MC9S12C64MFUE - 16-bit HCS12 MCU 64KB Flash QFP-80 | NXP
Référence : MC9S12C64MFUE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $19.6 | $19,60 |
| 10 | $17.85 | $178,50 |
| 100 | $14.95 | $1 495,00 |
| 500 | $12.4 | $6 200,00 |
| 1 000 | $10.2 | $10 200,00 |
MC9S12C64MFUE Présentation
An HCS12 microcontroller (MCU) is a 16-bit flash-based embedded processor that combines a CPU12 core with on-chip peripherals, analog modules and memory in a single chip. HCS12 sits in the hierarchy: HCS12 -> 16-bit MCU -> microcontroller -> embedded processor -> semiconductor. Compared with 8-bit MCUs the 16-bit datapath offers higher code density per MHz; compared with 32-bit Cortex-M parts the HCS12 is typically chosen for legacy automotive body and network nodes where the 16-bit toolchain and S12 software base are already deployed.
The MC9S12C64MFUE integrates an on-chip bandgap-based voltage regulator that derives the internal VDD from a 2.97 V to 5.5 V external supply, supporting both 3.3 V and 5 V systems without external regulation. The device includes a PLL for flexible clock generation from a wide range of external references, and an SCI, SPI and IIC/CAN communication block set targeting CAN-based automotive body controllers and LIN (LIN) sub-networks. 31 general-purpose I/O ports on the 80-pin package provide ample connectivity for sensor aggregation, while the 64 KB program Flash supports mid-sized application stacks with in-application reprogramming via the BDM interface.
The HCS12 CISC architecture uses variable-length instructions and dedicated addressing hardware to maximise code density, allowing 64 KB of Flash to host feature-rich automotive body and industrial control applications. The integrated voltage regulator plus PLL simplify BOM cost by removing the need for an external analog supply chain, and the 80-pin LQFP package offers a low-cost plastic footprint compatible with reflow-through-in-place assembly. The part also includes background debug mode (BDM) for non-intrusive in-circuit emulation and flash programming.
Typical applications include CAN/LIN body control modules, instrument clusters, automotive HVAC and seat controllers, industrial sensor hubs, RS-232/RS-485 networked sensors, and small appliance control boards. The wide 2.97 V to 5.5 V supply range allows direct connection to 5 V sensors and 12 V automotive rails after external regulation. The 64 KB Flash / 4 KB RAM memory mix suits tasks that need protocol stacks plus application logic but do not require the headroom of 128 KB-class S12C12 parts.
When designing with the MC9S12C64MFUE, ensure the external VDD decoupling network follows the datasheet reference layout, with 100 nF + 4.7 µF placed within 5 mm of the supply pins. The PLL loop-component values must match the chosen reference oscillator; incorrect Rs/Cs will prevent lock and the part will run on the unmultiplied bus rate. Leave the BDM pins accessible for production programming and field firmware updates. Note: this part is marked NRND by NXP - plan last-time-buy if your product lifecycle exceeds 2027.
This page synthesises distributor pricing, drop-in same-package alternatives within the S12C family, and practical hardware-design notes that complement the manufacturer datasheet for engineers evaluating the MC9S12C64MFUE for new designs or legacy maintenance.
