SPC574S60E7 - 32-bit Automotive MCU, 3MB Flash | NXP Semiconductors
Référence : SPC574S60E7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.2 | $1 420,00 |
| 500 | $12.9 | $6 450,00 |
| 1 000 | $11.75 | $11 750,00 |
SPC574S60E7 Présentation
A microcontroller (MCU) is a compact integrated circuit designed to govern a specific operation in an embedded system. It contains a processor core, memory, and programmable input/output peripherals. In the automotive domain, MCUs are the central control units for engine management, body control, advanced driver-assistance systems (ADAS), and infotainment. The SPC574S60E7 belongs to the SPC57 family of automotive MCUs, which are built on the Power Architecture and are widely used in safety-critical applications.
Key features of the SPC574S60E7 include a dual-core lockstep configuration for safety (eC200z4), a 3 MB flash with ECC, a 256 KB RAM, and a rich set of communication interfaces: 3 FlexCAN, 3 LIN, 2 SPI, 1 I2C, and 1 Ethernet (10/100 Mbps). It also integrates a 12-bit ADC with up to 32 channels, a 16-bit timer (eTPU2), and a 32-channel DMA controller. The device supports a supply voltage of 3.3V to 5V for I/O, with a core voltage of 1.2V.
The SPC574S60E7 is designed for functional safety up to ASIL-B, with built-in self-test (BIST) and error-correcting code (ECC) on memory. It includes a Memory Protection Unit (MPU) and a Cyclic Redundancy Check (CRC) unit for data integrity. The MCU is manufactured using a 55nm automotive-grade process, ensuring high reliability and low power consumption.
Typical applications include automotive body control modules (BCM), gateway modules, smart junction boxes, and battery management systems (BMS). Its robust communication interfaces and safety features make it ideal for connecting various vehicle networks and ensuring reliable data exchange.
When designing with the SPC574S60E7, ensure proper decoupling of the core and I/O power supplies, and follow the recommended PCB layout for the LQFP-144 package to minimize noise and thermal issues. The device requires an external crystal or oscillator for the main clock, and a separate low-power oscillator for the RTC.
Alternatives de remplacement direct pour SPC574S60E7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SPC574S60E3
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S64E3
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E7CE0AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E7CE0AY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E3CE0AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E3CE0AY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S64E3CE0AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S64E3CE0AY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E7CE0AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E7CE0AY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E3CE0AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E3CE0AY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S64E3CE0AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S64E3CE0AY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E7CE0AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E7CE0AY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E3CE0AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E3CE0AY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S64E3CE0AR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S64E3CE0AY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC574S60E7 Valeurs maximales et caractéristiques électriques
| Core | e200z4 (Power Architecture) |
| Core Speed | 160 MHz |
| Flash Memory | 3 MB |
| RAM | 256 KB |
| Boîtier | LQFP-144 (EPAD) |
| Température de fonctionnement | -40°C to +125°C |
| Supply Voltage (I/O) | 3.3V to 5V |
| Core Voltage | 1.2V |
| AEC-Q100 Grade | Grade 1 |
| Functional Safety | ASIL-B |
| ADC | 12-bit, 32 channels |
| Timer | 16-bit eTPU2 |
| DMA Channels | 32 |
| Communication Interfaces | 3 FlexCAN, 3 LIN, 2 SPI, 1 I2C, 1 Ethernet |
| Process Technology | 55nm automotive-grade |
Configuration des broches de SPC574S60E7
| Broche 1 | VDD — Core power supply (1.2V) |
| Broche 2 | VSS — Ground |
| Broche 3 | VDDIO — I/O power supply (3.3V-5V) |
| Broche 4 | RESET — Reset input (active low) |
| Broche 5 | XTAL — Crystal oscillator input |
| Broche 6 | EXTAL — Crystal oscillator output |
| Broche 7 | CAN0_TX — FlexCAN 0 transmit |
| Broche 8 | CAN0_RX — FlexCAN 0 receive |
| Broche 9 | CAN1_TX — FlexCAN 1 transmit |
| Broche 10 | CAN1_RX — FlexCAN 1 receive |
| Broche 11 | LIN0_TX — LIN 0 transmit |
| Broche 12 | LIN0_RX — LIN 0 receive |
| Broche 13 | SPI0_SCK — SPI 0 clock |
| Broche 14 | SPI0_MOSI — SPI 0 master out slave in |
| Broche 15 | SPI0_MISO — SPI 0 master in slave out |
| Broche 16 | I2C0_SCL — I2C 0 clock |
| Broche 17 | I2C0_SDA — I2C 0 data |
| Broche 18 | ETH_TX — Ethernet transmit |
| Broche 19 | ETH_RX — Ethernet receive |
| Broche 20 | ADC0_IN0 — ADC 0 channel 0 input |
Applications typiques
SPC574S60E7 convient pour 6 applications: Automotive Body Control Module, Gateway Module, Battery Management System, Smart Junction Box, Motor Control, Airbag Control Unit.
