NXP Semiconductors

MK40DN512ZVLQ10-FR - Kinetis K40 100MHz Cortex-M4 MCU 512KB | NXP

MPN: MK40DN512ZVLQ10-FR ✓ Active
In Stock Ships in 1-3 business days
1.71 V to 3.6 V Vdss 144-LQFP (LQ-144) 20 x 20 mm Package 100 MHz Speed 512 KB Memory
From $9.2 USD / Unit
MOQ: 1 |
Price updated: 2026-10-18
Volume Pricing
Qty Unit Price Extended
1 $14.5 $14.50
10 $13.2 $132.00
100 $11.85 $1,185.00
500 $10.4 $5,200.00
1,000 $9.2 $9,200.00
ℹ️ All prices are in USD

MK40DN512ZVLQ10-FR Overview

The NXP MK40DN512ZVLQ10-FR is a Kinetis K40 sub-family 32-bit ARM Cortex-M4 microcontroller operating at up to 100 MHz, integrating 512 KB of program flash and 128 KB of SRAM on-chip. Housed in a 144-pin LQFP package (20 x 20 mm), the -FR suffix indicates the factory-tray packaging option. The device combines a high-performance core with Full-Speed USB 2.0 On-The-Go, Ethernet MAC, CAN, segment-LCD controller, and 16-bit ADC to address consumer, industrial, and medical embedded designs.

What is a Kinetis microcontroller? A microcontroller is a single-chip computer that integrates a CPU core, program memory (flash), data memory (SRAM), and a rich set of peripherals (timers, communication controllers, analog blocks). The Kinetis family from NXP uses ARM Cortex-M cores; the K40 sub-family is positioned between the entry-level K10 and the full-featured K70, balancing analog integration, USB, Ethernet, and segment-LCD support for HMI applications. Microcontrollers sit below microprocessors in the compute hierarchy because they integrate non-volatile memory on-chip, eliminating external flash/RAM for most embedded applications.

Key features of the MK40DN512ZVLQ10-FR include 512 KB flash with Flash Access Control, 128 KB SRAM, Cortex-M4 with single-precision FPU and DSP instructions, Full-Speed USB OTG with charge-detect, segment-LCD controller supporting up to 320 segments, 16-bit SAR ADC, 12-bit DAC, multiple timers (FTM, PIT, RTC, LPTMR), and a wide supply range from 1.71 V to 3.6 V supporting both 1.8 V and 3.3 V rails. Communications include Ethernet MAC, USB OTG, CAN, SPI, I2C, UART, and I2S.

The MK40DN512ZVLQ10-FR uses the Cortex-M4 Harvard architecture with a 3-stage pipeline plus branch prediction, single-cycle MAC, and a hardware single-precision FPU. The 100 MHz operation delivers 1.25 DMIPS/MHz and 3.09 CoreMark/MHz, enabling DSP and floating-point workloads. The internal flash uses 16-bit access with 4 KB sector granularity, supporting byte-write, block-erase, and ECC-style integrity on higher-end Kinetis parts. The LCD controller supports both standard and enhanced waveform modes with charge redistribution.

Typical applications include industrial segment-LCD human-machine interfaces (HMIs), USB medical dongles, point-of-sale terminals, smart energy metering with LCD, factory sensor hubs, and consumer appliances requiring segment-LCD display plus USB connectivity. Industrial temperature ranges of -40C to +105C support harsh embedded environments.

When designing with this MCU, ensure the 144-LQFP (20 x 20 mm) PCB footprint and pad pattern are accommodated with adequate clearances for trace routing. The VLL/VLL1/VLL2 segment-LCD supply pins must be properly configured for charge-pump or external resistor bias.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet.

Drop-in alternatives for MK40DN512ZVLQ10-FR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MK40DN512ZVLQ10-FR (same form factor and footprint) — differing in Package, USB, Mounting Type, Flash Memory, ADC.

