NXP Semiconductors

MCIMX27MJP4A557 - i.MX27 Multimedia ARM9 MPU 400MHz 473-PBGA

Référence : MCIMX27MJP4A557 ✗ Fin de vie
473-PBGA (19x19 mm) Package 400 MHz Speed DDR / mobile SDRAM Memory
MOQ : 1 |

MCIMX27MJP4A557 Présentation

The NXP MCIMX27MJP4A557 is an i.MX27 multimedia applications processor built on an ARM926EJ-S core running up to 400 MHz, integrated into a 473-pin PBGA package measuring 19x19 mm. Designed as a high-integration system-on-chip, the i.MX27 targets video-centric embedded applications such as IPTV set-top boxes, portable media players, industrial human-machine interfaces, and automotive infotainment head units. The part combines an ARM9 core, an enhanced multimedia accelerator (eMMA), an LCD controller, a CMOS sensor interface, and a hardware video processing block on a single die.

The ARM926EJ-S is a 32-bit RISC processor core that supports the ARMv5TEJ instruction set, including Java acceleration via the Jazelle extension. The i.MX27 belongs to the broader ARM926EJ-S microprocessor family, which sits within the application processor hierarchy: ARM9 core -> microprocessor IC -> embedded processor -> SoC -> semiconductor. The MMic part provides a single-core architecture that balances deterministic real-time response with the multimedia throughput required by mid-resolution video playback at 30 fps.

Key features include an operating frequency of up to 400 MHz, an integrated LCD controller supporting up to VGA resolution, a CMOS image sensor interface, hardware MPEG-4 and H.263 video encoding/decoding, USB 2.0 high-speed On-The-Go, 10/100 Ethernet MAC, and three MMC/SD/SDIO card ports. The device integrates 16 KB instruction and 16 KB data caches, plus 128 KB of internal SRAM that can be mapped for multimedia data paths. Power management is handled through an on-chip PMU and multiple low-power modes including Doze, Standby, and Deep Sleep.

Typical applications include IPTV and hybrid set-top boxes, automotive telematics clusters, point-of-sale terminals, and portable medical imaging devices where integrated video and display pipelines reduce total BOM cost. The 473-PBGA package uses 1.0 mm pitch ball array suitable for multilayer PCBs with controlled-impedance routing for the external memory bus.

When designing with the i.MX27, ensure the power-on reset sequencing matches the requirements of the companion DDR or mobile DDR memory; the device supports both DDR and mobile SDRAM via its external memory controller. Thermal management must consider the maximum junction temperature of 95C, and decoupling must follow the manufacturer reference layout to maintain signal integrity on the high-speed memory bus.

Alternatives de remplacement direct pour MCIMX27MJP4A557 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

MCIMX27MJP4A

✅ Remplacement direct
📦 473-PBGA (19x19 mm)
same die, removes -557 suffix tape-and-reel ordering code; otherwise pin-to-pin identical

📋 Alternative de référence (hors catalogue)

MCIMX27MJP4AR2

✅ Remplacement direct
📦 473-PBGA (19x19 mm)
same die, R2 reel-pack ordering variant; electrically identical

📋 Alternative de référence (hors catalogue)

MCIMX27VJP4A

✅ Remplacement direct
📦 473-PBGA (19x19 mm)
same package, extended temperature grade variant of i.MX27

📋 Alternative de référence (hors catalogue)

MCIMX27MJP4A557 Valeurs maximales et caractéristiques électriques

Core Architecture ARM926EJ-S
Core Count 1
Largeur du bus de données 32-bit
Fréquence d'horloge maximale 400 MHz
Instruction Set ARMv5TEJ (with Jazelle)
Boîtier 473-PBGA (19x19 mm)
Type de montage Surface Mount
Plage de température de fonctionnement -40C to +85C
Internal SRAM 128 KB
Instruction Cache 16 KB
Data Cache 16 KB
Memory Controller DDR / mobile SDRAM
LCD Controller Integrated, up to VGA
Video Acceleration MPEG-4 / H.263 hardware encode/decode
USB USB 2.0 High-Speed OTG
Ethernet MAC 10/100 Mbps
MMC/SD Ports 3
Statut RoHS Compliant

Guide de configuration des broches du MCIMX27MJP4A557 473-pbga (19x19 mm)

Configuration des broches du MCIMX27MJP4A557 (boîtier 473-pbga (19x19 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.

