MCZ33790EG - 2-Ch DSI Physical Layer Interface IC | NXP
Référence : MCZ33790EG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.2 | $5,20 |
| 10 | $4.78 | $47,80 |
| 100 | $4.3 | $430,00 |
| 500 | $3.85 | $1 925,00 |
| 1 000 | $3.4 | $3 400,00 |
MCZ33790EG Présentation
What is a DSI Physical Layer Interface? A DSI physical layer IC is a specialized transceiver that converts a microcontroller's logic-level signals into robust, fault-tolerant bus signals suitable for body-control networks. It sits between the protocol controller and the wiring harness, handling differential signaling, fault detection, and bus protection. Within the broader component taxonomy, it is an Interface IC -> Physical Layer Transceiver -> Automotive Bus Interface, falling under the category of specialized automotive communication ICs.
Key features include two independent DSI channels, integrated bus fault protection, low standby current for battery-conscious applications, and a wide operating voltage range suitable for 12 V automotive systems. The 16-SOIC (EG) package offers a robust through-hole-or-surface-mount-compatible footprint that is widely accepted in automotive ECUs.
At the architecture level, the 33790 uses differential current-mode signaling with high tolerance to ground offset, short circuits, and reverse battery conditions. On-chip diagnostics detect bus faults such as opens, shorts to ground, and shorts to battery, enabling the host microcontroller to log and respond to wiring harness degradation without external circuitry.
Typical applications include automotive body controllers (BCM), instrument clusters, HVAC control modules, seat and mirror controllers, and other distributed electronic modules that communicate over the Freescale's DSI bus. The device is particularly attractive in architectures where a single master node polls multiple remote satellite ECUs.
When designing with the 33790, ensure proper bus termination and keep stub lengths short to maintain signal integrity. The device's fault diagnostics should be polled periodically so wiring faults are detected early, and standby-current budgeting is critical for modules parked to sleep on the vehicle battery.
This page synthesizes distributor availability, drop-in alternatives, and practical design notes that are not collated in any single manufacturer document.
Alternatives de remplacement direct pour MCZ33790EG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCZ33290EFR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33390EFR2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33790EG Spécifications
| Product Type | Distributed System Interface (DSI) Physical Layer Transceiver |
| Number of Channels | 2 |
| Bus Protocol | Freescale/NXP Distributed System Interface (DSI) |
| Boîtier | 16-SOIC (EG), 7.50 mm body width |
| Type de montage | Surface Mount |
| Packaging | Tube |
| Lead Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
| Interface Function | Physical layer / transceiver |
| Bus Fault Diagnostics | Bus open / short-to-ground / short-to-battery detection |
| Target Application Domain | Automotive body electronics, BCM, instrument cluster |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Family | MCZ33xxx automotive interface ICs |
Configuration des broches de MCZ33790EG
| Broche 1 | VCC — Power supply input |
| Broche 2 | GND — Ground |
| Broche 3 | TX1 — Logic-level transmit input, channel 1 |
| Broche 4 | RX1 — Logic-level receive output, channel 1 |
| Broche 5 | EN1 — Channel 1 enable |
| Broche 6 | DB1_H — DSI bus high-side pin, channel 1 |
| Broche 7 | DB1_L — DSI bus low-side pin, channel 1 |
| Broche 8 | FAULT1 — Channel 1 fault diagnostic output |
| Broche 9 | FAULT2 — Channel 2 fault diagnostic output |
| Broche 10 | DB2_H — DSI bus high-side pin, channel 2 |
| Broche 11 | DB2_L — DSI bus low-side pin, channel 2 |
| Broche 12 | EN2 — Channel 2 enable |
| Broche 13 | RX2 — Logic-level receive output, channel 2 |
| Broche 14 | TX2 — Logic-level transmit input, channel 2 |
| Broche 15 | VSUP — Battery / supply voltage input |
| Broche 16 | NC — Not connected (per datasheet) |
Applications typiques
MCZ33790EG convient pour 6 applications: Automotive Body Control Module (BCM), Instrument Cluster Communication, HVAC Control Module, Seat and Mirror Control Modules, Lighting Control Modules, Distributed Switch Pack Interface.
Automotive Body Control Module (BCM)
The MCZ33790EG is a strong fit for body control modules that link distributed satellite ECUs over Freescale's DSI bus. Its two independent physical-layer channels let a single IC drive two sub-networks of body electronics - say, one channel for lighting/switch pack and another for door modules - reducing the host MCU's pin count and BOM cost. The device's integrated fault diagnostics detect open wires, shorts to ground, and shorts to battery, which is essential in BCM architectures where wiring harness faults must be logged without external protection circuitry. Per the manufacturer datasheet, the 16-SOIC (EG) package has the wide-body 7.50 mm form factor preferred in automotive ECU assembly lines. Compared with a CAN/LIN solution, the MCZ33790EG is appropriate when the OEM has selected the proprietary DSI bus for legacy or cost reasons; otherwise CAN transceivers dominate new designs.
Recommandé
Instrument Cluster Communication
Instrument clusters that communicate with a body or powertrain ECU over DSI benefit from the MCZ33790EG's two-channel physical-layer interface. One channel can carry DSI bus traffic from the cluster's local switch pack (turn signal stalk, wiper stalk, lighting controls) while the second channel interfaces the cluster to the central BCM, with the device's fault diagnostics ensuring dimmer or switch failures are reported back to the host. The 16-SOIC (EG) wide-body package survives the high-vibration automotive environment and is straightforward to place on a cluster PCB alongside other analog drivers. According to the Freescale datasheet, the IC's automotive-grade design target supports the temperature and voltage transients typical behind an instrument cluster, and the lead-free, RoHS-compliant packaging satisfies modern vehicle environmental directives.