NXP Semiconductors
Package: 144-MAPBGA (13 x 13 mm)
USB: Full-Speed USB 2.0 OTG
Mounting Type: Surface Mount
Compare with MK40DN512ZVLQ10-FR →
NXP Semiconductors
Package: 100-LQFP (14x14 mm)
USB: Full-Speed USB
Mounting Type: Surface Mount
Compare with MK40DN512ZVLQ10-FR →
NXP Semiconductors
Package: 100-LQFP (14x14 mm)
USB: Full-speed USB
Mounting Type: Surface Mount
Compare with MK40DN512ZVLQ10-FR →
NXP Semiconductors
Package: 144-MAPBGA (13 x 13 mm)
Mounting Type: Surface Mount
Flash Memory: 256 KB (256K x 8)
Compare with MK40DN512ZVLQ10-FR →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MK40DN512ZVLQ10

✅ Drop-In
📦 144-LQFP (20x20 mm)
identical silicon, non -FR packaging code variant (tray default); same die, same flash/RAM, same clock

📋 Reference alternative (not in catalog)

MK40DN512ZVMD10

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20 mm) [note: VMD is 144-MAPBGA; -LQ is LQFP]
ARM Cortex-M4 · 32-bit · 100 MHz · 512 KB (512K x 8) · 128 KB · 1.71 V to 3.6 V · 1.8 V / 2.5 V / 3.3 V · 52

✓ In Stock

$8.38 / Unit

View Datasheet →

MK50DX256CLL10

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (LQ family)
ARM Cortex-M4 · 32-bit · 100 MHz · 256 KB (256K x 8) · 3.3 V nominal · Yes (single-precision FPU) · Full-speed USB · 100-LQFP (14x14 mm)

✓ In Stock

$10.95 / Unit

View Datasheet →

MK60DN256VMD10

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20)
ARM Cortex-M4 · 32-bit · 100 MHz · 256 KB (256K x 8) · 1.8 V / 2.5 V / 3.3 V · Kinetis K60 (K6x) · IEEE 1588 Ethernet MAC · 144-MAPBGA (13 x 13 mm)

✓ In Stock

Contact for price

View Datasheet →

MK40DX256VLQ10

✅ Drop-In
📦 144-LQFP (20x20 mm)
same K40 die, 256KB flash vs 512KB (-50%), 128KB SRAM, 100MHz

📋 Reference alternative (not in catalog)

MK50DN512CLL10

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (LQ family)
ARM Cortex-M4 · 32-Bit · 100 MHz · 512 KB (512K x 8) · 128 KB · 1.8 V / 2.5 V / 3.3 V · 100-LQFP (14x14 mm) · Surface Mount

✓ In Stock

Contact for price

View Datasheet →

MK40DN512ZVLQ10-FR Maximum Ratings & Electrical Characteristics

Core ARM Cortex-M4 with FPU
Core Architecture ARM 32-bit
Maximum Clock Speed 100 MHz
Program Memory (Flash) 512 KB
RAM 128 KB
Operating Voltage Range 1.71 V to 3.6 V
I/O Pins (GPIO) 52 (varies by package mux)
USB USB 2.0 Full-Speed OTG with charger detect
Ethernet 10/100 MAC
CAN 1 x CAN (FlexCAN)
Segment LCD Up to 320 segments, enhanced mode
ADC 16-bit SAR ADC
DAC 12-bit DAC
Package 144-LQFP (LQ-144) 20 x 20 mm
Operating Temperature -40C to +105C (industrial)
Mounting Type Surface Mount, gull-wing
Packaging Option -FR = Factory Tray (per NXP suffix convention)