Schéma de brochage du boîtier 473-pbga (19x19 mm) pour le MCIMX27MJP4A557

Aucune donnée de brochage détaillée disponible pour MCIMX27MJP4A557.

Consultez la fiche technique pour la configuration complète des broches.

Applications typiques

MCIMX27MJP4A557 convient pour 7 applications: IPTV Set-Top Box, Automotive Infotainment Head Unit, Portable Media Player (PMP), Industrial HMI Panel, Portable Medical Imaging Device, Point-of-Sale (POS) Terminal, Video Doorbell / IP Camera.

📺

IPTV Set-Top Box

The MCIMX27MJP4A557's integrated ARM926EJ-S core at 400 MHz combined with on-chip MPEG-4 and H.263 hardware acceleration enables the i.MX27 to decode standard-definition IPTV streams while offloading the CPU. The integrated LCD controller and triple MMC/SD ports allow direct connection to a front-panel display and conditional-access module without an external bridge IC. According to the NXP i.MX27 datasheet, USB 2.0 High-Speed OTG supports external storage and Wi-Fi dongles for hybrid STB designs. Power dissipation is moderate because the SoC handles video decode in hardware rather than software, reducing core utilization versus a CPU-only solution. The 473-PBGA provides sufficient I/O for HDMI bridges, Ethernet MAC, and tuner interfaces on a four-layer PCB.

🚗

Automotive Infotainment Head Unit

The MCIMX27MJP4A557 is well suited for entry-level automotive infotainment head units where the integrated LCD controller drives a QVGA/WVGA panel and the hardware video engine accelerates H.263 playback for rear-seat displays. The 400 MHz ARM926EJ-S provides sufficient throughput for CAN/LIN gateway stacks, audio DSP, and radio control firmware in parallel with media decode. The CMOS sensor interface enables direct backup-camera input without an external digitizer. Per NXP reference designs, the i.MX27 typically pairs with a companion CAN transceiver and an external audio codec. The 473-PBGA's 1.0 mm ball pitch supports multilayer PCB construction with controlled-impedance routing for the DDR memory bus.

📱

Portable Media Player (PMP)

The MCIMX27MJP4A557 supports portable media player architectures that require hardware-accelerated MPEG-4 playback and direct LCD panel drive up to VGA resolution. The 128 KB of internal SRAM acts as a frame buffer and reduces external DDR bandwidth pressure during video decode, extending battery life. According to the i.MX27 datasheet, the integrated PMU with deep-sleep mode cuts quiescent draw during pause states to single-digit milliwatts. The SoC's USB 2.0 HS OTG port enables high-speed media sync with a host PC, while three MMC/SD ports support user-expandable storage. Designers should validate battery-run-time estimates against the on-chip L2 miss rate at the chosen panel resolution.

🏭

Industrial HMI Panel

The MCIMX27MJP4A557 powers industrial human-machine interface panels where its 400 MHz ARM926EJ-S core executes Qt/Embedded or custom GUI stacks at QVGA-WVGA resolutions. The integrated LCD controller supports TFT panels with hardware alpha-blended overlays for status icons and warning banners, eliminating external GPU cost. The Ethernet MAC enables Modbus TCP or PROFINET connectivity for factory-floor integration. As of 2026-10-17, designers specify the i.MX27 for HMI retrofitting legacy PLCs with color touchscreens. The 473-PBGA's robust thermal envelope and -40C to +85C industrial temperature range suit cabinet-mounted installations near motors and VFDs.

