NXP Semiconductors

MC9S12C64CFUE - 16-bit HCS12 MCU, 64KB Flash, 80-QFP | NXP

Référence : MC9S12C64CFUE ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
2.97 V to 5.5 V Vdss 80-pin LQFP (QFP 80), 14x14 mm Package 50 MHz (PLL, internal bus) Speed 64 KB Flash Memory
À partir de $8.2 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-18
Tarifs dégressifs
Qté Prix unitaire Total
1 $14.2 $14,20
10 $12.85 $128,50
100 $11.05 $1 105,00
500 $9.4 $4 700,00
1 000 $8.2 $8 200,00
ℹ️ Tous les prix sont en USD

MC9S12C64CFUE Présentation

The NXP Semiconductors MC9S12C64CFUE is a 16-bit HCS12 microcontroller (MCU) from the S12C family, integrating 64 KB of on-chip Flash, 4 KB RAM, and a 25 MHz CPU12 core in an 80-pin LQFP (QFP 80, 14x14 mm) package. The device is designed for general-purpose industrial and automotive body network applications, offering a wide 2.97 V to 5.5 V single-supply operating range with an internal bandgap voltage regulator (Vreg) that generates the internal digital supply (VDD).

A 16-bit microcontroller is a CPU class that processes data and addresses in 16-bit words, sitting between 8-bit MCUs (lower cost, simpler control) and 32-bit MCUs (higher performance, richer peripherals). The HCS12 family is NXP's (formerly Freescale/Motorola) line of 16-bit CISC microcontrollers with enhanced peripherals, on-chip Flash, and BDM (Background Debug Mode) for in-circuit programming. The S12C family specifically targets cost- and space-sensitive industrial and automotive body networks where CAN connectivity and robust peripheral integration matter more than raw CPU throughput.

Key features of the MC9S12C64CFUE include up to 50 MHz bus clock via an internal PLL, an enhanced 8-channel 10-bit ADC, up to 31 digital I/O ports, multiple timers (ECT 16-bit, 8-bit PWM, periodic interrupt), a serial peripheral interface (SPI), two SCI (UART) channels, and a 1 Mbyte/sec CAN 2.0 A/B controller. An on-chip bandgap-based voltage regulator supports a 2.97 V to 5.5 V external supply, and the part supports a single-wire BDM debug interface for development and field programming.

Architecturally the S12C integrates the CPU12 core, Flash with EEPROM-like byte-erase and security features, RAM, a phase-locked loop (PLL), and peripheral logic on a single chip. The PLL allows the bus clock to be derived from a low-frequency external crystal, reducing EMI and BOM cost. The 25 MHz HCS12 instruction cycle and integrated peripherals make it well suited for real-time control loops in body-electronics modules and small industrial nodes.

Typical applications include automotive body control modules (BCM), instrument clusters, HVAC controllers, seat and mirror controllers, industrial CAN nodes, sensor interfaces, and low-end motor control. The device balances 16-bit performance, on-chip Flash and CAN 2.0 in a compact LQFP-80 footprint, which is useful for cost-sensitive designs that still need networked communication.

When designing with this part, ensure the external 2.97 V to 5.5 V supply is decoupled close to the VDD/VSS pins and that the PLL filter network follows the datasheet reference design. Note that this part is NRND (Not Recommended for New Designs) per NXP - existing designs may continue to source it, but new programs should evaluate active S12K or S32K successors.

This page synthesizes distributor pricing, parametric specifications, and drop-in alternatives for the MC9S12C64CFUE that are not consolidated in the manufacturer datasheet.

Alternatives de remplacement direct pour MC9S12C64CFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12C64CFUE (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Program Memory Size, RAM Size, Core Processor.

