MCF51JE128VMB - 32-bit ColdFire V1 MCU, 128KB Flash, 50MHz, USB | NXP
Référence : MCF51JE128VMB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.59 | $9,59 |
| 10 | $8.86 | $88,60 |
| 100 | $7.94 | $794,00 |
| 500 | $7.21 | $3 605,00 |
| 1 000 | $6.55 | $6 550,00 |
MCF51JE128VMB Présentation
What is a ColdFire microcontroller? ColdFire is NXP's (originally Freescale's) 32-bit microprocessor architecture derived from the original Motorola 68000 family. Devices in the MCF51JE series sit in the same hierarchy as: ColdFire V1 core -> 32-bit MCU -> embedded microcontroller -> integrated circuit. Compared with 8-bit MCUs (e.g., 8051, AVR), ColdFire V1 gives 32-bit processing in a low-power envelope suited for industrial and consumer embedded systems.
Key features include up to 50 MHz core frequency, 128 KB program Flash, 32 KB SRAM, integrated USB 2.0 full-speed OTG with on-chip transceiver, multiple serial interfaces (CAN, I2C, SCI/UART, SPI), 12-bit ADC, and PWM/timer modules. Up to 48 GPIO pins give designers flexibility for sensor or user-interface I/O. The integrated USB OTG controller eliminates the need for an external transceiver, reducing BOM cost.
The ColdFire V1 core uses a variable-length instruction set with a 32-bit register model, balancing code density with throughput. On-chip peripherals include a low-voltage detection (LVD) module, watchdog timer, and PWM units. The internal bus matrix and Flash controller enable deterministic interrupt response suitable for real-time control.
Typical applications include USB smart metering, industrial sensor hubs, low-cost measurement equipment, and consumer devices needing embedded USB (e.g., data loggers, HID peripherals). It is well-suited for battery-powered designs because of the family's low-power modes.
When designing with the MCF51JE128VMB, ensure PCB layout accommodates the MAPBGA's 0.8 mm ball pitch - careful fan-out and possibly 4-layer stack-up are recommended. For non-USB applications in the same family, consider the lower-cost MCF51AC series; for higher pin count, see the MCF51MM family.
This page synthesizes distributor pricing, same-family alternative variants (MCF51JE256CMB, MCF51JE256VML), and practical BGA-layout design notes not found in a typical catalog summary.
Alternatives de remplacement direct pour MCF51JE128VMB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF51JE128VMB (même facteur de forme et même empreinte) — différant par Package, Connectivity, Program Memory Size, Supply Voltage, Number of I/O.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF51JE256CMB
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MCF51JE256VML
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MCF51MM128VMB
✅ Remplacement direct✓ En stock
$11.0968 / unité
Voir la fiche technique →MCF51JM64VQH
✅ Remplacement direct✓ En stock
$5.25 / unité
Voir la fiche technique →MC9S12XEQ256VAA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF51JE128VMB Valeurs maximales et caractéristiques électriques
| Core Processor | Coldfire V1 |
| Core Size | 32-Bit |
| Fréquence d'horloge maximale | 50 MHz |
| Program Memory Size | 128 KB (128K x 8) |
| Program Memory Type | FLASH |
| Number of I/O | 48 |
| Connectivity | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG |
| USB | USB 2.0 Full-Speed On-The-Go (OTG) |
| Peripherals | LVD, PWM, WDT |
| Tension d'alimentation | 2.5 V / 3.3 V |
| Boîtier | 81-MAPBGA (10 x 10 mm) |
| Type de montage | Surface Mount |
Guide de configuration des broches du MCF51JE128VMB 81-mapbga (10 x 10 mm)
Configuration des broches du MCF51JE128VMB (boîtier 81-mapbga (10 x 10 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCF51JE128VMB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCF51JE128VMB convient pour 6 applications: USB Smart Metering & Data Loggers, Industrial CAN Sensor Hubs, Human Interface Devices (HID) over USB, Low-Cost Measurement / Data Acquisition, Consumer USB Charging Cradles & Docks, Connected Lighting / LED Controllers.
USB Smart Metering & Data Loggers
The MCF51JE128VMB is purpose-built for USB-attached metering and logging devices because it integrates a USB 2.0 Full-Speed OTG transceiver directly on-chip - no external PHY needed. With 128 KB Flash it can host metering firmware, calibration tables, and small embedded web/HID stacks, while 50 MHz ColdFire V1 horsepower handles periodic ADC sampling and protocol framing. The 48 GPIO fan out to LED pulse outputs, opto-isolated sensor inputs, and an isolated SPI bus for an external metrology AFE. Together the integrated USB, generous Flash, and low-power ColdFire modes let metering OEMs ship a single-chip bill-of-materials instead of a two-chip MCU+USB-PHY stack.
Recommandé
Industrial CAN Sensor Hubs
The MCF51JE128VMB is well-suited to industrial CAN-enabled sensor hubs because of its integrated CANbus controller, 50 MHz Coldfire V1 core, and 48 GPIOs for analog and digital sensor fan-in. The 128 KB Flash holds protocol stacks (CANopen or DeviceNet) and the sensor-fusion firmware, while 32 KB-class SRAM buffers time-series sensor reads. The on-chip 12-bit ADC and PWM peripherals eliminate external ADC and motor-driver chips in a typical sensor-hub or HVAC transmitter. Extended industrial-grade temperature support makes the part a fit for factory-floor sensor nodes.
Recommandé
Human Interface Devices (HID) over USB
For USB keyboards, mice, touch panels, or custom HID peripherals, the MCF51JE128VMB delivers integrated USB OTG with on-chip transceiver plus 48 GPIOs that map cleanly to scan matrices and capacitive touch I/O. The 50 MHz core scans large key matrices without timing jitter and runs USB HID class firmware directly out of 128 KB Flash. Lower-power Run and Wait modes help battery-powered wireless HID dongles meet standby targets. The ColdFire instruction set keeps code density high, reducing Flash pressure versus equivalent 32-bit ARM Cortex-M0 designs in similar HID products.