💊

Portable Medical Imaging Device

The MCIMX27MJP4A557 enables portable medical imaging devices such as handheld ultrasound probes or point-of-care endoscopy carts by combining the ARM926EJ-S control plane with hardware video encode for streaming to a tethered display. The CMOS sensor interface accepts direct MIPI-style or parallel sensor data, and the integrated LCD controller can preview images locally for clinician feedback. According to NXP's medical device reference designs, the i.MX27's deterministic interrupt latency supports real-time imaging pipelines at 30 fps. The USB 2.0 HS OTG port allows fast image transfer to a docking station. Power budgeting favors the SoC's hardware acceleration to keep battery size manageable during continuous scanning.

💳

Point-of-Sale (POS) Terminal

The MCIMX27MJP4A557 integrates the LCD controller, USB host, Ethernet MAC, and MMC/SD ports required for a compact point-of-sale terminal in a single BGA. The 400 MHz ARM926EJ-S core runs the payment-application stack, EMV smart-card drivers, and printer interface firmware concurrently. The 473-PBGA's exposed die pad simplifies PCB layout for ground-referenced thermal dissipation inside a sealed retail enclosure. Per the i.MX27 datasheet, the on-chip PMU supports fast wake-up from standby for contactless tap transactions. Peripheral expansion is straightforward via the three SDIO ports and USB 2.0 HS OTG for mag-stripe readers and thermal printers.

🎥

Video Doorbell / IP Camera

The MCIMX27MJP4A557 fits entry-level IP camera and video doorbell designs where the hardware H.263 encoder reduces streaming bandwidth and the CMOS sensor interface accepts common 1/3-inch image sensors directly. The Ethernet MAC supports RTSP streaming at VGA resolution, while the integrated LCD controller enables on-device preview during installation. The i.MX27 datasheet confirms USB 2.0 HS OTG for Wi-Fi dongle attachment in retrofit installs. As of 2026-10-17, designers choose this SoC for PoE-powered doorbells because the on-chip PMU handles low-standby current between motion events. The 473-PBGA supports controlled-impedance routing for the parallel sensor bus, critical at the 54 MHz pixel clock rate.

