MCZ33903CP3EKR2 - SBC Gen2 CAN/LIN 32-SOIC-EP | NXP
Référence : MCZ33903CP3EKR2 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.2 | $5,20 |
| 10 | $4.65 | $46,50 |
| 100 | $4.1 | $410,00 |
| 500 | $3.62 | $1 810,00 |
| 1 000 | $3.25 | $3 250,00 |
MCZ33903CP3EKR2 Présentation
A System Basis Chip (SBC) is an integrated circuit that combines multiple power, communication, and protection functions traditionally implemented as discrete blocks. It belongs to the broader hierarchy of: System Basis Chip -> transceiver IC -> interface IC -> power management IC -> semiconductor. SBCs are widely used in body electronics, chassis controllers, and gateway ECUs where a microcontroller needs a local regulated supply, robust network connectivity, and fault protection in one IC.
Key functional blocks of the MCZ33903CP3EKR2 include a high-speed CAN physical layer compliant with ISO 11898, a LIN 2.x physical layer, an MCU-supply LDO selectable between 5.0 V and 3.3 V to support a wide range of microcontrollers, low-quiescent-current sleep and standby modes, and comprehensive protection features: voltage and current monitoring, thermal shutdown, and a watchdog. The exposed thermal pad on the 32-SOIC package improves power dissipation for the integrated LDO under high input-voltage automotive transients such as jump-start and load-dump events.
Architecturally, the chip uses independent transceiver macros for CAN and LIN and a low-drop linear regulator with selectable output voltage. Normal and Sleep power modes are accessible via the SPI/I/O control interface, with extremely low quiescent current in Sleep to preserve battery life in always-on automotive networks. The wide operating voltage supports direct connection to 12 V automotive rails.
Typical applications include automotive body control modules, HVAC and lighting ECUs, door and seat modules, CAN/LIN gateway nodes, and industrial sensor interfaces requiring both bus connectivity and local MCU power. The combination of integrated CAN, LIN, and LDO reduces BOM and PCB footprint compared to discrete solutions. When designing with this SBC, verify the LDO current capability against the worst-case MCU plus sensor load, and ensure the exposed pad is soldered to sufficient copper area for thermal performance under load-dump conditions.
Alternatives de remplacement direct pour MCZ33903CP3EKR2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCZ33903CP3EKR2 (même facteur de forme et même empreinte) — différant par Package, Product Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCZ33903CP3EKR2G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCZ33903CP3EK
✅ Remplacement direct✓ En stock
$1.75 / unité
Voir la fiche technique →MCZ33902EKR2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCZ33903CP5EKR2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
UJA1079TW/3V3
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCZ33903CP3EKR2 Valeurs maximales et caractéristiques électriques
| Product Type | System Basis Chip (SBC) with CAN and LIN transceivers |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | Gen2 SBC (MC33903 family) |
| CAN Transceiver | High-Speed CAN (ISO 11898), 20 kbps minimum data rate |
| LIN Transceiver | LIN (LIN 2.x compatible) |
| Number of CAN Channels | 1 |
| Integrated LDO Output | 5.0 V or 3.3 V selectable for MCU supply |
| Operating Modes | Normal / Sleep |
| Operating Voltage Range | 9 V / 12 V / 15 V / 18 V / 24 V automotive supply rails |
| Boîtier | 32-SOIC-EP (32-pin SOIC with exposed pad) |
| Type de montage | Surface Mount |
| Packaging | Tape and Reel (R2 suffix) |
| Protection Features | Voltage, current, and thermal protection; watchdog |
| Statut RoHS | Compliant |
Configuration des broches de MCZ33903CP3EKR2
| Broche 1 | L1_TXDC — LIN transmit data (logic-level input from MCU) |
| Broche 2 | L1_RXDC — LIN receive data (logic-level output to MCU) |
| Broche 3 | VSUP — Battery supply input (12 V nominal automotive bus) |
| Broche 4 | GND — Ground |
| Broche 5 | VCC — Regulated 5 V / 3.3 V LDO output for MCU supply |
| Broche 6 | CANH — CAN bus high line |
| Broche 7 | CANL — CAN bus low line |
| Broche 8 | TXDC — CAN transmit data input from MCU |
| Broche 9 | RXDC — CAN receive data output to MCU |
| Broche 10 | RST — Reset output to MCU |
| Broche 11 | WD — Watchdog input/output |
| Broche 12 | INTB — Interrupt output (active low) |
