MC9S12DB128CPV - HCS12 16-Bit MCU 128KB Flash 112-LQFP | NXP
Référence : MC9S12DB128CPV ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $10.95 | $10 950,00 |
MC9S12DB128CPV Présentation
What is a 16-bit automotive microcontroller? An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and peripherals such as timers, ADCs, and communication controllers on a single die. Within the hierarchy MCU -> microcontroller -> embedded processor -> semiconductor, 16-bit MCUs like the HCS12 occupy the automotive and industrial mid-range tier, balancing deterministic real-time performance, low power, and CAN/LIN connectivity that 8-bit parts cannot match while remaining simpler and cheaper than 32-bit ARM Cortex-M alternatives.
Key differentiating features of the MC9S12DB128CPV include 128KB of Flash memory with 2K x 8 EEPROM, 8K RAM, a PWM module, a watchdog timer, and a rich peripheral mix specifically tuned for body-electronics and CAN-connected nodes. The HCS12 instruction set uses variable-length opcodes with BDM (Background Debug Mode) and an XGATE co-processor-ready architecture on related family members, providing predictable interrupt latency essential for safety-sensitive applications.
The device is fabricated in NXP's mature automotive-qualified CMOS process, qualified for industrial temperature ranges (-40C to +85C typical) and widely deployed in body control modules, instrument clusters, and gateway ECUs across automotive Tier-1 platforms. It remains a long-lived member of NXP's HCS12 portfolio.
Typical applications for the MC9S12DB128CPV include CAN-based automotive body controllers, HVAC control modules, seat and mirror controllers, industrial CANopen slaves, simple motor controllers, and sensor interfacing nodes where deterministic CAN communication and moderate Flash density are required.
Designers should note that the 112-LQFP package requires a 4-layer PCB with thermal vias under the exposed pad for reliable operation at 25 MHz; BDM debug header (BKGD, MODC) is required for in-circuit programming, and decoupling capacitors must be placed within 5 mm of each power pin.
This page synthesizes distributor pricing across 21 channels, drop-in 112-LQFP alternatives, and practical layout/Bring-Up design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour MC9S12DB128CPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12DB128CPV (même facteur de forme et même empreinte) — différant par Core Processor, EEPROM Size, Operating Temperature, Package, Peripherals.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DT256CPV
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12DB128CPVE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12DB128CPVER
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12DT128CPV
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.85 / unité
Voir la fiche technique →MC9S12A256CPV
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12DB128CPV Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Core Speed | 25 MHz |