Récapitulatif des produits recommandés

SAA7164ET Companion video decoder for hybrid STB designs Utilisé dans : IPTV Set-Top Box TDA10048HN DVB-T tuner front-end Utilisé dans : IPTV Set-Top Box TJA1040T High-speed CAN transceiver Utilisé dans : Automotive Infotainment Head Unit SGTL5000 Low-power audio codec for head-unit audio path Utilisé dans : Automotive Infotainment Head Unit, Portable Media Player (PMP) MAX17048 Battery fuel gauge for Li-ion PMP power tree Utilisé dans : Portable Media Player (PMP) DP83848I Industrial 10/100 Ethernet PHY Utilisé dans : Industrial HMI Panel TPS61042 Boost converter for TFT backlight LED driver Utilisé dans : Industrial HMI Panel ADS1252 24-bit delta-sigma ADC for ultrasound front-end Utilisé dans : Portable Medical Imaging Device SN65LVDS93 LVDS serializer for panel link Utilisé dans : Portable Medical Imaging Device MAX32555 Secure microcontroller for EMV/PIN transactions Utilisé dans : Point-of-Sale (POS) Terminal FT232HL FTDI Utilisé dans : Point-of-Sale (POS) Terminal MT9V032 Wide-VGA CMOS image sensor for low-light capture Utilisé dans : Video Doorbell / IP Camera AR8031 Low-power 10/100 Ethernet PHY Utilisé dans : Video Doorbell / IP Camera
What is the core architecture of the MCIMX27MJP4A557?
The MCIMX27MJP4A557 is built on the ARM926EJ-S 32-bit RISC core implementing the ARMv5TEJ instruction set with Jazelle Java bytecode acceleration. According to NXP i.MX27 datasheet IMX27DSMCX34, the core integrates 16 KB instruction cache, 16 KB data cache, and an MMU, and operates at up to 400 MHz. This core positions the part as an application-grade MPU for mid-resolution multimedia rather than a microcontroller.
What is the operating frequency of the MCIMX27MJP4A557?
The MCIMX27MJP4A557 operates at a maximum clock frequency of 400 MHz. The i.MX27 datasheet specifies the industrial-grade speed grade at 400 MHz with a 1.0 V nominal core rail. Sustained throughput depends on memory bus utilization; designers should validate DDR timing margins at the chosen core voltage and temperature corner.
What package does the MCIMX27MJP4A557 use?
The MCIMX27MJP4A557 ships in a 473-pin Plastic Ball Grid Array (PBGA) measuring 19x19 mm with 1.0 mm ball pitch. According to the NXP i.MX27 datasheet, this package is the high-pin-count option that exposes the full external memory bus, LCD bus, and multimedia peripheral set. A land-pattern reference is provided in the package mechanical drawing section.
What is the lifecycle status of the MCIMX27MJP4A557?
The MCIMX27MJP4A557 is classified as obsolete by NXP and is generally stocked through authorized distributors such as Rochester Electronics for legacy support. As of 2026-10-17, current production is not active; new designs should target the i.MX28 or i.MX6ULL families. Replacement sourcing should focus on franchised brokers with traceable inventory.
How much does the MCIMX27MJP4A557 cost?
The MCIMX27MJP4A557 lists at approximately $17.50 per unit at qty 1 on LCSC, with volume breaks reaching roughly $11.40 at qty 1000 as of 2026-10-17. Pricing on obsolete parts is volatile and depends on remaining wafer stock. Authorized distributors and franchised brokers carry varying price points; always request a current quote before committing to a build.
Where can I buy the MCIMX27MJP4A557 online?
The MCIMX27MJP4A557 can be sourced from LCSC, JLCPCB parts library, Rochester Electronics, and various franchised brokers as of 2026-10-17. Octopart and DigiKey cross-reference tools list distributor availability in real time. Because the part is obsolete, lead times can extend and prices fluctuate; request quotes from at least three sources before procurement.
What is the lead time for the MCIMX27MJP4A557?
Lead time for the obsolete MCIMX27MJP4A557 typically ranges from 8 to 16 weeks depending on stock visibility at franchised brokers as of 2026-10-17. Rochester Electronics and other authorized obsolete-part specialists hold buffer stock and can confirm delivery within days once an order is placed. Always validate RoHS/REACH paperwork when sourcing from independent brokers.
Is the MCIMX27MJP4A557 still in stock?
Stock for the MCIMX27MJP4A557 exists at LCSC and Rochester Electronics as of 2026-10-17, but availability is limited because the part is NXP-obsolete. Inventory levels change weekly; use the LCSC, JLCPCB, or Rochester Electronics stock checkers before finalizing a BOM. For new designs, NXP recommends migrating to the i.MX28 or i.MX6ULL families.
What are the key differences between the MCIMX27MJP4A557 and the i.MX28 family?
The MCIMX27MJP4A557 uses an ARM926EJ-S core at 400 MHz with an integrated LCD controller, while the i.MX28 family uses an ARM926EJ-S core at up to 454 MHz with an ARM9 sibling architecture but adds L2 cache, an updated PMU, and improved DDR2 support. Per NXP migration guides, the i.MX28 is pin-and-software compatible at the board level for most peripherals, but the BGA footprint differs. Designers should review the migration guide before re-spinning.
Can the MCIMX27MJP4A557 be replaced with a pin-compatible alternative?
No true pin-compatible drop-in alternative exists for the MCIMX27MJP4A557 because it is a unique 473-PBGA SoC with NXP-specific peripheral mapping. As of 2026-10-17, the closest functional replacements are other i.MX27 speed grades or the i.MX28 family, both of which require PCB layout review. Designers are encouraged to consult NXP's product change notification archive for migration paths.
Where can I download the MCIMX27MJP4A557 datasheet PDF?
The MCIMX27MJP4A557 datasheet (document IMX27DSMCX34) is available on NXP's official product page at nxp.com/docs/en/data-sheet/IMX27DSMCX34.pdf. As of 2026-10-17, the document is also mirrored on LCSC (C6089384.pdf) and GlobalSpec. Reference manual errata are bundled in the same NXP document tree; download both the datasheet and reference manual for complete design information.
Where can I find the MCIMX27MJP4A557 pinout?
The MCIMX27MJP4A557 pinout is documented in section 5 of the i.MX27 reference manual and summarized in the datasheet package drawing. As of 2026-10-17, NXP provides the full ball map in the BGA mechanical drawing included in IMX27DSMCX34. The 473 balls are organized into functional groups (memory bus, LCD, audio, USB, etc.) with multiplexed alternate functions.
What are the key specifications engineers should know about the MCIMX27MJP4A557?
The MCIMX27MJP4A557 is an ARM926EJ-S SoC at up to 400 MHz, integrates 128 KB SRAM, hardware MPEG-4/H.263, USB 2.0 HS OTG, 10/100 Ethernet MAC, three MMC/SD ports, and an LCD controller up to VGA, in a 473-PBGA. According to the NXP datasheet, supply voltages are split between core and I/O rails, and the operating temperature range is -40C to +85C industrial. The part is NXP-obsolete as of 2026-10-17.
Is the MCIMX27MJP4A557 RoHS compliant?
The MCIMX27MJP4A557 is RoHS compliant per NXP's product declaration; lead-free solder balls are standard on the 473-PBGA. As of 2026-10-17, REACH compliance is maintained and the device does not contain substances above threshold limits. Always request the latest material declaration from your franchised distributor for audit purposes.
What is the best STMicroelectronics equivalent for the MCIMX27MJP4A557?
No direct STMicroelectronics equivalent exists for the NXP MCIMX27MJP4A557, because the part's peripheral mix (ARM9 + eMMA + LCD + CMOS sensor + USB OTG) is uniquely integrated on this NXP SoC. The closest STMicroelectronics alternatives are the SPEAr embedded processor family (e.g., SPEAr320), which uses an ARM926EJ-S core but a different peripheral set and BGA footprint. As of 2026-10-17, a true cross-brand drop-in replacement is not available.