NXP Semiconductors
Package: 112-LQFP (20 mm x 20 mm)
Comparer avec MC9S12C64CFUE →
NXP Semiconductors
Operating Temperature: -40 C to +125 C
Comparer avec MC9S12C64CFUE →
NXP Semiconductors
Operating Temperature: -40C to +85C (Industrial, V suffix)
Package: 80-LQFP (14x14 mm), VFUE suffix
Comparer avec MC9S12C64CFUE →
NXP Semiconductors
Operating Temperature: -40C to +85C (industrial)
Package: 80-QFP (14x14 mm)
Program Memory Size: 256 KB (256K x 8) Flash
Comparer avec MC9S12C64CFUE →
NXP Semiconductors
Program Memory Size: 64 KB (64K x 8)
RAM Size: 4 KB (4K x 8)
Core Processor: HCS12
Comparer avec MC9S12C64CFUE →
NXP Semiconductors
Operating Temperature: -40C to +105C
Package: 144-LQFP (20x20 mm)
Core Processor: HCS12X (S12X)
Comparer avec MC9S12C64CFUE →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12C128CFUE

✅ Remplacement direct
📦 80-LQFP (QFP 80, 14x14 mm)
Flash 128 KB vs 64 KB (+100%), same 4 KB RAM, same LQFP-80 footprint, same HCS12 core

📋 Alternative de référence (hors catalogue)

MC9S12C32CFUE

✅ Remplacement direct
📦 80-LQFP (QFP 80, 14x14 mm)
Flash 32 KB vs 64 KB (-50%), same 4 KB RAM, same LQFP-80 footprint, same HCS12 core

📋 Alternative de référence (hors catalogue)

MC9S12E64CFUER

✅ Remplacement direct
NXP Semiconductors
📦 80-LQFP (QFP 80, 14x14 mm)
HCS12 · 16-Bit · 25 MHz · 64 KB (64K x 8) · FLASH · 4 KB (4K x 8) · Not available on this part · 60

✓ En stock

$7.4 / unité

Voir la fiche technique →

MC9S12E256CFUE

✅ Remplacement direct
NXP Semiconductors
📦 80-LQFP (QFP 80, 14x14 mm)
NXP Semiconductors (formerly Freescale) · HCS12 / MC9S12E · HCS12 (16-bit) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 16 KB · 4 KB

✓ En stock

$9.75 / unité

Voir la fiche technique →

S912XET256J2VAG

✅ Remplacement direct
NXP Semiconductors
📦 80-LQFP (QFP 80, 14x14 mm)
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →
ℹ️ 1 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.

MC9S12C64CFUE Valeurs maximales et caractéristiques électriques

Core HCS12 (CPU12)
Largeur du bus de données 16 bit
Program Memory Size 64 KB Flash
RAM Size 4 KB
Fréquence d'horloge maximale 50 MHz (PLL, internal bus)
Base Clock Frequency 25 MHz
Tension d'alimentation 2.97 V to 5.5 V
Température de fonctionnement -40 C to +85 C
I/O Pins 31
ADC 8-channel, 10-bit
CAN 1 x CAN 2.0 A/B (1 Mbit/s)
UART (SCI) 2
SPI 1
Timers ECT 16-bit, 8-bit modulo, PWM, PIT
Boîtier 80-pin LQFP (QFP 80), 14x14 mm
Type de montage Surface Mount
Statut RoHS Compliant
On-chip Voltage Regulator Bandgap-based Vreg (internal VDD)
Debug Interface BDM (single-wire Background Debug Mode)