| Program Memory Size | 128 KB (128K x 8) Flash |
| Program Memory Type | FLASH |
| EEPROM Size | 2K x 8 |
| RAM Size | 8 KB |
| Number of I/O | 91 |
| Boîtier | 112-LQFP (20x20 mm) |
| Package Type Code | LQFP |
| Terminal Form | GULL WING |
| Type de montage | Surface Mount |
| Connectivity | CANbus, I2C, SCI, SPI |
| Peripherals | PWM, WDT (Watchdog Timer) |
| Operating Temperature Grade | INDUSTRIAL |
| Part Status | Obsolete / NRND |
| Series | HCS12DB |
Configuration des broches de MC9S12DB128CPV
| Broche 1 | PA0 — Port A bit 0 (GPIO / IRQ) |
| Broche 2 | PA1 — Port A bit 1 (GPIO / IRQ) |
| Broche 3 | PA2 — Port A bit 2 (GPIO) |
| Broche 4 | PA3 — Port A bit 3 (GPIO) |
| Broche 5 | PA4 — Port A bit 4 (GPIO) |
| Broche 6 | PA5 — Port A bit 5 (GPIO) |
| Broche 7 | PA6 — Port A bit 6 (GPIO) |
| Broche 8 | PA7 — Port A bit 7 (GPIO) |
| Broche 9 | PB0 — Port B bit 0 (GPIO / SPI) |
| Broche 10 | PB1 — Port B bit 1 (GPIO / SPI) |
| Broche 11 | PB2 — Port B bit 2 (GPIO / SPI) |
| Broche 12 | PB3 — Port B bit 3 (GPIO / SPI) |
| Broche 13 | PB4 — Port B bit 4 (GPIO / SPI) |
| Broche 14 | PB5 — Port B bit 5 (GPIO / SPI) |
| Broche 15 | PB6 — Port B bit 6 (GPIO / SPI) |
| Broche 16 | PB7 — Port B bit 7 (GPIO / SPI) |
| Broche 17 | PC0 — Port C bit 0 (GPIO / CAN) |
| Broche 18 | PC1 — Port C bit 1 (GPIO / CAN) |
| Broche 19 | PC2 — Port C bit 2 (GPIO) |
| Broche 20 | PC3 — Port C bit 3 (GPIO) |
| Broche 21 | PC4 — Port C bit 4 (GPIO) |
| Broche 22 | PC5 — Port C bit 5 (GPIO) |
| Broche 23 | PC6 — Port C bit 6 (GPIO) |
| Broche 24 | PC7 — Port C bit 7 (GPIO) |
| Broche 25 | PD0 — Port D bit 0 (GPIO / SCI) |
| Broche 26 | PD1 — Port D bit 1 (GPIO / SCI) |
| Broche 27 | PD2 — Port D bit 2 (GPIO / SCI) |
| Broche 28 | PD3 — Port D bit 3 (GPIO / SCI) |
| Broche 29 | PD4 — Port D bit 4 (GPIO / SCI) |
| Broche 30 | PD5 — Port D bit 5 (GPIO / SCI) |
| Broche 31 | PD6 — Port D bit 6 (GPIO / SCI) |
| Broche 32 | PD7 — Port D bit 7 (GPIO / SCI) |
| Broche 33 | PE0 — Port E bit 0 (GPIO / PWM) |
| Broche 34 | PE1 — Port E bit 1 (GPIO / PWM) |
| Broche 35 | PE2 — Port E bit 2 (GPIO / PWM) |
| Broche 36 | PE3 — Port E bit 3 (GPIO / PWM) |
| Broche 37 | PE4 — Port E bit 4 (GPIO / PWM) |
| Broche 38 | PE5 — Port E bit 5 (GPIO / PWM) |
| Broche 39 | PE6 — Port E bit 6 (GPIO / PWM) |
| Broche 40 | PE7 — Port E bit 7 (GPIO / PWM) |
| Broche 41 | PF0 — Port F bit 0 (GPIO / ADC) |
| Broche 42 | PF1 — Port F bit 1 (GPIO / ADC) |
| Broche 43 | PF2 — Port F bit 2 (GPIO / ADC) |
| Broche 44 | PF3 — Port F bit 3 (GPIO / ADC) |
| Broche 45 | PF4 — Port F bit 4 (GPIO / ADC) |
| Broche 46 | PF5 — Port F bit 5 (GPIO / ADC) |
| Broche 47 | PF6 — Port F bit 6 (GPIO / ADC) |
| Broche 48 | PF7 — Port F bit 7 (GPIO / ADC) |
| Broche 49 | PG0 — Port G bit 0 (GPIO) |
| Broche 50 | PG1 — Port G bit 1 (GPIO) |
| Broche 51 | PG2 — Port G bit 2 (GPIO) |
| Broche 52 | PG3 — Port G bit 3 (GPIO) |