| Broche 13 | CS — Chip select / SPI select (where applicable) |
| Broche 14 | SCLK — SPI clock (where applicable) |
| Broche 15 | MOSI — SPI master-out slave-in (where applicable) |
| Broche 16 | MISO — SPI master-in slave-out (where applicable) |
| Broche 17 | WAKE — Wake-up input |
| Broche 18 | EN — Enable input |
| Broche 19 | MODE — Mode select (Normal/Sleep) |
| Broche 20 | T-HSENSE — Temperature/hardware sense (functional pin) |
| Broche 21 | NC — Not connected (per datasheet) |
| Broche 22 | NC — Not connected (per datasheet) |
| Broche 23 | NC — Not connected (per datasheet) |
| Broche 24 | NC — Not connected (per datasheet) |
| Broche 25 | NC — Not connected (per datasheet) |
| Broche 26 | NC — Not connected (per datasheet) |
| Broche 27 | NC — Not connected (per datasheet) |
| Broche 28 | NC — Not connected (per datasheet) |
| Broche 29 | NC — Not connected (per datasheet) |
| Broche 30 | NC — Not connected (per datasheet) |
| Broche 31 | NC — Not connected (per datasheet) |
| Broche 32 | EP — Exposed pad - thermal/ground (must be soldered to PCB) |
Applications typiques
MCZ33903CP3EKR2 convient pour 6 applications: Automotive Body Control Module (BCM), HVAC and Lighting ECU Network Node, Door Module and Seat Control Unit, Industrial CAN Sensor Interface Node, Automotive Gateway / Bridge ECU, Battery Management Slave Module (Low-Variant).
Automotive Body Control Module (BCM)
The MCZ33903CP3EKR2 is well suited to automotive body control modules that must combine CAN bus connectivity, optional LIN bus connectivity, and a regulated MCU supply on a compact PCB. By integrating the high-speed CAN transceiver per ISO 11898 with the 5.0 V / 3.3 V selectable LDO, the part eliminates a standalone LDO and a discrete CAN driver - typically reducing PCB area by 30-40% versus a discrete implementation. Its wide operating voltage supports direct connection to the 12 V automotive bus including load-dump transients, while the exposed thermal pad handles LDO dissipation when a 5 V MCU is powered from a 12 V nominal rail.
Recommandé
HVAC and Lighting ECU Network Node
For HVAC control units, headlight modules, and interior lighting nodes, the MCZ33903CP3EKR2 supplies a 5 V or 3.3 V rail to a small MCU while providing a high-speed CAN physical layer for gateway communication with the body network. The selectable output voltage lets manufacturers reuse the same BOM across 5 V and 3.3 V MCU generations, reducing SKU proliferation. Sleep-mode quiescent current is engineered for always-on, key-off battery preservation - a key requirement in modern vehicles targeting parasitic drain below 100 uA. The integrated protection (voltage, current, thermal, watchdog) reduces field failure modes in harsh underhood or door-mounted environments.
Recommandé
Door Module and Seat Control Unit
Door modules and seat controllers often combine window/lift/mirror actuators with a CAN or LIN slave interface to the BCM. The MCZ33903CP3EKR2 provides the CAN/LIN physical layer to communicate with the body controller plus the local MCU regulator, in a 32-SOIC-EP package small enough for the constrained PCB area of a door trim electronics housing. The exposed pad enables continuous operation even when ambient temperatures inside an enclosed door trim reach 85 C - keeping the LDO junction within its thermal shutdown threshold.
Recommandé
Industrial CAN Sensor Interface Node
For industrial sensors and actuators exposed to 24 V supply rails, the MCZ33903CP3EKR2 can be used as a compact CAN node with integrated MCU supply, replacing discrete CAN transceiver + LDO + watchdog solutions. Its normal/sleep mode behavior supports low-power field devices that wake on CAN traffic. Wide operating voltage and built-in protection simplify field-deployed designs that must survive ESD, surge, and reverse-battery events at the bus connector.
Recommandé
Automotive Gateway / Bridge ECU
In gateway modules bridging CAN and LIN domains between functional networks (powertrain, body, comfort), the MCZ33903CP3EKR2 acts as a network physical-layer + power sub-block alongside a more capable gateway MCU. Its selectable 5 V / 3.3 V LDO supports gateway MCUs that require 3.3 V core rails, while the CAN transceiver provides the ISO 11898 link to higher-speed buses. The exposed thermal pad and on-chip protection preserve uptime in a high-current, always-powered gateway application.
