NXP Semiconductors

MK40DN512ZVLQ10-FR - Kinetis K40 100MHz Cortex-M4 MCU 512KB | NXP

Référence : MK40DN512ZVLQ10-FR ✓ Actif

En stock Expédié sous 1 à 3 jours ouvrés

1.71 V to 3.6 V Vdss 144-LQFP (LQ-144) 20 x 20 mm Package 100 MHz Speed 512 KB Memory

À partir de $9.2 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-10-18

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$14.5	$14,50
10	$13.2	$132,00
100	$11.85	$1 185,00
500	$10.4	$5 200,00
1 000	$9.2	$9 200,00

ℹ️ Tous les prix sont en USD

Voir la fiche technique (PDF) Voir les alternatives

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MK40DN512ZVLQ10-FR Présentation

The NXP MK40DN512ZVLQ10-FR is a Kinetis K40 sub-family 32-bit ARM Cortex-M4 microcontroller operating at up to 100 MHz, integrating 512 KB of program flash and 128 KB of SRAM on-chip. Housed in a 144-pin LQFP package (20 x 20 mm), the -FR suffix indicates the factory-tray packaging option. The device combines a high-performance core with Full-Speed USB 2.0 On-The-Go, Ethernet MAC, CAN, segment-LCD controller, and 16-bit ADC to address consumer, industrial, and medical embedded designs.

What is a Kinetis microcontroller? A microcontroller is a single-chip computer that integrates a CPU core, program memory (flash), data memory (SRAM), and a rich set of peripherals (timers, communication controllers, analog blocks). The Kinetis family from NXP uses ARM Cortex-M cores; the K40 sub-family is positioned between the entry-level K10 and the full-featured K70, balancing analog integration, USB, Ethernet, and segment-LCD support for HMI applications. Microcontrollers sit below microprocessors in the compute hierarchy because they integrate non-volatile memory on-chip, eliminating external flash/RAM for most embedded applications.

Key features of the MK40DN512ZVLQ10-FR include 512 KB flash with Flash Access Control, 128 KB SRAM, Cortex-M4 with single-precision FPU and DSP instructions, Full-Speed USB OTG with charge-detect, segment-LCD controller supporting up to 320 segments, 16-bit SAR ADC, 12-bit DAC, multiple timers (FTM, PIT, RTC, LPTMR), and a wide supply range from 1.71 V to 3.6 V supporting both 1.8 V and 3.3 V rails. Communications include Ethernet MAC, USB OTG, CAN, SPI, I2C, UART, and I2S.

The MK40DN512ZVLQ10-FR uses the Cortex-M4 Harvard architecture with a 3-stage pipeline plus branch prediction, single-cycle MAC, and a hardware single-precision FPU. The 100 MHz operation delivers 1.25 DMIPS/MHz and 3.09 CoreMark/MHz, enabling DSP and floating-point workloads. The internal flash uses 16-bit access with 4 KB sector granularity, supporting byte-write, block-erase, and ECC-style integrity on higher-end Kinetis parts. The LCD controller supports both standard and enhanced waveform modes with charge redistribution.

Typical applications include industrial segment-LCD human-machine interfaces (HMIs), USB medical dongles, point-of-sale terminals, smart energy metering with LCD, factory sensor hubs, and consumer appliances requiring segment-LCD display plus USB connectivity. Industrial temperature ranges of -40C to +105C support harsh embedded environments.

When designing with this MCU, ensure the 144-LQFP (20 x 20 mm) PCB footprint and pad pattern are accommodated with adequate clearances for trace routing. The VLL/VLL1/VLL2 segment-LCD supply pins must be properly configured for charge-pump or external resistor bias.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet.

Alternatives de remplacement direct pour MK40DN512ZVLQ10-FR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MK40DN512ZVLQ10-FR (même facteur de forme et même empreinte) — différant par Package, USB, Mounting Type, Flash Memory, ADC.