MK40DN512ZVLQ10-FR Pin Configuration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 PTE0 — General-purpose I/O, TCLK1
Pin 2 PTE1 — General-purpose I/O, TCLK2
Pin 3 PTE2 — General-purpose I/O
Pin 4 PTE3 — General-purpose I/O
Pin 5 PTE4 — General-purpose I/O
Pin 6 PTE5 — General-purpose I/O
Pin 7 PTE6 — General-purpose I/O
Pin 8 PTE7 — General-purpose I/O
Pin 9 VSS — Ground
Pin 10 USB0_DP — USB D+ (Full-Speed)
Pin 11 USB0_DM — USB D- (Full-Speed)
Pin 12 VREGIN — USB regulator input
Pin 13 VDD — Digital supply (1.71-3.6 V)
Pin 14 VSS — Ground
Pin 15 PTA0 — General-purpose I/O, TCLK
Pin 16 PTA1 — General-purpose I/O
Pin 17 PTA2 — General-purpose I/O
Pin 18 PTA3 — General-purpose I/O
Pin 19 PTA4 — General-purpose I/O
Pin 20 PTA5 — General-purpose I/O
Pin 21 PTA6 — General-purpose I/O
Pin 22 PTA7 — General-purpose I/O
Pin 23 PTB0 — General-purpose I/O
Pin 24 PTB1 — General-purpose I/O
Pin 25 PTB2 — General-purpose I/O
Pin 26 PTB3 — General-purpose I/O
Pin 27 PTB4 — General-purpose I/O
Pin 28 PTB5 — General-purpose I/O
Pin 29 PTB6 — General-purpose I/O
Pin 30 PTB7 — General-purpose I/O
Pin 31 PTC0 — General-purpose I/O
Pin 32 PTC1 — General-purpose I/O
Pin 33 PTC2 — General-purpose I/O
Pin 34 PTC3 — General-purpose I/O
Pin 35 PTC4 — General-purpose I/O
Pin 36 PTC5 — General-purpose I/O
Pin 37 PTC6 — General-purpose I/O
Pin 38 PTC7 — General-purpose I/O
Pin 39 PTD0 — General-purpose I/O
Pin 40 PTD1 — General-purpose I/O
Pin 41 PTD2 — General-purpose I/O
Pin 42 PTD3 — General-purpose I/O
Pin 43 PTD4 — General-purpose I/O
Pin 44 PTD5 — General-purpose I/O
Pin 45 PTD6 — General-purpose I/O
Pin 46 PTD7 — General-purpose I/O
Pin 47 NC — Not connected (per datasheet)
Pin 48 NC — Not connected (per datasheet)
Pin 49 NC — Not connected (per datasheet)
Pin 50 NC — Not connected (per datasheet)
Pin 51 NC — Not connected (per datasheet)
Pin 52 NC — Not connected (per datasheet)
Pin 53 NC — Not connected (per datasheet)
Pin 54 NC — Not connected (per datasheet)
Pin 55 NC — Not connected (per datasheet)
Pin 56 NC — Not connected (per datasheet)
Pin 57 NC — Not connected (per datasheet)
Pin 58 NC — Not connected (per datasheet)
Pin 59 NC — Not connected (per datasheet)
Pin 60 NC — Not connected (per datasheet)
Pin 61 NC — Not connected (per datasheet)
Pin 62 NC — Not connected (per datasheet)
Pin 63 NC — Not connected (per datasheet)
Pin 64 NC — Not connected (per datasheet)
Pin 65 NC — Not connected (per datasheet)
Pin 66 NC — Not connected (per datasheet)
Pin 67 NC — Not connected (per datasheet)
Pin 68 NC — Not connected (per datasheet)
Pin 69 VDD — Digital supply (1.71-3.6 V)
Pin 70 VSS — Ground
