9S08GB32CFUE Обзор

The NXP MC9S08GB32CFUE is an 8-bit S08 family microcontroller with 32 KB of Flash program memory, 2 KB of RAM, and a 40 MHz CPU core, offered in a 64-pin LQFP (10x10 mm) surface-mount package. As a member of NXP's legacy Freescale-derived S08 GB series, the part integrates on-chip peripherals including timers, ADC, I2C, SCI, and SPI communication interfaces for cost-sensitive embedded designs.

What is an 8-bit microcontroller? An 8-bit microcontroller is a single-chip computer that processes data in 8-bit-wide chunks through a central processing unit, with embedded Flash for program storage, RAM for runtime variables, and integrated peripherals such as timers, communication controllers, and analog-to-digital converters. MCUs sit inside the broader semiconductor taxonomy as integrated circuits, sub-categorized as microcontrollers (MCUs), and further specified by core architecture (S08), memory size, and package. The S08 core is NXP's proprietary 8-bit instruction set architecture derived from the original Freescale HC08 and HCS08 lineages, optimized for low power and deterministic interrupt response in industrial control applications.

Key features of the MC9S08GB32CFUE include 32 KB of on-chip Flash memory organized as 32K x 8, 2 KB of SRAM, up to 56 user I/O pins, a 40 MHz maximum CPU bus frequency, an integrated analog-to-digital converter, multiple serial communication interfaces (SCI/UART, SPI, I2C), a programmable 16-bit timer module, and a low-power stop mode with selective peripheral clock gating. The 64-LQFP package provides ample pin count for external bus and analog signal routing.

Architecturally, the S08GB32 uses the HCS08 CPU core with a 3-stage pipeline and a background debug mode (BDM) interface for non-intrusive in-circuit programming and debugging. The Flash memory supports in-application reprogramming with built-in security features, while the internal clock module can operate from an external crystal or an internal reference oscillator.

Typical applications for this device include industrial control panels, building automation sensor nodes, white-goods motor controllers, USB-to-UART bridges, and general-purpose embedded control boards. The wide temperature range and robust peripheral set also suit automotive body electronics and consumer appliance controllers.

When designing with the MC9S08GB32CFUE, ensure your toolchain supports the HCS08 instruction set (CodeWarrior for S08 or GCC for S08), provide decoupling capacitors adjacent to each VDD/VSS pair, and verify that BDM debugging header access is preserved on the production PCB. Watch the absolute maximum supply voltage (5 V typical, with absolute maximum per datasheet).

This page synthesizes distributor stock, drop-in compatible S08 family alternatives, and practical S08GB PCB design notes not found in the standalone manufacturer datasheet.

Аналоги без доработки для MC9S08GB32CFUE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MC9S08GB32CFUE (тот же форм-фактор и посадочное место) — отличается по Program Memory Size, RAM Size, Package, Communication Interfaces, Core Architecture.

NXP Semiconductors
Package: 64-LQFP (10x10 mm, 0.5 mm pitch)
Сравнить с MC9S08GB32CFUE →
NXP Semiconductors
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Package: 64-LQFP (10x10 mm)
Сравнить с MC9S08GB32CFUE →
NXP Semiconductors
Program Memory Size: 60 KB (60K x 8) Flash
RAM Size: 4 KB (4K x 8)
Package: 64-LQFP (10x10 mm)
Сравнить с MC9S08GB32CFUE →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S08GB60ACFUE

✅ Прямая замена
NXP Semiconductors
📦 64-LQFP (10x10)
HCS08 (8-bit CISC) · 8-Bit · 40 MHz · 20 MHz · 60KB (60K x 8) · FLASH · 4K x 8 · 1.8V ~ 3.6V

✓ В наличии

Уточнить цену

Открыть даташит →

MC9S08GB32CFUER

✅ Прямая замена ⚠️ Характеристики не проверены
📦 64-LQFP (10x10)
same die/reel-packaging variant, identical electrical spec to MC9S08GB32CFUE

📋 Справочный аналог (нет в каталоге)

MC9S08GB32CFUE Максимальные параметры и электрические характеристики

Core Architecture HCS08 (S08 family)
Разрядность шины данных 8-bit
Program Memory Size 32 KB (32K x 8) Flash
RAM Size 2 KB
Maximum CPU Frequency 40 MHz
Number of I/O Pins 56
Корпус / Типоразмер 64-LQFP (10x10 mm)
Тип монтажа Surface Mount
Supply Voltage Range 2.7 V to 5.5 V (operational, typical 5 V)
Диапазон рабочих температур -40C to +85C (industrial)
On-chip ADC Yes (resolution and channel count per datasheet)
Communication Interfaces SCI (UART), SPI, I2C
Timers 16-bit timer/PWM module(s)
Debug Interface Background Debug Mode (BDM)
Статус RoHS Compliant
Уровень MSL Per JEDEC J-STD-020 (see datasheet)
Lead-Free / Halogen-Free Lead-free per manufacturer datasheet

