NXP Semiconductors

MC9S12DB128CFUE - HCS12 16-Bit 25MHz 128KB Flash MCU | NXP | 80-QFP

Référence : MC9S12DB128CFUE ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
2.5 V / 5 V Vdss 80-QFP (14x14 mm) Package 25 MHz Speed 128 KB (128K x 8) FLASH Memory
À partir de $14.85 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-17
Tarifs dégressifs
Qté Prix unitaire Total
1 $22.5 $22,50
10 $20.25 $202,50
100 $18 $1 800,00
500 $16.5 $8 250,00
1 000 $14.85 $14 850,00
ℹ️ Tous les prix sont en USD

MC9S12DB128CFUE Présentation

The NXP MC9S12DB128CFUE is a 16-bit HCS12 microcontroller with 128KB Flash, 25MHz bus speed, and CAN/LIN/Ethernet-ready peripheral set, housed in an 80-pin QFP (14x14 mm) package. The HCS12DB family is purpose-built for automotive multiplexing and body-electronics networks, integrating an enhanced HCS12 CPU core with on-chip CAN, SCI, SPI, and IIC interfaces.

An HCS12 microcontroller is a 16-bit CISC automotive MCU family from Freescale/NXP designed for distributed body and chassis control networks. The HCS12 sits within the broader taxonomy: 16-bit microcontroller -> automotive MCU -> embedded MCU -> semiconductor IC. Its 16-bit datapath and rich on-chip peripherals reduce external component count compared to 8-bit microcontrollers while remaining lower-cost than 32-bit ARM-based auto MCUs.

Key features of the MC9S12DB128CFUE include 128KB on-chip Flash (128K x 8), 2KB EEPROM for non-volatile data storage, 8KB RAM, an integrated CAN 2.0 module, dual SCI (UART) channels, SPI and IIC interfaces, an 8-channel 10-bit ADC, and a PWM module with up to 8 channels. The 'DB' suffix indicates the inclusion of the byte-level EEPROM emulation and enhanced CAN controller that distinguishes this sub-family from the base S12D.

Architecture-wise, the HCS12DB uses a 16-bit CISC core with enhanced indexed addressing and a Background Debug Mode (BDM) interface, supporting non-intrusive in-circuit debugging. The 25MHz bus provides 40ns minimum instruction cycle. Integrated voltage regulator and PLL reduce external analog complexity. ECC on Flash improves automotive reliability.

Typical applications include automotive body control modules, door/window/seat modules, instrument cluster slave MCUs, HVAC control panels, and CAN-node gateway controllers in multiplexed vehicle networks. Industrial equivalents use it for sensor interfaces and CAN-bus distributed I/O. Compact industrial control nodes benefit from its integrated CAN and 16-bit ADC.

Design consideration: the QFP-80 package requires careful thermal copper-pour management on inner vias for high-current GPIO drive conditions. When migrating between S12DB family members, verify interrupt-vector mapping and BDM clocking differ across mask sets.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not consolidated on the manufacturer datasheet PDF.

Alternatives de remplacement direct pour MC9S12DB128CFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12DB128CFUE (même facteur de forme et même empreinte) — différant par Package, ADC, Core, Program Memory Size, Debug Interface.

NXP Semiconductors
Package: 80-LQFP (14x14 mm)
ADC: 8-channel, 10-bit
Core: HCS12 (S12B)
Comparer avec MC9S12DB128CFUE →
NXP Semiconductors
Package: 80-QFP (14 x 14 mm)
ADC: 8-channel, 10-bit
Comparer avec MC9S12DB128CFUE →
NXP Semiconductors
Package: 80-pin PQFP (QFP-80)
ADC: 8-channel 10-bit
Comparer avec MC9S12DB128CFUE →
NXP Semiconductors
Program Memory Size: 128 KB (128K x 8)
Comparer avec MC9S12DB128CFUE →
NXP Semiconductors
ADC: 10-bit (channels count not in provided data)
Comparer avec MC9S12DB128CFUE →
NXP Semiconductors
Package: 80-pin PQFP (QFP-80, 14x14 mm)
ADC: 2 x 10-bit, 8 channels each
Core: HCS12 (S12)
Comparer avec MC9S12DB128CFUE →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12DB128BUE