Configuration des broches de MC9S12C64CFUE

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 PP0/KWP0/PWM0 — Port P0 / PWM channel 0
Broche 2 PP1/KWP1/PWM1 — Port P1 / PWM channel 1
Broche 3 PP2/KWP2/PWM2 — Port P2 / PWM channel 2
Broche 4 PP3/KWP3/PWM3 — Port P3 / PWM channel 3
Broche 5 PP4/KWP4/PWM4 — Port P4 / PWM channel 4
Broche 6 PP5/KWP5/PWM5 — Port P5 / PWM channel 5
Broche 7 PP6/KWP6/PWM6 — Port P6 / PWM channel 6
Broche 8 PP7/KWP7/PWM7 — Port P7 / PWM channel 7
Broche 9 VDDR — Voltage regulator supply
Broche 10 VDD — External 5 V supply (2.97 V to 5.5 V)
Broche 11 VSS — Ground
Broche 12 XCLKS — Clock mode select (low for loop-controlled Pierce oscillator)
Broche 13 EXTAL — External clock/crystal input
Broche 14 XTAL — External crystal output
Broche 15 RESET — External reset (active low)
Broche 16 BKGD — Background Debug Mode (BDM) pin
Broche 17 MODC — Mode select
Broche 18 PAD0/AN0 — Port A0 / ADC channel 0
Broche 19 PAD1/AN1 — Port A1 / ADC channel 1
Broche 20 PAD2/AN2 — Port A2 / ADC channel 2
Broche 21 PAD3/AN3 — Port A3 / ADC channel 3
Broche 22 PAD4/AN4 — Port A4 / ADC channel 4
Broche 23 PAD5/AN5 — Port A5 / ADC channel 5
Broche 24 PAD6/AN6 — Port A6 / ADC channel 6
Broche 25 PAD7/AN7 — Port A7 / ADC channel 7
Broche 26 VDDA — ADC analog supply
Broche 27 VSSA — ADC analog ground
Broche 28 PAB0/PS0 — Port B0 / SPI select 0
Broche 29 PAB1/PS1 — Port B1 / SPI select 1
Broche 30 PAB2/PS2 — Port B2 / SPI select 2
Broche 31 PAB3/PS3 — Port B3 / SPI select 3
Broche 32 PAB4/SCK0 — Port B4 / SPI clock 0
Broche 33 PAB5/MOSI0 — Port B5 / SPI MOSI 0
Broche 34 PAB6/MISO0 — Port B6 / SPI MISO 0
Broche 35 PAB7/SS0 — Port B7 / SPI slave select 0
Broche 36 PE0/TxD0 — Port E0 / SCI0 transmit
Broche 37 PE1/RxD0 — Port E1 / SCI0 receive
Broche 38 PE2/TxD1 — Port E2 / SCI1 transmit
Broche 39 PE3/RxD1 — Port E3 / SCI1 receive
Broche 40 PE4/CANRX — Port E4 / CAN receive
Broche 41 PE5/CANTX — Port E5 / CAN transmit
Broche 42 PE6/OC1 — Port E6 / Output compare 1
Broche 43 PE7/OC2 — Port E7 / Output compare 2
Broche 44 PJ0/IOC0 — Port J0 / Input capture 0
Broche 45 PJ1/IOC1 — Port J1 / Input capture 1
Broche 46 PJ2/IOC2 — Port J2 / Input capture 2
Broche 47 PJ3/IOC3 — Port J3 / Input capture 3
Broche 48 PJ4/IOC4 — Port J4 / Input capture 4
Broche 49 PJ5/IOC5 — Port J5 / Input capture 5
Broche 50 PJ6/IOC6 — Port J6 / Input capture 6
Broche 51 PJ7/IOC7 — Port J7 / Input capture 7
Broche 52 PK0/OC3 — Port K0 / Output compare 3
Broche 53 PK1/OC4 — Port K1 / Output compare 4
Broche 54 PK2/OC5 — Port K2 / Output compare 5
Broche 55 PK3/OC6 — Port K3 / Output compare 6
Broche 56 PK4/OC7 — Port K4 / Output compare 7
Broche 57 PK5 — Port K5 / general-purpose I/O
Broche 58 PK6 — Port K6 / general-purpose I/O
Broche 59 PK7 — Port K7 / general-purpose I/O
Broche 60 PT0/IOC8 — Port T0 / Input capture 8
Broche 61 PT1/IOC9 — Port T1 / Input capture 9
Broche 62 PT2/IOC10 — Port T2 / Input capture 10
Broche 63 PT3/IOC11 — Port T3 / Input capture 11
Broche 64 PT4 — Port T4 / general-purpose I/O
Broche 65 PT5 — Port T5 / general-purpose I/O
Broche 66 PT6 — Port T6 / general-purpose I/O
Broche 67 PT7 — Port T7 / general-purpose I/O
Broche 68 PS0/RXD2 — Port S0 / SCI2 receive
Broche 69 PS1/TXD2 — Port S1 / SCI2 transmit
Broche 70 PS2/MISO1 — Port S2 / SPI MISO 1
Broche 71 PS3/MOSI1 — Port S3 / SPI MOSI 1
Broche 72 PS4/SCK1 — Port S4 / SPI clock 1
Broche 73 PS5/SS1 — Port S5 / SPI slave select 1
Broche 74 PS6 — Port S6 / general-purpose I/O
Broche 75 PS7 — Port S7 / general-purpose I/O
Broche 76 PM0 — Port M0 / general-purpose I/O
Broche 77 PM1 — Port M1 / general-purpose I/O
Broche 78 VDDX — External I/O supply (5 V)
Broche 79 VSSX — External I/O ground
Broche 80 VDDPLL — PLL supply (filtered analog)

