MCIMX355AVM5B - i.MX35 ARM1136 MPU 532MHz MAPBGA-400 | NXP
Référence : MCIMX355AVM5B ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $29.8 | $298,00 |
| 100 | $26.4 | $2 640,00 |
| 500 | $23.2 | $11 600,00 |
| 1 000 | $20.1 | $20 100,00 |
MCIMX355AVM5B Présentation
An applications microprocessor (MPU) is a high-integration system-on-chip that combines a CPU core, memory controllers, graphics accelerators, and a rich set of peripheral IP into a single device. Within the embedded taxonomy, the i.MX35 family sits between microcontroller units (MCUs) and full application processors, offering 32-bit processing headroom, an MMU for full OS support (Linux, WinCE), and dedicated multimedia engines that an MCU cannot economically provide. Compared to a discrete CPU-plus-glue-logic implementation, an i.MX35 MPU reduces BOM count, simplifies PCB layout, and shortens time-to-market for connected multimedia products.
Key features of the MCIMX355AVM5B include the ARM1136JF-S core with Jazelle and SIMD extensions, hardware-accelerated image processing, an integrated LCD controller, dual CAN controllers for industrial networking, and a wide peripheral set covering USB, Ethernet, MMC/SD, I2C, SPI, and UART. The integrated ESAI, SPDIF, and ASRC blocks enable hardware audio mixing without taxing the CPU. Memory interface supports DDR/DDR2 and mobile DDR, with NAND flash controller including ECC for reliable boot from managed or raw flash.
The i.MX35 architecture pairs the ARM11 core with a multi-layer bus matrix, allowing simultaneous data movement between the IPU, peripherals, and external memory without starving the CPU. The integrated IPU performs scaling, color conversion, de-interlacing, and rotation in hardware, freeing the ARM core for application logic. Hardware security features include secure boot, OTP fuse bank, and run-time integrity checks suitable for tamper-resistant automotive HMI products.
Typical applications for the MCIMX355AVM5B include automotive infotainment and cluster HMI, industrial HMI panels, point-of-sale (POS) and kiosk terminals, portable media players, and medical imaging displays. Its combination of 532 MHz performance, low BOM cost, and integrated image/audio blocks makes it a strong fit for cost-sensitive multimedia products where an MCU is too small but a high-end application processor is overkill.
When designing with this part, ensure the 17x17 mm MAPBGA land pattern is fabricated with 0.8 mm pitch and that the PCB stackup supports DDR2 trace impedance. Decouple each power rail close to the balls with 100 nF X7R plus bulk ceramic, and follow NXP reference design guidelines for the clock, reset, and boot-mode strapping. Industrial temperature grade is factory-set in the M5B suffix; verify the full operating range against your enclosure thermal design.
Alternatives de remplacement direct pour MCIMX355AVM5B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCIMX355AVM5B (même facteur de forme et même empreinte) — différant par Core Architecture, Program Memory Type, Manufacturer.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCIMX355AJQ5C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX357DVM5B
✅ Remplacement direct✓ En stock
$17.5 / unité
Voir la fiche technique →MCIMX351AVM5B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX353DVM5B
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →MCIMX355AVM5B Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Part Family | i.MX35 |
| Core Architecture | ARM1136JF-S (32-bit) |
| Maximum CPU Clock | 532 MHz |
| Package Type | MAPBGA (LFBGA) |
| Pin/Ball Count | 400 |
| Package Dimensions | 17 mm x 17 mm |
| Ball Pitch | 0.8 mm |
| Number of I/O | 96 |
| RAM Size (on-chip) | 128 KB |
| Program Memory Type | ROMless |
| Oscillator Type | External |
| Temperature Grade | Industrial |
| Integrated IP | IPU, ESAI, SPDIF, ASRC, LCD controller, dual CAN, USB, Ethernet |
| Memory Interface | DDR/DDR2/mobile DDR, NAND with ECC |
| Packaging | Tray |
Guide de configuration des broches du MCIMX355AVM5B 17 mm x 17 mm
Configuration des broches du MCIMX355AVM5B (boîtier 17 mm x 17 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCIMX355AVM5B.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCIMX355AVM5B convient pour 7 applications: Automotive Infotainment HMI, Industrial HMI Panels, Point-of-Sale Terminals, Portable Media Players, Medical Imaging Displays, Kiosk and Digital Signage, Connected IoT Edge Gateways.
Automotive Infotainment HMI
The MCIMX355AVM5B's 532 MHz ARM1136JF-S core plus integrated Image Processing Unit handle 720p H.264 decode, JPEG acceleration, and LCD panel driving up to WVGA without external companion chips. The ESAI/SPDIF/ASRC blocks deliver 5.1 audio mixing for head-unit designs, while dual CAN 2.0B controllers interface with the vehicle bus. The 400-ball MAPBGA in industrial temperature grade fits behind a 7-inch touch panel in entry-level dash HMI products.
Recommandé
Industrial HMI Panels
In factory-floor operator panels, the MCIMX355AVM5B runs Linux/WinCE on its 532 MHz ARM core, drives a resistive or projected-capacitive touch display through the integrated LCD controller, and serves industrial Ethernet via the on-chip MAC. The integrated image processing enables on-monitor video playback for machine-status dashboards. The 17x17 mm 400-ball MAPBGA simplifies EMI containment inside a sealed metal enclosure.