Automotive Body Control Module
The SPC574S60E7 is ideal for automotive body control modules (BCM) due to its robust communication interfaces (FlexCAN, LIN) and high-speed processing. It manages lighting, windows, locks, and other body functions. The MCU's 3 MB flash and 256 KB RAM provide ample storage for complex control algorithms. Its AEC-Q100 Grade 1 qualification ensures reliable operation in harsh automotive environments. The dual-core lockstep configuration enhances safety, making it suitable for safety-critical body functions.
Recommandé
Gateway Module
The SPC574S60E7 is well-suited for automotive gateway modules that route data between different vehicle networks. Its multiple FlexCAN, LIN, and Ethernet interfaces enable seamless communication between CAN, LIN, and Ethernet networks. The 160 MHz core speed ensures low-latency data forwarding. The MCU's 3 MB flash allows for storing routing tables and diagnostic data. The integrated DMA controller offloads data transfer tasks, improving overall system efficiency. The device's functional safety features (ASIL-B) ensure reliable gateway operation in safety-critical applications.
Recommandé
Battery Management System
The SPC574S60E7 is ideal for battery management systems (BMS) in electric and hybrid vehicles. Its 12-bit ADC with 32 channels enables precise monitoring of battery voltage, current, and temperature. The MCU's robust communication interfaces (FlexCAN, LIN) allow it to communicate with battery cells and the vehicle's central control unit. The 3 MB flash provides ample storage for battery management algorithms and calibration data. The device's functional safety features (ASIL-B) ensure safe operation in critical battery management applications. The wide operating temperature range (-40°C to +125°C) makes it suitable for under-hood BMS installations.
Recommandé
Smart Junction Box
The SPC574S60E7 is well-suited for smart junction boxes that distribute power and control signals in vehicles. Its multiple FlexCAN and LIN interfaces enable communication with various vehicle modules. The MCU's high-speed processing (160 MHz) allows for real-time control of power distribution. The 3 MB flash provides storage for power management algorithms. The device's robust I/O capabilities and 12-bit ADC enable precise monitoring of current and voltage. The AEC-Q100 Grade 1 qualification ensures reliable operation in demanding automotive environments.
Recommandé
Motor Control
The SPC574S60E7 is ideal for motor control applications, such as brushless DC (BLDC) motors in automotive systems. Its 16-bit eTPU2 timer provides precise PWM generation for motor control. The 12-bit ADC enables accurate current and voltage sensing. The MCU's high-speed processing (160 MHz) supports complex motor control algorithms. The 3 MB flash provides storage for motor control firmware. The device's functional safety features (ASIL-B) ensure safe operation in motor control applications. The wide operating temperature range makes it suitable for under-hood motor control modules.
Recommandé
Airbag Control Unit
The SPC574S60E7 is well-suited for airbag control units (ACU) due to its high reliability and safety features. The dual-core lockstep configuration ensures fault detection and safe operation. The MCU's 3 MB flash provides storage for airbag deployment algorithms. The 12-bit ADC enables precise sensing of crash sensors. The device's functional safety features (ASIL-B) meet the stringent safety requirements for airbag systems. The AEC-Q100 Grade 1 qualification ensures reliable operation in harsh automotive environments. The wide operating temperature range (-40°C to +125°C) makes it suitable for ACU installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SPC574S60E7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SPC574S60E3 | SPC574S64E3 | SPC574S60E7CE0AR |
|---|---|---|---|---|
| Package | LQFP-144 (EPAD) | LQFP-144 (EPAD) - same | LQFP-144 (EPAD) - same | LQFP-144 (EPAD) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 160 MHz | 140 MHz | 140 MHz | 160 MHz |
| Flash Memory | 3 MB | 1 MB | 1.5 MB | 3 MB |
| RAM | 256 KB | 128 KB | 192 KB | 256 KB |
| ADC Channels | 32 | 32 | 32 | 32 |
| Ethernet | Yes (10/100 Mbps) | No | No | Yes (10/100 Mbps) |
| Functional Safety | ASIL-B | ASIL-B | ASIL-B | ASIL-B |
Principaux différenciateurs
- Higher memory capacity (vs SPC574S60E3)
- Ethernet interface (vs SPC574S60E3)
- Higher core speed (vs SPC574S60E3)
Notes de conception
Ensure proper decoupling of the core (1.2V) and I/O (3.3V-5V) power supplies. Place 100nF ceramic capacitors close to each power pin and a 10uF bulk capacitor near the power input. This minimizes voltage ripple and ensures stable operation of the MCU.
Follow the recommended PCB layout for the LQFP-144 package. Use a solid ground plane and route high-speed signals (Ethernet, FlexCAN) with controlled impedance. Keep the exposed pad (EPAD) connected to ground for optimal thermal performance.
Ensure the external crystal or oscillator is connected correctly to the XTAL and EXTAL pins. Use a separate low-power oscillator for the RTC. Avoid exceeding the maximum input voltage on any pin, as this can damage the MCU.
Informations de conformité
AEC-Q100 Grade 1 qualified. RoHS and REACH compliant per NXP product page.