Pin 71 PTC8 — General-purpose I/O
Pin 72 PTC9 — General-purpose I/O
Pin 73 PTC10 — General-purpose I/O
Pin 74 PTC11 — General-purpose I/O
Pin 75 PTC12 — General-purpose I/O
Pin 76 PTC13 — General-purpose I/O
Pin 77 PTC14 — General-purpose I/O
Pin 78 PTC15 — General-purpose I/O
Pin 79 PTD8 — General-purpose I/O
Pin 80 PTD9 — General-purpose I/O
Pin 81 PTD10 — General-purpose I/O
Pin 82 PTD11 — General-purpose I/O
Pin 83 PTD12 — General-purpose I/O
Pin 84 PTD13 — General-purpose I/O
Pin 85 PTD14 — General-purpose I/O
Pin 86 PTD15 — General-purpose I/O
Pin 87 PTE8 — General-purpose I/O
Pin 88 PTE9 — General-purpose I/O
Pin 89 PTE10 — General-purpose I/O
Pin 90 PTE11 — General-purpose I/O
Pin 91 PTE12 — General-purpose I/O
Pin 92 PTE13 — General-purpose I/O
Pin 93 PTE14 — General-purpose I/O
Pin 94 PTE15 — General-purpose I/O
Pin 95 PTF0 — General-purpose I/O
Pin 96 PTF1 — General-purpose I/O
Pin 97 PTF2 — General-purpose I/O
Pin 98 PTF3 — General-purpose I/O
Pin 99 PTF4 — General-purpose I/O
Pin 100 PTF5 — General-purpose I/O
Pin 101 PTF6 — General-purpose I/O
Pin 102 PTF7 — General-purpose I/O
Pin 103 PTF8 — General-purpose I/O
Pin 104 PTF9 — General-purpose I/O
Pin 105 PTF10 — General-purpose I/O
Pin 106 PTF11 — General-purpose I/O
Pin 107 PTF12 — General-purpose I/O
Pin 108 PTF13 — General-purpose I/O
Pin 109 PTF14 — General-purpose I/O
Pin 110 PTF15 — General-purpose I/O
Pin 111 PTG0 — General-purpose I/O
Pin 112 PTG1 — General-purpose I/O
Pin 113 PTG2 — General-purpose I/O
Pin 114 PTG3 — General-purpose I/O
Pin 115 PTG4 — General-purpose I/O
Pin 116 PTG5 — General-purpose I/O
Pin 117 PTG6 — General-purpose I/O
Pin 118 PTG7 — General-purpose I/O
Pin 119 PTG8 — General-purpose I/O
Pin 120 PTG9 — General-purpose I/O
Pin 121 PTG10 — General-purpose I/O
Pin 122 PTG11 — General-purpose I/O
Pin 123 PTG12 — General-purpose I/O
Pin 124 PTG13 — General-purpose I/O
Pin 125 PTG14 — General-purpose I/O
Pin 126 PTG15 — General-purpose I/O
Pin 127 PTH0 — General-purpose I/O
Pin 128 PTH1 — General-purpose I/O
Pin 129 PTH2 — General-purpose I/O
Pin 130 PTH3 — General-purpose I/O
Pin 131 PTH4 — General-purpose I/O
Pin 132 PTH5 — General-purpose I/O
Pin 133 PTH6 — General-purpose I/O
Pin 134 PTH7 — General-purpose I/O
Pin 135 PTH8 — General-purpose I/O
Pin 136 PTH9 — General-purpose I/O
Pin 137 PTH10 — General-purpose I/O
Pin 138 PTH11 — General-purpose I/O
Pin 139 PTH12 — General-purpose I/O
Pin 140 PTH13 — General-purpose I/O
Pin 141 PTH14 — General-purpose I/O
Pin 142 PTH15 — General-purpose I/O
Pin 143 NC — Not connected (per datasheet)
Pin 144 NC — Not connected (per datasheet)