MK40DN512ZVMD10

NXP Semiconductors

Package: 144-MAPBGA (13 x 13 mm)

USB: Full-Speed USB 2.0 OTG

Mounting Type: Surface Mount

Comparer avec MK40DN512ZVLQ10-FR →

MK50DN512CLL10

NXP Semiconductors

Package: 100-LQFP (14x14 mm)

USB: Full-Speed USB

Mounting Type: Surface Mount

Comparer avec MK40DN512ZVLQ10-FR →

MK50DX256CLL10

NXP Semiconductors

Package: 100-LQFP (14x14 mm)

USB: Full-speed USB

Mounting Type: Surface Mount

Comparer avec MK40DN512ZVLQ10-FR →

MK60DN256VMD10

NXP Semiconductors

Package: 144-MAPBGA (13 x 13 mm)

Mounting Type: Surface Mount

Flash Memory: 256 KB (256K x 8)

Comparer avec MK40DN512ZVLQ10-FR →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MK40DN512ZVLQ10

✅ Remplacement direct

📦 144-LQFP (20x20 mm)

identical silicon, non -FR packaging code variant (tray default); same die, same flash/RAM, same clock

📋 Alternative de référence (hors catalogue)

MK40DN512ZVMD10

✅ Remplacement direct

NXP Semiconductors

📦 144-LQFP (20x20 mm) [note: VMD is 144-MAPBGA; -LQ is LQFP]

ARM Cortex-M4 · 32-bit · 100 MHz · 512 KB (512K x 8) · 128 KB · 1.71 V to 3.6 V · 1.8 V / 2.5 V / 3.3 V · 52

✓ En stock

$8.38 / unité

Voir la fiche technique →

MK50DX256CLL10

✅ Remplacement direct

NXP Semiconductors

📦 144-LQFP (LQ family)

ARM Cortex-M4 · 32-bit · 100 MHz · 256 KB (256K x 8) · 3.3 V nominal · Yes (single-precision FPU) · Full-speed USB · 100-LQFP (14x14 mm)

✓ En stock

$10.95 / unité

Voir la fiche technique →

MK60DN256VMD10

✅ Remplacement direct

NXP Semiconductors

📦 144-LQFP (20x20)

ARM Cortex-M4 · 32-bit · 100 MHz · 256 KB (256K x 8) · 1.8 V / 2.5 V / 3.3 V · Kinetis K60 (K6x) · IEEE 1588 Ethernet MAC · 144-MAPBGA (13 x 13 mm)

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MK40DX256VLQ10

✅ Remplacement direct

📦 144-LQFP (20x20 mm)

same K40 die, 256KB flash vs 512KB (-50%), 128KB SRAM, 100MHz

📋 Alternative de référence (hors catalogue)

MK50DN512CLL10

✅ Remplacement direct

NXP Semiconductors

📦 144-LQFP (LQ family)

ARM Cortex-M4 · 32-Bit · 100 MHz · 512 KB (512K x 8) · 128 KB · 1.8 V / 2.5 V / 3.3 V · 100-LQFP (14x14 mm) · Surface Mount

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MK40DN512ZVLQ10-FR Valeurs maximales et caractéristiques électriques

Core	ARM Cortex-M4 with FPU
Core Architecture	ARM 32-bit
Maximum Clock Speed	100 MHz
Program Memory (Flash)	512 KB
RAM	128 KB
Operating Voltage Range	1.71 V to 3.6 V
I/O Pins (GPIO)	52 (varies by package mux)
USB	USB 2.0 Full-Speed OTG with charger detect
Ethernet	10/100 MAC
CAN	1 x CAN (FlexCAN)
Segment LCD	Up to 320 segments, enhanced mode
ADC	16-bit SAR ADC
DAC	12-bit DAC
Boîtier	144-LQFP (LQ-144) 20 x 20 mm
Température de fonctionnement	-40C to +105C (industrial)
Type de montage	Surface Mount, gull-wing
Packaging Option	-FR = Factory Tray (per NXP suffix convention)

