MCZ33287EG - Contact Monitor + Dual Low-Side Driver SOIC-20
Référence : MCZ33287EG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.92 | $4,92 |
| 10 | $4.43 | $44,30 |
| 100 | $3.94 | $394,00 |
| 500 | $3.54 | $1 770,00 |
| 1 000 | $3.15 | $3 150,00 |
MCZ33287EG Présentation
An automotive contact monitor (sometimes called a switch-contact interface IC) is a specialized power-management and signal-conditioning device that sits between the low-voltage digital domain of a microcontroller and the harsh, transient-rich electrical environment of an automobile body controller. In modern vehicles, dozens of mechanical switches (door latches, window position sensors, seat switches, headlamp controls) must be reliably debounced, level-shifted, and translated into logic-level signals that a microcontroller can read, even in the presence of conducted EMI, reverse-battery events, and load-dump transients. The category hierarchy is: contact monitor / switch interface IC -> peripheral driver -> interface IC -> power management & signal conditioning -> semiconductor.
Key features include eight configurable contact-sense inputs, two low-side protected drivers with built-in thermal shutdown, automotive-grade temperature rating, and gull-wing SO-20 leads compatible with standard reflow and wave-solder processes. The IC operates from a wide supply range and includes internal clamping and protection structures on both the inputs and outputs. Compared with discrete resistor networks and external MOSFET drivers, the MCZ33287EG collapses significant BOM count, simplifying automotive body-controller PCBs.
Internally, the contact monitor block combines programmable current sources, comparators with adjustable thresholds, and debounce timers; the dual low-side driver uses on-chip N-channel MOSFETs with thermal and short-circuit protection. The integrated protection eliminates the need for external flyback diodes on inductive loads such as relays and small solenoids, reducing both board area and BOM cost.
Typical applications include automotive body controllers reading door, window, seat, and lighting switches; HVAC control modules that need to monitor multiple contact closures; central locking and alarm systems driving relays and small actuators; and industrial PLCs where robust switch monitoring with protected outputs is required. The part was originally launched by Freescale Semiconductor, now NXP.
When designing with the MCZ33287EG, ensure adequate copper area for thermal dissipation on the low-side driver outputs (especially at full continuous current into inductive loads) and follow the datasheet recommendations for input RC filtering to suppress high-frequency EMI from automotive wiring harnesses.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers shorten sourcing and qualification cycles for automotive body-controller designs.
Alternatives de remplacement direct pour MCZ33287EG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCZ33287EG (même facteur de forme et même empreinte) — différant par Function, Operating Temperature Range, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCZ33287EFR2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCZ33287EF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC33390EFR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC33887DWBR2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.55 / unité
Voir la fiche technique →TLE7259-3GE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33287EG Spécifications
| Fonction | Contact Monitoring + Dual Low-Side Protected Driver |
| Contact Sense Inputs | 8 (switch-to-battery or switch-to-ground) |
| Low-Side Driver Outputs | 2 (internal N-channel MOSFETs) |
| Plage de température de fonctionnement | Automotive grade |
| Temperature Grade | Automotive |
| Boîtier | 20-SOIC (0.295 inch, 7.50 mm width) |
| Terminal Form | Gull Wing |
| Number of Terminals | 20 |
| Package Code | SOP |
| Package Shape | Rectangular |
| Type de montage | Surface Mount |
| Lead Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
| Architecture | Buffer or inverter-based peripheral driver |
| Internal Protection | Thermal shutdown on low-side drivers |
Configuration des broches de MCZ33287EG
| Broche 1 | IN1 — Switch-sense input 1 (switch-to-battery or switch-to-ground) |
| Broche 2 | IN2 — Switch-sense input 2 |
| Broche 3 | IN3 — Switch-sense input 3 |
| Broche 4 | IN4 — Switch-sense input 4 |
| Broche 5 | IN5 — Switch-sense input 5 |
| Broche 6 | IN6 — Switch-sense input 6 |
| Broche 7 | IN7 — Switch-sense input 7 |
| Broche 8 | IN8 — Switch-sense input 8 |
| Broche 9 | VCC — Supply voltage |
| Broche 10 | GND — Ground |
| Broche 11 | OUT1 — Low-side protected driver output 1 |
| Broche 12 | OUT2 — Low-side protected driver output 2 |
| Broche 13 | LOGIC1 — Logic interface line to host MCU |
| Broche 14 | LOGIC2 — Logic interface line to host MCU |
| Broche 15 | LOGIC3 — Logic interface line to host MCU |
| Broche 16 | LOGIC4 — Logic interface line to host MCU |
| Broche 17 | LOGIC5 — Logic interface line to host MCU |
| Broche 18 | LOGIC6 — Logic interface line to host MCU |
| Broche 19 | LOGIC7 — Logic interface line to host MCU |
| Broche 20 | LOGIC8 — Logic interface line to host MCU |
Applications typiques
MCZ33287EG convient pour 6 applications: Automotive Body Controller - Switch Monitoring, Relay and Solenoid Driver Module, HVAC Control Module Interface, Industrial PLC Switch Interface, Central Locking and Alarm System, Lighting Control Module Switch Inputs.
Automotive Body Controller - Switch Monitoring
The MCZ33287EG's eight switch-contact sense inputs make it an ideal front-end for automotive body controllers that must read dozens of mechanical switches. In a typical door module, the IC connects directly to door-latch, window-position, lock, and mirror-switch contacts and debounces/translates them into clean logic-level signals for the host MCU. Switch-to-battery and switch-to-ground configurable inputs handle both pull-up and pull-down wiring conventions, eliminating external resistor networks. Automotive temperature grade and integrated transient protection on inputs reduce field-return risk.
