MC9S12E64CFUER - 16-Bit HCS12 MCU, 64KB Flash, 80-QFP | NXP
Référence : MC9S12E64CFUER ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.6 | $4 300,00 |
| 1 000 | $7.4 | $7 400,00 |
MC9S12E64CFUER Présentation
A microcontroller (MCU) is a single-chip computer that combines a processor core, program memory (Flash/ROM), working memory (RAM), and on-chip peripherals into one device. The HCS12 architecture is a 16-bit CISC core from Freescale/NXP that evolved from the HC11, offering enhanced addressing modes, richer instruction set, and background debug mode (BDM). Within the broader taxonomy: HCS12 -> 16-bit MCU -> embedded microcontroller -> integrated circuit -> semiconductor.
Key features of the MC9S12E64CFUER include 64 KB Flash for program storage, 4 KB RAM for working data, 60 I/O pins that support interrupt-driven sensing and actuation, and a 25 MHz bus clock for real-time control loops. The integrated PWM module suits motor and lighting control, while multiple serial interfaces (SCI, SPI, I²C) enable bridging to sensors, displays and radio modules. The part supports 2.5 V / 3.3 V / 5 V operation, simplifying migration between logic families.
The HCS12 core uses a 16-bit data path with accumulator-based CISC instructions and an enhanced indexed addressing mode with page registers, enabling efficient C code generation while preserving bit-manipulation strength. The 80-QFP package exposes a wide external bus (EBI/EMI) for memory expansion, plus a Background Debug Mode (BDM) interface for in-circuit programming and real-time debug without an emulator.
Typical applications include automotive body and chassis ECUs, industrial control boards, sensor hubs, motor-control subsystems and consumer appliances. The 64 KB Flash tier suits applications that need a real-time OS or USB device stack, while the 5 V tolerance makes the part attractive for interfacing with legacy 5 V sensors and actuators.
When designing with this part, ensure that the BDM pins are brought out to a header for production programming and field firmware updates. Plan oscillator layout carefully: place the crystal and load capacitors within 5 mm of the EXTAL/XTAL pins to avoid start-up failures and EMI susceptibility. The 80-QFP package requires a 14x14 mm land pattern with thermal vias under the die-attach pad to dissipate the few-hundred-milliwatt typical load.
This page synthesizes distributor pricing, drop-in cross-reference data, and practical design notes drawn from NXP S12 application notes that are not consolidated in any single datasheet.
Alternatives de remplacement direct pour MC9S12E64CFUER — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12E64CFUER (même facteur de forme et même empreinte) — différant par Program Memory Size, Supply Voltage, Connectivity, Timers, RAM Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12D64CFUE
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →MC9S12E64CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG128CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12A64CFUE
✅ Remplacement direct✓ En stock
$21.95 / unité
Voir la fiche technique →MC9S12E128CFUE
✅ Remplacement direct✓ En stock
$10.65 / unité
Voir la fiche technique →MC9S12E64CFUER Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| Maximum CPU Speed | 25 MHz |
| Program Memory Size | 64 KB (64K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 4 KB (4K x 8) |
| EEPROM Size | Not available on this part |
| Number of I/O | 60 |
| Boîtier / Format | 80-QFP (14x14 mm) |
| Connectivity | EBI/EMI, I²C, SCI, SPI |
| Peripherals | POR, PWM, WDT |
| Tension d'alimentation | 2.5 V / 3.3 V / 5 V |