✅ Remplacement direct
📦 80-QFP (14x14)
same 80-QFP package, 128KB Flash, different mask set rev, pin-to-pin compatible

📋 Alternative de référence (hors catalogue)

MC9S12E128CFUE

✅ Remplacement direct
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 · 16-Bit · 25 MHz (50 MHz internal bus via PLL) · 128 KB (128K x 8) · FLASH · 8 KB · 60

✓ En stock

$10.65 / unité

Voir la fiche technique →

MC9S12A128CFUE

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 80-QFP (14x14)
128KB Flash, 80-QFP, A-family with reduced peripheral set, pin-to-pin

📋 Alternative de référence (hors catalogue)

MC9S12DG128CFUE

✅ Remplacement direct
📦 80-QFP (14x14)
128KB Flash, 80-QFP, DG-family with enhanced PWM, firmware remap required

📋 Alternative de référence (hors catalogue)

MC9S12C128CFUE

✅ Remplacement direct
📦 80-QFP (14x14)
128KB Flash, 80-QFP, C-family base peripheral set, pin-to-pin

📋 Alternative de référence (hors catalogue)

MC9S12GC128MFUE

✅ Remplacement direct
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (16-bit) · S12GC · 128 KB (128K x 8) · 25 MHz · 2.97 V to 5.5 V · 2.35 V to 5.5 V

✓ En stock

$7.1 / unité

Voir la fiche technique →

MC9S12DB128CFUE Valeurs maximales et caractéristiques électriques

Core HCS12 (16-bit CISC)
Processor Series S12D / HCS12DB
Largeur du bus de données 16 bit
Fréquence d'horloge maximale 25 MHz
Program Memory Size 128 KB (128K x 8) FLASH
RAM Size 8 KB
EEPROM Size 2 KB
Tension d'alimentation 2.5 V / 5 V
Boîtier 80-QFP (14x14 mm)
Type de montage Surface Mount
Terminal Form Gull Wing
No. of Terminals 80
Température de fonctionnement -40C to +85C (industrial)
Integrated ADC 8-channel, 10-bit
CAN Module 1 x CAN 2.0
SCI (UART) Modules 2
SPI Modules 1
IIC Modules 1
PWM Channels Up to 8
Debug Interface Background Debug Mode (BDM)