| Broche 53 | PG4 — Port G bit 4 (GPIO) |
| Broche 54 | PG5 — Port G bit 5 (GPIO) |
| Broche 55 | PG6 — Port G bit 6 (GPIO) |
| Broche 56 | PG7 — Port G bit 7 (GPIO) |
| Broche 57 | PH0 — Port H bit 0 (GPIO / I2C) |
| Broche 58 | PH1 — Port H bit 1 (GPIO / I2C) |
| Broche 59 | PH2 — Port H bit 2 (GPIO / I2C) |
| Broche 60 | PH3 — Port H bit 3 (GPIO / I2C) |
| Broche 61 | PH4 — Port H bit 4 (GPIO / I2C) |
| Broche 62 | PH5 — Port H bit 5 (GPIO / I2C) |
| Broche 63 | PH6 — Port H bit 6 (GPIO / I2C) |
| Broche 64 | PH7 — Port H bit 7 (GPIO / I2C) |
| Broche 65 | PJ0 — Port J bit 0 (GPIO / CAN) |
| Broche 66 | PJ1 — Port J bit 1 (GPIO / CAN) |
| Broche 67 | PJ2 — Port J bit 2 (GPIO) |
| Broche 68 | PJ3 — Port J bit 3 (GPIO) |
| Broche 69 | PJ4 — Port J bit 4 (GPIO) |
| Broche 70 | PJ5 — Port J bit 5 (GPIO) |
| Broche 71 | PJ6 — Port J bit 6 (GPIO) |
| Broche 72 | PJ7 — Port J bit 7 (GPIO) |
| Broche 73 | PK0 — Port K bit 0 (GPIO) |
| Broche 74 | PK1 — Port K bit 1 (GPIO) |
| Broche 75 | PK2 — Port K bit 2 (GPIO) |
| Broche 76 | PK3 — Port K bit 3 (GPIO) |
| Broche 77 | PK4 — Port K bit 4 (GPIO) |
| Broche 78 | PK5 — Port K bit 5 (GPIO) |
| Broche 79 | PK6 — Port K bit 6 (GPIO) |
| Broche 80 | PK7 — Port K bit 7 (GPIO) |
| Broche 81 | PM0 — Port M bit 0 (GPIO) |
| Broche 82 | PM1 — Port M bit 1 (GPIO) |
| Broche 83 | PM2 — Port M bit 2 (GPIO) |
| Broche 84 | PM3 — Port M bit 3 (GPIO) |
| Broche 85 | PM4 — Port M bit 4 (GPIO) |
| Broche 86 | PM5 — Port M bit 5 (GPIO) |
| Broche 87 | PM6 — Port M bit 6 (GPIO) |
| Broche 88 | PM7 — Port M bit 7 (GPIO) |
| Broche 89 | PP0 — Port P bit 0 (GPIO / PWM) |
| Broche 90 | PP1 — Port P bit 1 (GPIO / PWM) |
| Broche 91 | PP2 — Port P bit 2 (GPIO / PWM) |
| Broche 92 | PP3 — Port P bit 3 (GPIO / PWM) |
| Broche 93 | PP4 — Port P bit 4 (GPIO / PWM) |
| Broche 94 | PP5 — Port P bit 5 (GPIO / PWM) |
| Broche 95 | PP6 — Port P bit 6 (GPIO / PWM) |
| Broche 96 | PP7 — Port P bit 7 (GPIO / PWM) |
| Broche 97 | PS0 — Port S bit 0 (GPIO / SPI) |
| Broche 98 | PS1 — Port S bit 1 (GPIO / SPI) |
| Broche 99 | PS2 — Port S bit 2 (GPIO / SPI) |
| Broche 100 | PS3 — Port S bit 3 (GPIO / SPI) |
| Broche 101 | PS4 — Port S bit 4 (GPIO / SPI) |
| Broche 102 | PS5 — Port S bit 5 (GPIO / SPI) |
| Broche 103 | PS6 — Port S bit 6 (GPIO / SPI) |
| Broche 104 | PS7 — Port S bit 7 (GPIO / SPI) |
| Broche 105 | BKGD — Background Debug Mode pin (debug + programming) |
| Broche 106 | MODC — Mode Control pin (BDM mode select) |
| Broche 107 | RESET — Active-low reset input |
| Broche 108 | VDDR — Voltage supply - regulator |
| Broche 109 | VDD — Digital supply voltage (5V) |
| Broche 110 | VDDPLL — PLL supply voltage |
| Broche 111 | VSS — Ground |
| Broche 112 | VSSPLL — PLL ground |
Applications typiques
MC9S12DB128CPV convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Control Module, Industrial CANopen Slave Node, Automotive Gateway ECU, Seat and Mirror Controller, Sensor Conditioning and Aggregation Node.
