MCF51JE128VMB - 32-bit ColdFire V1 MCU, 128KB Flash, 50MHz, USB | NXP
부품 번호: MCF51JE128VMB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.59 | $9.59 |
| 10 | $8.86 | $88.60 |
| 100 | $7.94 | $794.00 |
| 500 | $7.21 | $3,605.00 |
| 1,000 | $6.55 | $6,550.00 |
MCF51JE128VMB 개요
What is a ColdFire microcontroller? ColdFire is NXP's (originally Freescale's) 32-bit microprocessor architecture derived from the original Motorola 68000 family. Devices in the MCF51JE series sit in the same hierarchy as: ColdFire V1 core -> 32-bit MCU -> embedded microcontroller -> integrated circuit. Compared with 8-bit MCUs (e.g., 8051, AVR), ColdFire V1 gives 32-bit processing in a low-power envelope suited for industrial and consumer embedded systems.
Key features include up to 50 MHz core frequency, 128 KB program Flash, 32 KB SRAM, integrated USB 2.0 full-speed OTG with on-chip transceiver, multiple serial interfaces (CAN, I2C, SCI/UART, SPI), 12-bit ADC, and PWM/timer modules. Up to 48 GPIO pins give designers flexibility for sensor or user-interface I/O. The integrated USB OTG controller eliminates the need for an external transceiver, reducing BOM cost.
The ColdFire V1 core uses a variable-length instruction set with a 32-bit register model, balancing code density with throughput. On-chip peripherals include a low-voltage detection (LVD) module, watchdog timer, and PWM units. The internal bus matrix and Flash controller enable deterministic interrupt response suitable for real-time control.
Typical applications include USB smart metering, industrial sensor hubs, low-cost measurement equipment, and consumer devices needing embedded USB (e.g., data loggers, HID peripherals). It is well-suited for battery-powered designs because of the family's low-power modes.
When designing with the MCF51JE128VMB, ensure PCB layout accommodates the MAPBGA's 0.8 mm ball pitch - careful fan-out and possibly 4-layer stack-up are recommended. For non-USB applications in the same family, consider the lower-cost MCF51AC series; for higher pin count, see the MCF51MM family.
This page synthesizes distributor pricing, same-family alternative variants (MCF51JE256CMB, MCF51JE256VML), and practical BGA-layout design notes not found in a typical catalog summary.
드롭인 대체품: MCF51JE128VMB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF51JE128VMB (동일 폼 팩터 및 풋프린트) — 차이점: Package, Connectivity, Program Memory Size, Supply Voltage, Number of I/O.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF51JE256CMB
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MCF51JE256VML
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MCF51MM128VMB
✅ 드롭인✓ 재고 있음
$11.0968 / 개
데이터시트 보기 →MCF51JM64VQH
✅ 드롭인✓ 재고 있음
$5.25 / 개
데이터시트 보기 →MC9S12XEQ256VAA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF51JE128VMB 최대 정격 & 전기적 특성
| Core Processor | Coldfire V1 |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 50 MHz |
| Program Memory Size | 128 KB (128K x 8) |
| Program Memory Type | FLASH |
| Number of I/O | 48 |
| Connectivity | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG |
| USB | USB 2.0 Full-Speed On-The-Go (OTG) |
| Peripherals | LVD, PWM, WDT |
| 공급 전압 | 2.5 V / 3.3 V |
| 패키지 | 81-MAPBGA (10 x 10 mm) |
| 실장 유형 | Surface Mount |
MCF51JE128VMB 81-mapbga (10 x 10 mm) 핀 구성 가이드
MCF51JE128VMB(81-mapbga (10 x 10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MCF51JE128VMB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MCF51JE128VMB 적합 용도: 6 애플리케이션s: USB Smart Metering & Data Loggers, Industrial CAN Sensor Hubs, Human Interface Devices (HID) over USB, Low-Cost Measurement / Data Acquisition, Consumer USB Charging Cradles & Docks, Connected Lighting / LED Controllers.
USB Smart Metering & Data Loggers
The MCF51JE128VMB is purpose-built for USB-attached metering and logging devices because it integrates a USB 2.0 Full-Speed OTG transceiver directly on-chip - no external PHY needed. With 128 KB Flash it can host metering firmware, calibration tables, and small embedded web/HID stacks, while 50 MHz ColdFire V1 horsepower handles periodic ADC sampling and protocol framing. The 48 GPIO fan out to LED pulse outputs, opto-isolated sensor inputs, and an isolated SPI bus for an external metrology AFE. Together the integrated USB, generous Flash, and low-power ColdFire modes let metering OEMs ship a single-chip bill-of-materials instead of a two-chip MCU+USB-PHY stack.
추천
Industrial CAN Sensor Hubs
The MCF51JE128VMB is well-suited to industrial CAN-enabled sensor hubs because of its integrated CANbus controller, 50 MHz Coldfire V1 core, and 48 GPIOs for analog and digital sensor fan-in. The 128 KB Flash holds protocol stacks (CANopen or DeviceNet) and the sensor-fusion firmware, while 32 KB-class SRAM buffers time-series sensor reads. The on-chip 12-bit ADC and PWM peripherals eliminate external ADC and motor-driver chips in a typical sensor-hub or HVAC transmitter. Extended industrial-grade temperature support makes the part a fit for factory-floor sensor nodes.
추천
Human Interface Devices (HID) over USB
For USB keyboards, mice, touch panels, or custom HID peripherals, the MCF51JE128VMB delivers integrated USB OTG with on-chip transceiver plus 48 GPIOs that map cleanly to scan matrices and capacitive touch I/O. The 50 MHz core scans large key matrices without timing jitter and runs USB HID class firmware directly out of 128 KB Flash. Lower-power Run and Wait modes help battery-powered wireless HID dongles meet standby targets. The ColdFire instruction set keeps code density high, reducing Flash pressure versus equivalent 32-bit ARM Cortex-M0 designs in similar HID products.