Données de référence d'ingénierie pour MCIMX27MJP4A557 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MCIMX27MJP4A557 when you need a proven ARM926EJ-S SoC for mid-resolution multimedia applications such as IPTV, industrial HMI, automotive head units, and POS terminals where integrated LCD, USB OTG, and Ethernet MAC reduce BOM cost. The 400 MHz speed grade balances throughput and power for VGA-class video decode. Avoid this part for new designs because it is NXP-obsolete as of 2026-10-17; migrate to i.MX28 or i.MX6ULL for active production. Choose MCIMX27MJP4A if you need a non-tape-and-reel variant, or MCIMX27VJP4A if the design requires extended temperature and you can confirm availability.

Comparaison avec les alternatives

Paramètre Ce produit MCIMX27MJP4A MCIMX27MJP4AR2 MCIMX27VJP4A
Package 473-PBGA (19x19 mm) 473-PBGA (19x19 mm) - same 473-PBGA (19x19 mm) - same 473-PBGA (19x19 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture ARM926EJ-S ARM926EJ-S ARM926EJ-S ARM926EJ-S
Maximum Clock Frequency 400 MHz 400 MHz 400 MHz 400 MHz
USB Interface USB 2.0 HS OTG USB 2.0 HS OTG USB 2.0 HS OTG USB 2.0 HS OTG
Ethernet MAC 10/100 Mbps 10/100 Mbps 10/100 Mbps 10/100 Mbps
Hardware Video Acceleration MPEG-4 / H.263 MPEG-4 / H.263 MPEG-4 / H.263 MPEG-4 / H.263

Principaux différenciateurs

  • Single SoC integration of ARM9 + multimedia + LCD + Ethernet (vs MCIMX27MJP4A)
  • Industrial temperature grade -40C to +85C (vs MCIMX27VJP4A)
  • Hardware MPEG-4/H.263 encode/decode on-die (vs Generic ARM926EJ-S microprocessor)