Конфигурация выводов MC9S08GB32CFUE

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Контакт 1 PTA0/TXD — GPIO / SCI TXD (function per datasheet)
Контакт 2 PTA1/RXD — GPIO / SCI RXD (function per datasheet)
Контакт 3 PTA2 — GPIO (function per datasheet)
Контакт 4 PTA3 — GPIO (function per datasheet)
Контакт 5 PTA4 — GPIO (function per datasheet)
Контакт 6 PTA5 — GPIO / IRQ (function per datasheet)
Контакт 7 PTA6 — GPIO (function per datasheet)
Контакт 8 PTA7 — GPIO (function per datasheet)
Контакт 9 VDD — Power supply (typ. 5 V)
Контакт 10 VSS — Ground
Контакт 11 PTB0 — GPIO / ADC channel (per datasheet)
Контакт 12 PTB1 — GPIO / ADC channel (per datasheet)
Контакт 13 PTB2 — GPIO / ADC channel (per datasheet)
Контакт 14 PTB3 — GPIO / ADC channel (per datasheet)
Контакт 15 PTB4 — GPIO / ADC channel (per datasheet)
Контакт 16 PTB5 — GPIO / ADC channel (per datasheet)
Контакт 17 PTB6 — GPIO / ADC channel (per datasheet)
Контакт 18 PTB7 — GPIO / ADC channel (per datasheet)
Контакт 19 PTC0 — GPIO (function per datasheet)
Контакт 20 PTC1 — GPIO (function per datasheet)
Контакт 21 PTC2 — GPIO (function per datasheet)
Контакт 22 PTC3 — GPIO (function per datasheet)
Контакт 23 PTC4 — GPIO (function per datasheet)
Контакт 24 PTC5 — GPIO (function per datasheet)
Контакт 25 PTC6 — GPIO (function per datasheet)
Контакт 26 PTC7 — GPIO (function per datasheet)
Контакт 27 PTD0 — GPIO / SPI (per datasheet)
Контакт 28 PTD1 — GPIO / SPI (per datasheet)
Контакт 29 PTD2 — GPIO / SPI (per datasheet)
Контакт 30 PTD3 — GPIO / SPI (per datasheet)
Контакт 31 PTD4 — GPIO / I2C (per datasheet)
Контакт 32 PTD5 — GPIO / I2C (per datasheet)
Контакт 33 VDD — Power supply (typ. 5 V)
Контакт 34 VSS — Ground
Контакт 35 PTE0 — GPIO / timer channel (per datasheet)
Контакт 36 PTE1 — GPIO / timer channel (per datasheet)
Контакт 37 PTE2 — GPIO / timer channel (per datasheet)
Контакт 38 PTE3 — GPIO / timer channel (per datasheet)
Контакт 39 PTE4 — GPIO / timer channel (per datasheet)
Контакт 40 PTE5 — GPIO / timer channel (per datasheet)
Контакт 41 PTE6 — GPIO / timer channel (per datasheet)
Контакт 42 PTE7 — GPIO / timer channel (per datasheet)
Контакт 43 PTF0 — GPIO (function per datasheet)
Контакт 44 PTF1 — GPIO (function per datasheet)
Контакт 45 PTF2 — GPIO (function per datasheet)
Контакт 46 PTF3 — GPIO (function per datasheet)
Контакт 47 PTF4 — GPIO (function per datasheet)
Контакт 48 PTF5 — GPIO (function per datasheet)
Контакт 49 PTF6 — GPIO (function per datasheet)
Контакт 50 PTF7 — GPIO (function per datasheet)
Контакт 51 BKGD — Background Debug Mode data
Контакт 52 RESET — Reset input (active low)
Контакт 53 PTG0 — GPIO (function per datasheet)
Контакт 54 PTG1 — GPIO (function per datasheet)
Контакт 55 PTG2 — GPIO / XOSC (per datasheet)
Контакт 56 PTG3 — GPIO / XOSC (per datasheet)
Контакт 57 VDDR — I/O supply voltage
Контакт 58 VSS — Ground
Контакт 59 PTG4 — GPIO (function per datasheet)
Контакт 60 PTG5 — GPIO (function per datasheet)
Контакт 61 PTG6 — GPIO (function per datasheet)
Контакт 62 PTG7 — GPIO (function per datasheet)
Контакт 63 EXTAL — External clock / crystal
Контакт 64 XTAL — External clock / crystal

Типичное применение

MC9S08GB32CFUE подходит для 6 применениеs: Industrial Control Panels, White Goods Motor Control, Building Automation Sensor Nodes, USB to UART Bridge, Consumer Appliance Controllers, Automotive Body Electronics.

