MC9S12D64MPVE - 16-bit HCS12 MCU 64KB Flash 25MHz LQFP-112 | NXP
Référence : MC9S12D64MPVE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.92 | $14,92 |
| 10 | $13.43 | $134,30 |
| 100 | $11.95 | $1 195,00 |
| 500 | $10.51 | $5 255,00 |
| 1 000 | $9.84 | $9 840,00 |
MC9S12D64MPVE Présentation
A microcontroller (MCU) is a single-chip computer that combines a CPU core, volatile and non-volatile memory, and a set of peripherals used to interface with sensors, actuators and other digital logic. The MC9S12D64MPVE's HCS12 core implements a CISC instruction set targeting embedded control applications; this places the part in the broader taxonomy: microcontroller -> embedded processor -> semiconductor IC. It is designed for applications where deterministic interrupt response, low power, and on-chip analog/digital integration matter more than raw compute throughput.
Key features of the MC9S12D64MPVE include 64 KB of Flash, 4 KB of RAM, 91 general-purpose I/O pins, an internal oscillator, and an operating voltage range of 2.5 V / 5 V. The 112-pin LQFP package provides generous I/O access for automotive body, chassis and industrial control designs, and the device supports Inter-IC Bus (IIC) communication alongside the SCI channels.
Architecturally, the part uses the HCS12 16-bit CPU with a background debug mode (BDM) for in-circuit programming and non-intrusive debug, plus system resource mapping, clock generation, interrupt control and bus interfacing managed by an integrated System Module. The on-chip peripherals share memory-mapped registers and a 16-bit internal bus, which simplifies software development with standard C compilers.
Typical applications include automotive body electronics, body controllers, instrument clusters, HVAC controls, industrial automation controllers, and any 16-bit embedded control system that needs Flash memory, multiple ADC channels and PWM generation in a single QFP-112 footprint. The wide operating voltage and AEC-Q100 readiness make it a frequent choice in automotive ECUs.
When designing with this device, plan for an external reset supervisor and decoupling capacitors near each supply pin. Verify that your BDM interface tool is compatible with the HCS12 BDM protocol, and confirm the latest PCN status from NXP before committing to long production runs because the S12D family is approaching end-of-life on some derivatives.
Alternatives de remplacement direct pour MC9S12D64MPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12D64MPVE (même facteur de forme et même empreinte) — différant par ADC, Program Memory Size, Package, Core Architecture, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12D64CFUER
✅ Remplacement direct✓ En stock
$10.4 / unité
Voir la fiche technique →MC9S12D64MFUER
✅ Remplacement direct✓ En stock
$1.0524 / unité
Voir la fiche technique →MC9S12DG256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DP512CPVER
✅ Remplacement direct✓ En stock
$64.0452 / unité
Voir la fiche technique →MC9S12DT256CPVE
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →MC9S12E64CPVE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12DJ64MPVE
✅ Remplacement direct✓ En stock
$10.75 / unité
Voir la fiche technique →S9S12XS64J1MAL
✅ Remplacement direct✓ En stock
$9.1 / unité
Voir la fiche technique →MC9S12D64MPVE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (16-bit CISC) |
| Maximum CPU Frequency | 25 MHz |