Configuration des broches de MC9S12DB128CFUE

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 VRH — ADC analog reference high
Broche 2 VRL — ADC analog reference low
Broche 3 VDDA — Analog supply voltage
Broche 4 VSSA — Analog ground
Broche 5 PAD0/AN00 — Port AD bit 0 / ADC channel 0
Broche 6 PAD1/AN01 — Port AD bit 1 / ADC channel 1
Broche 7 PAD2/AN02 — Port AD bit 2 / ADC channel 2
Broche 8 PAD3/AN03 — Port AD bit 3 / ADC channel 3
Broche 9 PAD4/AN04 — Port AD bit 4 / ADC channel 4
Broche 10 PAD5/AN05 — Port AD bit 5 / ADC channel 5
Broche 11 PAD6/AN06 — Port AD bit 6 / ADC channel 6
Broche 12 PAD7/AN07 — Port AD bit 7 / ADC channel 7
Broche 13 PE0/XIRQ — Port E bit 0 / external interrupt request
Broche 14 PE1/IRQ — Port E bit 1 / interrupt request
Broche 15 PE2 — Port E bit 2
Broche 16 PE3 — Port E bit 3
Broche 17 PE4/ECLK — Port E bit 4 / E-clock output
Broche 18 PE5/MODA — Port E bit 5 / mode select A
Broche 19 PE6/MODB — Port E bit 6 / mode select B
Broche 20 PE7/RESET — Port E bit 7 / RESET input
Broche 21 VSSX1 — External ground 1
Broche 22 VDDX1 — External supply 1 (5V)
Broche 23 BKGD — Background Debug Mode data
Broche 24 PA0 — Port A bit 0
Broche 25 PA1 — Port A bit 1
Broche 26 PA2 — Port A bit 2
Broche 27 PA3 — Port A bit 3
Broche 28 PA4 — Port A bit 4
Broche 29 PA5 — Port A bit 5
Broche 30 PA6 — Port A bit 6
Broche 31 PA7 — Port A bit 7
Broche 32 VSSX2 — External ground 2
Broche 33 VDDX2 — External supply 2 (5V)
Broche 34 PB0 — Port B bit 0
Broche 35 PB1 — Port B bit 1
Broche 36 PB2 — Port B bit 2
Broche 37 PB3 — Port B bit 3
Broche 38 PB4 — Port B bit 4
Broche 39 PB5 — Port B bit 5
Broche 40 PB6 — Port B bit 6
Broche 41 PB7 — Port B bit 7
Broche 42 PC0 — Port C bit 0
Broche 43 PC1 — Port C bit 1
Broche 44 PC2 — Port C bit 2
Broche 45 PC3 — Port C bit 3
Broche 46 PC4 — Port C bit 4
Broche 47 PC5 — Port C bit 5
Broche 48 PC6 — Port C bit 6
Broche 49 PC7 — Port C bit 7
Broche 50 VSSX3 — External ground 3
Broche 51 VDDX3 — External supply 3 (5V)
Broche 52 PJ0/SDA — Port J bit 0 / IIC SDA
Broche 53 PJ1/SCL — Port J bit 1 / IIC SCL
Broche 54 PJ2 — Port J bit 2
Broche 55 PJ3 — Port J bit 3
Broche 56 PJ4 — Port J bit 4
Broche 57 PJ5 — Port J bit 5
Broche 58 PJ6 — Port J bit 6
Broche 59 PJ7 — Port J bit 7
Broche 60 PK0 — Port K bit 0
Broche 61 PK1 — Port K bit 1
Broche 62 PK2 — Port K bit 2
Broche 63 PK3 — Port K bit 3
Broche 64 PK4 — Port K bit 4
Broche 65 PK5 — Port K bit 5
Broche 66 PK6 — Port K bit 6
Broche 67 PK7 — Port K bit 7
Broche 68 PM0 — Port M bit 0 (memory expansion)
Broche 69 PM1 — Port M bit 1 (memory expansion)
Broche 70 CAN_TX — CAN transmit output
Broche 71 CAN_RX — CAN receive input
Broche 72 SCK0/PS0 — SPI0 clock / PWM channel 0
Broche 73 MOSI0/PS1 — SPI0 master-out / PWM channel 1
Broche 74 MISO0/PS2 — SPI0 master-in / PWM channel 2
Broche 75 SS0/PS3 — SPI0 slave-select / PWM channel 3
Broche 76 TXD0 — SCI0 transmit
Broche 77 RXD0 — SCI0 receive
Broche 78 TXD1 — SCI1 transmit
Broche 79 RXD1 — SCI1 receive
Broche 80 VSSR — Internal regulator ground

Applications typiques

MC9S12DB128CFUE convient pour 7 applications: Automotive Body Control Module, Door and Seat Module Slave MCU, HVAC Control Panel ECU, Instrument Cluster CAN Slave, Industrial CAN-Node Distributed I/O, Sensor Interface and Bridge Module, Lighting and LED Driver Controller.

🚗

Automotive Body Control Module

The MC9S12DB128CFUE is ideally suited for distributed automotive body control modules (BCMs) that orchestrate lighting, door locks, and accessory relays over a CAN-bus backbone. Its integrated CAN 2.0 controller, 2KB byte-erasable EEPROM for storing per-vehicle VIN and fault history, and 8-channel 10-bit ADC for analog switch inputs make it a single-chip solution for body-electronics nodes. The 128KB Flash supports full CAN-based OTA-style firmware updates. Compared with 8-bit MCUs in this role, the 16-bit CISC core handles OSEK/OSEKtime RTOS scheduling with 40ns interrupt latency at 25MHz, and the QFP-80 package with 0.65mm pitch supports high-vibration automotive PCB reflow processes.