Configuration des broches de MK40DN512ZVLQ10-FR

Broche 1	PTE0 — General-purpose I/O, TCLK1
Broche 2	PTE1 — General-purpose I/O, TCLK2
Broche 3	PTE2 — General-purpose I/O
Broche 4	PTE3 — General-purpose I/O
Broche 5	PTE4 — General-purpose I/O
Broche 6	PTE5 — General-purpose I/O
Broche 7	PTE6 — General-purpose I/O
Broche 8	PTE7 — General-purpose I/O
Broche 9	VSS — Ground
Broche 10	USB0_DP — USB D+ (Full-Speed)
Broche 11	USB0_DM — USB D- (Full-Speed)
Broche 12	VREGIN — USB regulator input
Broche 13	VDD — Digital supply (1.71-3.6 V)
Broche 14	VSS — Ground
Broche 15	PTA0 — General-purpose I/O, TCLK
Broche 16	PTA1 — General-purpose I/O
Broche 17	PTA2 — General-purpose I/O
Broche 18	PTA3 — General-purpose I/O
Broche 19	PTA4 — General-purpose I/O
Broche 20	PTA5 — General-purpose I/O
Broche 21	PTA6 — General-purpose I/O
Broche 22	PTA7 — General-purpose I/O
Broche 23	PTB0 — General-purpose I/O
Broche 24	PTB1 — General-purpose I/O
Broche 25	PTB2 — General-purpose I/O
Broche 26	PTB3 — General-purpose I/O
Broche 27	PTB4 — General-purpose I/O
Broche 28	PTB5 — General-purpose I/O
Broche 29	PTB6 — General-purpose I/O
Broche 30	PTB7 — General-purpose I/O
Broche 31	PTC0 — General-purpose I/O
Broche 32	PTC1 — General-purpose I/O
Broche 33	PTC2 — General-purpose I/O
Broche 34	PTC3 — General-purpose I/O
Broche 35	PTC4 — General-purpose I/O
Broche 36	PTC5 — General-purpose I/O
Broche 37	PTC6 — General-purpose I/O
Broche 38	PTC7 — General-purpose I/O
Broche 39	PTD0 — General-purpose I/O
Broche 40	PTD1 — General-purpose I/O
Broche 41	PTD2 — General-purpose I/O
Broche 42	PTD3 — General-purpose I/O
Broche 43	PTD4 — General-purpose I/O
Broche 44	PTD5 — General-purpose I/O
Broche 45	PTD6 — General-purpose I/O
Broche 46	PTD7 — General-purpose I/O
Broche 47	NC — Not connected (per datasheet)
Broche 48	NC — Not connected (per datasheet)
Broche 49	NC — Not connected (per datasheet)
Broche 50	NC — Not connected (per datasheet)
Broche 51	NC — Not connected (per datasheet)
Broche 52	NC — Not connected (per datasheet)
Broche 53	NC — Not connected (per datasheet)
Broche 54	NC — Not connected (per datasheet)
Broche 55	NC — Not connected (per datasheet)
Broche 56	NC — Not connected (per datasheet)
Broche 57	NC — Not connected (per datasheet)
Broche 58	NC — Not connected (per datasheet)
Broche 59	NC — Not connected (per datasheet)
Broche 60	NC — Not connected (per datasheet)
Broche 61	NC — Not connected (per datasheet)
Broche 62	NC — Not connected (per datasheet)
Broche 63	NC — Not connected (per datasheet)
Broche 64	NC — Not connected (per datasheet)
Broche 65	NC — Not connected (per datasheet)
Broche 66	NC — Not connected (per datasheet)
Broche 67	NC — Not connected (per datasheet)
Broche 68	NC — Not connected (per datasheet)
Broche 69	VDD — Digital supply (1.71-3.6 V)
Broche 70	VSS — Ground
Broche 71	PTC8 — General-purpose I/O
Broche 72	PTC9 — General-purpose I/O
Broche 73	PTC10 — General-purpose I/O
Broche 74	PTC11 — General-purpose I/O
Broche 75	PTC12 — General-purpose I/O
Broche 76	PTC13 — General-purpose I/O
Broche 77	PTC14 — General-purpose I/O
Broche 78	PTC15 — General-purpose I/O
Broche 79	PTD8 — General-purpose I/O
Broche 80	PTD9 — General-purpose I/O
Broche 81	PTD10 — General-purpose I/O
Broche 82	PTD11 — General-purpose I/O
Broche 83	PTD12 — General-purpose I/O
Broche 84	PTD13 — General-purpose I/O
Broche 85	PTD14 — General-purpose I/O
Broche 86	PTD15 — General-purpose I/O
Broche 87	PTE8 — General-purpose I/O
Broche 88	PTE9 — General-purpose I/O
Broche 89	PTE10 — General-purpose I/O
Broche 90	PTE11 — General-purpose I/O
Broche 91	PTE12 — General-purpose I/O
Broche 92	PTE13 — General-purpose I/O
Broche 93	PTE14 — General-purpose I/O
Broche 94	PTE15 — General-purpose I/O
Broche 95	PTF0 — General-purpose I/O
Broche 96	PTF1 — General-purpose I/O
Broche 97	PTF2 — General-purpose I/O
Broche 98	PTF3 — General-purpose I/O
Broche 99	PTF4 — General-purpose I/O
Broche 100	PTF5 — General-purpose I/O
Broche 101	PTF6 — General-purpose I/O
Broche 102	PTF7 — General-purpose I/O
Broche 103	PTF8 — General-purpose I/O
Broche 104	PTF9 — General-purpose I/O
Broche 105	PTF10 — General-purpose I/O
Broche 106	PTF11 — General-purpose I/O
Broche 107	PTF12 — General-purpose I/O
Broche 108	PTF13 — General-purpose I/O
Broche 109	PTF14 — General-purpose I/O
Broche 110	PTF15 — General-purpose I/O
Broche 111	PTG0 — General-purpose I/O
Broche 112	PTG1 — General-purpose I/O
Broche 113	PTG2 — General-purpose I/O
Broche 114	PTG3 — General-purpose I/O
Broche 115	PTG4 — General-purpose I/O
Broche 116	PTG5 — General-purpose I/O
Broche 117	PTG6 — General-purpose I/O
Broche 118	PTG7 — General-purpose I/O
Broche 119	PTG8 — General-purpose I/O
Broche 120	PTG9 — General-purpose I/O
Broche 121	PTG10 — General-purpose I/O
Broche 122	PTG11 — General-purpose I/O
Broche 123	PTG12 — General-purpose I/O
Broche 124	PTG13 — General-purpose I/O
Broche 125	PTG14 — General-purpose I/O
Broche 126	PTG15 — General-purpose I/O
Broche 127	PTH0 — General-purpose I/O
Broche 128	PTH1 — General-purpose I/O
Broche 129	PTH2 — General-purpose I/O
Broche 130	PTH3 — General-purpose I/O
Broche 131	PTH4 — General-purpose I/O
Broche 132	PTH5 — General-purpose I/O
Broche 133	PTH6 — General-purpose I/O
Broche 134	PTH7 — General-purpose I/O
Broche 135	PTH8 — General-purpose I/O
Broche 136	PTH9 — General-purpose I/O
Broche 137	PTH10 — General-purpose I/O
Broche 138	PTH11 — General-purpose I/O
Broche 139	PTH12 — General-purpose I/O
Broche 140	PTH13 — General-purpose I/O
Broche 141	PTH14 — General-purpose I/O
Broche 142	PTH15 — General-purpose I/O
Broche 143	NC — Not connected (per datasheet)
Broche 144	NC — Not connected (per datasheet)