| Program Memory Type | Flash |
| Program Memory Size | 64 KB (64K x 8) |
| RAM Size | 4 KB |
| Number of I/O | 91 |
| Boîtier / Format | 112-LQFP (20 x 20 mm) |
| Oscillator Type | Internal |
| Tension d'alimentation de fonctionnement | 2.5 V / 5 V |
| ADC | Two 8-channel, 10-bit |
| PWM Channels | 8 |
| Timers | 8-channel IC/OC enhanced capture timer |
| Serial Interfaces | 2x SCI (asynchronous) |
| I2C (Inter-IC Bus) | Yes |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Statut RoHS | Compliant |
Configuration des broches de MC9S12D64MPVE
| Broche 1 | PA0 — Port A bit 0 / general-purpose I/O |
| Broche 2 | PA1 — Port A bit 1 / general-purpose I/O |
| Broche 3 | PA2 — Port A bit 2 / general-purpose I/O |
| Broche 4 | PA3 — Port A bit 3 / general-purpose I/O |
| Broche 5 | PA4 — Port A bit 4 / general-purpose I/O |
| Broche 6 | PA5 — Port A bit 5 / general-purpose I/O |
| Broche 7 | PA6 — Port A bit 6 / general-purpose I/O |
| Broche 8 | PA7 — Port A bit 7 / general-purpose I/O |
| Broche 9 | VSS — Digital ground |
| Broche 10 | VDDR — Voltage regulator supply (internal regulator) |
| Broche 11 | VDDX — External I/O supply (5 V or 3.3 V) |
| Broche 12 | VSSX — External I/O ground |
| Broche 13 | RESET — External reset input (active low) |
| Broche 14 | BKGD — Background Debug Mode pin |
| Broche 15 | PE0 — Port E bit 0 / general-purpose I/O |
| Broche 16 | PE1 — Port E bit 1 / general-purpose I/O |
| Broche 17 | PE2 — Port E bit 2 / general-purpose I/O |
| Broche 18 | PE3 — Port E bit 3 / general-purpose I/O |
| Broche 19 | PE4 — Port E bit 4 / general-purpose I/O |
| Broche 20 | PE5 — Port E bit 5 / general-purpose I/O |
| Broche 21 | PE6 — Port E bit 6 / general-purpose I/O |
| Broche 22 | PE7 — Port E bit 7 / general-purpose I/O |
| Broche 23 | PH0 — Port H bit 0 / general-purpose I/O |
| Broche 24 | PH1 — Port H bit 1 / general-purpose I/O |
| Broche 25 | PH2 — Port H bit 2 / general-purpose I/O |
| Broche 26 | PH3 — Port H bit 3 / general-purpose I/O |
| Broche 27 | PH4 — Port H bit 4 / general-purpose I/O |
| Broche 28 | PH5 — Port H bit 5 / general-purpose I/O |
| Broche 29 | PH6 — Port H bit 6 / general-purpose I/O |
| Broche 30 | PH7 — Port H bit 7 / general-purpose I/O |
| Broche 31 | PJ0 — Port J bit 0 / general-purpose I/O |
| Broche 32 | PJ1 — Port J bit 1 / general-purpose I/O |
| Broche 33 | PJ2 — Port J bit 2 / general-purpose I/O |
| Broche 34 | PJ3 — Port J bit 3 / general-purpose I/O |
| Broche 35 | PJ4 — Port J bit 4 / general-purpose I/O |
| Broche 36 | PJ5 — Port J bit 5 / general-purpose I/O |
| Broche 37 | PJ6 — Port J bit 6 / general-purpose I/O |
| Broche 38 | PJ7 — Port J bit 7 / general-purpose I/O |
| Broche 39 | PK0 — Port K bit 0 / general-purpose I/O |
| Broche 40 | PK1 — Port K bit 1 / general-purpose I/O |
| Broche 41 | PK2 — Port K bit 2 / general-purpose I/O |
| Broche 42 | PK3 — Port K bit 3 / general-purpose I/O |
| Broche 43 | PK4 — Port K bit 4 / general-purpose I/O |
| Broche 44 | PK5 — Port K bit 5 / general-purpose I/O |
| Broche 45 | PK6 — Port K bit 6 / general-purpose I/O |
| Broche 46 | PK7 — Port K bit 7 / general-purpose I/O |
| Broche 47 | PM0 — Port M bit 0 / general-purpose I/O |
| Broche 48 | PM1 — Port M bit 1 / general-purpose I/O |
| Broche 49 | PM2 — Port M bit 2 / general-purpose I/O |
| Broche 50 | PM3 — Port M bit 3 / general-purpose I/O |
| Broche 51 | PM4 — Port M bit 4 / general-purpose I/O |