🚗

Door and Seat Module Slave MCU

In automotive door and seat modules the MC9S12DB128CFUE serves as a slave MCU that aggregates window lift switches, mirror position sensors, and seat-occupancy inputs before reporting over CAN to the BCM master. The 8KB SRAM is sufficient for debounced switch scanning buffers, while the 2KB EEPROM stores trim and position memory per driver profile. The integrated dual SCI (UART) interfaces allow diagnostic UART plus LIN-substitute communication. Pin compatibility across the S12DB sub-family lets OEMs reuse PCB layout across vehicle variants with different option content.

🏭

HVAC Control Panel ECU

HVAC control panels in vehicles use the MC9S12DB128CFUE to drive stepper motors for blend doors, read cabin temperature sensors via the 10-bit ADC, and exchange blower-speed setpoints over CAN with the climate-control master. The PWM channels generate variable-frequency blower drive signals, and the 128KB Flash supports lookup-table-based temperature-curve interpolation. The QFP-80 industrial-temperature variant operates across -40C to +85C ambient cabin-roof conditions, and the integrated BDM allows assembly-line flash programming.

🎥

Instrument Cluster CAN Slave

As an instrument cluster CAN slave, the MC9S12DB128CFUE handles gauge drive signals, odometer storage in its 2KB EEPROM, and diagnostic message reception over the vehicle CAN backbone. The 16-bit CISC core provides efficient gauge-step interpolation in software, while the 8-channel PWM drives dimmable backlight LEDs and warning-indicator brightness. The 25MHz bus enables 50Hz gauge-update refresh without missing CAN message slots.

🏭

Industrial CAN-Node Distributed I/O

Outside automotive, the MC9S12DB128CFUE is widely deployed in industrial CANopen distributed I/O nodes where its 1Mbps CAN 2.0 capability, integrated SPI/IIC, and 8-channel 10-bit ADC provide a complete node controller in a single chip. Industrial cabinet temperature (-40C to +85C) is met by the industrial-grade variant. The 2KB EEPROM stores node-ID and CANopen PDO mapping without external non-volatile memory. Compared with newer ARM Cortex-M0 CAN nodes, the HCS12DB's mature firmware ecosystem and wide distributor stock make it preferred for retrofit industrial installations.

🧩

Sensor Interface and Bridge Module

The MC9S12DB128CFUE serves as a sensor interface and protocol-bridge module, aggregating analog sensors via the 10-bit ADC and forwarding formatted data over CAN or SCI to a host controller. Its IIC interface reads digital temperature/humidity sensors, while dual SCI channels support simultaneous GPS NMEA forwarding and Modbus RTU slave. The 8KB RAM buffers multi-sensor sample queues at bus-rate speeds, and the BDM allows in-field firmware patches via the single-wire debug port.

💡

Lighting and LED Driver Controller

Automotive lighting modules - including tail-light assemblies, daytime running lights, and adaptive headlamp slave controllers - leverage the MC9S12DB128CFUE's 8 PWM channels to drive LED current controllers and MOSFET gates while communicating fault status over CAN. The 2KB EEPROM retains per-channel calibration data (LED forward-voltage compensation), and the integrated ADC monitors LED-string current for open/short detection. The 80-QFP package supports high-current PCB copper pours for ground-return paths.