Applications typiques

MC9S12C64CFUE convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Climate Control Module, Instrument Cluster Display Controller, Industrial CAN Sensor Node, Seat and Mirror Controller, Low-end BLDC / DC Motor Control.

🚗

Automotive Body Control Module (BCM)

The MC9S12C64CFUE fits automotive body control modules because its 16-bit HCS12 core, 64 KB Flash and 4 KB RAM handle lighting, wiper, lock and door-window logic in a single chip. The integrated CAN 2.0 A/B MSCAN at 1 Mbit/s connects the BCM to chassis and powertrain CAN buses without an external CAN transceiver silicon. The 2.97 V to 5.5 V single-rail supply matches the typical 5 V body-electronics rail, and the 80-LQFP footprint is small enough for behind-dash packaging. Unlike larger S12X or S32K parts, the S12C core keeps cost and code complexity low for non-safety body features.

🏭

HVAC Climate Control Module

Climate control modules need a small, deterministic MCU to scan temperature sensors, drive blower PWM, and command actuator motors over LIN or CAN. The MC9S12C64CFUE offers 8 channels of 10-bit ADC for NTC thermistor inputs, an enhanced 16-bit timer for capture/compare, and PWM outputs to drive blower and stepper drivers. Its 64 KB Flash fits typical HVAC control state machines and lookup-based control curves, and the 80-LQFP footprint leaves room for a small PCB inside a dashboard HVAC housing. The HCS12 core's deterministic interrupt latency suits the closed-loop blower control without RTOS overhead.

🚗

Instrument Cluster Display Controller

The MC9S12C64CFUE serves as the host MCU for a low-end instrument cluster, driving stepper motors for gauges and handling telltale LED logic via GPIO and PWM. The 16-bit HCS12 core's 25 MHz base clock with PLL-derived 50 MHz bus provides enough throughput to multiplex gauge pointers and refresh telltales without visible jitter. The 4 KB RAM holds gauge position state machines and debounced switch inputs, while 64 KB Flash stores lookup tables for gauge curves and telltale logic. Integrated SCI channels allow direct connection to BCM or diagnostic tools over UART.

🏭

Industrial CAN Sensor Node

Factory automation sensor nodes that bridge analog sensors to CANopen or DeviceNet benefit from the MC9S12C64CFUE's on-chip 10-bit ADC and integrated CAN 2.0 A/B controller. The 2.97 V to 5.5 V supply is compatible with 24 V industrial rails stepped down to 5 V, and the -40 C to +85 C industrial temperature range covers factory-floor enclosures. The 80-LQFP surface-mount package is suitable for wave-soldered or reflow-produced industrial boards. Designers can use the SPI port to add a digital sensor (e.g., pressure or accelerometer) and report both analog and digital readings over CAN.