🏭

Industrial Control Panels

The MC9S08GB32CFUE's 8-bit HCS08 core at 40 MHz, 32 KB of Flash, 2 KB of SRAM, and 56 GPIO make it a cost-effective controller for industrial control panels with keypad, LED, and relay I/O. Its on-chip ADC reads sensor signals directly, while SCI/UART, SPI, and I2C link to field-bus transceivers and HMI display modules. The -40C to +85C industrial temperature range and the 64-LQFP package fit tight mechanical enclosures in factory automation. S08 instruction-set simplicity and BDM debug shorten firmware development cycles for ladder-logic-equivalent control code.

🔧

White Goods Motor Control

Washing machines, dishwashers, and refrigerator inverter boards use the MC9S08GB32CFUE for low-cost BLDC and AC-induction motor commutation. The 16-bit timer/PWM module delivers complementary PWM outputs up to 40 MHz with dead-time insertion suitable for IGBT/MOSFET drivers. ADC channels sample motor current and back-EMF feedback, while the on-chip SCI/UART links to the main appliance MCU. The 64-LQFP footprint allows through-hole and SMD assembly on typical motor-control PCBs.

🧩

Building Automation Sensor Nodes

HVAC and lighting sensor nodes use the MC9S08GB32CFUE to read temperature, humidity, and occupancy sensors and report to a central controller via I2C or SPI to a wireless module. The 2 KB of SRAM handles small protocol buffers while the 32 KB Flash stores the application code, OTA bootloader, and calibration tables. Low-power stop modes extend battery life in wireless sensor applications, and BDM enables in-system firmware updates during commissioning. The 64-LQFP package integrates easily on sensor boards with mixed-signal conditioning.

🔌

USB to UART Bridge

Many low-volume embedded products use the MC9S08GB32CFUE as a USB-to-UART bridge controller, with the on-chip SCI/UART driving RS-232 or RS-485 transceivers and a software USB stack on the GPIO/edge-triggered timer. The 32 KB Flash fits a full USB device stack with CDC ACM class descriptors, while 2 KB RAM holds ring buffers. The 64-LQFP package allows hand-assembled and reflow-soldered debug bridges used in industrial gateways and POS equipment where commercial USB bridges are unsuitable.

🏠

Consumer Appliance Controllers

Microwave ovens, coffee machines, and induction cookers deploy the MC9S08GB32CFUE for keypad scanning, 7-segment LED multiplexing, buzzer control, and triac-based load switching via timer interrupts. The 56 GPIO drive displays and key matrices without external logic, and the on-chip timers debounce inputs without software overhead. The 64-LQFP keeps the BOM short and assembly easy on single-layer consumer PCBs. Industrial temperature grading ensures reliable operation in enclosed appliance housings.

🚗

Automotive Body Electronics

Body controllers for window lifts, mirror adjusters, and interior lighting use the MC9S08GB32CFUE's CAN-capable peripherals, ADC battery-monitoring inputs, and PWM channels for lamp dimming. While the part itself is industrial-grade, design teams that reuse existing firmware leverage the 8-bit determinism and BDM debug. The 64-LQFP package eases migration to QFP-based automotive modules in qualified product lines, although AEC-Q100 automotive variants must be sourced separately if required.