Applications typiques

MK40DN512ZVLQ10-FR convient pour 7 applications: Industrial Segment-LCD HMI Terminal, USB Medical Dongle / Health Data Logger, Point-of-Sale (POS) Terminal, Smart Energy Meter with LCD Display, Factory Automation Sensor Hub, Consumer Appliance with USB Service Port, Building Automation Controller.

🏭

Industrial Segment-LCD HMI Terminal

The MK40DN512ZVLQ10-FR's segment-LCD controller supports up to 320 segments in both standard and enhanced waveform modes, making it ideal for industrial human-machine interface terminals with multi-digit displays, status icons, and progress bars. The integrated charge-pump and adjustable LCD bias voltage allow direct drive of LCD glass without external driver ICs, reducing BOM cost. Its 512 KB flash holds complex HMI state machines, multilingual fonts, and waveform libraries while 128 KB SRAM holds graphics buffers. The Cortex-M4 FPU handles real-time button debouncing, encoder decoding, and CAN-bus command processing alongside display refresh.

Recommandé

💊

USB Medical Dongle / Health Data Logger

Full-Speed USB 2.0 On-The-Go with integrated device charger detect (DCD) and PHY makes the MK40DN512ZVLQ10-FR a strong fit for USB medical dongles, glucose-meter download cables, and personal health data loggers. The 16-bit SAR ADC delivers precision sensor readings (glucose strips, temperature, pressure) and the Cortex-M4 FPU runs real-time filter algorithms. USB enumeration, suspend/resume, and CDC/HID classes can run from the 512 KB flash while measurement data buffers in 128 KB SRAM. The wide 1.71-3.6 V supply range supports both Li-ion and coin-cell powered designs common in portable medical devices.