Alternatives de remplacement direct pour MC9S12C64MFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12C64MFUE (même facteur de forme et même empreinte) — différant par Program Memory Size, Package, ADC, RAM Size, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12C64CFUE
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →MC9S12C32CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12C128VFAE
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →MC9S12E64CFUER
✅ Remplacement direct✓ En stock
$7.4 / unité
Voir la fiche technique →MC9S12GC32CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12C64MFUER
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12C64MFUE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (CPU12) |
| Largeur du bus de données | 16 bit |
| Program Memory Size | 64 KB Flash |
| RAM Size | 4 KB |
| EEPROM Size | 1 KB |
| Maximum Clock Speed | 50 MHz (internal); 25 MHz bus |
| Tension d'alimentation | 2.97 V to 5.5 V |
| I/O Pins | 31 |
| Package Type | 80-pin LQFP (QFP-80) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +125 C |
| On-chip Voltage Regulator | Yes (bandgap-based Vreg) |
| PLL | Yes |
| Communication Interfaces | SCI, SPI, IIC, CAN |
| Debug Interface | BDM (Background Debug Mode) |
| Statut RoHS | Compliant |
Configuration des broches de MC9S12C64MFUE
| Broche 1 | VDDR — Voltage regulator supply (external VDDX bypassed to internal VDD) |
| Broche 2 | VDDX — External supply input (2.97 V to 5.5 V) |
| Broche 3 | VSSX — External ground return for VDDX |
| Broche 4 | RESET_b — Active-low reset input |
| Broche 5 | TEST — Test mode pin (tie to VSSX in normal operation) |
| Broche 6 | XCLKS — Clock select (selects oscillator mode) |
| Broche 7 | EXTAL — External oscillator input |
| Broche 8 | XTAL — External oscillator output |
| Broche 9 | VSS — Digital ground |
| Broche 10 | VDD — Internal digital supply (from on-chip Vreg) |
| Broche 11 | BKGD — Background Debug Mode pin (BDM) |
| Broche 12 | MODC — Mode selection (BDM/normal) |
| Broche 13 | PAD0 — Port AD bit 0 / AN0 |
| Broche 14 | PAD1 — Port AD bit 1 / AN1 |
| Broche 15 | PAD2 — Port AD bit 2 / AN2 |
| Broche 16 | PAD3 — Port AD bit 3 / AN3 |
| Broche 17 | PAD4 — Port AD bit 4 / AN4 |
| Broche 18 | PAD5 — Port AD bit 5 / AN5 |
| Broche 19 | PAD6 — Port AD bit 6 / AN6 |
| Broche 20 | PAD7 — Port AD bit 7 / AN7 |
| Broche 21 | PAD8 — Port AD bit 8 / AN8 |
| Broche 22 | PAD9 — Port AD bit 9 / AN9 |
| Broche 23 | PAD10 — Port AD bit 10 / AN10 |
| Broche 24 | PAD11 — Port AD bit 11 / AN11 |
| Broche 25 | PAD12 — Port AD bit 12 / AN12 |
| Broche 26 | PAD13 — Port AD bit 13 / AN13 |
| Broche 27 | PAD14 — Port AD bit 14 / AN14 |
| Broche 28 | PAD15 — Port AD bit 15 / AN15 |
| Broche 29 | VDDA — Analog supply for ADC |
| Broche 30 | VSSA — Analog ground for ADC |
| Broche 31 | VRH — ADC high reference |
| Broche 32 | VRL — ADC low reference |
| Broche 33 | PTA0 — Port A bit 0 |
| Broche 34 | PTA1 — Port A bit 1 |
| Broche 35 | PTA2 — Port A bit 2 |
| Broche 36 | PTA3 — Port A bit 3 |
| Broche 37 | PTA4 — Port A bit 4 |
| Broche 38 | PTA5 — Port A bit 5 |
| Broche 39 | PTA6 — Port A bit 6 |
| Broche 40 | PTA7 — Port A bit 7 |
| Broche 41 | PTB0 — Port B bit 0 |
| Broche 42 | PTB1 — Port B bit 1 |
| Broche 43 | PTB2 — Port B bit 2 |
| Broche 44 | PTB3 — Port B bit 3 |
| Broche 45 | PTB4 — Port B bit 4 |
| Broche 46 | PTB5 — Port B bit 5 |
| Broche 47 | PTB6 — Port B bit 6 |
| Broche 48 | PTB7 — Port B bit 7 |
| Broche 49 | PTC0 — Port C bit 0 / SCLK |
| Broche 50 | PTC1 — Port C bit 1 / MOSI |
| Broche 51 | PTC2 — Port C bit 2 / MISO |
| Broche 52 | PTC3 — Port C bit 3 / SS_b |
| Broche 53 | PTC4 — Port C bit 4 |
| Broche 54 | PTC5 — Port C bit 5 |
| Broche 55 | PTC6 — Port C bit 6 / TXCAN |
| Broche 56 | PTC7 — Port C bit 7 / RXCAN |
| Broche 57 | PTD0 — Port D bit 0 |
| Broche 58 | PTD1 — Port D bit 1 |
| Broche 59 | PTD2 — Port D bit 2 |
| Broche 60 | PTD3 — Port D bit 3 |
| Broche 61 | PTD4 — Port D bit 4 |
| Broche 62 | PTD5 — Port D bit 5 |
| Broche 63 | PTD6 — Port D bit 6 |
| Broche 64 | PTD7 — Port D bit 7 |
| Broche 65 | PTE0 — Port E bit 0 / TXD0 |
| Broche 66 | PTE1 — Port E bit 1 / RXD0 |
| Broche 67 | PTE2 — Port E bit 2 |
| Broche 68 | PTE3 — Port E bit 3 |
| Broche 69 | PTE4 — Port E bit 4 |
| Broche 70 | PTE5 — Port E bit 5 |
| Broche 71 | PTE6 — Port E bit 6 |
| Broche 72 | PTE7 — Port E bit 7 |
| Broche 73 | PTF0 — Port F bit 0 |
| Broche 74 | PTF1 — Port F bit 1 |
| Broche 75 | PTF2 — Port F bit 2 |
| Broche 76 | PTF3 — Port F bit 3 |
| Broche 77 | PTF4 — Port F bit 4 |
| Broche 78 | PTF5 — Port F bit 5 |
| Broche 79 | PTF6 — Port F bit 6 |
| Broche 80 | PTF7 — Port F bit 7 |
Applications typiques
MC9S12C64MFUE convient pour 6 applications: Automotive Body Control Module (CAN/LIN gateway), Instrument Cluster and Driver Display, HVAC and Seat Controller ECUs, Industrial Sensor Hub / RS-485 Node, Small Appliance and White-Goods Controller, Building Automation and HVAC Network Node.