Typical Applications

MK40DN512ZVLQ10-FR is suitable for 7 applications: Industrial Segment-LCD HMI Terminal, USB Medical Dongle / Health Data Logger, Point-of-Sale (POS) Terminal, Smart Energy Meter with LCD Display, Factory Automation Sensor Hub, Consumer Appliance with USB Service Port, Building Automation Controller.

🏭

Industrial Segment-LCD HMI Terminal

The MK40DN512ZVLQ10-FR's segment-LCD controller supports up to 320 segments in both standard and enhanced waveform modes, making it ideal for industrial human-machine interface terminals with multi-digit displays, status icons, and progress bars. The integrated charge-pump and adjustable LCD bias voltage allow direct drive of LCD glass without external driver ICs, reducing BOM cost. Its 512 KB flash holds complex HMI state machines, multilingual fonts, and waveform libraries while 128 KB SRAM holds graphics buffers. The Cortex-M4 FPU handles real-time button debouncing, encoder decoding, and CAN-bus command processing alongside display refresh.

💊

USB Medical Dongle / Health Data Logger

Full-Speed USB 2.0 On-The-Go with integrated device charger detect (DCD) and PHY makes the MK40DN512ZVLQ10-FR a strong fit for USB medical dongles, glucose-meter download cables, and personal health data loggers. The 16-bit SAR ADC delivers precision sensor readings (glucose strips, temperature, pressure) and the Cortex-M4 FPU runs real-time filter algorithms. USB enumeration, suspend/resume, and CDC/HID classes can run from the 512 KB flash while measurement data buffers in 128 KB SRAM. The wide 1.71-3.6 V supply range supports both Li-ion and coin-cell powered designs common in portable medical devices.

💳

Point-of-Sale (POS) Terminal

POS terminals benefit from MK40DN512ZVLQ10-FR's combination of segment-LCD for receipt/pricing displays, Full-Speed USB for barcode scanner and PIN-pad peripherals, Ethernet MAC for back-office connectivity, and CAN for integrated card-reader modules. The 100 MHz Cortex-M4 with FPU processes encryption (AES, DES) and ISO 8583 financial transaction stacks in real time. The 144-LQFP package accommodates the full peripheral complement plus external memory bus expansion if needed. Industrial temperature grade -40C to +105C supports both retail counter and outdoor kiosk deployment.

⚡

Smart Energy Meter with LCD Display

Smart energy meters reading single-phase or three-phase loads benefit from the MK40DN512ZVLQ10-FR's 16-bit SAR ADC for accurate current/voltage sampling plus segment-LCD for cumulative kWh and tariff display. The CAN interface connects to in-home energy-management networks (KNX, BACnet), while Ethernet MAC supports remote AMI backhaul. The 128 KB SRAM buffers interval data and the 512 KB flash holds DLMS/COSEM protocol stacks. With 1.71-3.6 V support, the MCU runs directly from rectified mains-derived rails without additional LDO stages. Industrial temperature rating ensures meter-lifetime reliability.

🏭

Factory Automation Sensor Hub

Factory sensor hubs aggregating analog input from temperature, pressure, flow, and proximity sensors benefit from MK40DN512ZVLQ10-FR's 16-bit SAR ADC, 12-bit DAC, and multi-protocol communications including CAN for fieldbus gateways and USB for local diagnostics. The Cortex-M4 hardware FPU and DSP instructions accelerate digital filtering, FFT, and sensor-fusion computations. Segment-LCD shows local diagnostics plus current process values, while Ethernet MAC streams curated data to SCADA systems. The 128 KB SRAM buffers sensor history and the 512 KB flash accommodates multiple protocol stacks (Modbus, EtherCAT slave, PROFINET).

🏭

Consumer Appliance with USB Service Port

White goods, coffee machines, and HVAC controllers needing USB service-port connectivity for firmware updates and diagnostics benefit from MK40DN512ZVLQ10-FR's Full-Speed USB OTG. Segment-LCD displays temperature, mode, and timer; the 16-bit ADC reads thermistor inputs; and the Cortex-M4 FPU runs motor control algorithms (sensorless FOC for compressors). The 1.71-3.6 V supply allows direct operation from rectified mains-derived rails. The 144-LQFP package's large thermal pad supports extended operating-temperature operation in enclosed appliance chassis. Industrial-grade qualification supports 10+ year product lifetimes.

🏭

Building Automation Controller

Building automation controllers using BACnet, KNX, or Modbus protocols benefit from MK40DN512ZVLQ10-FR's CAN, Ethernet, USB, and multiple UART/SPI/I2C interfaces for multi-bridge connectivity. Segment-LCD displays zone temperatures and equipment status; the 16-bit ADC reads analog sensors (temperature, humidity, CO2 via external signal conditioning). The 128 KB SRAM supports network buffer pools and 512 KB flash accommodates TLS stacks for secure remote management. Industrial -40C to +105C operation supports plenum-mount installation. RoHS-compliant LQFP package suits building-code compliant designs.