추천
Low-Cost Measurement / Data Acquisition
In low-cost measurement instruments the MCF51JE128VMB balances 12-bit ADC accuracy, USB data offload, and 50 MHz DSP-style throughput in a single chip. The 128 KB Flash stores calibration constants and acquisition profiles; 32 KB SRAM buffers waveform captures before USB streaming. The internal SCI/UART allows direct connection to a Bluetooth or RS-485 module for wireless variants. With up to 48 GPIOs, designers can multiplex multiple analog front-end chains without external muxes. Combined with low-power modes, the part is attractive for portable bench instruments.
추천
Consumer USB Charging Cradles & Docks
Charging cradles, sync stations, and small USB docks benefit from the MCF51JE128VMB's integrated USB OTG, small 81-MAPBGA footprint, and 50 MHz processing headroom. The MCU negotiates USB roles (host/device), drives status LEDs, and monitors charging-current feedback through on-chip ADC. With 128 KB Flash it can host proprietary charging protocols. The 48 GPIOs handle display matrix driving and button inputs typical of consumer docks. Low-power Wait mode keeps idle cradle power low for ENERGY STAR-style standby compliance.
추천
Connected Lighting / LED Controllers
LED controllers and connected-lighting nodes leverage the MCF51JE128VMB's PWM peripherals, 50 MHz core, and CANbus controller. The Coldfire V1 supports DMX or DALI-over-CAN bridges, while 48 GPIOs drive multi-channel LED PWM with hardware-accelerated fade and gamma. The 128 KB Flash holds lighting profile tables and the USB OTG enables host-side commissioning via USB. Low-power modes keep standby consumption minimal for battery-backed emergency-lighting nodes. Designers can also reuse the same BOM across multiple SKUs by simply scaling firmware thanks to the MCF51JE family's pin compatibility.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF51JE128VMB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF51JE256CMB | MCF51JE256VML | MCF51MM128VMB | MCF51JM64VQH | MC9S12XEQ256VAA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | Coldfire V1 32-bit | Coldfire V1 32-bit | Coldfire V1 32-bit | Coldfire V1 32-bit | Coldfire V1 32-bit | HCS12 16-bit |
| Program Flash | 128 KB | 256 KB | 256 KB | 128 KB | 64 KB | 256 KB |
| Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
주요 차별점
- On-chip integrated USB OTG with no external PHY needed (vs MC9S12XEQ256VAA)
- 50 MHz 32-bit ColdFire V1 with 128 KB Flash and industrial peripherals (vs MCF51JM64VQH)
- Same-family 256 KB upgrade path available (vs MCF51JE256CMB)
- Coldfire V1 core optimized for code density and determinism (vs MCF51MM128VMB)
설계 노트
The MCF51JE128VMB ships in an 81-ball MAPBGA (10 x 10 mm) with 0.8 mm ball pitch. BGA fan-out is critical: a 4-layer PCB with a dedicated ground plane is recommended, and vias-in-pad (VIPPO) with filled-and-capped vias are best for high-yield assembly. Allow at least 4 mil trace-and-space at fabrication; many prototypes use 4-layer FR-4 with 0.5 oz copper on top and 1 oz inner layers to support BGA fan-out. Always run a Design-for-Manufacturability (DFM) check using the manufacturer's BGA land pattern (NXP drawing). Paste stencil aperture should be ~0.85x ball diameter to prevent bridging.
Use a 10 uF + 0.1 uF decoupling pair within 5 mm of each VDD pin pair, and place a 4.7 uF bulk capacitor near the regulator output. The 2.5 V/3.3 V supply rails must ramp monotonically; add a power-on-reset (POR) supervisor if the upstream regulator has slow rise times. For USB applications, ensure VBUS-VDD decoupling prevents inrush events that could brown out the MCU. Estimated: at 50 MHz, core current is roughly 30-40 mA - design the LDO for at least 100 mA headroom including USB and peripheral surge currents.
Place the external reference crystal within 5 mm of the MCU XTAL pins, with a guard ring tied to ground on the outer perimeter and a differential trace length match within 1 mm. The USB DP/DM traces must be 90 ohm differential, 4-7 mm max length match, and routed over a continuous ground pour with no splits - never cross a ground-plane gap on USB lines. Keep analog ADC traces away from USB and high-speed PWM outputs to avoid coupling. Run a signal-integrity simulation if your product qualifies for USB-IF compliance testing.
Do not assume the 128 KB Flash JE part and the 256 KB JE part share the exact same BGA ballout - some pins migrate between CMB/VMB suffixes; always reference the per-MPN datasheet ball map during PCB layout. The Coldfire V1 core does NOT support the same instruction set as Coldfire V2/V3/V4 - re-compile firmware for the right family. Finally, do not exceed the absolute maximum VDD of 3.6 V; a 3.3 V rail with hot-plug transients can latch-up the part if not clamped.
Estimated: typical dissipation at 50 MHz core and full GPIO switching is around 50-80 mW (1.7-2.7 mA at 3.3 V). The MAPBGA package is the dominant thermal path - use thermal via array under the package center to spread heat to inner ground planes. For enclosed or fan-less designs, derate the operating ambient by 5-10 C to ensure the junction stays below 85 C industrial-grade max.
규정 준수 정보
NXP lead-free and RoHS compliant per product page. Not AEC-Q100 (consumer/industrial MCU). For exact REACH and halogen-free attestations, request a material declaration from NXP.