MCIMX353DVM5B - i.MX35 ARM1136JF-S MPU 532MHz | MAPBGA-400
Référence : MCIMX353DVM5B ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.25 | $24,25 |
| 10 | $22.1 | $221,00 |
| 100 | $19.85 | $1 985,00 |
| 500 | $17.4 | $8 700,00 |
| 1 000 | $15.2 | $15 200,00 |
MCIMX353DVM5B Présentation
An ARM11-based microprocessor (MPU) is a 32-bit RISC applications processor that executes an ARM instruction set, runs an operating system such as Linux or Windows Embedded, and provides hardware peripherals including memory controllers, display interfaces, and connectivity blocks. The i.MX35 sits in the system hierarchy as MPU -> applications processor -> microcontroller -> semiconductor; ARM11 represents an early generation of superscalar ARM cores bridging ARM9 and Cortex-A series. The MCIMX353DVM5B is the specific speed grade and feature subset within the broader i.MX35 family.
Key features include a 532 MHz ARM1136JF-S core with Jazelle Java acceleration, 96 general-purpose I/O lines, a 128 KB SRAM internal memory footprint, and integrated multimedia blocks for camera, LCD, and video processing. The external oscillator interface supports a wide range of system clocking topologies. The 400-ball MAPBGA package at 0.8 mm pitch supports fine-line PCB manufacturing and provides sufficient I/O density for LPDDR, NAND flash, and parallel display buses. Operating temperature is rated for industrial-grade deployments.
The MCIMX353DVM5B uses an ARM1136JF-S superscalar pipeline with separate I/D caches, MMU support for full operating systems (Linux, WinCE), and integrated peripherals including an LCD controller, CMOS sensor interface, USB 2.0 with PHY, and three MMC/SD ports. The device targets industrial-grade reliability with extended temperature support and long-life-cycle supply typical of NXP's i.MX application processor line.
Typical applications include industrial HMI panels, automotive infotainment prototypes, medical patient monitors, point-of-sale terminals, factory automation controllers, and connected IP cameras. The combination of ARM11 performance with integrated multimedia peripherals enables compact single-board designs without external co-processors.
When designing with the MCIMX353DVM5B, ensure the PCB supports all 400 balls of the MAPBGA and that DDR memory routing follows length-matched guidelines. A multi-layer PCB with dedicated ground planes is recommended because the device has mixed-signal analog blocks sensitive to power-rail noise.
This page synthesizes distributor pricing, parametric alternatives, BGA package details, and design notes not collocated on the manufacturer datasheet to support embedded engineers selecting a 532 MHz ARM11 applications processor.
Alternatives de remplacement direct pour MCIMX353DVM5B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCIMX353DVM5B (même facteur de forme et même empreinte) — différant par Core Architecture, Program Memory Type, Manufacturer.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCIMX353CVM5B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX357CJQ5C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX353DVM5B Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | i.MX35 |
| Core Processor | ARM1136JF-S |
| Core Architecture | ARM11 (32-bit RISC) |
| Fréquence d'horloge maximale | 532 MHz |
| Number of Cores | 1 |
| Internal SRAM | 128 KB |
| Program Memory Type | ROMless (external memory required) |
| Number of I/O | 96 |
| Boîtier | 400-LFBGA (MAPBGA), 17x17 mm, 0.8 mm pitch |
| Type de montage | Surface Mount |
| Oscillator Type | External |
| Packaging | Tray |
| Statut RoHS | Compliant (per distributor listing) |
Guide de configuration des broches du MCIMX353DVM5B 400-lfbga (mapbga), 17x17 mm, 0.8 mm pitch
Configuration des broches du MCIMX353DVM5B (boîtier 400-lfbga (mapbga), 17x17 mm, 0.8 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCIMX353DVM5B.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCIMX353DVM5B convient pour 6 applications: Industrial Human-Machine Interface (HMI) Panels, Automotive Infotainment Prototypes, Medical Patient Monitoring Displays, Point-of-Sale (POS) Terminals, Factory Automation Controllers, Connected IP Cameras and Surveillance.
Industrial Human-Machine Interface (HMI) Panels
The NXP MCIMX353DVM5B fits industrial HMI panels because its ARM1136JF-S core at 532 MHz provides enough throughput to render graphical user interfaces on integrated LCD controllers while managing serial fieldbus or Ethernet connectivity to PLCs. The i.MX35 family integrates an LCD controller, CMOS sensor interface, and USB 2.0 with PHY, eliminating the need for separate graphics or connectivity co-processors. Compared to lower-MHz ARM9 parts, the 532 MHz ARM11 core delivers 1.5-2x the rendering performance, supporting smoother touch response on operator panels. Power consumption stays within industrial thermal budgets when clock-gating unused peripherals.
Recommandé
Automotive Infotainment Prototypes
The MCIMX353DVM5B suits automotive infotainment prototypes because the i.MX35 platform integrates display, audio, and connectivity peripherals required for head-unit demo systems. Operating temperatures extend to industrial-grade ranges typically sufficient for cabin-mounted prototypes. Compared with external processor + companion chip designs, a single i.MX35 MPU reduces PCB area and BOM cost, accelerating prototype iteration. However, for production automotive deployment consult NXP's automotive-qualified i.MX variants rather than the standard MCIMX353DVM5B commercial/industrial grade.