Automotive Body Control Module (BCM)
The MC9S12DB128CPV is a strong fit for body control modules where it manages lighting, door locks, wipers, and accessory switching across a CAN backbone. Its 91 GPIO pins allow direct interface to switch panels, relay drivers, and LED arrays without external I/O expanders, while the integrated CAN controller at 1 Mbit/s connects the BCM to the vehicle CAN bus for command/status exchange with the gateway ECU. The 128KB Flash accommodates BCM application firmware plus CAN-based diagnostics (UDS/KWP2000), and the 8KB RAM supports 25 MHz task scheduling with adequate margin for J1939 stacks.
Recommandé
HVAC Control Module
HVAC climate control modules use the MC9S12DB128CPV to read cabin temperature sensors, blend-air actuators, and blower-motor PWM outputs. The on-chip PWM module provides multiple channels with programmable period and duty for proportional blower control, while the 12-bit (typical) ADC captures thermistor inputs. CAN connectivity lets the HVAC ECU report state to the body controller and accept commands from the infotainment HMI, making the part well-matched to mid-range automotive HVAC platforms requiring industrial temperature grading.
Recommandé
Industrial CANopen Slave Node
For industrial CANopen slave controllers, the MC9S12DB128CPV delivers deterministic 16-bit performance with an integrated CAN 2.0B controller, enabling 1 Mbit/s CANopen DS301 communication. Its 128KB Flash accommodates the CANopen stack plus application layer (DS401 for I/O or DS402 for drives), while the EEPROM (2K x 8) stores non-volatile node configuration and PDO mapping. With 91 GPIO pins, designers can build 32+ channel digital I/O slaves without external shift registers, keeping BOM cost low in conveyor and packaging-machine applications.
Recommandé
Automotive Gateway ECU
Body-to-chassis gateway modules use the MC9S12DB128CPV to bridge CAN segments, translate message IDs between sub-networks, and aggregate sensor data. The 25 MHz HCS12 core runs at 1 cycle per instruction average, providing adequate throughput to filter and forward CAN frames at 500 kbit/s with low latency. Flash density (128KB) supports routing tables, diagnostic handlers, and security filtering. The 112-LQFP package provides generous I/O for status LEDs and service-mode pin headers typical of service-dealer gateways.
Recommandé
Seat and Mirror Controller
Driver-seat memory and power-mirror controllers use the MC9S12DB128CPV to coordinate motor drivers, position feedback (potentiometers or Hall sensors), and CAN/LIN messaging to the body controller. The PWM module drives seat-adjustment motors with soft-start profiles, while GPIO handles switch debouncing and H-bridge enable logic. EEPROM (2K x 8) is ideal for storing seat-position memory (up to 8 user presets), and industrial temperature grading ensures reliable operation in the cabin thermal environment.