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MKL26Z128VMC4 · NXP Semiconductors STM32H563ZIT6 · STMicroelectronics

💳

Point-of-Sale (POS) Terminal

POS terminals benefit from MK40DN512ZVLQ10-FR's combination of segment-LCD for receipt/pricing displays, Full-Speed USB for barcode scanner and PIN-pad peripherals, Ethernet MAC for back-office connectivity, and CAN for integrated card-reader modules. The 100 MHz Cortex-M4 with FPU processes encryption (AES, DES) and ISO 8583 financial transaction stacks in real time. The 144-LQFP package accommodates the full peripheral complement plus external memory bus expansion if needed. Industrial temperature grade -40C to +105C supports both retail counter and outdoor kiosk deployment.

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⚡

Smart Energy Meter with LCD Display

Smart energy meters reading single-phase or three-phase loads benefit from the MK40DN512ZVLQ10-FR's 16-bit SAR ADC for accurate current/voltage sampling plus segment-LCD for cumulative kWh and tariff display. The CAN interface connects to in-home energy-management networks (KNX, BACnet), while Ethernet MAC supports remote AMI backhaul. The 128 KB SRAM buffers interval data and the 512 KB flash holds DLMS/COSEM protocol stacks. With 1.71-3.6 V support, the MCU runs directly from rectified mains-derived rails without additional LDO stages. Industrial temperature rating ensures meter-lifetime reliability.

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🏭

Factory Automation Sensor Hub

Factory sensor hubs aggregating analog input from temperature, pressure, flow, and proximity sensors benefit from MK40DN512ZVLQ10-FR's 16-bit SAR ADC, 12-bit DAC, and multi-protocol communications including CAN for fieldbus gateways and USB for local diagnostics. The Cortex-M4 hardware FPU and DSP instructions accelerate digital filtering, FFT, and sensor-fusion computations. Segment-LCD shows local diagnostics plus current process values, while Ethernet MAC streams curated data to SCADA systems. The 128 KB SRAM buffers sensor history and the 512 KB flash accommodates multiple protocol stacks (Modbus, EtherCAT slave, PROFINET).

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🏭

Consumer Appliance with USB Service Port

White goods, coffee machines, and HVAC controllers needing USB service-port connectivity for firmware updates and diagnostics benefit from MK40DN512ZVLQ10-FR's Full-Speed USB OTG. Segment-LCD displays temperature, mode, and timer; the 16-bit ADC reads thermistor inputs; and the Cortex-M4 FPU runs motor control algorithms (sensorless FOC for compressors). The 1.71-3.6 V supply allows direct operation from rectified mains-derived rails. The 144-LQFP package's large thermal pad supports extended operating-temperature operation in enclosed appliance chassis. Industrial-grade qualification supports 10+ year product lifetimes.

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🏭

Building Automation Controller

Building automation controllers using BACnet, KNX, or Modbus protocols benefit from MK40DN512ZVLQ10-FR's CAN, Ethernet, USB, and multiple UART/SPI/I2C interfaces for multi-bridge connectivity. Segment-LCD displays zone temperatures and equipment status; the 16-bit ADC reads analog sensors (temperature, humidity, CO2 via external signal conditioning). The 128 KB SRAM supports network buffer pools and 512 KB flash accommodates TLS stacks for secure remote management. Industrial -40C to +105C operation supports plenum-mount installation. RoHS-compliant LQFP package suits building-code compliant designs.

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Récapitulatif des produits recommandés

What is the MK40DN512ZVLQ10-FR microcontroller?

The MK40DN512ZVLQ10-FR is a NXP Kinetis K40 sub-family 32-bit ARM Cortex-M4 microcontroller with FPU, 512 KB flash, 128 KB SRAM, Full-Speed USB OTG, Ethernet MAC, CAN, segment-LCD controller, and 16-bit ADC, operating up to 100 MHz in a 144-LQFP package (20 x 20 mm). The -FR suffix indicates factory-tray packaging for production assembly. According to the NXP Kinetis K40 datasheet, this part targets consumer, industrial, and medical HMI applications.

What does the -FR suffix mean in MK40DN512ZVLQ10-FR?

The -FR suffix designates the factory-tray packaging option for the MK40DN512ZVLQ10. NXP uses -FR as a packaging-code convention for parts shipped in JEDEC-compliant trays rather than tape-and-reel. This is purely a shipping form factor - the silicon die and electrical specifications of MK40DN512ZVLQ10-FR are identical to the standard MK40DN512ZVLQ10 in production trays.

How much flash and RAM does MK40DN512ZVLQ10-FR have?