Automotive Body Control Module (CAN/LIN gateway)
The MC9S12C64MFUE suits automotive body control modules because its on-chip CAN and SCI peripherals support both high-speed CAN body networks and LIN (Local Interconnect Network) sub-buses in a single chip. With 64 KB Flash and 4 KB RAM, the part hosts a CAN/LIN gateway stack plus basic body-control logic, while the wide 2.97 V to 5.5 V supply range lets it operate directly from a regulated 12 V rail. The 31 I/O pins drive LEDs, relays and switch inputs typical of a body controller. AEC-Q100-grade temperature range (-40 C to +125 C) and the 80-pin LQFP package footprint align with standard body-controller PCB layouts, making the MC9S12C64MFUE a natural fit for body-electronics designs that must share firmware with other S12C nodes.
Recommandé
Instrument Cluster and Driver Display
Instrument clusters need an MCU that can drive stepper motors or segment LCDs while running CAN-based body-network communication. The MC9S12C64MFUE's HCS12 core at 25 MHz bus speed handles gauge control loops, and its 4 KB RAM buffers CAN messages without dropping frames. The on-chip SPI bus connects to external stepper-motor predriver ICs and LED drivers, while the 80-pin LQFP exposes enough I/O to control backlight, warning lamps and tell-tale indicators. The integrated bandgap voltage regulator removes an external analog supply, reducing BOM and PCB area - critical in cluster designs where space behind the cluster fascia is constrained. The MC9S12C64MFUE thus fits mid-range clusters that do not need the headroom of an S12XE or S12XF derivative.
Recommandé
HVAC and Seat Controller ECUs
HVAC and seat modules demand a small-footprint MCU that runs a CAN or LIN slave stack plus motor/blower control logic. The MC9S12C64MFUE integrates SCI/SPI/CAN peripherals and 31 I/O in the 80-pin LQFP, sufficient for stepper-motor drivers, NTC temperature sensors and PWM blower control without external glue logic. Its 2.97 V to 5.5 V supply rails accept both 5 V analog sensors and 12 V automotive rails after external regulation. The 64 KB Flash supports a CANopen or SAE J1939 stack alongside seat-position memory logic, and the integrated PLL allows the part to lock to a low-cost 4 MHz crystal. Compared with 32-bit Cortex-M alternatives, the MC9S12C64MFUE is typically lower-cost per unit and ships in a package footprint already approved by Tier-1 automotive seating suppliers.
Recommandé
Industrial Sensor Hub / RS-485 Node
Industrial sensor hubs aggregate 4-20 mA, 0-10 V and digital inputs over an RS-485 or CAN backbone. The MC9S12C64MFUE provides the SCI for RS-485 plus an IIC bus for digital sensor front-ends, all on a 25 MHz CPU12 core that runs a Modbus RTU or CANopen manager stack in 64 KB Flash. The 31 I/O pins accept up to 16 analog or digital sensor channels through external MUXing. The 2.97 V to 5.5 V supply range lets the same board be powered from 5 V regulated industrial supplies or 24 V backplane rails after external regulation. The integrated bandgap Vreg plus PLL minimise external components - reducing sensor-hub BOM cost and easing IEC 61010 EMC compliance by eliminating extra analog supplies.
Recommandé
Small Appliance and White-Goods Controller
Small appliances such as washing machines, dishwashers and induction cooktops need a 16-bit MCU that can drive triac-based mains control and run a user-interface state machine. The MC9S12C64MFUE's 31 I/O ports, PWM channels and 64 KB Flash are well matched to mid-tier appliance boards that drive a motor inverter, valve relays and a 7-segment or LCD display. The wide supply range lets the MCU run directly from a 5 V standby rail and survive brownout events, while the BDM interface simplifies factory firmware provisioning. Compared with 8-bit MCUs, the 16-bit datapath reduces the instruction footprint of complex state machines, fitting more features in the same 64 KB Flash budget.