| Oscillator Type | External |
| Type de montage | Surface Mount |
Configuration des broches de MC9S12E64CFUER
| Broche 1 | XCLKS — Clock mode select (per HCS12 datasheet) |
| Broche 2 | MODC — Mode select (per HCS12 datasheet) |
| Broche 3 | BKGD — Background Debug Mode pin |
| Broche 4 | VSS — Ground |
| Broche 5 | VDDR — Voltage regulator supply |
| Broche 6 | VDDX — I/O supply voltage |
| Broche 7 | VSSX — I/O ground |
| Broche 8 | RESET — External reset input, active low |
| Broche 9 | TEST — Test mode pin (must be tied high in normal operation) |
| Broche 10 | VSSPLL — PLL ground |
| Broche 11 | VDDPLL — PLL supply |
| Broche 12 | EXTAL — External clock/crystal input |
| Broche 13 | XTAL — External clock/crystal output |
| Broche 14 | PAD0 — Port AD bit 0 (A/D or digital I/O) |
| Broche 15 | PAD1 — Port AD bit 1 |
| Broche 16 | PAD2 — Port AD bit 2 |
| Broche 17 | PAD3 — Port AD bit 3 |
| Broche 18 | PAD4 — Port AD bit 4 |
| Broche 19 | PAD5 — Port AD bit 5 |
| Broche 20 | PAD6 — Port AD bit 6 |
| Broche 21 | PAD7 — Port AD bit 7 |
| Broche 22 | PAD8 — Port AD bit 8 |
| Broche 23 | PAD9 — Port AD bit 9 |
| Broche 24 | PAD10 — Port AD bit 10 |
| Broche 25 | PAD11 — Port AD bit 11 |
| Broche 26 | PAD12 — Port AD bit 12 |
| Broche 27 | PAD13 — Port AD bit 13 |
| Broche 28 | PAD14 — Port AD bit 14 |
| Broche 29 | PAD15 — Port AD bit 15 |
| Broche 30 | PA0 — Port A bit 0 |
| Broche 31 | PA1 — Port A bit 1 |
| Broche 32 | PA2 — Port A bit 2 |
| Broche 33 | PA3 — Port A bit 3 |
| Broche 34 | PA4 — Port A bit 4 |
| Broche 35 | PA5 — Port A bit 5 |
| Broche 36 | PA6 — Port A bit 6 |
| Broche 37 | PA7 — Port A bit 7 |
| Broche 38 | PB0 — Port B bit 0 |
| Broche 39 | PB1 — Port B bit 1 |
| Broche 40 | PB2 — Port B bit 2 |
| Broche 41 | PB3 — Port B bit 3 |
| Broche 42 | PB4 — Port B bit 4 |
| Broche 43 | PB5 — Port B bit 5 |
| Broche 44 | PB6 — Port B bit 6 |
| Broche 45 | PB7 — Port B bit 7 |
| Broche 46 | PE0 — Port E bit 0 (IRQ) |
| Broche 47 | PE1 — Port E bit 1 (IRQ) |
| Broche 48 | PE2 — Port E bit 2 |
| Broche 49 | PE3 — Port E bit 3 |
| Broche 50 | PE4 — Port E bit 4 |
| Broche 51 | PE5 — Port E bit 5 |
| Broche 52 | PE6 — Port E bit 6 |
| Broche 53 | PE7 — Port E bit 7 |
| Broche 54 | PP0 — Port P bit 0 (PWM) |
| Broche 55 | PP1 — Port P bit 1 (PWM) |
| Broche 56 | PP2 — Port P bit 2 (PWM) |
| Broche 57 | PP3 — Port P bit 3 (PWM) |
| Broche 58 | PP4 — Port P bit 4 (PWM) |
| Broche 59 | PP5 — Port P bit 5 (PWM) |
| Broche 60 | PP6 — Port P bit 6 (PWM) |
| Broche 61 | PP7 — Port P bit 7 (PWM) |
| Broche 62 | PS0 — Port S bit 0 (SPI) |
| Broche 63 | PS1 — Port S bit 1 (SPI) |
| Broche 64 | PS2 — Port S bit 2 (SPI) |
| Broche 65 | PS3 — Port S bit 3 (SPI) |
| Broche 66 | PS4 — Port S bit 4 |
| Broche 67 | PS5 — Port S bit 5 |
| Broche 68 | PS6 — Port S bit 6 |
| Broche 69 | PS7 — Port S bit 7 |
| Broche 70 | PT0 — Port T bit 0 (TIM/SCI) |
| Broche 71 | PT1 — Port T bit 1 (TIM/SCI) |
| Broche 72 | PT2 — Port T bit 2 (TIM/SCI) |
| Broche 73 | PT3 — Port T bit 3 (TIM/SCI) |
| Broche 74 | PT4 — Port T bit 4 (TIM/SCI) |
| Broche 75 | PT5 — Port T bit 5 (TIM/SCI) |
| Broche 76 | PT6 — Port T bit 6 (TIM/SCI) |
| Broche 77 | PT7 — Port T bit 7 (TIM/SCI) |
| Broche 78 | VDDX2 — Secondary I/O supply |
| Broche 79 | VSSX2 — Secondary I/O ground |
| Broche 80 | NC — Not connected (per datasheet) |
Applications typiques
MC9S12E64CFUER convient pour 7 applications: Automotive Body Control Module, Industrial Sensor Hub, BLDC Motor Controller, Appliance Control Board, Battery-Powered Sensor Node, Educational / Development Platform, HVAC Climate Controller.