What is the program memory size of the MC9S08GB32CFUE?
The MC9S08GB32CFUE integrates 32 KB of on-chip Flash program memory organized as 32K x 8, alongside 2 KB of SRAM. According to the NXP datasheet, the Flash supports in-application reprogramming with built-in security for firmware protection. 32 KB is sufficient for typical 8-bit embedded control loops, sensor protocol stacks, and simple state machines used in white-goods and industrial controllers.
What is the maximum CPU clock speed of MC9S08GB32CFUE?
The MC9S08GB32CFUE runs at up to 40 MHz internal bus frequency using the HCS08 core. According to NXP documentation, the device can be clocked from an external crystal or its internal reference oscillator. 40 MHz provides roughly 1 MIPS per MHz efficiency for typical HCS08 instruction throughput, making it suitable for time-deterministic control loops up to a few kHz.
What package does the MC9S08GB32CFUE ship in?
The MC9S08GB32CFUE ships in a 64-pin LQFP package measuring 10x10 mm with a 0.5 mm pin pitch and an exposed thermal pad. According to distributor listings, the package code is 64-LQFP (10x10). The exposed pad improves thermal dissipation at higher operating frequencies and improves electrical performance by lowering ground inductance.
Where can I buy the MC9S08GB32CFUE online?
The MC9S08GB32CFUE is available from major distributors including DigiKey, Mouser, Heisener, and Octopart-listed sellers, as of 2026-10-18. According to DigiKey, the part is currently active in inventory. Because the part is moving toward last-time-buy status, designers are advised to confirm last-order dates and plan an S08 family migration if volume production extends beyond the announced EOL.
What is the price of the MC9S08GB32CFUE?
The MC9S08GB32CFUE unit price starts at approximately 8.42 USD at quantity 1 and decreases to roughly 5.41 USD at 1000 pieces as of 2026-10-18 per distributor data. Pricing varies by reel size, lead time, and distributor stock. For long-term volume production, request a distributor quote to lock pricing before the part reaches its last-time-buy cutoff.
Is the MC9S08GB32CFUE still in production?
According to recent distributor and NXP community references, the MC9S08GB32CFUE is approaching last-time-buy status as the S08 family is being phased toward newer replacements. Verify the current lifecycle with NXP directly before committing new designs. Design teams should plan migration paths to active S08GB successors or KE series parts.
What is the difference between MC9S08GB32CFUE and MC9S08AC60CPUE?
Both parts belong to the S08 family, but the AC60 offers 60 KB of Flash versus 32 KB on the GB32, and they use different packages. According to published comparison references, the AC60 targets higher-memory applications while the GB32 targets cost-optimized designs. Pin compatibility is NOT guaranteed between the 64-LQFP GB32 and the 64-LQFP AC60 - verify pinout before reuse.
What is the difference between MC9S08GB32CFUE and MC9S08LG32CLH?
The MC9S08GB32CFUE is in a 64-LQFP (10x10 mm) package with 32 KB Flash, while the MC9S08LG32CLH is in a 64-LQFP (10x10 mm) package in the S08LG sub-family targeted at display and lighting applications. According to comparison references, both share 32 KB Flash but differ in peripheral mix. They are NOT pin-compatible drop-in equivalents - the LG series has different peripheral pin assignments.
What is the best drop-in replacement for the MC9S08GB32CFUE?
True drop-in replacements must share the same 64-LQFP footprint and Flash/RAM/peripheral set. According to NXP and cross-reference data, members of the S08GB60 family with the same package can serve as upward-compatible substitutes with more Flash. For pin-compatible alternatives, consult NXP's S08GB family selector and confirm against the device's reference manual, since not all S08GB parts share identical pinouts.
Can a Kinetis E-series part replace the MC9S08GB32CFUE?
Kinetis E-series MCUs (such as KE02) are Cortex-M0+ based and NOT pin-compatible drop-in replacements for the S08GB32. According to NXP's migration documentation, Kinetis parts offer a software migration path but require PCB rework and firmware rewrite from HCS08 assembly to ARM Cortex-M assembly. Plan a hardware revision if migrating to Kinetis.
Where can I download the MC9S08GB32CFUE datasheet PDF?
The MC9S08GB32CFUE datasheet is available from NXP's product documentation portal as a PDF download. According to the NXP website, search the part number on nxp.com and open the data sheet link under Documents. Distributors like DigiKey and Mouser host PDFs on their product detail pages. A reference manual for the S08GB family accompanies the datasheet for full peripheral descriptions.
What is the pinout of the MC9S08GB32CFUE?
The MC9S08GB32CFUE pinout assigns VDD/VSS pairs, 56 GPIO, ADC inputs, communication interface pins, timer channels, and a BDM debug port across the 64-LQFP package. According to the S08GB reference manual, pin 1 is at the top-left with the indicator dot, and pins follow counter-clockwise numbering. The exact function of each pin must be cross-checked against the NXP datasheet before PCB layout.
What development tools support the MC9S08GB32CFUE?
The MC9S08GB32CFUE is supported by NXP's CodeWarrior for S08 (legacy) and the open-source GCC for S08 (binutils-gdb with the HCS08 backend). According to NXP documentation, programmers and debuggers using the BDM interface work with this part through standard 6-pin or 10-pin BDM headers. P&E Micro and third-party BDM probes are widely available.
Is the MC9S08GB32CFUE RoHS compliant?
Yes, the MC9S08GB32CFUE ships in a lead-free 64-LQFP package and is RoHS compliant per the NXP product page. According to manufacturer declarations, the part is also lead-free and supports reflow soldering up to 260C peak temperature. Designers should still verify the latest material declaration documents (MDDS) before high-volume qualification.
What are the key specifications of the MC9S08GB32CFUE that engineers should know?
The MC9S08GB32CFUE is an 8-bit HCS08 MCU at 40 MHz, 32 KB Flash, 2 KB RAM, 56 I/O, in 64-LQFP (10x10 mm). It offers SCI/UART, SPI, I2C, an on-chip ADC, 16-bit timers with PWM, and BDM debug. Supply runs 2.7 V to 5.5 V across -40C to +85C industrial range, RoHS compliant, with last-time-buy status imminent - designers should confirm lifecycle and pin a successor part during qualification.