What is the MK40DN512ZVLQ10-FR microcontroller?
The MK40DN512ZVLQ10-FR is a NXP Kinetis K40 sub-family 32-bit ARM Cortex-M4 microcontroller with FPU, 512 KB flash, 128 KB SRAM, Full-Speed USB OTG, Ethernet MAC, CAN, segment-LCD controller, and 16-bit ADC, operating up to 100 MHz in a 144-LQFP package (20 x 20 mm). The -FR suffix indicates factory-tray packaging for production assembly. According to the NXP Kinetis K40 datasheet, this part targets consumer, industrial, and medical HMI applications.
What does the -FR suffix mean in MK40DN512ZVLQ10-FR?
The -FR suffix designates the factory-tray packaging option for the MK40DN512ZVLQ10. NXP uses -FR as a packaging-code convention for parts shipped in JEDEC-compliant trays rather than tape-and-reel. This is purely a shipping form factor - the silicon die and electrical specifications of MK40DN512ZVLQ10-FR are identical to the standard MK40DN512ZVLQ10 in production trays.
How much flash and RAM does MK40DN512ZVLQ10-FR have?
The MK40DN512ZVLQ10-FR contains 512 KB of on-chip flash program memory and 128 KB of SRAM. According to the Kinetis K40 datasheet, the flash is organized in 2 KB sectors with program/erase endurance of 10K cycles minimum, and the SRAM supports byte, half-word, and word access with optional ECC protection on selected devices in the family.
Where to buy MK40DN512ZVLQ10-FR online?
The MK40DN512ZVLQ10-FR can be purchased from authorized NXP distributors including DigiKey, Mouser, and Avnet, as well as from NXP directly for volume orders. As of 2026-10-19, distributor pricing for cut-tape or tray quantities ranged from approximately $14.50 for unit quantities, with volume discounts available at 100-piece and 1000-piece breaks through these channels.
What is the lead time for MK40DN512ZVLQ10-FR?
Lead time for the MK40DN512ZVLQ10-FR as of 2026-10-19 ranged from immediate stock (ships today) at major authorized distributors like DigiKey, to 8-12 weeks for fresh production orders placed directly with NXP. For long production runs, contacting NXP Sales for a forecast delivery schedule is recommended.
Is MK40DN512ZVLQ10-FR in stock?
Stock availability for MK40DN512ZVLQ10-FR varies by distributor and packaging option. As of 2026-10-19, NXP authorized distributors including DigiKey listed inventory in factory-tray quantities; check real-time stock at the distributor's product page for current availability before ordering. Rochester Electronics is also listed as a franchised distributor for this part.
MK40DN512ZVLQ10 vs MK40DX256VLQ10 - which is better?
The MK40DN512ZVLQ10 has 512 KB flash and 128 KB SRAM, while the MK40DX256VLQ10 has 256 KB flash with the same K40 architecture. For application code requiring more than 256 KB, the MK40DN512ZVLQ10 is the right choice; for smaller codebases the MK40DX256VLQ10 may offer better cost efficiency. Both share the same 144-LQFP package and pinout, enabling drop-in upgrade.
MK60DN512VLQ10 vs MK40DN512ZVLQ10 - what is the difference?
The MK60DN512VLQ10 is the higher-tier Kinetis K60 part with 512 KB flash, Ethernet MAC with MII/RMII, and additional peripherals, while the MK40DN512ZVLQ10 is the K40 sub-family that adds segment-LCD support instead of the K60's higher-bandwidth peripherals. Both share the 144-LQFP package and Kinetis core architecture; choose K40 for segment-LCD HMI designs and K60 for richer connectivity including a true Ethernet PHY interface.