Recommandé
Medical Patient Monitoring Displays
The MCIMX353DVM5B is suitable for medical patient monitoring display systems requiring a deterministic 32-bit processor with industrial temperature tolerance and reliability. The integrated LCD controller drives bedside monitor panels directly; USB 2.0 supports connectivity to bedside sensors and nurse-call systems. The ARM1136JF-S core executes real-time waveform rendering at sufficient frames-per-second for vitals display, while ROMless boot enables secure firmware loading for medical-device certification pathways. Long-life-cycle supply typical of NXP i.MX parts eases regulatory re-submission cycles.
Recommandé
Point-of-Sale (POS) Terminals
The NXP MCIMX353DVM5B fits point-of-sale terminals because the integrated ARM11 core at 532 MHz handles payment-application stacks, customer-facing display rendering, and receipt-printer coordination from a single chip. The 96 GPIO count accommodates barcode scanner, magnetic-stripe reader, and cash-drawer interfaces without external I/O expanders. Compared to discrete microcontroller + external graphics approaches, the i.MX35 reduces total part count and supports Linux-based payment frameworks out of the box.
Recommandé
Factory Automation Controllers
The MCIMX353DVM5B fits factory automation controllers because the i.MX35 platform combines an ARM1136JF-S core running Linux with industrial peripheral mix including Ethernet, USB, and serial interfaces. Determinism is achieved by running control loops on the dedicated hardware timers while Linux handles HMI and networking. Compared with MCU-only designs, the MPU class compute supports OPC-UA, MQTT, and on-device analytics workloads typical of Industry-4.0 retrofit controllers. The 400-MAPBGA package supports dense multi-layer PCB layouts common in DIN-rail-mounted controllers.
Recommandé
Connected IP Cameras and Surveillance
The MCIMX353DVM5B suits connected IP cameras because the integrated CMOS sensor interface accepts direct camera input, while the 532 MHz ARM11 core runs on-device video encoding (H.264 baseline) without external DSP. The integrated Ethernet MAC and USB 2.0 provide network and storage connectivity; the industrial temperature range supports outdoor deployments. Compared with separate sensor-processor designs, the i.MX35 reduces BOM and accelerates time-to-market for surveillance OEMs. Caveat: end-of-life status requires lifetime-buy planning for new surveillance product launches.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCIMX353DVM5B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCIMX353CVM5B | MCIMX357CJQ5C |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-LFBGA (MAPBGA) 17x17 mm | 400-LFBGA (MAPBGA) - same family, verify pin-by-pin | 400-MAPBGA - same family, verify pin-by-pin |
| Core | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S (i.MX357 variant) |
| Program Memory Type | ROMless | ROMless | ROMless |
| Lifecycle Status | End of Life (NXP PCN issued) | End of Life (same family) | Likely EOL (same product family) |
Principaux différenciateurs
- Highest published speed grade in the MCIMX353 family (vs MCIMX353CVM5B)
- Greater multimedia integration vs base i.MX353 (vs MCIMX357CJQ5C)
- Mature NXP/Freescale documentation and Linux BSP support (vs Generic ARM11 MPUs)
Notes de conception
The 400-MAPBGA package dissipates significant heat in continuous-load industrial workloads. Estimated: at Vcore=1.4V and 532 MHz CPU utilization near 70%, power dissipation is approximately 1.0-1.5W depending on peripheral activity. Apply a multi-layer PCB with at least 4 dedicated ground/power planes and a thermal via array under the exposed pad region to keep junction temperature below 100C in industrial environments. Avoid placing the MPU directly above heat-generating power components.
The 0.8 mm ball pitch MAPBGA requires PCB fabrication with microvia (laser-drilled) technology, stacked vias, or via-in-pad constructions to fan out the 400 balls to escape routes. Use a 6-layer stack-up with a dedicated ground plane and a 1.2-1.6 mm BGA escape region. Decoupling requires 100nF X7R capacitors placed within 2 mm of each power-supply ball group, plus bulk 10uF tantalum or ceramic caps adjacent to the MPU.
Because the MCIMX353DVM5B is NXP EOL, do not begin a new product design without a written longevity commitment from NXP or an authorized distributor. Maintain a lifetime-buy inventory strategy: secure 2-3x annual deployment volume plus a 12-month safety margin at end-of-life announcement. Always validate boot-mode pin strapping against the i.MX35 reference manual before PCB tape-out because MPU boot configuration is non-recoverable after assembly.
Informations de conformité
RoHS compliance confirmed by distributor listings (DigiKey, Mouser, LCSC). REACH status inferred from NXP corporate compliance program. AEC-Q100 not applicable - this is a commercial/industrial grade MPU; for automotive deployment use NXP's automotive-qualified i.MX variants. End-of-life status per NXP product page PCN/Discontinuance notice.