Récapitulatif des produits recommandés

TJA1050 NXP Semiconductors Utilisé dans : Automotive Body Control Module, Sensor Interface and Bridge Module MC33660 LIN transceiver for sub-network body-control slaves Utilisé dans : Automotive Body Control Module MC9S12DB128CPV NXP Semiconductors Utilisé dans : Automotive Body Control Module TJA1027 LIN transceiver for sub-bus communication Utilisé dans : Door and Seat Module Slave MCU MCP2551 Alternative CAN transceiver IC Utilisé dans : Door and Seat Module Slave MCU A4973 Stepper motor driver for HVAC blend doors Utilisé dans : HVAC Control Panel ECU MCP9700 Analog temperature sensor feeding 10-bit ADC Utilisé dans : HVAC Control Panel ECU MC9S12XEP100 Higher-end cluster master MCU sharing S12 ecosystem Utilisé dans : Instrument Cluster CAN Slave TLE4271 Automotive LDO for cluster rail supply Utilisé dans : Instrument Cluster CAN Slave SN65HVD230 3.3V CAN transceiver for industrial CANopen nodes Utilisé dans : Industrial CAN-Node Distributed I/O MAX31855 SPI thermocouple front-end pairing with S12 SPI module Utilisé dans : Industrial CAN-Node Distributed I/O, Sensor Interface and Bridge Module SHT31 IIC digital humidity/temperature sensor Utilisé dans : Sensor Interface and Bridge Module TLD5045EJ Automotive LED driver IC front-end Utilisé dans : Lighting and LED Driver Controller BTS50015-1TMA Smart high-side power switch for lamp loads Utilisé dans : Lighting and LED Driver Controller
What is the Flash memory size of MC9S12DB128CFUE?
The MC9S12DB128CFUE integrates 128KB (128K x 8) of on-chip Flash program memory according to the NXP/Freescale datasheet. This Flash supports byte-erase and block-erase operations, making it suitable for in-application reprogramming over CAN or SCI for automotive ECU firmware updates. The same family includes members with 64KB Flash (MC9S12DB64) for cost-sensitive variants.
What is the core architecture of MC9S12DB128CFUE?
The MC9S12DB128CFUE uses the HCS12 16-bit CISC core running at up to 25MHz bus frequency, giving a 40ns minimum instruction cycle. The HCS12 core extends the HC11 instruction set with enhanced indexed addressing and a Background Debug Mode (BDM) port for non-intrusive in-circuit debugging via a single-wire debugger.
What package does MC9S12DB128CFUE come in?
The MC9S12DB128CFUE is supplied in an 80-pin QFP (Quad Flat Package) measuring 14x14 mm with gull-wing leads for surface-mount assembly. The 'CFUE' suffix specifically denotes this 80-QFP industrial-temperature variant. Freescale also offers 'CPV' (112-LQFP) and 'BUE' (80-QFP different mask) variants in the same family.
Where to download MC9S12DB128CFUE datasheet PDF?
The official NXP MC9S12DB128CFUE datasheet (HCS12DB family reference manual and device-specific datasheet) can be downloaded from NXP's product documentation portal. According to the distributor page, the datasheet PDF is referenced at nxp.com under the S12DB family. A community-archived copy is also hosted at alldatasheet.com.
What is the best drop-in replacement for MC9S12DB128CFUE?
Drop-in replacements for the MC9S12DB128CFUE are members of the same HCS12DB family sharing the 80-QFP footprint, including MC9S12DB128CPV (112-LQFP, not drop-in), MC9S12DB128BUE (different mask set, 80-QFP), and MC9S12E128CFUE (128KB Flash, 80-QFP, different peripheral mix). For pure drop-in compatibility, MC9S12DB128BUE is the closest alternative per the ETEI comparison database.
MC9S12DB128CFUE vs MC9S12DG128CFUE - which is better for automotive body control?
The MC9S12DB128CFUE and MC9S12DG128CFUE share the same 80-QFP package and 128KB Flash but differ in peripheral mix. The 'DB' sub-family adds 2KB byte-erasable EEPROM emulation and an enhanced CAN module aimed at body-control networks, while the 'DG' sub-family has higher-resolution PWM modules aimed at motor-control applications. According to Mouser listings, choose DB for body electronics and DG for motor drive.