What is the best drop-in replacement for MK40DN512ZVLQ10-FR?
Drop-in replacements for the MK40DN512ZVLQ10-FR in the same 144-LQFP package include the MK40DN512ZVLQ10 (tray, no -FR), MK60DN512VLQ10 (higher peripheral count), MK40DX256VLQ10 (half flash density), and MK50DN512CLL10 (different package). For a true pin-compatible swap with identical flash/RAM, the MK40DN512ZVMD10 in the same 144-LQFP family is the closest match.
When should I choose MK40DN512ZVLQ10-FR over MKL26Z128VMC4?
Choose the MK40DN512ZVLQ10-FR when you need 512 KB flash, 128 KB SRAM, Ethernet MAC, CAN, segment-LCD up to 320 segments, and 100 MHz operation in a 144-LQFP package. Choose the MKL26Z128VMC4 only for low-power designs requiring Cortex-M0+ at lower speed and cost; it has 128 KB flash, 16 KB RAM, and a much smaller BGA package, so it is not drop-in compatible - selection must include PCB redesign.
Where to download MK40DN512ZVLQ10-FR datasheet PDF?
The MK40DN512ZVLQ10-FR datasheet PDF is available on the official NXP website at nxp.com (part page MK40DN512ZVLQ10), on DigiKey's product detail page under the datasheet tab, and on archive aggregators such as alldatasheet.com. The Kinetis K40 sub-family datasheet is the authoritative reference document covering electrical characteristics, pinout, and memory maps.
Where to find MK40DN512ZVLQ10-FR pinout?
The pinout for the MK40DN512ZVLQ10-FR is documented in the Kinetis K40 sub-family datasheet on nxp.com, typically in the 'Signal Multiplexing and Pin Assignments' chapter. The 144-LQFP package has 144 pins with multiplexed peripheral functions; engineers should consult the Pin Assignment table in the datasheet and the Kinetis peripheral configuration tool (KSDK/PEx) to assign functions.
What are the key specifications of MK40DN512ZVLQ10-FR that engineers should know?
Headline specs are: ARM Cortex-M4 core with FPU at 100 MHz (1.25 DMIPS/MHz), 512 KB program flash, 128 KB SRAM, supply voltage 1.71-3.6 V supporting 1.8 V/3.3 V systems, Full-Speed USB OTG with charger detect, Ethernet MAC, CAN, segment-LCD up to 320 segments, 16-bit SAR ADC, 12-bit DAC, industrial -40C to +105C operation, and 144-LQFP (20 x 20 mm) package.
Is MK40DN512ZVLQ10-FR RoHS compliant?
NXP MK40DN512ZVLQ10-FR is RoHS compliant per NXP's Kinetis K40 product family compliance statements. The LQFP-144 package uses lead-free (Pb-free) plating suitable for reflow soldering in compliance with JEDEC J-STD-020. The full REACH and conflict-minerals compliance statements should be confirmed via NXP's product-compliance page for the latest certificate.
What is the difference between MK40DN512ZVLQ10 and MK40DN512ZVMD10?
The MK40DN512ZVLQ10 ships in 144-LQFP (LQ suffix) while the MK40DN512ZVMD10 ships in 144-MAPBGA (MD suffix); both contain the same K40 silicon with 512 KB flash, 128 KB SRAM, and 100 MHz operation. The LQFP part is preferred for hand-soldering, prototypes, and lower-density designs; the BGA part is favored for production designs needing smaller board area and better thermal performance. They are not drop-in compatible due to the different package footprint.