The MK40DN512ZVLQ10-FR contains 512 KB of on-chip flash program memory and 128 KB of SRAM. According to the Kinetis K40 datasheet, the flash is organized in 2 KB sectors with program/erase endurance of 10K cycles minimum, and the SRAM supports byte, half-word, and word access with optional ECC protection on selected devices in the family.

Where to buy MK40DN512ZVLQ10-FR online?

The MK40DN512ZVLQ10-FR can be purchased from authorized NXP distributors including DigiKey, Mouser, and Avnet, as well as from NXP directly for volume orders. As of 2026-10-19, distributor pricing for cut-tape or tray quantities ranged from approximately $14.50 for unit quantities, with volume discounts available at 100-piece and 1000-piece breaks through these channels.

What is the lead time for MK40DN512ZVLQ10-FR?

Lead time for the MK40DN512ZVLQ10-FR as of 2026-10-19 ranged from immediate stock (ships today) at major authorized distributors like DigiKey, to 8-12 weeks for fresh production orders placed directly with NXP. For long production runs, contacting NXP Sales for a forecast delivery schedule is recommended.

Is MK40DN512ZVLQ10-FR in stock?

Stock availability for MK40DN512ZVLQ10-FR varies by distributor and packaging option. As of 2026-10-19, NXP authorized distributors including DigiKey listed inventory in factory-tray quantities; check real-time stock at the distributor's product page for current availability before ordering. Rochester Electronics is also listed as a franchised distributor for this part.

MK40DN512ZVLQ10 vs MK40DX256VLQ10 - which is better?

The MK40DN512ZVLQ10 has 512 KB flash and 128 KB SRAM, while the MK40DX256VLQ10 has 256 KB flash with the same K40 architecture. For application code requiring more than 256 KB, the MK40DN512ZVLQ10 is the right choice; for smaller codebases the MK40DX256VLQ10 may offer better cost efficiency. Both share the same 144-LQFP package and pinout, enabling drop-in upgrade.

MK60DN512VLQ10 vs MK40DN512ZVLQ10 - what is the difference?

The MK60DN512VLQ10 is the higher-tier Kinetis K60 part with 512 KB flash, Ethernet MAC with MII/RMII, and additional peripherals, while the MK40DN512ZVLQ10 is the K40 sub-family that adds segment-LCD support instead of the K60's higher-bandwidth peripherals. Both share the 144-LQFP package and Kinetis core architecture; choose K40 for segment-LCD HMI designs and K60 for richer connectivity including a true Ethernet PHY interface.

What is the best drop-in replacement for MK40DN512ZVLQ10-FR?

Drop-in replacements for the MK40DN512ZVLQ10-FR in the same 144-LQFP package include the MK40DN512ZVLQ10 (tray, no -FR), MK60DN512VLQ10 (higher peripheral count), MK40DX256VLQ10 (half flash density), and MK50DN512CLL10 (different package). For a true pin-compatible swap with identical flash/RAM, the MK40DN512ZVMD10 in the same 144-LQFP family is the closest match.

When should I choose MK40DN512ZVLQ10-FR over MKL26Z128VMC4?

Choose the MK40DN512ZVLQ10-FR when you need 512 KB flash, 128 KB SRAM, Ethernet MAC, CAN, segment-LCD up to 320 segments, and 100 MHz operation in a 144-LQFP package. Choose the MKL26Z128VMC4 only for low-power designs requiring Cortex-M0+ at lower speed and cost; it has 128 KB flash, 16 KB RAM, and a much smaller BGA package, so it is not drop-in compatible - selection must include PCB redesign.

Where to download MK40DN512ZVLQ10-FR datasheet PDF?

The MK40DN512ZVLQ10-FR datasheet PDF is available on the official NXP website at nxp.com (part page MK40DN512ZVLQ10), on DigiKey's product detail page under the datasheet tab, and on archive aggregators such as alldatasheet.com. The Kinetis K40 sub-family datasheet is the authoritative reference document covering electrical characteristics, pinout, and memory maps.

Where to find MK40DN512ZVLQ10-FR pinout?

The pinout for the MK40DN512ZVLQ10-FR is documented in the Kinetis K40 sub-family datasheet on nxp.com, typically in the 'Signal Multiplexing and Pin Assignments' chapter. The 144-LQFP package has 144 pins with multiplexed peripheral functions; engineers should consult the Pin Assignment table in the datasheet and the Kinetis peripheral configuration tool (KSDK/PEx) to assign functions.