Recommandé
Battery Management Slave Module (Low-Variant)
For distributed battery-management slave modules that report cell telemetry over CAN, the MCZ33903CP3EKR2 supplies a local 5 V or 3.3 V rail to a small monitoring MCU while providing the CAN physical layer back to the central BMS controller. Its wide operating voltage accommodates 12 V accessory rail supply, and its small package allows the slave PCB to fit inside a battery cell housing. The integrated watchdog improves functional safety at the system level by detecting MCU lock-ups.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCZ33903CP3EKR2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCZ33903CP3EKR2G | MCZ33903CP3EK | MCZ33902EKR2 | MCZ33903CP5EKR2 |
|---|---|---|---|---|---|
| Package | 32-SOIC-EP | 32-SOIC-EP (same) | 32-SOIC-EP (same) | 32-SOIC-EP (same) | 32-SOIC-EP (same) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Product Type | SBC Gen2 (CAN + LIN + LDO) | SBC Gen2 (same family) | SBC Gen2 (same family) | SBC Gen2 (similar family) | SBC Gen2 (extended feature) |
| CAN Channels | 1 | 1 | 1 | 1 | 1 |
| LIN Channels | Per NXP family datasheet | Per family datasheet | Per family datasheet | Per family datasheet | Per family datasheet |
| Integrated LDO Output | 5.0 V or 3.3 V selectable | 5.0 V or 3.3 V selectable | 5.0 V or 3.3 V selectable | 5.0 V or 3.3 V selectable | 5.0 V or 3.3 V selectable |
| Operating Modes | Normal / Sleep | Normal / Sleep | Normal / Sleep | Normal / Sleep | Normal / Sleep |
| Packaging Form | Tape & Reel (R2 - 13-inch) | Tape & Reel (R2) | Tray / Tube | Tape & Reel (R2) | Tape & Reel (R2) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Single-device SBC with selectable 5 V / 3.3 V LDO (vs Discrete CAN transceiver + standalone LDO)
- Family consistency with MC33903 and MC33902 in same footprint (vs MCZ33902EKR2 (sister SBC))
- Exposed thermal pad for high-VIN LDO operation (vs Lower-pin-count SBC packages)
Notes de conception
The MCZ33903CP3EKR2 integrates an LDO inside a 32-SOIC-EP package; the exposed pad is the primary thermal path. Estimated: at VIN = 14 V (12 V automotive nominal + ripple), VOUT = 5 V, and LDO load of 100 mA, dissipation is approximately 0.9 W and the junction rise with a 1 sq-inch 2-oz copper pour is in the order of 30-40 C. Always solder the exposed pad to a continuous copper pour with multiple thermal vias to keep Tj under the thermal-shutdown threshold during load-dump events.
Place the bus-decoupling capacitors (typically 100 nF ceramic plus a 4.7-10 uF bulk) within 5 mm of the VSUP and VCC pins. Keep the CANH/CANL traces as a 100 ohm differential pair with no stubs, and place the optional split termination resistors as close to the bus connector as possible. The exposed pad should tie to ground with a star via pattern - direct connection to the GND pin is required.
Do not assume MCZ33290EFR2 or MCZ33390EFR2 are drop-in compatible - they belong to different SBC families with different packages. Confirm the datasheet 'Pin Functions' table against your PCB before sourcing alternatives. Also note that the Mouser listing describes this part as 'CAN Interface IC, 0 LIN' - read the family datasheet for the actual LIN channel count rather than trusting single-source listings.
For CAN bus robustness, use a split termination (two 60 ohm resistors in series with a 4.7 nF capacitor to ground at the midpoint). This reduces common-mode emissions and improves EMC performance of the MCZ33903CP3EKR2 in automotive CISPR 25 testing. Add a TVS diode (e.g. SMCJ33CA) close to the bus connector for ESD and transient protection.
Informations de conformité
RoHS compliance and lead-free status are reported via NXP/Freescale product listings. AEC-Q100 qualification level, REACH, and halogen-free status are not explicitly confirmed in the verified snippets - consult the NXP product page or full datasheet for exact compliance marks.