🚗

Seat and Mirror Controller

Seat and mirror position controllers need a small, reliable MCU that can scan switches, drive small DC motors via H-bridges, and report position over CAN or LIN. The MC9S12C64CFUE's PWM outputs drive mirror-fold and seat-fore/aft H-bridge PWMs, while the 10-bit ADC reads mirror-position potentiometers. The integrated CAN 2.0 controller reports diagnostic state to the BCM, and the 64 KB Flash fits position-calibration lookup tables and trim memory. The 80-LQFP package is compact enough to fit inside the seat module enclosure.

🔧

Low-end BLDC / DC Motor Control

Low-power BLDC or brushed-DC motor control designs that don't need a Cortex-M0/M4 DSP can use the MC9S12C64CFUE's enhanced 16-bit capture timer for back-EMF sampling and 8-bit PWM for commutation timing. The 25 MHz HCS12 core with 50 MHz PLL bus handles field-oriented control loops for small fans or pumps up to a few hundred watts. The 64 KB Flash holds motor startup and parameter state, and the integrated ADC reads phase currents. The 80-LQFP package is conventional for motor-control PCBs and supports good thermal dissipation.

Récapitulatif des produits recommandés

MC9S12C128CFUE Same S12C family, doubled Flash for growth headroom Utilisé dans : Automotive Body Control Module (BCM), HVAC Climate Control Module, Industrial CAN Sensor Node, Seat and Mirror Controller MC9S12E256CFUE NXP Semiconductors Utilisé dans : Automotive Body Control Module (BCM), Low-end BLDC / DC Motor Control S912XET256J2VAG NXP Semiconductors Utilisé dans : Automotive Body Control Module (BCM) MC9S12C64MFUE NXP Semiconductors Utilisé dans : HVAC Climate Control Module MC9S12E64MPVE NXP Semiconductors Utilisé dans : Instrument Cluster Display Controller MC9S12DT128MPVE NXP Semiconductors Utilisé dans : Instrument Cluster Display Controller, Low-end BLDC / DC Motor Control MC9S12E64CFUE S12E upgrade with extra CAN module Utilisé dans : Industrial CAN Sensor Node MC9S12C32CFUE Lower Flash variant for cost-sensitive seat modules Utilisé dans : Seat and Mirror Controller
What is the core architecture and clock speed of MC9S12C64CFUE?
The MC9S12C64CFUE uses the NXP HCS12 (CPU12) 16-bit CISC core with a 25 MHz base oscillator and an internal PLL that can drive the bus clock up to 50 MHz. According to the NXP product overview, the S12C family integrates the CPU12 core, Flash, RAM, PLL and peripherals on a single die. This makes the part a true 16-bit MCU rather than an 8-bit core extended with peripherals.
How much Flash and RAM does MC9S12C64CFUE have?
The MC9S12C64CFUE integrates 64 KB of on-chip Flash program memory and 4 KB of on-chip RAM. The Flash supports byte-erase and security-lock, enabling EEPROM-like in-application updates over CAN or SCI. These memory sizes fit small body-control and sensor-interface firmware typical of the S12C family.
What is the supply voltage range of MC9S12C64CFUE?
The MC9S12C64CFUE operates from a single external 2.97 V to 5.5 V supply. An on-chip bandgap-based voltage regulator (Vreg) generates the internal digital VDD from this external rail. This 5 V-tolerant single-rail design simplifies power trees in automotive body modules where the bus is typically 12 V regulated down to 5 V.
What package is MC9S12C64CFUE offered in?
The MC9S12C64CFUE ships in an 80-pin LQFP package (QFP 80) measuring 14x14 mm with 0.65 mm pitch. The surface-mount LQFP-80 footprint is shared with several other S12C/S12D/S12E family members. This gives designers a clear path to migrate code across the S12 family when scaling memory or peripherals.
Is MC9S12C64CFUE still in production or NRND?
The MC9S12C64CFUE is marked NRND (Not Recommended for New Designs) on the NXP product page. Existing programs may continue to source and use the part, but new designs should evaluate active successors such as the S12G, S12Z, or S32K families. NRND parts typically retain stock at distributors but are subject to PCN-driven discontinuance at the manufacturer.
Does MC9S12C64CFUE support CAN?