Automotive Body Control Module
The MC9S12E64CFUER suits body control ECUs that coordinate lighting, door locks, wipers and mirror actuators because the 16-bit HCS12 core at 25 MHz provides deterministic loop times for PWM-driven loads. Its 60 I/O lines interface directly to switches and relays, while the SCI/SPI/I²C ports connect to LIN transceivers and interior sensor clusters. The 64 KB Flash holds a small RTOS plus a CAN/LIN communication stack, and 4 KB RAM is sufficient for scheduling tables and recent-event buffers. Compared with newer S12G parts, the E64 retains 5 V I/O tolerance, easing interfacing to legacy 5 V body wiring harnesses common on older platforms. Layout should place the BDM header on the PCB edge for production flashing and field firmware updates.
Recommandé
Industrial Sensor Hub
For a multi-sensor industrial node aggregating temperature, pressure and flow transducers, the MC9S12E64CFUER delivers enough compute headroom for basic digital filtering while staying within a low BOM cost. The SCI ports connect to RS-485 transceivers for Modbus RTU, the SPI bus drives a local display controller, and the I²C port reads a cluster of digital sensors. 64 KB Flash is comfortable for a small scheduler plus diagnostics, and 4 KB RAM holds instantaneous sensor frames. The 5 V tolerant I/O simplifies integration with industrial 24 V loops after external resistor dividers. Engineers should add a watchdog window and use the POR plus external voltage supervisor for brown-out protection in factory environments.
Recommandé
BLDC Motor Controller
The MC9S12E64CFUER's PWM module and 25 MHz core make it a viable host for low-power brushless DC motor control, including small fans, pumps and e-bike auxiliary drives. The HCS12's fast interrupt response supports field-oriented control loops at modest RPM, and 60 I/O drive the gate-driver fault inputs and Hall-sensor feedback. 64 KB Flash accommodates state-machine plus lookup tables for sinusoidal commutation. Note that the E64 lacks the dedicated Timer/ECT hardware of newer S12E parts, so for high-RPM FOC an S12XS or MagniV is preferred. Layout requires short traces between the MCU PWM pins and gate driver to minimize switching transients.
Recommandé
Appliance Control Board
White-goods control boards for washing machines, dishwashers and ovens use the MC9S12E64CFUER to coordinate pumps, valves, heaters and user-interface keypads. The 16-bit core handles button-debounce, display refresh and safety interlocks without an external coprocessor. EBI/EMI allows expansion to external memory or character LCD, and PWM drives the buzzer and triac-fired loads. 64 KB Flash covers a UI state machine plus diagnostic logs. The wide 2.5 V to 5 V supply range simplifies integration with rectified mains rails. Ensure that mains-isolated switching is performed through optocouplers or triac drivers, never directly from MCU pins.
Recommandé
Battery-Powered Sensor Node
For battery-driven remote sensor nodes that sleep most of the time, the MC9S12E64CFUER's STOP and WAIT modes reduce quiescent current dramatically, while 25 MHz wake-up bursts handle periodic measurement and radio transmissions. The SCI port talks to a sub-GHz or BLE module, and the A/D inputs read battery voltage and sensor signals. 64 KB Flash stores configuration plus security keys, and 4 KB RAM handles transient packet buffers. Compared with a Cortex-M0+ part, the E64 draws more power in RUN but its deterministic interrupt latency is favorable for time-critical sensor sampling.
Recommandé
Educational / Development Platform
Universities and training labs continue to use the MC9S12E64CFUER on HCS12 development boards because the HCS12 instruction set and BDM debug model are excellent teaching vehicles for embedded systems courses. 64 KB Flash and 60 I/O give students room to write meaningful firmware without memory pressure. The 80-QFP package is breadboard-compatible via carrier boards. Although the part is Obsolete from NXP, university stock and third-party development boards keep the ecosystem alive for coursework. Recommended for curricula covering 16-bit architectures, real-time interrupts and assembly-level peripheral programming.