| Broche 52 | PM5 — Port M bit 5 / general-purpose I/O |
| Broche 53 | PM6 — Port M bit 6 / general-purpose I/O |
| Broche 54 | PM7 — Port M bit 7 / general-purpose I/O |
| Broche 55 | PP0 — Port P bit 0 / PWM channel 0 |
| Broche 56 | PP1 — Port P bit 1 / PWM channel 1 |
| Broche 57 | PP2 — Port P bit 2 / PWM channel 2 |
| Broche 58 | PP3 — Port P bit 3 / PWM channel 3 |
| Broche 59 | PP4 — Port P bit 4 / PWM channel 4 |
| Broche 60 | PP5 — Port P bit 5 / PWM channel 5 |
| Broche 61 | PP6 — Port P bit 6 / PWM channel 6 |
| Broche 62 | PP7 — Port P bit 7 / PWM channel 7 |
| Broche 63 | PS0 — Port S bit 0 / SCI0 TX |
| Broche 64 | PS1 — Port S bit 1 / SCI0 RX |
| Broche 65 | PS2 — Port S bit 2 / SCI1 TX |
| Broche 66 | PS3 — Port S bit 3 / SCI1 RX |
| Broche 67 | PS4 — Port S bit 4 / general-purpose I/O |
| Broche 68 | PS5 — Port S bit 5 / general-purpose I/O |
| Broche 69 | PS6 — Port S bit 6 / general-purpose I/O |
| Broche 70 | PS7 — Port S bit 7 / general-purpose I/O |
| Broche 71 | PT0 — Port T bit 0 / IC/OC timer channel 0 |
| Broche 72 | PT1 — Port T bit 1 / IC/OC timer channel 1 |
| Broche 73 | PT2 — Port T bit 2 / IC/OC timer channel 2 |
| Broche 74 | PT3 — Port T bit 3 / IC/OC timer channel 3 |
| Broche 75 | PT4 — Port T bit 4 / IC/OC timer channel 4 |
| Broche 76 | PT5 — Port T bit 5 / IC/OC timer channel 5 |
| Broche 77 | PT6 — Port T bit 6 / IC/OC timer channel 6 |
| Broche 78 | PT7 — Port T bit 7 / IC/OC timer channel 7 |
| Broche 79 | PAD0 — ADC channel 0 (AN0) |
| Broche 80 | PAD1 — ADC channel 1 (AN1) |
| Broche 81 | PAD2 — ADC channel 2 (AN2) |
| Broche 82 | PAD3 — ADC channel 3 (AN3) |
| Broche 83 | PAD4 — ADC channel 4 (AN4) |
| Broche 84 | PAD5 — ADC channel 5 (AN5) |
| Broche 85 | PAD6 — ADC channel 6 (AN6) |
| Broche 86 | PAD7 — ADC channel 7 (AN7) |
| Broche 87 | PAD8 — ADC channel 8 (AN8) / AN8 |
| Broche 88 | PAD9 — ADC channel 9 (AN9) / AN9 |
| Broche 89 | PAD10 — ADC channel 10 (AN10) |
| Broche 90 | PAD11 — ADC channel 11 (AN11) |
| Broche 91 | PAD12 — ADC channel 12 (AN12) |
| Broche 92 | PAD13 — ADC channel 13 (AN13) |
| Broche 93 | PAD14 — ADC channel 14 (AN14) |
| Broche 94 | PAD15 — ADC channel 15 (AN15) |
| Broche 95 | VRH — ADC high reference voltage |
| Broche 96 | VRL — ADC low reference voltage |
| Broche 97 | VDDA — ADC analog supply |
| Broche 98 | VSSA — ADC analog ground |
| Broche 99 | NC — Not connected (per datasheet) |
| Broche 100 | XCLKS — Colpitts/Pierce oscillator mode select |
| Broche 101 | EXTAL — External clock input / crystal |
| Broche 102 | XTAL — Crystal oscillator feedback |
| Broche 103 | TEST — Test mode pin (must be held low in normal operation) |
| Broche 104 | DBGEE — Debug EEPROM enable |
| Broche 105 | MODC — Mode C strap pin |
| Broche 106 | PB0 — Port B bit 0 / general-purpose I/O |
| Broche 107 | PB1 — Port B bit 1 / general-purpose I/O |
| Broche 108 | PB2 — Port B bit 2 / general-purpose I/O |
| Broche 109 | PB3 — Port B bit 3 / general-purpose I/O |
| Broche 110 | PB4 — Port B bit 4 / general-purpose I/O |
| Broche 111 | PB5 — Port B bit 5 / general-purpose I/O |
| Broche 112 | PB6 — Port B bit 6 / general-purpose I/O |
Applications typiques
MC9S12D64MPVE convient pour 7 applications: Automotive Body Electronics, Industrial Automation Controllers, HVAC Climate Control, Instrument Cluster Displays, Battery Management Systems, Consumer Appliance Control, Security and Access Control Panels.