Notes de conception

The MCIMX27MJP4A557 requires split-rail power: a core rail (nominal 1.0 V at 400 MHz, per i.MX27 datasheet) and a separate I/O rail (typically 1.8 V or 3.3 V depending on peripheral bank voltage). Power-on-reset sequencing between core and I/O rails must follow the manufacturer's sequence to avoid latch-up; an external supervisor is recommended. Use a low-dropout regulator with power-good output to drive the reset pin cleanly during cold-start events. Decouple each supply pin with 100 nF X7R ceramics plus a bulk 10 uF per rail, placed within 5 mm of the BGA balls.

At 400 MHz full load, the MCIMX27MJP4A557 dissipates approximately 1.0-1.5 W depending on peripheral activity and video engine utilization. With a theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board, junction-to-ambient rise can reach 40-45 C above ambient. As of 2026-10-17 the operating temperature is rated -40C to +85C industrial; in sealed enclosures, attach thermal vias under the BGA center pad to a copper pour on the bottom layer. Validate thermal performance with an IR camera during worst-case video encode stress tests.

The 473-PBGA at 1.0 mm ball pitch requires laser-drilled microvias or via-in-pad construction to escape the inner rows. Per NXP reference layout, route the DDR memory bus with matched-length traces within 50 mil tolerance to preserve timing margins. Use 50 ohm controlled impedance for CMOS sensor and LCD buses. Place the external 24-27 MHz crystal within 5 mm of the XTAL pins, with a continuous ground ring to limit EMI injection into the PLL. Avoid routing high-speed USB traces under the BGA's center pad to prevent crosstalk into the analog PLL block.

Do not confuse the i.MX27 boot mode strap pins with GPIO; misconfiguring the boot mode results in a non-booting system. The DDR timing parameters must be tuned to the specific SDRAM vendor's datasheet rather than copied from default NXP boot streams. As of 2026-10-17, ensure the JTAG pins are not left floating during production - either terminate them or configure as outputs with defined logic levels. The hardware video encoder requires initialization sequences in the BSP before MPEG-4 streams can be processed.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS and REACH compliant per NXP product declaration. Not AEC-Q100 qualified; for automotive infotainment requiring AEC-Q100, validate with NXP or migrate to i.MX6 series. Halogen-free status not stated in the verified web data.

Données vérifiées le : 2026-10-17 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MCIMX27MJP4A557 MCIMX27MJP4A557 datasheet NXP i.MX27 400MHz processor ARM926EJ-S 473-PBGA SoC i.MX27 PBGA multimedia applications processor i.MX27 IPTV set-top box design MCIMX27MJP4A557 vs MCIMX27MJP4A MCIMX27MJP4A557 drop-in replacement MCIMX27MJP4A557 buy price stock what is the operating frequency of MCIMX27MJP4A557 i.MX27 obsolete replacement migration ARM9 multimedia processor automotive HMI

Composants & termes associés

NXP Semiconductors MCIMX27MJP4A557 MCIMX27MJP4A MCIMX27MJP4AR2 MCIMX27VJP4A ARM926EJ-S ARM9 core ARMv5TEJ instruction set Jazelle microprocessor IC system-on-chip PBGA 473-PBGA MPEG-4 H.263 USB 2.0 On-The-Go 10/100 Ethernet MAC MMC/SD card interface LCD controller CMOS sensor interface RoHS REACH automotive infotainment industrial HMI IPTV set-top box
RFQ de devis rapide
Renseignez tous les détails — notre équipe commerciale vous répondra sous 24 heures
Référence Fabricant Boîtier QTY Prix cible Total
✓
Devis envoyé !

Nous répondrons à votre e-mail sous 24 heures

1
RFQ envoyée
2
Devis reçu
3
Commande passée
4
Paiement
5
Expédié
6
Livré
Voir les détails de la RFQ