Recommandé
Building Automation and HVAC Network Node
Building automation networks such as BACnet MS/TP and Modbus gateways need an MCU with SCI, CAN or IIC peripherals plus enough Flash for protocol stacks. The MC9S12C64MFUE fits BACnet wall-modules, VAV damper actuators and rooftop-unit controllers that aggregate temperature, CO2 and occupancy sensor data. Its SCI runs BACnet MS/TP over RS-485, while the IIC bus serves digital temperature/humidity sensors. With 64 KB Flash the part holds a Modbus or BACnet stack plus the local control algorithm, and the 4 KB RAM buffers inbound MS/TP frames without loss. The 80-pin LQFP's 0.5 mm pitch is suitable for industrial-automation PCB processes, and the part's operating temperature range supports unheated plant-room installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12C64MFUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12C64CFUE | MC9S12C32CFUE | MC9S12C128VFAE | MC9S12E64CFUE | MC9S12GC32CFUE | MC9S12C64MFUER |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-80 (QFP-80) | LQFP-80 (QFP-80) - same | LQFP-80 (QFP-80) - same | LQFP-80 (QFP-80) - same | LQFP-80 (QFP-80) - same | LQFP-80 (QFP-80) - same | LQFP-80 (QFP-80) - same |
| Flash | 64 KB | 64 KB | 32 KB | 128 KB | 64 KB | 32 KB | 64 KB |
| RAM | 4 KB | 4 KB | 2 KB | 8 KB | 4 KB | 2 KB | 4 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 2 KB | 2 KB | 1 KB | 1 KB |
| Core | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) |
| Max Clock | 50 MHz internal / 25 MHz bus | 50 MHz internal / 25 MHz bus | 50 MHz internal / 25 MHz bus | 50 MHz internal / 25 MHz bus | 50 MHz internal / 25 MHz bus | 50 MHz internal / 25 MHz bus | 50 MHz internal / 25 MHz bus |
| Supply Voltage | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V |
| Lifecycle | NRND | Active (verify with NXP) | NRND (verify with NXP) | Active (verify with NXP) | NRND (verify with NXP) | NRND (verify with NXP) | NRND |
Principaux différenciateurs
- Wider operating temperature range suited to body-electronics and underhood nodes (vs MC9S12C64CFUE)
- Lower in-application Flash programming overhead via BDM (vs MC9S12E64CFUE)
- Pin-compatible upgrade path to 128 KB Flash without PCB rework (vs MC9S12C32CFUE)
Notes de conception
The MC9S12C64MFUE has separate analog (VDDA/VSSA) and digital (VDD/VSS) supply pins. Place a 100 nF decoupling capacitor within 5 mm of each VDD pin and a 4.7 µF bulk capacitor close to the VDDX pin. Tie VDDR to VDDX with the datasheet-recommended 1 µF + 100 nF local bypass. ADC reference pins VRH and VRL must be bypassed with 100 nF + 4.7 µF to achieve the ADC's rated ENOB; floating references will significantly degrade conversion accuracy.
Route the EXTAL/XTAL oscillator traces as short, symmetric nets with ground guard rings on both sides. Keep crystal traces away from switching signals such as PWM and TXCAN. The PLL filter components (Rs and Cs at the XFC pin) must be placed within 5 mm of the XFC pad with the values specified in the datasheet's PLL section - incorrect loop values prevent PLL lock and the part runs at the unmultiplied reference frequency.
The CAN peripheral on PTC6/TNC7 is rated for ISO 11898-2/-5 but requires an external transceiver (such as TJA1057T or MC33661) to drive the bus. Keep the MCU-to-transceiver traces under 50 mm and put a common-mode choke or split termination on the bus to pass automotive EMC requirements. The BKGD pin requires a 10 kΩ pull-up to VDDX during reset; otherwise BDM communication will be unreliable.
Do not leave TEST or MODC floating - tie TEST to VSSX through a 10 kΩ resistor and MODC to VSSX for normal operation, or leave them routed to a test header. Floating TEST or MODC pins can put the MCU into factory-test mode and prevent application code execution. Also, ensure the BDM firmware-pull enable bit is configured correctly before locking the Flash - otherwise field firmware updates will be impossible.
Informations de conformité
AEC-Q100 qualified per NXP automotive-grade M-suffix designation; RoHS compliant per product page. NRND lifecycle per NXP product page as of 2026-10-19.
