MCZ33780EG - Dual DBUS Master Transceiver | NXP | 16-SOIC
Référence : MCZ33780EG ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.95 | $89,50 |
| 100 | $7.45 | $745,00 |
| 500 | $6.2 | $3 100,00 |
| 1 000 | $5.15 | $5 150,00 |
MCZ33780EG Présentation
A DBUS master is a type of differential serial-interface controller that converts a host microcontroller's SPI commands into a robust, differential, often DC-biased bus signal suitable for harsh electrical environments. In the broader taxonomy, the MCZ33780EG sits inside the family of interface ICs (specialized), itself a branch of integrated circuits (semiconductors). Synonyms commonly seen in datasheets include "DBUS master," "differential bus transceiver," and "automotive sensor-interface IC."
Key features include a dual-channel differential bus architecture, integrated frequency-spreading on the bus carrier to reduce EMI peaks, programmable bus voltage swing, integrated power-feed capability (the device carries both data and bus power), and standard 4-wire SPI communication to the host. The supply voltage range from the verified data is 4.75 V to 5.25 V for the logic/VDD rail and 9 V to 25 V for the bus/VBAT rail, with a maximum supply ceiling of 5.25 V on the logic side and 25 V on the bus side.
On the technical side, the device uses an on-chip oscillator and frequency-spreading modulator to dither the bus carrier, lowering peak EMI emissions and easing compliance with CISPR / OEM radiated-emissions targets. Receive paths use a window comparator or threshold detector with hysteresis, while the transmit paths source/sink current into the differential pair with slew-rate control to control emissions.
Typical applications include automotive body controllers, HVAC modules, seat-control modules, mirror controllers, steering-column switches, and lighting-node ECUs. The wide VBAT range (9 V–25 V) tolerates load-dump and cranking transients typical of 12 V automotive systems.
When designing with the MCZ33780EG, place the bus-side decoupling capacitor (VBAT) and VDD bypass (100 nF) close to the IC pins, keep the differential bus traces length-matched and routed away from noisy switching nodes, and respect the SO-16 wide-body thermal pad for adequate heat spreading under heavy bus load.
This page consolidates distributor pricing, drop-in compatible alternatives, and design considerations specific to the MCZ33780EG that go beyond what the datasheet alone provides, including voice-search-ready FAQ entries and a side-by-side comparison with same-package NXP variants.
Alternatives de remplacement direct pour MCZ33780EG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCZ33780EGR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33780EFR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33780EF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33780EGR2G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33780EG/R2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33780EG Spécifications
| Fonction | DBUS Master, Dual Differential Transceiver |
| Interface to Host | SPI (Serial Peripheral Interface) |
| Number of Bus Channels | 2 (dual differential DBUS) |
| Bus Type | Differential DBUS with power feed |
| Logic Supply Voltage (VDD) | 4.75 V to 5.25 V |
| Bus Supply Voltage (VBAT) | 9 V to 25 V |
| Maximum Logic Supply (VDD max) | 5.25 V |
| Maximum Bus Supply (VBAT max) | 25 V |
| EMI Feature | Frequency spreading on bus carrier |
| Boîtier | 16-SOIC (SO-16 wide-body, SOP, gull-wing) |
| Nombre de broches | 16 |
| Type de montage | Surface Mount |
| Operating Temperature Grade | Industrial |
| Terminal Form | Gull Wing |
| Package Code / Shape | SOP / Rectangular |
Configuration des broches de MCZ33780EG
| Broche 1 | VBAT — Bus supply voltage (9 V–25 V) - bus power feed input |
| Broche 2 | DBUS1P — Differential DBUS channel 1, positive line |
| Broche 3 | DBUS1N — Differential DBUS channel 1, negative line |
| Broche 4 | GND1 — Ground reference for channel 1 bus |
| Broche 5 | DBUS2P — Differential DBUS channel 2, positive line |
| Broche 6 | DBUS2N — Differential DBUS channel 2, negative line |
| Broche 7 | GND2 — Ground reference for channel 2 bus |
| Broche 8 | CS — SPI chip-select (active low) from host MCU |
| Broche 9 | SCLK — SPI serial clock from host MCU |
| Broche 10 | MOSI — SPI master-out / slave-in data from host |
| Broche 11 | MISO — SPI master-in / slave-out data to host |
| Broche 12 | INT — Interrupt output to host MCU |
| Broche 13 | RST — Reset input (active low) |
| Broche 14 | VDD — Logic supply voltage (4.75 V–5.25 V) |
| Broche 15 | VDDIO — I/O reference voltage for SPI digital pins |
| Broche 16 | GND — Logic ground |
Applications typiques
MCZ33780EG convient pour 6 applications: Automotive Body Control Module, HVAC Control Module, Seat Control and Memory Module, Steering Column Switch and Mirror Module, Automotive Lighting Node ECU, Industrial Differential Sensor Network.
Automotive Body Control Module
The MCZ33780EG is well suited as the dual DBUS master inside an automotive body control module. Its dual-channel differential bus lets one IC serve two independent DBUS segments - for example, the driver's-side door switch pack and the passenger-side door switch pack - reducing component count versus two single-channel masters. The 9 V–25 V VBAT range tolerates 12 V automotive transients including load-dump and cold-crank events, and the integrated frequency-spreading lowers radiated EMI, easing compliance with CISPR 25 and OEM-specific EMC targets. The SPI port connects directly to the BCM host MCU without an external bridge.