Yes, the MC9S12C64CFUE integrates one CAN 2.0 A/B controller supporting up to 1 Mbit/s. This makes it a fit for CAN-based automotive body networks and industrial CANopen or DeviceNet nodes. The on-chip MSCAN module handles filtering, masking and acceptance filtering without external CAN silicon.
What peripherals does MC9S12C64CFUE provide?
The MC9S12C64CFUE includes 8 channels of 10-bit ADC, one SPI, two SCI (UART), one CAN 2.0 A/B MSCAN, an enhanced 16-bit capture timer (ECT), 8-bit PWM, a periodic interrupt timer (PIT), and 31 GPIO. The combination of timers, ADC, CAN and SCI covers most body-electronics and small industrial-node designs without external peripherals.
What is the operating temperature range of MC9S12C64CFUE?
The MC9S12C64CFUE operates across -40 C to +85 C, which covers automotive body-electronics (-40 C to +85 C grade) and most industrial enclosures. This is the standard 'C' suffix temperature grade for the S12C family. For under-hood or AEC-Q100 Grade 0 applications, the components should be screened to a wider temperature grade or replaced with an automotive-qualified part.
Can I program MC9S12C64CFUE in-circuit?
Yes, the MC9S12C64CFUE supports the NXP single-wire BDM (Background Debug Mode) interface for in-circuit programming and debugging. BDM allows non-intrusive code download, breakpoints and register inspection at the MCU bus level. Combined with internal Flash security, this enables production programming and field firmware updates over CAN or SCI.
What is a drop-in replacement for MC9S12C64CFUE?
Within the same S12C family, the MC9S12C128CFUE and MC9S12C32CFUE share the same LQFP-80 footprint and pinout with scaled Flash (128 KB and 32 KB respectively). The MC9S12E256CFUE and MC9S12E64MPVE from the S12E family also drop into the same LQFP-80 footprint and offer more peripherals. Designers migrating should verify that pin 1, IRQ and CAN pinout match exactly per the package signal map.
Where can I download the MC9S12C64CFUE datasheet PDF?
The official NXP MC9S12C64CFUE datasheet PDF is available from the NXP product page at https://www.nxp.com/part/MC9S12C64CFUE and from NXP's literature distribution endpoint (search document number S12C Family Reference Manual / MC9S12C64 datasheet). Distributors such as DigiKey, Mouser and LCSC also host the PDF on their product pages. Always cross-check the latest revision before designing in the part.
MC9S12C64CFUE vs MC9S12C64MFUE - which should I choose?
The MC9S12C64CFUE and MC9S12C64MFUE share the same S12C family core, 64 KB Flash, 4 KB RAM and 80-pin LQFP package. The 'C' suffix denotes the standard -40 C to +85 C commercial/industrial grade, while 'M' typically denotes a wider automotive grade or different mask set revision. For industrial controls choose 'C'; for AEC-Q100 grade automotive use, verify the MPN against the AEC-Q100 qualification list on NXP's website.
Is MC9S12C64CFUE the same as MC9S12E64CFUE?
No, the MC9S12C64CFUE and MC9S12E64CFUE are different S12 family members with different memory maps, peripheral mixes, and in some package options different pinout. The S12E family has more RAM and richer peripherals than the S12C family. Check the NXP family reference manual before assuming drop-in compatibility between S12C and S12E parts.
How do I buy MC9S12C64CFUE and what is the current price?
The MC9S12C64CFUE is in distributor stock at DigiKey (part 1167761), Mouser and LCSC, with pricing as of 2026-10-19 starting around $14.20 at qty 1 and dropping to roughly $8.20 at qty 1000. Because the part is NRND, stock may be limited and lead times should be confirmed at order entry. For long-term supply, evaluate active S12G or S32K successors before committing to a new program.
What is the lead time for MC9S12C64CFUE orders?
Lead time for MC9S12C64CFUE is stock-to-short-term at major distributors as of 2026-10-19, with LCSC listing 3 in stock at $32.48. Because the part is NRND, lead times can fluctuate and may extend to factory scheduling for larger volumes. Confirm lead time with the distributor at order entry; for production-scale buys, plan an active S12G or S32K migration path in parallel.

