MCF52232AF50 - 32-bit ColdFire V2 MCU, 128KB Flash, 50MHz | NXP
Référence : MCF52232AF50 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.7 | $8,70 |
| 10 | $8.12 | $81,20 |
| 100 | $7.05 | $705,00 |
| 500 | $6.32 | $3 160,00 |
| 1 000 | $5.74 | $5 740,00 |
MCF52232AF50 Présentation
A ColdFire microcontroller is a 32-bit reduced instruction set computing (RISC) processor based on the legacy Motorola 68000 family architecture, designed for low-power, deterministic embedded control. The ColdFire V2 core implements a variable-length instruction set that mixes 16-bit and 32-bit opcodes to balance code density and throughput. Within the broader taxonomy, ColdFire V2 sits below V3/V4/V5 performance tiers but above legacy 8-bit/16-bit microcontrollers (8051, MSP430, PIC16) and is classified under embedded microcontrollers -> microcontrollers -> integrated circuits -> semiconductors.
Key features of the MCF52232AF50 include the 50 MHz ColdFire V2 core delivering up to 50 MIPS, 128 KB of on-chip Flash, 32 KB of SRAM, an integrated Fast Ethernet Controller (FEC) supporting 10/100 Mbps with MII/RMII interfaces, a USB 2.0 Full-Speed On-the-Go controller, CAN 2.0B module, three UARTs, queued SPI, two I2C ports, an 8-channel 12-bit ADC, four 32-bit timers with DMA, and 56 general-purpose I/O lines. The LQFP-80 package provides easy PCB integration while exposing the full peripheral set.
The MCF52232AF50 is built on a 0.13 micron process and is designed for low-power networked embedded systems where deterministic 32-bit performance is required alongside Ethernet connectivity. The integrated FEC and USB OTG reduce BOM cost and PCB area, while the ColdFire V2 instruction set allows efficient C compilation for control code.
Typical applications include industrial Ethernet controllers, building automation gateways, smart energy meters, point-of-sale terminals, networked sensor hubs, and CAN-to-Ethernet bridges. The combination of Ethernet, CAN, USB OTG and rich analog/digital peripherals enables single-chip implementations of previously multi-chip designs.
Design consideration: use a 25 MHz external crystal with the integrated PLL to derive the 50 MHz core clock, place 0.1 uF decoupling capacitors adjacent to every VDD/VSS pin pair, and follow the NXP application note on FEC magnetics layout to achieve IEEE 802.3 EMI compliance.
This page synthesizes distributor pricing, NXP-family pin-compatible drop-in alternatives (MCF52231/52233/52234/52235) and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MCF52232AF50 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF52232AF50 (même facteur de forme et même empreinte).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF52231AF50
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF52233AF50
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF52234AF50
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF52235AF50
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF52235CAL60
✅ Remplacement direct✓ En stock
$34.15 / unité
Voir la fiche technique →MCF52232AF50 Valeurs maximales et caractéristiques électriques
| Core Architecture | ColdFire V2 (32-bit RISC) |
| Core Frequency | 50 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| RAM Size | 32 KB |
| Number of I/O | 56 |
| Boîtier / Format | 80-LQFP (14x14 mm) |
| Tension d'alimentation | 3.3 V |
| Oscillator Type | Internal |
| Ethernet | 10/100 Mbps MAC (MII/RMII) |
| USB | USB 2.0 Full-Speed OTG |
| CAN | CAN 2.0B |
| UART | 3 |
| SPI | 1 (queued) |
| I2C | 2 |
| ADC | 12-bit, 8-channel |
| Timers | 4 x 32-bit |
| Température de fonctionnement | -40C to +85C |
| Type de montage | Surface Mount |
| Packaging | Tray |
Guide de configuration des broches du MCF52232AF50 80-lqfp (14x14 mm)
Configuration des broches du MCF52232AF50 (boîtier 80-lqfp (14x14 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCF52232AF50.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCF52232AF50 convient pour 6 applications: Industrial Ethernet Controller, Building Automation Gateway, Smart Energy Meter, Point-of-Sale Terminal, Networked Sensor Hub, CAN-to-Ethernet Bridge.
Industrial Ethernet Controller
The MCF52232AF50's integrated 10/100 Mbps Fast Ethernet Controller with MII/RMII PHY interface and 50 MHz ColdFire V2 throughput make it ideal for industrial Ethernet nodes such as PLCs, distributed I/O blocks, and protocol gateways. Designers can run Modbus TCP, EtherNet/IP, or PROFINET stacks directly on-chip without an external network processor, while the 32 KB SRAM sustains TCP/IP socket buffers. Placed on the same PCB as a 25 MHz crystal, PHY, and magnetics, it delivers a compact single-chip networked controller. Unlike higher-end Cortex-M3 parts, the ColdFire V2 instruction set keeps interrupt latency deterministic for real-time industrial control loops.
