MC9S08GT16CFD - 8-Bit 40MHz 16KB Flash MCU | NXP
Référence : MC9S08GT16CFD ✗ Fin de vie| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
MC9S08GT16CFD Présentation
An S08 microcontroller is an 8-bit embedded microcontroller in the broader hierarchy of embedded processors, microcontrollers, and semiconductors. It executes firmware from flash memory and provides general-purpose I/O, interrupt handling, timers, communications interfaces, and analog or timing resources depending on the device variant. The MC9S08GT16CFD family is intended for designs that need deterministic embedded control rather than a high-level application processor.
The principal verified characteristics are an 8-bit CPU, 40 MHz maximum operating frequency, and 16 KB flash memory. The package is a 48-terminal no-lead square QFN with an exposed pad, identified by package code HVQCCN in distributor data. The S08 instruction set includes the BGND instruction according to the retrieved technical description, and the device supports up to 32 interrupt or reset sources. Software-selectable port pullups and internal pullups on RESET and IRQ are also identified as design features.
The 40 MHz clock rate provides useful processing headroom for control loops, protocol servicing, and supervisory logic, while the 16 KB flash capacity supports compact firmware. The exposed-pad package improves board-level heat spreading when used with a properly designed thermal pad and copper area, but final thermal performance depends on PCB construction, copper area, airflow, and the actual operating condition.
Typical application domains include industrial control modules, motor or actuator supervisory circuits, building and access-control equipment, consumer appliances, instrumentation, and low-cost embedded nodes. Selection should begin with the verified 40 MHz performance, 16 KB flash requirement, S08 software compatibility, and the exact 48-QFN-EP footprint.
Place the decoupling network close to the supply pins and preserve the exposed-pad land pattern and thermal-via layout specified by the manufacturer package documentation. Confirm pin functions, voltage limits, peripheral availability, programming requirements, and lifecycle status against the current NXP datasheet before releasing a production design.
This page consolidates verified distributor specifications, package information, sourcing references, and engineering guidance for engineers comparing the MC9S08GT16CFD with other embedded-control solutions. It does not infer undocumented electrical limits or claim a drop-in replacement unless the manufacturer footprint and pinout have been independently confirmed.
Alternatives de remplacement direct pour MC9S08GT16CFD — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08GT16CFD (même facteur de forme et même empreinte) — différant par Instruction Set.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08GT16CFD-MO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08GT16ACFCE
✅ Remplacement direct✓ En stock
$2.31 / unité
Voir la fiche technique →MC9S08GT16CFD Valeurs maximales et caractéristiques électriques
| CPU Architecture | 8-bit HCS08 CPU |
| Maximum CPU Frequency | 40 MHz |
| Flash Memory | 16 KB |
| Flash Organization | 16K x 8 |
| Instruction Set | HC08 instruction set with added BGND instruction |
| Interrupt or Reset Sources | Up to 32 sources |
| General-Purpose I/O | 38 general-purpose I/O pins identified in retrieved technical data |
| Port Pullups | Software selectable on ports when used as inputs |
| RESET Pullup | Internal pullup identified in retrieved technical data |
| IRQ Pullup | Internal pullup identified in retrieved technical data |
| Package Type | 48-QFN-EP |
| Package Dimensions | 7 mm x 7 mm |
| Package Code | HVQCCN |
| Terminal Count | 48 terminals |
| Terminal Form | No lead |
| Temperature Grade | Industrial |
| Device Class | Embedded microcontroller |
Guide de configuration des broches du MC9S08GT16CFD hvqccn
Configuration des broches du MC9S08GT16CFD (boîtier hvqccn). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S08GT16CFD.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S08GT16CFD convient pour 6 applications: Industrial Control Module, Motor and Actuator Supervision, Building and Access-Control Equipment, Consumer Appliance Controller, Instrumentation and Data Acquisition, HMI and Display Peripheral Control.
Industrial Control Module
The MC9S08GT16CFD fits compact industrial-control modules that supervise sensors, actuators, interlocks, and system status. Its verified 40 MHz 8-bit S08 CPU provides deterministic processing capability, while 16 KB of flash supports firmware for state machines, diagnostics, debouncing, and communication service routines. The 48-QFN-EP package helps reduce board area in control assemblies where the exposed pad can be tied to a carefully designed thermal copper area. The designer should confirm voltage limits, RAM, timer resources, and communication peripherals in the current datasheet before assigning exact control functions.