What are the key specifications of MK40DN512ZVLQ10-FR that engineers should know?

Headline specs are: ARM Cortex-M4 core with FPU at 100 MHz (1.25 DMIPS/MHz), 512 KB program flash, 128 KB SRAM, supply voltage 1.71-3.6 V supporting 1.8 V/3.3 V systems, Full-Speed USB OTG with charger detect, Ethernet MAC, CAN, segment-LCD up to 320 segments, 16-bit SAR ADC, 12-bit DAC, industrial -40C to +105C operation, and 144-LQFP (20 x 20 mm) package.

Is MK40DN512ZVLQ10-FR RoHS compliant?

NXP MK40DN512ZVLQ10-FR is RoHS compliant per NXP's Kinetis K40 product family compliance statements. The LQFP-144 package uses lead-free (Pb-free) plating suitable for reflow soldering in compliance with JEDEC J-STD-020. The full REACH and conflict-minerals compliance statements should be confirmed via NXP's product-compliance page for the latest certificate.

What is the difference between MK40DN512ZVLQ10 and MK40DN512ZVMD10?

The MK40DN512ZVLQ10 ships in 144-LQFP (LQ suffix) while the MK40DN512ZVMD10 ships in 144-MAPBGA (MD suffix); both contain the same K40 silicon with 512 KB flash, 128 KB SRAM, and 100 MHz operation. The LQFP part is preferred for hand-soldering, prototypes, and lower-density designs; the BGA part is favored for production designs needing smaller board area and better thermal performance. They are not drop-in compatible due to the different package footprint.

Données de référence d'ingénierie pour MK40DN512ZVLQ10-FR — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose MK40DN512ZVLQ10-FR when designing industrial or consumer HMIs that need segment-LCD displays up to 320 segments, Full-Speed USB OTG for peripherals or service ports, Ethernet MAC for connectivity, 100 MHz Cortex-M4 performance, and 512 KB flash for complex firmware with 128 KB SRAM for buffers. It is the right pick for industrial segment-LCD equipment, smart energy meters, USB medical dongles, and POS terminals. If your design only needs smaller flash/RAM (256 KB flash, 64 KB SRAM), the MK50DX256CLL10 or MK40DX256VLQ10 are drop-in compatible at lower cost. If you need true 100 MBit Ethernet PHY connectivity (versus just MAC), consider the K60 sub-family (MK60DN512VLQ10) which adds MII/RMII interfaces. For ultra-low-power battery designs, the MKL26Z128VMC4 with Cortex-M0+ would be a better choice but requires a smaller BGA package and PCB redesign.

Comparaison avec les alternatives

Paramètre	Ce produit	MK40DN512ZVLQ10	MK50DX256CLL10	MK40DX256VLQ10	MK50DN512CLL10
Brand	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors	NXP Semiconductors
Package	144-LQFP (20x20 mm)	144-LQFP (20x20 mm) - same	144-LQFP (20x20 mm) - same	144-LQFP (20x20 mm) - same	144-LQFP (20x20 mm) - same
Program Flash	512 KB	512 KB	256 KB (-50%)	256 KB (-50%)	512 KB (same)
SRAM	128 KB	128 KB	64 KB (-50%)	128 KB (same)	128 KB (same)
Core / Max Speed	Cortex-M4 / 100 MHz	Cortex-M4 / 100 MHz	Cortex-M4 / 100 MHz	Cortex-M4 / 100 MHz	Cortex-M4 / 100 MHz
Segment-LCD Support	Up to 320 segments	Up to 320 segments	Up to 320 segments (K50 also has LCD)	Up to 320 segments	Up to 320 segments (K50 also has LCD)
Operating Voltage Range	1.71 V to 3.6 V	1.71 V to 3.6 V	1.71 V to 3.6 V	1.71 V to 3.6 V	1.71 V to 3.6 V
USB / Ethernet	Full-Speed USB OTG / 10/100 MAC	Full-Speed USB OTG / 10/100 MAC	Full-Speed USB OTG / No Ethernet on K50 base	Full-Speed USB OTG / 10/100 MAC	Full-Speed USB OTG / No Ethernet on K50 base
Operating Temperature	-40C to +105C	-40C to +105C	-40C to +105C	-40C to +105C	-40C to +105C

Principaux différenciateurs

Segment-LCD up to 320 segments integrated (vs MKL26Z128VMC4)
Higher flash density at 100 MHz (vs MK40DX256VLQ10)
Same 144-LQFP package and pinout across sub-family (vs MK40DN512ZVMD10)
Full-Speed USB OTG with charger detect (vs MKL04Z32VFM4)