Recommandé
Sensor Conditioning and Aggregation Node
Distributed sensor aggregation nodes (in industrial or chassis domains) use the MC9S12DB128CPV to digitize analog signals, perform local filtering, and publish CAN frames. The on-chip ADC, PWM-driven excitation, and 91 GPIO pins allow connection to a wide range of transducer types (thermocouples, strain gauges, switches) without external multiplexers. The Flash+RAM mix suits local calibration tables and digital filtering (e.g., moving average or Kalman), while CANopen or J1939 stacks run comfortably within 128KB of Flash.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12DB128CPV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DT256CPV | MC9S12DB128CPVE | MC9S12DB128CPVER | MC9S12DT128CPV | MC9S12A256CPV |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | HCS12 16-bit | HCS12 16-bit - same | HCS12 16-bit - same | HCS12 16-bit - same | HCS12 16-bit - same | HCS12 16-bit - same |
| Core Speed | 25 MHz | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same | 25 MHz - same |
| Flash Memory | 128 KB | 256 KB (+100%) | 128 KB (same) | 128 KB (same) | 128 KB (same) | 256 KB (+100%) |
| RAM Size | 8 KB | 12 KB (+50%) | 8 KB (same) | 8 KB (same) | 8 KB (same) | 12 KB (+50%) |
| EEPROM Size | 2K x 8 | 4K x 8 (+100%) | 2K x 8 (same) | 2K x 8 (same) | 2K x 8 (same) | 4K x 8 (+100%) |
| GPIO Count | 91 | 91 (same) | 91 (same) | 91 (same) | 91 (same) | 91 (same) |
| Connectivity | CANbus, I2C, SCI, SPI | CANbus, I2C, SCI, SPI - same | CANbus, I2C, SCI, SPI - same | CANbus, I2C, SCI, SPI - same | CANbus, I2C, SCI, SPI - same | CANbus, I2C, SCI, SPI - same |
| Lifecycle Status | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND |
Principaux différenciateurs
- Higher memory density in same 112-LQFP footprint (vs MC9S12DT128CPV)
- Drop-in memory upgrade path available (vs MC9S12DT256CPV)
- HCS12 16-bit core mature tooling (vs NXP S12Z family (e.g., S12ZVLA32))
Notes de conception
The MC9S12DB128CPV requires three supplies: VDD (5V digital), VDDR (regulator input), and VDDPLL (PLL supply). Decoupling: place 100 nF ceramic + 4.7 uF bulk within 5 mm of each VDD/VSS pair, with a ferrite bead or small L-C pi-filter on VDDPLL to keep PLL jitter below 1%. Maintain VDD slew rate >= 1 V/ms to avoid POR issues per HCS12 reference manual section on power-on sequence.
The 112-LQFP package has 0.65 mm pitch. Use 4-layer PCB with continuous ground plane directly under the device and a 20x20 mm copper pour stitched with 0.3 mm thermal vias (1.5 mm pitch) for thermal management. Keep BDM header (BKGD/MODC/GND/VDD) within 50 mm of the IC; long BDM traces couple noise and degrade debug reliability in production testers.
Do not leave MODC floating. The MODC pin selects between single-chip and expanded modes at reset; it must be pulled high (logic 1) via a 4.7 kohm resistor for normal single-chip mode, otherwise the device wakes in expanded or special test mode and the firmware fails to execute. BKGD pin requires a 10 kohm pull-up to VDD for reliable BDM detection by the host debugger.
Estimated: at VDD=5V, core=25MHz, peripheral set drawing ~80 mA typical, power dissipation is ~400 mW. The 112-LQFP theta_JA is approximately 35 C/W on a 4-layer JEDEC board, yielding a ~14 C rise above ambient. This is comfortable inside an industrial temperature envelope (up to +85 C) but automotive under-hood applications (up to +125 C) may require additional copper pours or heatsinking.
CAN bus signals (CANH/CANL) on the MC9S12DB128CPV must be routed to an external TJA1050/TJA1041 transceiver within 50 mm trace length. Avoid 90-degree bends; use 45-degree or curved routing. Place a 120 ohm split-termination network (two 60 ohm resistors + 4.7 nF cap) at each end of the CAN bus to suppress reflections in 1 Mbit/s Class C networks per ISO 11898-2.
Informations de conformité
AEC-Q100 qualification inferred from automotive HCS12DB family pedigree per NXP product page; specific AEC-Q100 certificate document number not provided in distributor data. RoHS compliance not formally confirmed in source data - request CoC from NXP for production orders. Lead-free packaging confirmed via LQFP finish.