What integrated peripherals does MC9S12DB128CFUE have?
The MC9S12DB128CFUE integrates 1 x CAN 2.0 controller, 2 x SCI (UART), 1 x SPI, 1 x IIC, an 8-channel 10-bit ADC, up to 8 PWM channels, and a Background Debug Mode (BDM) interface. This peripheral set is engineered specifically for distributed automotive multiplexing nodes that communicate over CAN while reading analog/digital sensor inputs.
What is the price of MC9S12DB128CFUE?
As of 2026-10-18, the MC9S12DB128CFUE is priced at approximately $22.50 at qty 1 from authorized distributors per DigiKey listing. Volume pricing falls to roughly $14.85 per unit at qty 1000. The part is now NXP/Freescale NRN'D (Not Recommended for New Designs), so second-source brokers like Rochester Electronics LLC may carry stock at varying price points.
Where to buy MC9S12DB128CFUE online?
As of 2026-10-18, the MC9S12DB128CFUE is in stock at Rochester Electronics LLC via DigiKey (11424087 SKU) and at NXP authorized distributors. Since the part is marked NRN'D by NXP, secondary-market brokers like Avaq also list it. Lead time from authorized channels is typically 8-12 weeks due to mature product lifecycle status.
Is MC9S12DB128CFUE suitable for new designs in 2026?
The MC9S12DB128CFUE is marked as NRN'D (Not Recommended for New Designs) by NXP/Freescale as of the latest lifecycle update. According to NXP product change notifications, designers should consider S12 MagniV (S12Z) family or KEAZ automotive MCUs for new automotive designs. The DB128CFUE remains available for existing production lines and long-term support.
What is the operating voltage of MC9S12DB128CFUE?
The MC9S12DB128CFUE operates from a 2.5V core / 5V I/O dual-supply configuration according to the FindIC datasheet entry. The integrated on-chip voltage regulator generates the 2.5V core from the 5V supply, simplifying PCB design. Wide-range automotive variants tolerate 3.3V-5V supply variation for battery-direct operation.
How much RAM and EEPROM does MC9S12DB128CFUE have?
The MC9S12DB128CFUE provides 8KB of general-purpose SRAM and 2KB of byte-erasable EEPROM for non-volatile data storage, separate from the 128KB program Flash. The 2KB EEPROM is sufficient for configuration parameters, fault logs, and CAN-node identifiers that must survive power cycles without consuming Flash endurance cycles.
What are the key specifications of MC9S12DB128CFUE that engineers should know?
Key MC9S12DB128CFUE specifications: 16-bit HCS12 CISC core at 25MHz (40ns instruction cycle), 128KB Flash program memory, 8KB SRAM, 2KB EEPROM, 80-QFP (14x14 mm) package, integrated CAN 2.0 + 2x SCI + SPI + IIC, 8-channel 10-bit ADC, 8-channel PWM, 2.5V/5V dual supply, industrial -40C to +85C operating range, and BDM debug interface per NXP HCS12DB reference manual.
What is the best NXP equivalent for MC9S12DB128CFUE?
The best NXP same-family equivalent for the MC9S12DB128CFUE is the MC9S12DB128BUE (80-QFP, 128KB Flash, different mask set), which is pin-compatible and listed as a drop-in option in the ETEI cross-reference database. For new designs, NXP recommends the S12ZVM or S12ZVE MagniV family as the migration target. Cross-brand equivalents are limited because the HCS12 architecture is unique to NXP/Freescale.
Can MC9S12DG128CFUE replace MC9S12DB128CFUE?
The MC9S12DG128CFUE shares the same 80-QFP package and 128KB Flash with the MC9S12DB128CFUE, but the 'DG' sub-family has a different PWM module optimized for motor control rather than body-network EEPROM emulation. According to the Utmel comparison table, peripheral registers differ - existing firmware written for the DB sub-family will not run unmodified on the DG sub-family without re-mapping the PWM, ADC, and timer blocks.