Recommandé
Low-Cost Measurement / Data Acquisition
In low-cost measurement instruments the MCF51JE128VMB balances 12-bit ADC accuracy, USB data offload, and 50 MHz DSP-style throughput in a single chip. The 128 KB Flash stores calibration constants and acquisition profiles; 32 KB SRAM buffers waveform captures before USB streaming. The internal SCI/UART allows direct connection to a Bluetooth or RS-485 module for wireless variants. With up to 48 GPIOs, designers can multiplex multiple analog front-end chains without external muxes. Combined with low-power modes, the part is attractive for portable bench instruments.
Recommandé
Consumer USB Charging Cradles & Docks
Charging cradles, sync stations, and small USB docks benefit from the MCF51JE128VMB's integrated USB OTG, small 81-MAPBGA footprint, and 50 MHz processing headroom. The MCU negotiates USB roles (host/device), drives status LEDs, and monitors charging-current feedback through on-chip ADC. With 128 KB Flash it can host proprietary charging protocols. The 48 GPIOs handle display matrix driving and button inputs typical of consumer docks. Low-power Wait mode keeps idle cradle power low for ENERGY STAR-style standby compliance.
Recommandé
Connected Lighting / LED Controllers
LED controllers and connected-lighting nodes leverage the MCF51JE128VMB's PWM peripherals, 50 MHz core, and CANbus controller. The Coldfire V1 supports DMX or DALI-over-CAN bridges, while 48 GPIOs drive multi-channel LED PWM with hardware-accelerated fade and gamma. The 128 KB Flash holds lighting profile tables and the USB OTG enables host-side commissioning via USB. Low-power modes keep standby consumption minimal for battery-backed emergency-lighting nodes. Designers can also reuse the same BOM across multiple SKUs by simply scaling firmware thanks to the MCF51JE family's pin compatibility.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF51JE128VMB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF51JE256CMB | MCF51JE256VML | MCF51MM128VMB | MCF51JM64VQH | MC9S12XEQ256VAA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | Coldfire V1 32-bit | Coldfire V1 32-bit | Coldfire V1 32-bit | Coldfire V1 32-bit | Coldfire V1 32-bit | HCS12 16-bit |
| Program Flash | 128 KB | 256 KB | 256 KB | 128 KB | 64 KB | 256 KB |
| Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
Principaux différenciateurs
- On-chip integrated USB OTG with no external PHY needed (vs MC9S12XEQ256VAA)
- 50 MHz 32-bit ColdFire V1 with 128 KB Flash and industrial peripherals (vs MCF51JM64VQH)
- Same-family 256 KB upgrade path available (vs MCF51JE256CMB)
- Coldfire V1 core optimized for code density and determinism (vs MCF51MM128VMB)
Notes de conception
The MCF51JE128VMB ships in an 81-ball MAPBGA (10 x 10 mm) with 0.8 mm ball pitch. BGA fan-out is critical: a 4-layer PCB with a dedicated ground plane is recommended, and vias-in-pad (VIPPO) with filled-and-capped vias are best for high-yield assembly. Allow at least 4 mil trace-and-space at fabrication; many prototypes use 4-layer FR-4 with 0.5 oz copper on top and 1 oz inner layers to support BGA fan-out. Always run a Design-for-Manufacturability (DFM) check using the manufacturer's BGA land pattern (NXP drawing). Paste stencil aperture should be ~0.85x ball diameter to prevent bridging.
Use a 10 uF + 0.1 uF decoupling pair within 5 mm of each VDD pin pair, and place a 4.7 uF bulk capacitor near the regulator output. The 2.5 V/3.3 V supply rails must ramp monotonically; add a power-on-reset (POR) supervisor if the upstream regulator has slow rise times. For USB applications, ensure VBUS-VDD decoupling prevents inrush events that could brown out the MCU. Estimated: at 50 MHz, core current is roughly 30-40 mA - design the LDO for at least 100 mA headroom including USB and peripheral surge currents.
Place the external reference crystal within 5 mm of the MCU XTAL pins, with a guard ring tied to ground on the outer perimeter and a differential trace length match within 1 mm. The USB DP/DM traces must be 90 ohm differential, 4-7 mm max length match, and routed over a continuous ground pour with no splits - never cross a ground-plane gap on USB lines. Keep analog ADC traces away from USB and high-speed PWM outputs to avoid coupling. Run a signal-integrity simulation if your product qualifies for USB-IF compliance testing.
Do not assume the 128 KB Flash JE part and the 256 KB JE part share the exact same BGA ballout - some pins migrate between CMB/VMB suffixes; always reference the per-MPN datasheet ball map during PCB layout. The Coldfire V1 core does NOT support the same instruction set as Coldfire V2/V3/V4 - re-compile firmware for the right family. Finally, do not exceed the absolute maximum VDD of 3.6 V; a 3.3 V rail with hot-plug transients can latch-up the part if not clamped.
Estimated: typical dissipation at 50 MHz core and full GPIO switching is around 50-80 mW (1.7-2.7 mA at 3.3 V). The MAPBGA package is the dominant thermal path - use thermal via array under the package center to spread heat to inner ground planes. For enclosed or fan-less designs, derate the operating ambient by 5-10 C to ensure the junction stays below 85 C industrial-grade max.
Informations de conformité
NXP lead-free and RoHS compliant per product page. Not AEC-Q100 (consumer/industrial MCU). For exact REACH and halogen-free attestations, request a material declaration from NXP.