Recommandé
HVAC Control Module
HVAC control modules with rear-seat or distributed user interfaces often use a low-cost bus to connect to the central HVAC controller. The MCZ33790EG fits this application because its two DSI channels can carry both the user-interface cluster and the blower/sensor network, while on-chip diagnostics report shorted or open wiring back to the HVAC ECU. The 16-SOIC (EG) package's wide body eases automotive PCBA rework and visual inspection. Per the manufacturer datasheet, the device's standby current is low enough for always-on climate modules that need to wake on bus activity. Compared with discrete transceivers, the integrated diagnostics cut BOM and PCB footprint, which is helpful when the HVAC ECU is co-located with other circuits on a dense controller board.
Recommandé
Seat and Mirror Control Modules
Power seat and power mirror modules typically use a low-speed distributed bus to communicate with the central body controller. The MCZ13018's two-channel DSI interface allows a single ECU to bridge both the driver's and passenger side door networks, reducing the number of physical-layer ICs on the door module PCB. The integrated short-to-battery and short-to-ground detection is essential in the door environment where wiring is exposed to moisture and mechanical stress. According to the manufacturer datasheet, the 16-SOIC (EG) package is robust for the door cavity temperature range, and the RoHS-compliant, lead-free construction satisfies end-of-life vehicle directives. The device's low standby current supports the always-connected door modules that wake on bus activity when the car is unlocked.
Recommandé
Lighting Control Modules
Front and rear lighting modules with adaptive headlamp logic or sequential turn indicators often need a low-cost bus between the BCM and the lighting ECU. The MCZ33790EG is appropriate here because its two physical-layer channels can drive both front and rear lighting sub-networks from one IC, while the integrated fault diagnostics flag burned-out lamps or wiring faults through the same bus. The wide-body 16-SOIC (EG) package is automotive-friendly and supports high-volume SMT lines. According to the Freescale datasheet, the device's automotive design target helps the lighting ECU operate over the voltage transients encountered during load-dump events. Compared with discrete opto-isolated transceivers, the MCZ33790EG saves PCB area in tightly packed headlamp modules.
Recommandé
Distributed Switch Pack Interface
Steering-column or door-mounted switch packs (window switches, mirror switches, lighting switches) typically communicate with a body or door ECU over a low-speed bus. The MCZ33790EG is a fit because each switch-pack ECU can use one of the two available DSI channels to talk to the BCM, and on-chip diagnostics flag stuck switches or wiring shorts to the host. The 16-SOIC (EG) package is small enough for the confined switch-pack PCB, yet its wide body aids automotive-line optical inspection. Per the manufacturer datasheet, the device's low standby current supports always-on switch packs that wake on bus activity when a door is opened. Compared with discrete analog switch interfaces, the MCZ33790EG enables a digital, noise-immune bus architecture.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCZ33790EG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCZ33290EFR2 | MCZ33390EFR2 |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 16-SOIC (EG) | 16-SOIC (EG) | 16-SOIC (EG) |
| Product Type | 2-Channel DSI Physical Layer Interface | DSI Physical Layer Interface (family) | DSI Physical Layer Interface (family) |
| Bus Protocol | Freescale/NXP DSI | Freescale/NXP DSI | Freescale/NXP DSI |
| RoHS Status | Compliant | Compliant | Compliant |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Lead Free | Yes | Yes | Yes |
Principaux différenciateurs
- Two DSI physical-layer channels in one 16-SOIC (vs MCZ33290EFR2)
- Same-package family replacement candidate (vs MCZ33390EFR2)
- On-chip DSI bus fault diagnostics (vs Discrete DSI interface with external comparators)
Notes de conception
Per the Freescale datasheet guidance for the DSI physical layer, route the differential bus pair (DB1_H/DB1_L and DB2_H/DB2_L) as a 100-character differential pair with controlled impedance, keep stubs short, and place the bus termination components near the IC. Use a solid ground plane directly under the bus traces to minimize emissions from the differential edges; the wide-body 16-SOIC (EG) package makes it easy to keep the ground plane continuous under the IC body. Decouple VCC and VSUP with a 100 nF X7R close to each supply pin and a 10 uF bulk capacitor on VSUP within 1 cm of the IC.
Do not assume the MCZ33790EG is pin-compatible with the MCZ33290 or MCZ33390 without verifying against the latest NXP datasheet. According to the ETEI comparison pages, all three are 16-SOIC family members, but channel count, enable logic, and fault-output behavior may differ across family SKUs. Also note that the proprietary DSI bus protocol is not interchangeable with LIN, CAN, or FlexRay - using the wrong MCU firmware will silently fail bus arbitration. Finally, ensure VSUP is reverse-polarity protected at the harness or the IC will be damaged during assembly mishandling.
The MCZ33790EG's differential DSI bus uses edge rates designed for the Freescale DSI protocol - it is not a generic RS-485 or LIN transceiver. Match the bus termination to the datasheet's recommended resistor values, and verify the differential pair is balanced (matched length, identical layer changes) so that common-mode noise does not exceed the receiver's tolerance. Estimated: with 1 m of twisted-pair cable at 1 Mbps DSI rates, the stub length should be kept below ~50 mm to avoid reflections; this estimate is a starting point and should be confirmed by TDR / eye-diagram measurement on the actual harness.
Informations de conformité
RoHS compliant and lead-free per distributor pages (DigiKey, Mouser). REACH, AEC-Q100, halogen-free, and conflict-mineral data not present in verified web snippets; request latest NXP product compliance documentation.