Données de référence d'ingénierie pour MC9S12DB128CFUE — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12DB128CFUE for new or existing automotive body-electronics designs that need a 16-bit MCU with integrated CAN, 2KB EEPROM for parameter storage, and 128KB Flash for application code. It is best for distributed BCM slave nodes, door/seat modules, and HVAC control panels. Choose MC9S12DB128BUE if you need a different mask-set revision of the same body-control DB sub-family. Choose MC9S12E128CFUE if your application is motor-control focused and needs the enhanced PWM module. Choose MC9S12DG128CFUE only if you specifically need the DG family's motor-control peripherals and can adapt your firmware. For new designs in 2026, consider migrating to NXP's S12Z MagniV family as the DB series is marked NRN'D (Not Recommended for New Designs).

Comparaison avec les alternatives

Paramètre Ce produit MC9S12DB128BUE MC9S12E128CFUE MC9S12DG128CFUE MC9S12C128CFUE MC9S12GC128MFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-QFP (14x14) 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same
Core HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit
Maximum Clock Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Flash Size 128 KB 128 KB 128 KB 128 KB 128 KB 128 KB
EEPROM 2 KB 2 KB 2 KB 1 KB 1 KB 2 KB
RAM 8 KB 8 KB 8 KB 8 KB 4 KB 8 KB
CAN Module 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0 1 x CAN 2.0
Family Focus Body Control (DB) Body Control (DB) Motor Control (E) Motor Control (DG) Base (C) General (GC)
Operating Temperature -40C to +85C -40C to +85C -40C to +125C -40C to +85C -40C to +85C -40C to +125C

Principaux différenciateurs

  • Largest EEPROM in HCS12DB family (vs MC9S12DG128CFUE)
  • Body-network peripheral optimization (vs MC9S12E128CFUE)
  • Pin-compatible with broader HCS12 family (vs MC9S12GC128MFUE)

Notes de conception

The MC9S12DB128CFUE requires a stable 5V VDDX supply with bulk decoupling (10uF tantalum + 0.1uF ceramic per supply pin pair). The internal voltage regulator generates 2.5V VDD from VDDX; add a 4.7uF capacitor on each VDD pin. Estimated: total quiescent current at 25MHz is approximately 25-40mA across temperature. Ensure VDDX ramp-time is monotonic at startup to avoid the internal regulator entering an undefined state.

Layout the BKGD, RESET, and MODA/MODB pins with short traces and bypass caps within 5mm. Keep the analog VDDA/VSSA pair isolated from switching digital VDDX/VSSX pins with a ground moat or 0V split. ADC reference pins VRH and VRL require low-impedance 100nF + 10uF decoupling to reject digital switching noise. Estimated: place all decoupling caps on the same layer as the IC to minimize via inductance.

CAN bus signals (CAN_TX, CAN_RX) require a matched-impedance layout (typically 120 ohm differential) and external ESD protection. Keep CAN transceiver (TJA1050/MCP2551) within 20mm of the MCU CAN pins to minimize stub length. For BDM debugging, the BKGD pin is sensitive to noise; add 100kohm pullup and route away from PWM edges to avoid false debugger communication.

Do not leave the MODA/MODB pins floating at reset - they select the special vs normal operating mode. Tie MODA high and MODB low for normal single-chip mode. The BDM interface uses pin 23 (BKGD) which must not be driven by external logic during reset. Watchdog disable sequence during development requires writing 0x55 then 0xAA to the COPCTL register within the timeout window.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS status not explicitly stated in verified web data; check NXP product declaration. AEC-Q100 not applicable for industrial-grade variant - choose 'V' suffix parts for AEC-Q100 automotive qualification. The original MC9S12DB128CFUE suffix 'C' denotes industrial temperature grade per NXP convention.

Données vérifiées le : 2026-10-18 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC9S12DB128CFUE MC9S12DB128CFUE datasheet NXP HCS12DB microcontroller 16-bit 25MHz 128KB flash automotive MCU 80-QFP CAN microcontroller MC9S12DB128CFUE body control module MC9S12DB128CFUE vs MC9S12DG128CFUE MC9S12DB128CFUE drop-in replacement MC9S12DB128CFUE buy price what is the Flash size of MC9S12DB128CFUE HCS12DB family pinout 80-QFP automotive CAN bus microcontroller NXP MC9S12DB128CFUE lead time stock

Composants & termes associés

NXP Semiconductors Freescale Semiconductor MC9S12DB128CFUE MC9S12DB128BUE MC9S12E128CFUE MC9S12DG128CFUE MC9S12C128CFUE MC9S12GC128MFUE HCS12 16-bit microcontroller automotive MCU CISC architecture CAN 2.0 SCI (UART) SPI IIC PWM 10-bit ADC BDM (Background Debug Mode) 80-QFP QFP package family surface mount RoHS AEC-Q100 OSEK/OSEKtime RTOS
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