Recommandé
Building Automation Gateway
The MCF52232AF50 fits building automation gateways that bridge BACnet, LonWorks, or Modbus field buses to IP networks. Its three UARTs handle multiple field-bus transceivers, the 12-bit ADC reads analog sensor channels, and the Ethernet MAC uplinks to the building IP backbone. Operating from -40C to +85C, it survives plant-room thermal stress without derating. The 128 KB Flash supports full BACnet/IP stack plus web HMI pages, eliminating the need for an external memory IC.
Recommandé
Smart Energy Meter
The MCF52232AF50 powers single-phase and three-phase smart energy meters requiring metering DSP, tamper logging, and AMI uplink. The 50 MHz ColdFire V2 core runs metering algorithms and the Ethernet MAC pushes data to AMI head-ends over IPv4/IPv6. The 32 KB SRAM buffers measurement intervals while the 128 KB Flash stores tariff tables and logging firmware. AEC-Q100 is not required for indoor meter installations, but the industrial -40C to +85C range covers outdoor cabinet deployments.
Recommandé
Point-of-Sale Terminal
The MCF52232AF50 drives compact point-of-sale terminals requiring Ethernet for payment processing, USB OTG for peripherals (barcode scanner, receipt printer), and UART for PIN pad communication. The ColdFire V2 core runs the payment stack, while the integrated USB OTG controller eliminates the need for an external PHY. The 56 GPIO lines drive keypad scanning, LCD control, and cash-drawer signalling. Compared to host-PC POS designs, this single-chip approach reduces BOM by 30-40%.
Recommandé
Networked Sensor Hub
The MCF52232AF50 aggregates sensor data from UART, SPI, I2C, and analog channels and publishes it over Ethernet for IoT or industrial IoT gateways. The 8-channel 12-bit ADC reads analog sensors directly, while the queued SPI and I2C ports connect to digital sensors and EEPROM. The Ethernet MAC supports Power-over-Ethernet PD designs, allowing single-cable deployment in ceiling or wall-mounted sensor nodes. Deterministic ColdFire V2 interrupt latency keeps time-stamped sensor data coherent across the network.
Recommandé
CAN-to-Ethernet Bridge
The MCF52232AF50 (when upgraded to MCF52231AF50 for CAN support, since base MCF52232AF50 lacks CAN) bridges CAN 2.0B field-bus traffic to Ethernet for vehicle telematics, fleet management, and industrial control. The ColdFire V2 core forwards CAN frames to TCP/UDP sockets with deterministic latency. The LQFP-80 footprint exposes all peripheral pins, simplifying PCB layout of isolated CAN and Ethernet transceivers. Compared to multi-chip ARM+CPLD bridges, the integrated approach reduces board area by 50%.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF52232AF50 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF52231AF50 | MCF52233AF50 | MCF52234AF50 | MCF52235AF50 | MCF52235CAL60 |
|---|---|---|---|---|---|---|
| Package | LQFP-80 (14x14) | LQFP-80 (14x14) - same | LQFP-80 (14x14) - same | LQFP-80 (14x14) - same | LQFP-80 (14x14) - same | LQFP-80 (14x14) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 60 MHz |
| Flash Size | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| RAM Size | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| CAN 2.0B Module | No | Yes | Yes | Yes | Yes | Yes |
| Cryptographic Acceleration | No | No | No | No | Yes | Yes |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| Core Architecture | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
Principaux différenciateurs
- Pin-to-pin family compatibility with MCF5223x siblings (vs MCF52235CAL60)
- No CAN module keeps cost lower than CAN-equipped siblings (vs MCF52231AF50)
- 50 MHz core balances performance and power consumption (vs MCF52235CAL60)
Notes de conception
Decouple every VDD/VSS pin pair on the MCF52232AF50 with a 0.1 uF ceramic capacitor placed within 3 mm of each pin; add a single 10 uF bulk capacitor near the regulator output. The 50 MHz core generates high-frequency switching transients that couple through the LQFP-80 lead frame; bulk decoupling alone is insufficient. Place a ferrite bead on the analog AVDD rail to isolate the 12-bit ADC from digital switching noise.
Route the Ethernet MII/RMII signals with 50 ohm controlled impedance and length-match the clock-to-data traces within 50 mil to meet IEEE 802.3 timing. Place the PHY as close as possible to the RJ-45 jack and route the differential TX/RX pairs as 100 ohm differential pairs. Refer to the NXP application note on Ethernet layout for the recommended magnetics isolation barrier; violating the keep-out zone will fail EMI compliance testing.
Do not omit the external 25 MHz crystal or use the wrong load capacitance; the integrated PLL multiplies this reference to derive the 50 MHz core clock, and crystal frequency error directly translates into Ethernet PHY clock error that breaks 100 Mbps link. Use a crystal with +/- 50 ppm tolerance or better, and follow the NXP reference design for the crystal load capacitors. Programming the PLL to a non-multiple of the input frequency will cause core lock-up.
Informations de conformité
RoHS and REACH compliant per NXP product page and distributor listings. Not AEC-Q100 qualified - this is an industrial-grade part rated -40C to +85C, not automotive grade.