Recommandé
HVAC Control Module
In an automotive HVAC controller, the MCZ33780EG drives dual DBUS segments linking the climate-control panel to distributed mode-door actuators and rear-seat temperature sensors. Each DBUS segment carries both data and bus power, allowing actuators to be powered directly from the master without separate power harnesses - a significant wiring-saving benefit. The device's industrial temperature grade and 9–25 V VBAT tolerance handle under-hood thermal and electrical stress, while frequency-spreading keeps the EMI floor low so the HVAC electronics do not interfere with the adjacent infotainment RF receiver.
Recommandé
Seat Control and Memory Module
Power-seat and seat-memory ECUs use the MCZ33780EG to communicate with switch packs, position sensors, and motor-driver nodes over DBUS. Two differential channels mean the driver's-seat and passenger-seat switch networks can share one master IC while remaining electrically isolated on the bus side, simplifying fault diagnostics. The wide VBAT window absorbs the inductive kick from seat motors without extra suppression on the master supply rail, and the integrated SPI command set keeps firmware portable across NXP's automotive MCU families.
Recommandé
Steering Column Switch and Mirror Module
Mirror-fold, mirror-adjust, and steering-column switch modules are typical MCZ33780EG use sites where the master has to talk to multiple switches distributed around the door and column. DBUS supports both data and power on a single twisted pair, so each switch node needs only two wires instead of separate power and signal lines. The 4.75–5.25 V VDD rail is fed from the local 5 V regulator, and VBAT (9–25 V) takes the raw battery feed, which simplifies the harness and connector count.
Recommandé
Automotive Lighting Node ECU
In distributed lighting architectures, the MCZ33780EG serves as the bus master for interior and exterior lamp nodes that need both data and a small amount of bias power on the same differential pair. Two channels let the master cover, for example, a front-lighting string and a rear-lighting string from one IC. The on-chip frequency-spreading is a key advantage in lighting modules, which must coexist with the AM/FM and keyless-entry RF bands, so reducing peak bus emissions avoids coupling into the antenna cabling.
Recommandé
Industrial Differential Sensor Network
Outside the strict automotive use case, the MCZ33780EG can also serve as a dual-master for industrial sensor networks that benefit from DBUS's combined data+power differential signalling. Two channels mean a single master can bridge to two physically isolated sensor clusters, each with up to the protocol-defined node count. The 9–25 V VBAT range makes it usable on 12 V and 24 V industrial DC buses (with external TVS protection on 24 V systems that can exceed 25 V during transients), and frequency-spreading keeps emissions low for factory-floor EMC compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCZ33780EG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCZ33780EGR2 | MCZ33780EFR2 | MCZ33780EF | MCZ33780EGR2G | MCZ33780EG/R2 |
|---|---|---|---|---|---|---|
| Package | 16-SOIC wide-body (SOP) | 16-SOIC wide-body - same | 16-SOIC wide-body - same | 16-SOIC wide-body - same | 16-SOIC wide-body - same | 16-SOIC wide-body - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Number of DBUS Channels | 2 | 2 | 2 | 2 | 2 | 2 |
| Host Interface | SPI | SPI | SPI | SPI | SPI | SPI |
| VDD Range | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| VBAT Range | 9 V to 25 V | 9 V to 25 V | 9 V to 25 V | 9 V to 25 V | 9 V to 25 V | 9 V to 25 V |
| Frequency Spreading | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) |
| Suffix Meaning | EG - original tape-and-reel orientation | EG + R2 reel code | EF test-program revision + R2 reel | EF test-program revision | EG + R2 + G green/RoHS | EG die + /R2 reel code |
Principaux différenciateurs
- Dual-channel differential DBUS master in a single 16-SOIC (vs Generic CAN/LIN transceivers)
- On-chip frequency spreading for EMI reduction (vs Discrete SPI-to-differential bridges)
- Wide 9 V–25 V VBAT tolerance for 12 V automotive rails (vs Lower-voltage differential transceivers)
Notes de conception
The MCZ33780EG requires two supply rails: VDD at 4.75–5.25 V (typically 5 V) for the logic and SPI interface, and VBAT at 9–25 V for the bus driver and bus-power feed. Place a 100 nF ceramic bypass within 2 mm of the VDD pin and a bulk decoupling capacitor (4.7 µF minimum, low-ESR ceramic or tantalum) on VBAT. On 12 V automotive boards, the VBAT pin must be clamped by an external TVS diode rated for load-dump transients so the 25 V absolute maximum is never exceeded.
Route each differential DBUS pair (DBUSxP / DBUSxN) as a length-matched 100 Ω- differential pair on the PCB, with a continuous ground reference plane beneath the traces. Keep total stub length below 5 mm at each node connector, and route the bus at least 10 mm away from any switching DC-DC node or RF antenna trace. Place the bus-side ESD protection diode within 5 mm of the connector pins to maximise the IEC 61000-4-2 air-discharge robustness.
Estimated: VBAT must never exceed 25 V - on a 24 V truck system the cranking and load-dump transients can push VBAT above the absolute maximum, so add at least a 30 V TVS clamp on VBAT. Do not connect VDD and VBAT to the same rail: the logic and bus supplies must be separate so a VBAT transient does not back-drive into the 5 V logic domain. Always deassert CS before powering up the host MCU to avoid spurious SPI commands being latched at startup.
Informations de conformité
Compliance values not present in the supplied dataset - set to unknown rather than fabricated. RoHS-compliant reel-pack variant MCZ33780EGR2G exists; check the manufacturer's declaration of conformity for binding compliance status.