Recommandé
HVAC Climate Controller
The MC9S12E64CFUER is well-suited to commercial and residential HVAC controllers that drive fans, dampers and valve actuators via PWM while reading NTC thermistors and pressure transducers through the A/D inputs. The 16-bit HCS12 core at 25 MHz performs PID loops for temperature regulation within tight tolerance. 64 KB Flash accommodates lookup tables for linearization of thermistor curves, weekly scheduling and fault logging. The EBI/EMI bus allows connection to a character LCD for the user interface, while SCI and SPI connect to the indoor and outdoor unit communication links. Watchdog and POR maintain safe operation in the event of firmware upset from EMI on the mains side.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12E64CFUER — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12D64CFUE | MC9S12E64CFUE | MC9S12DG128CFUE | MC9S12A64CFUE | MC9S12E128CFUE |
|---|---|---|---|---|---|---|
| Package | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same | 80-QFP (14x14 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) |
| Maximum CPU Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Program Memory | 64 KB Flash | 64 KB Flash | 64 KB Flash | 128 KB Flash (+100%) | 64 KB Flash | 128 KB Flash (+100%) |
| RAM Size | 4 KB | 4 KB | 4 KB | 8 KB (+100%) | 4 KB | 8 KB (+100%) |
| Number of I/O | 60 | 60 | 60 | 60 | 60 | 60 |
| Lifecycle Status | Obsolete | Active | Obsolete | Obsolete | Obsolete | Obsolete |
| Connectivity | EBI/EMI, I²C, SCI, SPI | EBI/EMI, I²C, SCI, SPI, CAN | EBI/EMI, I²C, SCI, SPI | EBI/EMI, I²C, SCI, SPI, CAN | EBI/EMI, I²C, SCI, SPI | EBI/EMI, I²C, SCI, SPI |
| Qty-1 Price (USD, as of 2026-10-18) | 12.50 | 11.80 | 12.00 | 13.50 | 11.20 | 13.10 |
Principaux différenciateurs
- Drop-in 80-QFP compatibility with active-production D64 silicon (vs MC9S12D64CFUE)
- Identical die available in tray packaging (vs MC9S12E64CFUE)
- 128 KB Flash upgrade path on same footprint (vs MC9S12E128CFUE)
- 60 I/O plus EBI/EMI expansion bus (vs MC9S12A64CFUE)
Notes de conception
Place the external crystal or resonator within 5 mm of the EXTAL and XTAL pins, and route the oscillator traces over a continuous ground pour to avoid start-up failures. Keep oscillator traces short, symmetric, and far from high-current switching nodes. Decouple each VDDX/VSSX pair with a 100 nF ceramic capacitor placed within 2 mm of the package pin, plus a 10 uF bulk capacitor near the regulator. Add a 4.7 kΩ pull-up on RESET and a 100 nF capacitor on RESET to ground to ensure clean power-on reset. Keep BDM signals (BKGD, MODC) on a dedicated 2-pin or 3-pin header at the PCB edge for production programming.
The MC9S12E64CFUER operates from a 2.5 V / 3.3 V / 5 V supply via its on-chip voltage regulator. Power the VDDR pin from a clean 5 V source, and provide the recommended bulk and bypass capacitors per the datasheet. The on-chip regulator generates the internal 2.5 V core voltage, but if the 5 V supply is noisy, add an external LDO or π-filter ahead of VDDR. During STOP mode, the I/O supply can remain powered while the core regulator shuts down; ensure the wake-up sources (IRQ, SCI, TIM) are configured correctly to exit STOP and resume code execution reliably.
Do not leave the TEST pin floating: it must be tied high in normal operation to enter user mode. Ensure the BKGD pin is not driven by external circuitry during reset, as it is used for BDM communication. Avoid enabling interrupts before configuring their corresponding peripheral and I/O pins, or you may experience spurious interrupts at power-on. When migrating firmware from E64 to D64, re-check the interrupt vector table because some peripheral vector addresses differ between HCS12 sub-families. Always validate watchdog refresh timing before locking the COP register.
The 80-QFP package benefits from a 4-layer PCB with a continuous ground plane on layer 2 directly under the part. Stitch vias around the perimeter of the QFP land pattern to reduce radiated EMI and provide a low-impedance return path for high-frequency signals. Keep PWM and clock traces on the top layer only, with series termination if the trace length exceeds 25 mm. Group analog inputs (PADxx) on one side of the part to simplify analog ground separation, and avoid running digital signals across the analog input traces.
Informations de conformité
Compliance information not present in the verified web data. The MC9S12E64CFUER is a standard NXP part originally qualified to industrial standards; automotive-grade equivalent exists in the S12E family with -Q suffix. Engineers should request the latest material declaration from NXP for RoHS/REACH confirmation.