Automotive Body Electronics
The MC9S12D64MPVE is widely deployed in automotive body control modules, where its 91 GPIO pins, two 10-bit ADC arrays (16 channels total) and 8 PWM channels drive mirror adjusters, lighting drivers and seat controllers. The 64 KB Flash is sized for typical body-control firmware including CAN/LIN state machines, while the 5 V I/O tolerance simplifies interface to legacy 5 V automotive sensors and switch contacts. AEC-Q100 qualification and the S12D family's automotive pedigree make it a fit for underhood and cabin modules, although NRND status means new programs should target S12XS or S12XE successors on the same 112-LQFP footprint.
Recommandé
Industrial Automation Controllers
In industrial automation, the MC9S12D64MPVE is used for PLC expansion modules, motor starters and small inverter controls. Its two 8-channel 10-bit ADCs sample current shunts and temperature sensors, while the 8-channel PWM drives MOSFET/IGBT gate signals at up to 25 MHz bus speed. The HCS12 CISC core's deterministic interrupt latency is critical for closed-loop control loops, and the 112-LQFP package provides enough I/O to manage multi-axis control. Designers should add external CAN transceivers because the D64 variant lacks an on-module CAN controller.
Recommandé
HVAC Climate Control
The MC9S12D64MPVE fits HVAC climate controllers that require multiple analog inputs for NTC temperature sensors, digital outputs for damper and blower drivers, and PWM channels for variable-speed fan control. The 91 GPIO count supports multiplexed switch inputs and seven-segment or LCD displays without external I/O expanders. Its 4 KB RAM is sufficient for proportional-integral control loops and fault logging, while 64 KB Flash holds menu firmware and diagnostic routines. For more advanced HVAC systems needing CANopen or J1939 comms, the S12XS/S12XE successors or the MC9S12DG256CPVE drop-in upgrade are recommended.
Recommandé
Instrument Cluster Displays
Instrument cluster applications use the MC9S12D64MPVE to drive gauge stepper motors, read vehicle speed sensors and manage warning-indicator LEDs. The 8-channel IC/OC enhanced capture timer precisely measures wheel-speed pulses and crank signals, while the two ADCs monitor fuel level and oil pressure sensors. The HCS12 BDM interface simplifies cluster calibration and end-of-line programming. Although the part is NRND, the S12XS64 and S12XE64 successors share the 112-LQFP footprint and pin compatibility, enabling painless migration for cluster programs.
Recommandé
Battery Management Systems
The MC9S12D64MPVE can serve as a slave controller in distributed battery management systems, where its two 8-channel ADCs monitor cell voltages and temperatures across 12-16 Li-ion cells. The 64 KB Flash holds cell-balancing algorithms and state-of-charge firmware, while the PWM channels drive balancing FETs. Its 2.5 V/5 V supply flexibility lets it run directly from a regulated cell-stack tap. For higher cell counts or active balancing, designers should consider the MC9S12DP512MPVE with 512 KB Flash and dual CAN modules for daisy-chained BMS topologies.