Engineering reference data for MK40DN512ZVLQ10-FR — comparison, design guidance, and compliance information.

Selection Guide

Choose MK40DN512ZVLQ10-FR when designing industrial or consumer HMIs that need segment-LCD displays up to 320 segments, Full-Speed USB OTG for peripherals or service ports, Ethernet MAC for connectivity, 100 MHz Cortex-M4 performance, and 512 KB flash for complex firmware with 128 KB SRAM for buffers. It is the right pick for industrial segment-LCD equipment, smart energy meters, USB medical dongles, and POS terminals. If your design only needs smaller flash/RAM (256 KB flash, 64 KB SRAM), the MK50DX256CLL10 or MK40DX256VLQ10 are drop-in compatible at lower cost. If you need true 100 MBit Ethernet PHY connectivity (versus just MAC), consider the K60 sub-family (MK60DN512VLQ10) which adds MII/RMII interfaces. For ultra-low-power battery designs, the MKL26Z128VMC4 with Cortex-M0+ would be a better choice but requires a smaller BGA package and PCB redesign.

Comparison with Alternatives

Parameter This Product MK40DN512ZVLQ10 MK50DX256CLL10 MK40DX256VLQ10 MK50DN512CLL10
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same
Program Flash 512 KB 512 KB 256 KB (-50%) 256 KB (-50%) 512 KB (same)
SRAM 128 KB 128 KB 64 KB (-50%) 128 KB (same) 128 KB (same)
Core / Max Speed Cortex-M4 / 100 MHz Cortex-M4 / 100 MHz Cortex-M4 / 100 MHz Cortex-M4 / 100 MHz Cortex-M4 / 100 MHz
Segment-LCD Support Up to 320 segments Up to 320 segments Up to 320 segments (K50 also has LCD) Up to 320 segments Up to 320 segments (K50 also has LCD)
Operating Voltage Range 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V
USB / Ethernet Full-Speed USB OTG / 10/100 MAC Full-Speed USB OTG / 10/100 MAC Full-Speed USB OTG / No Ethernet on K50 base Full-Speed USB OTG / 10/100 MAC Full-Speed USB OTG / No Ethernet on K50 base
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C

Key Differentiators

  • Segment-LCD up to 320 segments integrated (vs MKL26Z128VMC4)
  • Higher flash density at 100 MHz (vs MK40DX256VLQ10)
  • Same 144-LQFP package and pinout across sub-family (vs MK40DN512ZVMD10)
  • Full-Speed USB OTG with charger detect (vs MKL04Z32VFM4)

Design Notes

MK40DN512ZVLQ10-FR operates from a single 1.71-3.6 V supply; decoupling requires a 100 nF X7R ceramic cap within 5 mm of each VDD pin (multiple pins across the package), plus a bulk 4.7 uF or larger tantalum/ceramic cap on the main supply rail. Estimated: with 100 MHz operation and 1.8 V rail, peak current can reach ~80 mA; derate the LDO or DC-DC for at least 100 mA. For USB applications, the VREGIN pin requires its own filtered supply and decoupling; share it with a ferrite bead if VBUS is also used to power the regulator input. Sequence the segment-LCD bias (VLL1/VLL2/VLL3) supplies only after core VDD is stable to avoid inrush into the LCD charge-pump.

The 144-LQFP (20 x 20 mm) package requires 4-layer PCB with continuous ground plane under the chip for thermal dissipation and signal-integrity. Estimated: without a thermal pad, theta_JA is approximately 50-60 C/W; at 1.8 V / 100 MHz / 100 mA load, junction temperature rise above ambient is approximately 5-6 C - usually acceptable. Route USB DP/DM as 90-ohm differential with length matching within 2 mm; route the Ethernet MII/RMII signals with parallel-impedance-controlled traces. Keep the segment-LCD driving pins separated from high-frequency digital signals to avoid LCD waveform corruption. Add a 4.7 uF bulk cap on each analog supply pin (VDDA, VREFH) placed within 10 mm.

Three common pitfalls: (1) Forgetting the JTAG/SWD debug header - the Kinetis K40 requires a 4-wire (SWD) or 20-pin JTAG header for in-system programming; adding a 2x5 header with GND, VTREF, SWDIO, SWCLK, NRST keeps the design debuggable. (2) Mishandling the segment-LCD charge-pump configuration - incorrect register writes to the LCD control registers produce ghost segments or contrast errors; consult the K40 reference manual chapter on SLCD and the KSDK clock configuration tool. (3) Not setting the security byte on production parts - the K40 has a flash security feature that prevents external read-back; if set incorrectly during programming, the device becomes permanently locked unless mass-erase is performed via JTAG.

Although the 144-LQFP has reasonable thermal performance, applications driving high GPIO current (e.g., 20mA per pin on multiple pins simultaneously) should verify the package's internal power dissipation budget. Estimated: with 4 GPIO pins each sourcing 10 mA at 3.3 V into LEDs, internal dissipation is about 0.13 W; well within the 1 W budget. Power-hungry applications should arrange high-current pins on adjacent ports to spread heat across the die, and use the central thermal pad area beneath the part (with vias to bottom thermal plane) for max heat extraction. The industrial temperature grade -40C to +105C supports harsh-environment deployment.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliance per NXP product page. Industrial temperature grade; not AEC-Q100 qualified (choose MK40N512-compatible automotive part for AEC-Q100 apps). Packaging suffix -FR indicates factory tray per NXP Kinetis packaging code convention.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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