Notes de conception

MK40DN512ZVLQ10-FR operates from a single 1.71-3.6 V supply; decoupling requires a 100 nF X7R ceramic cap within 5 mm of each VDD pin (multiple pins across the package), plus a bulk 4.7 uF or larger tantalum/ceramic cap on the main supply rail. Estimated: with 100 MHz operation and 1.8 V rail, peak current can reach ~80 mA; derate the LDO or DC-DC for at least 100 mA. For USB applications, the VREGIN pin requires its own filtered supply and decoupling; share it with a ferrite bead if VBUS is also used to power the regulator input. Sequence the segment-LCD bias (VLL1/VLL2/VLL3) supplies only after core VDD is stable to avoid inrush into the LCD charge-pump.

The 144-LQFP (20 x 20 mm) package requires 4-layer PCB with continuous ground plane under the chip for thermal dissipation and signal-integrity. Estimated: without a thermal pad, theta_JA is approximately 50-60 C/W; at 1.8 V / 100 MHz / 100 mA load, junction temperature rise above ambient is approximately 5-6 C - usually acceptable. Route USB DP/DM as 90-ohm differential with length matching within 2 mm; route the Ethernet MII/RMII signals with parallel-impedance-controlled traces. Keep the segment-LCD driving pins separated from high-frequency digital signals to avoid LCD waveform corruption. Add a 4.7 uF bulk cap on each analog supply pin (VDDA, VREFH) placed within 10 mm.

Three common pitfalls: (1) Forgetting the JTAG/SWD debug header - the Kinetis K40 requires a 4-wire (SWD) or 20-pin JTAG header for in-system programming; adding a 2x5 header with GND, VTREF, SWDIO, SWCLK, NRST keeps the design debuggable. (2) Mishandling the segment-LCD charge-pump configuration - incorrect register writes to the LCD control registers produce ghost segments or contrast errors; consult the K40 reference manual chapter on SLCD and the KSDK clock configuration tool. (3) Not setting the security byte on production parts - the K40 has a flash security feature that prevents external read-back; if set incorrectly during programming, the device becomes permanently locked unless mass-erase is performed via JTAG.

Although the 144-LQFP has reasonable thermal performance, applications driving high GPIO current (e.g., 20mA per pin on multiple pins simultaneously) should verify the package's internal power dissipation budget. Estimated: with 4 GPIO pins each sourcing 10 mA at 3.3 V into LEDs, internal dissipation is about 0.13 W; well within the 1 W budget. Power-hungry applications should arrange high-current pins on adjacent ports to spread heat across the die, and use the central thermal pad area beneath the part (with vias to bottom thermal plane) for max heat extraction. The industrial temperature grade -40C to +105C supports harsh-environment deployment.

Informations de conformité

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sans plomb

Yes

Sans halogène

Yes

Minerais de conflit

Compliant

RoHS and REACH compliance per NXP product page. Industrial temperature grade; not AEC-Q100 qualified (choose MK40N512-compatible automotive part for AEC-Q100 apps). Packaging suffix -FR indicates factory tray per NXP Kinetis packaging code convention.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Manufacturer Product Page, Distributor, Distributor, Octopart, Manufacturer Datasheet

Recherches associées

MK40DN512ZVLQ10-FR MK40DN512ZVLQ10-FR datasheet NXP Kinetis K40 microcontroller Kinetis K40 100MHz Cortex-M4 144-LQFP Kinetis MCU segment LCD MK40DN512ZVLQ10-FR industrial HMI MK40DN512ZVLQ10 vs MK40DX256VLQ10 MK40DN512ZVLQ10-FR drop-in replacement MK40DN512ZVLQ10-FR buy what is segment LCD controller 320 segments Kinetis K40 USB OTG pinout NXP K40 Cortex-M4 512KB flash

Composants & termes associés

NXP Semiconductors MK40DN512ZVLQ10-FR Freescale Semiconductor MK40DN512ZVLQ10 MK40DX256VLQ10 MK50DN512CLL10 ARM Cortex-M4 FPU microcontroller Kinetis K40 sub-family Full-Speed USB OTG Ethernet MAC segment LCD controller 144-LQFP RoHS REACH industrial temperature grade 16-bit SAR ADC FlexCAN