Recommandé
Motor and Actuator Supervision
The MC9S08GT16CFD can supervise motors, solenoids, relays, and other actuators in compact equipment where a dedicated higher-level processor is unnecessary. At up to 40 MHz, the 8-bit S08 core can execute timing sequences, limit checks, fault flags, and safety-state transitions while 16 KB flash stores the application firmware. The QFN-EP footprint is useful in space-constrained boards, but exposed-pad layout and thermal-via construction must follow the package requirements. Exact PWM, capture, ADC, and protection capabilities remain data-needed until confirmed in the manufacturer documentation.
Recommandé
Building and Access-Control Equipment
The MC9S08GT16CFD is suitable for access-control readers, lock controllers, door interfaces, and building-automation subnodes that require local real-time decisions. Its 8-bit architecture and 16 KB flash capacity fit compact firmware for credential handling, keypad or reader scanning, relay control, status indication, and fault reporting. The verified RESET and IRQ pullup features can reduce external support components, while software-selectable port pullups can simplify input conditioning. Designers must still verify absolute maximum ratings, supply voltage, ESD requirements, security boundaries, and package-specific pin assignments in the official documentation.
Recommandé
Consumer Appliance Controller
The MC9S08GT16CFD can serve as the primary embedded controller in a small appliance, display module, or user-interface accessory. Its 40 MHz S08 processor supports responsive menu handling, button scanning, indicator control, sensor polling, and supervisory logic, while the 16 KB flash capacity constrains firmware size and encourages compact modular code. The 48-QFN-EP package supports dense layouts but requires careful land-pattern reproduction and thermal design. Before using it in a consumer product, verify EMC-related design guidance, ESD protection, supply tolerances, endurance requirements, and production programming requirements from the manufacturer sources.
Recommandé
Instrumentation and Data Acquisition
The MC9S08GT16CFD can be evaluated for instrumentation nodes that perform local signal conditioning decisions, calibration handling, status reporting, and data pre-processing. The verified 8-bit architecture is appropriate for deterministic supervisory tasks, and the 40 MHz operating point provides more headroom than basic low-clock control loops. The 16 KB flash footprint may be sufficient for compact firmware, but the supplied data does not identify ADC resolution, RAM, timers, or communication interfaces. Those capabilities must be confirmed before selecting it for precision measurement, and analog front-end design must be validated separately from the digital MCU selection.
Recommandé
HMI and Display Peripheral Control
The MC9S08GT16CFD may fit compact HMI peripherals, display-keypad modules, and status panels where a local microcontroller must scan inputs and update indicators. The 40 MHz S08 core can manage timing and event handling, while 16 KB flash provides storage for compact UI logic and configuration data. The package’s 48-QFN-EP form factor can reduce board area, but the exposed pad must be connected according to the package drawing and thermal strategy. Display voltage, serial interface, ESD protection, and connector pinout requirements should be treated as separate engineering checks because they are not specified in the supplied verification data.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08GT16CFD — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08GT16CFD-MO | MC9S08GT16 |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Architecture | 8-bit HCS08 S08 | 8-bit S08, stated in listing | S08 family identification |
Principaux différenciateurs
- Verified 40 MHz operation (vs MC9S08GT16CFD-MO)
- Compact exposed-pad package (vs MC9S08GT16)
- Documented input-support features (vs MC9S08GT16CFD-MO)
- Flash-backed 8-bit architecture (vs MC9S08GT16)
Notes de conception
Reproduce the manufacturer’s 48-QFN-EP land pattern rather than substituting a generic 48-QFN footprint. The retrieved distributor records identify a 7 mm x 7 mm no-lead package with an exposed pad and HVQCCN package code. Verify pad dimensions, pitch, thermal-via recommendations, solder-mask clearance, and pin-one orientation against the current package drawing before release. Because the supplied data does not include the numbered pinout or land pattern, do not infer these details from the package family name.
Treat the exposed pad as a thermal and electrical construction feature, not as an optional copper pour. Follow the manufacturer’s exposed-pad connection and via recommendations, and provide a continuous or properly segmented thermal copper area appropriate to the board stack-up. Actual junction temperature depends on package dissipation, ambient temperature, copper area, via count, airflow, and the verified operating mode; the supplied data does not provide thermal resistance or maximum power, so those values must be obtained from the datasheet before thermal approval.
Do not treat MC9S08GT16CFD-MO as an exact substitute solely because it appears in a distributor result. Confirm the base MPN, suffix meaning, manufacturer, temperature grade, package marking, flash and RAM configuration, pin multiplexing, clock requirements, and lifecycle status. Also verify that firmware and boot configuration are compatible. The provided data confirms family characteristics but does not establish every electrical or ordering parameter for the suffix.
Informations de conformité
The supplied distributor snippets identify industrial temperature grade and package information but do not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. These fields remain unknown rather than inferred.