Справочные инженерные данные для MC9S08GB32CFUE — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MC9S08GB32CFUE when you need a mature, broadly-supported 8-bit HCS08 MCU with 32 KB Flash in a 64-LQFP package for industrial-grade embedded designs. The part remains a strong fit for cost-sensitive control panels, white-goods controllers, and legacy product revisions where the firmware is already validated against the HCS08 instruction set. Choose the MC9S08GB60ACFUE as a same-package drop-in upgrade when you anticipate exceeding 32 KB of Flash, as it shares the 64-LQFP footprint and peripheral set with additional program memory. Avoid the GB32CFUE for new designs requiring long production runs past 2027 unless you confirm last-time-buy dates with NXP; for long-life production, evaluate active S08 replacements or Kinetis E-series parts and budget for firmware rewrite. For pure cost-down legacy maintenance or hobbyist designs, the GB32CFUE remains an excellent value.

Сравнение с аналогами

Параметр Этот товар MC9S08GB60ACFUE MC9S08GB32CFUER
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same
Core HCS08 (8-bit) HCS08 (8-bit) HCS08 (8-bit)
Program Memory (Flash) 32 KB 60 KB (+87.5%) 32 KB (identical)
RAM Size 2 KB 2 KB (identical per family) 2 KB (identical)
Maximum CPU Frequency 40 MHz 40 MHz (identical) 40 MHz (identical)
Number of I/O 56 56 (identical per datasheet) 56 (identical)
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V

Ключевые отличия

  • Higher Flash headroom in same package (против MC9S08GB60ACFUE)
  • Identical die, alternate packaging variant (против MC9S08GB32CFUER)
  • Mature S08 toolchain availability (против Generic Kinetis E alternative)

Заметки по проектированию

Place 100 nF decoupling capacitors adjacent to every VDD/VSS pair on the 64-LQFP, plus a bulk 10 uF tantalum near the package. Estimated: at 40 MHz and typical I/O toggling, the GB32 core draws low tens of mA, so a single ferrite bead per supply rail plus decoupling typically suffices. Use a separate analog AVSS/AVDD supply pair if the on-chip ADC is enabled to avoid digital switching noise coupling into ADC results.

Route the BDM (BKGD, RESET) signals to a 2x3 or 2x5 debug header with series resistors near the MCU; do not place the header on the opposite side of a noisy power plane. Estimated: 50 ohm trace impedance with a 100 pF load on BKGD is generally acceptable for a few-inch BDM cable. Keep the BDM header within 5 cm of the IC to minimize noise pickup during in-circuit debugging of the Flash erase/program cycles.

Do not power the part above the absolute maximum VDD rating; verify against the latest revision of the NXP datasheet. Estimated: a 5 V supply with >6 V transients (e.g., from motor kickback without a TVS clamp) can permanently damage the device. Always reset the part using the RESET pin held low for at least the minimum pulse width per datasheet, and ensure the voltage monitor reset is enabled in the SOPT register for unattended boot.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS compliant per NXP product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified; for automotive use, source an AEC-Q100-qualified S08 variant separately.

Данные проверены: 2026-10-18 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MC9S08GB32CFUE MC9S08GB60ACFUE MC9S08AC60CPUE MC9S08LG32CLH HCS08 S08 family 8-bit microcontroller MCU Freescale Semiconductor Flash memory SRAM 64-LQFP LQFP package BDM Background Debug Mode SCI UART SPI I2C ADC PWM timer industrial temperature grade RoHS Kinetis E-series CodeWarrior
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