Recommandé
Point-of-Sale Terminals
POS terminals benefit from the MCIMX355AVM5B's multimedia acceleration: the IPU handles signature capture and barcode scanner video preview, while the ESAI/SPDIF block drives audio prompts during checkout. The ARM1136 core runs payment applications under Linux with the MMU enforcing process isolation. Industrial temperature grade supports deployment in semi-outdoor kiosk environments such as QSR drive-through lanes.
Recommandé
Portable Media Players
Portable media players leverage the MCIMX355AVM5B's hardware audio mixing: ESAI multiplexes multiple audio streams, SPDIF outputs to external DACs, and ASRC resamples compressed content to the headphone rate. The IPU offloads video decode, freeing the ARM core for UI rendering. Low BOM count (no external audio DSP) keeps portable players in the entry-level price tier.
Recommandé
Medical Imaging Displays
Diagnostic and patient-monitoring displays use the MCIMX355AVM5B to drive high-resolution LCD panels through the integrated LCD controller, while the IPU applies real-time color-space conversion and gamma correction for medical imaging accuracy. The ARM1136 MMU enables secure partitioning between the clinical UI and the diagnostic viewer. Industrial temperature grade supports deployment in clinical settings with regulated thermal envelopes.
Recommandé
Kiosk and Digital Signage
Kiosk and digital signage designs rely on the MCIMX355AVM5B's 532 MHz performance to render full-screen marketing video, while the IPU accelerates H.264 decode at 720p. The integrated Ethernet MAC streams content updates over the network, and the NAND controller with ECC boots from local flash without a hard disk. The 400-ball MAPBGA is suited to slim kiosk enclosures with constrained thermal dissipation.
Recommandé
Connected IoT Edge Gateways
IoT edge gateways use the MCIMX355AVM5B as a protocol-conversion hub: the ARM1136 core runs Linux with MQTT/Modbus stacks, the integrated Ethernet MAC and USB 2.0 ports aggregate upstream connectivity, and the ESAI/SPDIF blocks serve as analog audio notification channels. Industrial temperature grade supports outdoor enclosure operation, while the 400-ball MAPBGA delivers thermal headroom for fanless designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCIMX355AVM5B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCIMX355AJQ5C | MCIMX357DVM5B | MCIMX351AVM5B | MCIMX353DVM5B |
|---|---|---|---|---|---|
| Package | MAPBGA-400 (LFBGA 17x17 mm) | MAPBGA-400 (LFBGA 17x17 mm) - same | MAPBGA-400 (LFBGA 17x17 mm) - same | MAPBGA-400 (LFBGA 17x17 mm) - same | MAPBGA-400 (LFBGA 17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM1136JF-S | ARM1136JF-S - same | ARM1136JF-S - same | ARM1136JF-S - same | ARM1136JF-S - same |
| Max CPU Clock | 532 MHz | 532 MHz | 532 MHz | 532 MHz | 532 MHz |
| Temperature Grade | Industrial | Automotive (AEC-Q100) | Industrial | Industrial | Industrial |
| Image Processing Unit (IPU) | Yes | Yes | Yes (dual-display capable) | Yes | No |
| ESAI/SPDIF/ASRC Audio | Yes | Yes | Yes | Limited | Yes |
| On-chip SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
Principaux différenciateurs
- Full IPU + ESAI/SPDIF/ASRC audio subsystem in the 400-ball MAPBGA (vs MCIMX353DVM5B)
- Industrial temperature grade for cost-sensitive HMI (vs MCIMX355AJQ5C)
- Stable, long-life i.MX35 silicon compared to newer i.MX6/i.MX8 (vs NXP i.MX6ULL)
Notes de conception
Estimated: The 400-ball MAPBGA at 0.8 mm pitch requires a 4-layer PCB minimum with 0.2 mm via-in-pad (VIP) microvias under the BGA and matched 50 ohm controlled impedance for the DDR2 traces. The 17x17 mm land pattern is densely populated; route all signal escape on the top layer first, then break out inner rows on layers 3-4. Follow the NXP i.MX35 reference design package for the exact stackup and decoupling scheme.
Estimated: At 532 MHz core clock the i.MX355 dissipates approximately 0.7-1.0 W depending on peripheral enable. Provide a 4-layer power plane dedicated to the core rail and a separate plane for the DDR2 I/O rail, with at least six 100 nF X7R decoupling capacitors placed under the BGA plus 10 uF bulk ceramic within 5 mm. Use a low-dropout regulator such as TPS54331 for the 1.2 V core and a separate switching regulator for the 1.8 V DDR2 rail.
Estimated: Industrial temperature grade M5B suffix requires the junction temperature stay below 100 C for reliable operation. With 1 W dissipation in a 400-ball MAPBGA (theta_JA typically 25-30 C/W on a 4-layer JEDEC board), the ambient envelope can reach 70 C without active cooling. For sealed kiosk enclosures with no airflow, add a copper coin or thermal pad under the package center to spread heat into the PCB.
Boot-mode strapping pins must be held at the correct logic level during the reset assertion window; incorrect boot configuration causes the i.MX35 to enter serial downloader mode instead of booting from NAND. The DDR2 calibration sequence is sensitive to PCB trace length mismatch - keep the byte-lane length matching within 25 mil. Do not omit the 32.768 kHz RTC crystal even if you do not need RTC; the system clock relies on it for warm-boot timing.
Informations de conformité
Industrial temperature grade per M5B suffix. Not AEC-Q100 qualified; choose MCIMX355AJQ5C for automotive. RoHS compliance per NXP product page.