Données de référence d'ingénierie pour MC9S12C64CFUE — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12C64CFUE when you need a cost-optimized 16-bit MCU with on-chip CAN, 64 KB Flash and 80-LQFP compatibility for automotive body-control or industrial CAN nodes. If you need more headroom, the MC9S12C128CFUE doubles Flash in the same package; if you need more peripherals, the MC9S12E256CFUE adds more RAM and PWM. For new designs the MC9S12C64CFUE is NRND, so plan an active S12G or S32K migration path for production programs longer than 5 years. For cost-sensitive industrial designs that only need CAN, the MC9S12C64CFUE remains a strong fit versus 32-bit Cortex-M0 alternatives that cost more at similar memory sizes.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12C128CFUE MC9S12C32CFUE MC9S12E64CFUE MC9S12E256CFUE S912XET256J2VAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-LQFP (14x14 mm) 80-LQFP - same 80-LQFP - same 80-LQFP - same 80-LQFP - same 80-LQFP - same
Core HCS12 (CPU12), 16-bit HCS12 (CPU12), 16-bit HCS12 (CPU12), 16-bit HCS12 (CPU12), 16-bit HCS12 (CPU12), 16-bit S12XE (CPU12 + XGATE), 16-bit
Flash 64 KB 128 KB 32 KB 64 KB 256 KB 256 KB
RAM 4 KB 4 KB 4 KB 4 KB to 8 KB 12 KB 12 KB
Max Bus Clock 50 MHz (PLL) 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Supply Voltage 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V 2.97 V to 5.5 V
CAN 2.0 1 x MSCAN (1 Mbit/s) 1 x MSCAN 1 x MSCAN 1 x MSCAN 1 x MSCAN 1 to 2 x MSCAN
Lifecycle NRND NRND NRND NRND NRND Active

Principaux différenciateurs

  • Drop-in 64 KB Flash baseline in the S12C family (vs MC9S12C32CFUE)
  • Lower peripheral and pin count vs S12E family (vs MC9S12E256CFUE)
  • Integrated CAN 2.0 MSCAN without external silicon (vs Generic 16-bit MCU without CAN)

Notes de conception

The MC9S12C64CFUE requires a single 2.97 V to 5.5 V external rail on VDD/VDDR/VDDX/VDDA. Place 100 nF decoupling close to each VDD/VSS pair and a 4.7 uF to 10 uF bulk capacitor on VDDR. The internal bandgap Vreg generates the core VDD from VDDR - do not load the internal Vreg pin. Use a separate analog ground island for VSSA/VDDA to keep ADC noise below 1 LSB at 10-bit resolution.

Keep the EXTAL/XTAL traces short and surrounded by a ground pour to minimize oscillator coupling. Route the CANH/CANL differential pair as a 120-ohm impedance-matched pair with 120-ohm termination at each end of the bus, and place the external CAN transceiver within 50 mm of the MCU CANTX/CANRX pins. The BDM (BKGD) pin should be accessible on a 2-pin header for in-circuit programming and debug.

Do not connect any load to the internal Vreg pin; the bandgap regulator is intended only to power the internal core. When migrating from MC9S12C64CFUE to MC9S12C128CFUE or MC9S12E256CFUE, verify that pin 1, IRQ, BDM and CAN pin assignments match the package datasheet - the S12E family differs in peripheral mapping even though the LQFP-80 footprint is shared. Always lock the Flash security bits after final programming to prevent in-field code extraction.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS compliant per NXP product page. Not AEC-Q100 qualified at the standard 'C' grade; 'M' grade variants may carry wider automotive qualification - verify against NXP's AEC-Q100 letter before design-in. Halogen-free status not explicitly stated in the verified data.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

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