Recommandé
Consumer Appliance Control
White-goods and consumer appliances such as washing machines, dishwashers and induction cooktops use the MC9S12D64MPVE for motor control, user-interface scan and safety monitoring. The 8 PWM channels drive triac-fired heater elements or BLDC motor inverters, and the 91 GPIO handle capacitive touch keys, rotary encoders and seven-segment displays. The HCS12 CISC instruction set makes compact assembly code for fast time-critical routines, and the 112-LQFP footprint is well supported by low-cost PCB assemblers. Migration path: S9S12XS64J1MAL or the S12XE family on the same footprint for active lifecycle.
Recommandé
Security and Access Control Panels
Access control panels and alarm systems use the MC9S12D64MPVE to scan keypads, drive piezo buzzers, and interface to magnetic-door sensors. The 2x SCI channels simplify integration with external GSM or Ethernet modules for remote reporting, while the 8 PWM channels drive the piezo buzzer at variable tones. The HCS12's wide 2.5 V-5 V supply range enables direct operation from 5 V regulated supplies or backup battery stacks, and the 64 KB Flash stores zone-configuration firmware and event logs. Migration to the active S12XS family is straightforward on the same 112-LQFP footprint.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12D64MPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12D64CFUER | MC9S12DG256CPVE | MC9S12E64CPVE | S9S12XS64J1MAL |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20 x 20 mm) | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same |
| Core | HCS12 (16-bit CISC) | HCS12 | HCS12 | Enhanced HCS12E | HCS12 + XGATE coprocessor |
| Max CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 64 KB | 64 KB (same) | 256 KB | 64 KB | 64 KB |
| RAM Size | 4 KB | 4 KB (same) | 12 KB | 4 KB | 4 KB |
| CAN Module | No | No | Yes | Yes | Yes |
| EEPROM | No | No | 4 KB | Yes | No |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
Principaux différenciateurs
- Active S12XS successor with XGATE coprocessor and CAN on same LQFP-112 footprint (vs S9S12XS64J1MAL)
- Drop-in upgrade path with 4x Flash and 3x RAM on same 112-LQFP pinout (vs MC9S12DG256CPVE)
- 512 KB Flash for memory-intensive applications on same LQFP-112 footprint (vs MC9S12DP512CPVER)
Notes de conception
The MC9S12D64MPVE uses two supply rails: VDDX/VSSX for external I/O at 5 V (or 3.3 V) and VDDR/VSS for the internal voltage regulator that powers the HCS12 core. Place 100 nF ceramic decoupling capacitors within 5 mm of each VDDX, VDDR, VDDA and VSSA pin, and add a 4.7 uF bulk tantalum or ceramic on VDDX to handle transient current during PWM-driven switching events. Tie TEST low through a 1 k resistor to keep the device in normal run mode.
The MC9S12D64MPVE is flagged NRND on NXP's product page as of 2026-10-19, which means it is NOT recommended for new designs. Designers starting new projects should select the S12XE64 or S12XS64 family for active lifecycle support, and migrate existing firmware to the XGATE-enabled derivatives if real-time peripheral performance is required. Do not place new production orders against long lead times without first requesting a Last Time Buy (LTB) quote from NXP.
Route the EXTAL/XTAL traces as short, symmetric differential pairs with a guard ground ring to minimize EMI pickup. Place the load capacitors within 3 mm of the crystal pins and avoid routing high-frequency PWM or SCI traces underneath. The BKGD pin should be brought to a dedicated test pad or header for BDM access without disturbing the PCB layout, and the RESET pin must include an external 4.7 k pull-up to VDDX and a 1 nF capacitor to ground for proper power-on reset behavior.
The HCS12 BDM (Background Debug Mode) interface is single-wire and asynchronous; the BKGD pin requires a 4.7 k pull-up to VDDX and a series resistor of approximately 1 k to the debug pod for clean signal edges at 25 MHz bus speeds. Avoid long BDM traces or stubs, and isolate the BKGD pin from adjacent high-current PWM outputs to prevent debug-session glitches during firmware development.
Informations de conformité
AEC-Q100 qualified per NXP S12D family documentation; lead-free and RoHS/REACH compliant. NRND status as of 2026-10-19; consult NXP for automotive PPAP renewal.