Recommandé
Relay and Solenoid Driver Module
The two integrated low-side protected drivers on the MCZ33287EG drive small relays, solenoids, and LED arrays directly, with on-chip thermal shutdown eliminating most discrete protection circuitry. In a central-locking or seat-control module the IC handles both the switch-monitor inputs (door switches, seat switches) and the actuator outputs (lock motors, lumbar solenoids) in a single 20-SOIC, reducing PCB area by half versus discrete solutions. The internal N-channel FETs tolerate the inductive flyback of small automotive coils without external free-wheeling diodes in most cases.
Recommandé
HVAC Control Module Interface
HVAC control modules require reading multiple mode-select, blower-speed, and temperature-switch contacts while driving small loads such as mode-door actuators and indicator lamps. The MCZ33287EG's eight contact-monitor inputs handle all of these signals in one IC, while the two low-side drivers can directly switch the mode-door actuator and a status LED. Automotive-grade temperature rating and integrated protection on both inputs and outputs meet the harsh under-dash thermal environment, reducing warranty exposure versus discrete designs.
Recommandé
Industrial PLC Switch Interface
Although designed for automotive, the MCZ33287EG's robust input structure and protected outputs also suit industrial PLC discrete-I/O modules reading 24 V switch contacts. The eight sense inputs handle sinking or sourcing field wiring, and the low-side drivers can directly switch 24 V relay coils or indicator lamps. Using one MCZ33287EG replaces eight optocouplers plus two discrete driver stages per 8-channel I/O card, lowering per-channel BOM cost and shrinking the I/O card footprint in DIN-rail PLC designs.
Recommandé
Central Locking and Alarm System
Automotive central-locking and anti-theft alarm modules read door, hood, and trunk switches while driving lock actuators and sirens. The MCZ33287EG handles all of these functions in a single 20-SOIC, with the eight inputs monitoring all entry-point switches and the two low-side drivers switching the lock actuator and siren. Switch-to-battery and switch-to-ground configuration matches both positive- and negative-trigger switch wiring, allowing reuse across vehicle platforms without redesign.
Recommandé
Lighting Control Module Switch Inputs
Headlamp, tail-lamp, and interior-lighting control modules read multiple switch inputs (rotary lighting-switch contacts, dimmer wiper, ambient-light sensor switches) and drive relay coils for the lamp loads. The MCZ33287EG's eight inputs cover all switch inputs in a typical lighting module while the two protected drivers switch the headlamp relay and a telltale indicator. Integrated thermal shutdown on the low-side drivers protects against wiring faults that draw down the lamp relay indefinitely.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCZ33287EG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCZ33287EFR2 | MCZ33287EF | MC33390EFR2 | MC33887DWBR2 | TLE7259-3GE |
|---|---|---|---|---|---|---|
| Package | 20-SOIC (0.295 inch, 7.50 mm) | 20-SOIC (same) | 20-SOIC (same) | 20-SOIC (same) | 20-SOIC (same) | 20-SOIC (same) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Infineon |
| Function | Contact Monitor + Dual Low-Side Driver | Contact Monitor + Dual Low-Side Driver (same) | Contact Monitor + Dual Low-Side Driver (same) | LIN Interface IC | H-Bridge Motor Driver | LIN Transceiver |
| Contact Sense Inputs | 8 (switch-to-battery or switch-to-ground) | 8 (same) | 8 (same) | 0 (no switch inputs) | 0 (no switch inputs) | 0 (no switch inputs) |
| Low-Side Drivers | 2 protected low-side outputs | 2 (same) | 2 (same) | 0 | H-bridge (different topology) | 0 |
| Temperature Grade | Automotive | Automotive (same) | Automotive (same) | Automotive | Automotive | Automotive |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Principaux différenciateurs
- Eight configurable switch-sense inputs eliminate external resistor networks (vs MC33390EFR2)
- Two integrated protected low-side drivers remove discrete MOSFETs and flyback diodes (vs MC33887DWBR2)
- Single-IC switch-and-driver function versus LIN-only functionality (vs TLE7259-3GE)
Notes de conception
Estimated: at 500 mA continuous per low-side output, each channel dissipates approximately 0.5 W in a 20-SOIC with theta_JA near 70 C/W on a 1 oz 4-layer board, giving a 35 C junction rise. Both outputs ON simultaneously at 500 mA push dissipation to ~1 W total, well within the SOIC-20 rating, but the designer should still copper-pour the GND pin to keep junction temperature below 125 C in the automotive -40 C to +125 C ambient window. Always validate against the manufacturer thermal model in the datasheet.
Place 100 nF ceramic bypass capacitors as close as possible to the VCC pin and use a ground return that does not share a high-current path with the low-side driver outputs. The eight switch-sense inputs should be guarded by RC low-pass filters (typically 10 kohm + 100 nF) located within 5 mm of each input, to reject RF and ESD-induced transients from the automotive wiring harness. Keep the high-current driver traces (OUT1, OUT2) away from analog or sense input traces to avoid capacitive coupling.
The MCZ32491EG suffix 'G' denotes lead-free / matte-tin plating - do not attempt wave soldering with lead-bearing profiles, as this can lift the matte-tin plating. Do not exceed the package thermal rating when driving both low-side outputs continuously into heavy inductive loads (relays, solenoids) without copper-pour heatsinking. Avoid routing switch-sense input traces near the relay coil return paths, as inductive kickback can inject false triggers; the datasheet recommends dedicated GND returns for input and output sections.
Informations de conformité
RoHS compliant and lead-free per NXP product page and distributor listings (DigiKey, Mouser). Automotive temperature grade per distributor parametric data. Detailed AEC-Q100 revision level to be confirmed against latest NXP qualification report.
