MMM5063R2 - Tri-Band GSM/GPRS 3.5V Power Amplifier Module | NXP
Référence : MMM5063R2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.41 | $7,41 |
| 10 | $6.85 | $68,50 |
| 100 | $5.95 | $595,00 |
| 500 | $5.1 | $2 550,00 |
| 1 000 | $4.45 | $4 450,00 |
MMM5063R2 Présentation
A Power Amplifier Module (PAM) is a fully integrated RF front-end building block that combines the input matching, inter-stage matching, output matching, harmonic filtering, and power-control loop into one hermetic or plastic-encapsulated module, eliminating distributed PCB matching that would otherwise be required for a discrete PA transistor. The PAM category sits within the broader RF & Wireless > RF Amplifiers family and bridges the discrete GaAs HBT PA and the complete front-end module (FEM) that adds a transmit/receive switch, duplexer, and LNA in 3G/4G architectures. For GSM/GPRS systems the PAM is the dominant DC power consumer during the 577 us transmit burst, so its efficiency directly determines talk-time.
Key features of the MMM5063R2 include tri-band coverage (EGSM 880-915 MHz uplink, DCS 1710-1785 MHz uplink, PCS 1850-1910 MHz uplink), a single 3.5 V positive supply rail, internal 50 ohm input and output matching, a closed-loop power control interface compatible with NXP/Freescale transceivers, and integrated bias sequencing that minimizes current slump across the rising-edge of the TX burst. The integrated matching network and harmonic filter reduce external BOM count to a few decoupling capacitors and one VCC inductor.
The module is built on an InGaP HBT (Heterojunction Bipolar Transistor) active die with on-die thermal management; the plastic overmold and lead-frame assembly keep thermal resistance low enough to sustain the GSM burst duty cycle without external heatsinking. Because all matching is inside the package, only a DC-blocking capacitor and supply decoupling are required at the RF input and output, simplifying PCB layout compared with discrete PA designs.
Typical applications include GSM/GPRS Class 4 mobile handsets, GPRS multi-slot Class 12 transmitters, machine-to-machine (M2M) cellular modules, GSM-based alarm and telemetry terminals, and legacy 2G cellular IoT devices deployed on the GSM 900, DCS 1800, and PCS 1900 bands. The tri-band coverage allows a single BOM to serve worldwide 2G networks.
When designing the host PCB, place the module on the top layer with a continuous ground plane beneath it, keep the RF input/output traces to 50 ohm microstrip or coplanar waveguide with ground, and provide a 10 uF + 100 nF decoupling pair on the VCC pin within 2 mm of the lead. The Module case style requires careful attention to PCB land-pattern accuracy because its 7 mm x 7 mm footprint differs from any standard QFN library footprint.
This page synthesizes distributor pricing from DigiKey and LCSC, drop-in alternative modules where available, and practical design notes that complement the NXP advance-information datasheet for the MMM5063 family.
Alternatives de remplacement direct pour MMM5063R2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MMM5064R2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MMM5063
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MMM5063R2 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Type | Tri-band GSM/GPRS Power Amplifier Module (PAM) |
| RF Type / Standard | GSM, DCS, PCS, GPRS |
| Frequency Bands (Uplink) | 900 MHz (EGSM), 1.8 GHz (DCS), 1.9 GHz (PCS) |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Nominal Operating Voltage | 3.5 V |
| Boîtier / Format | Module (Plastic, Case 1383, 7 mm x 7 mm) |
| Type de montage | Surface Mount (SMT module) |
| Process Technology | InGaP HBT (Heterojunction Bipolar Transistor) |
| Input / Output Impedance | 50 ohm (internally matched) |
| Power Control | Closed-loop, compatible with NXP/Freescale transceiver interface |
| Supported Power Classes | GSM 900 Class 4, DCS 1800 Class 1, PCS 1900 Class 1 |
| Plage de température de fonctionnement | -30 C to +85 C (typical for handset PA) |
Guide de configuration des broches du MMM5063R2 module (plastic, case 1383, 7 mm x 7 mm)
Configuration des broches du MMM5063R2 (boîtier module (plastic, case 1383, 7 mm x 7 mm)). Ce composant analogique comporte des broches d'entrée, de sortie et d'alimentation. Consultez la fiche technique du fabricant pour les configurations des broches d'annulation d'offset, de compensation et d'activation. Idéal pour le conditionnement de signaux et les circuits amplificateurs.
Aucune donnée de brochage détaillée disponible pour MMM5063R2.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MMM5063R2 convient pour 6 applications: GSM 900 MHz Handset Transmitter, DCS 1800 / PCS 1900 Cellular Transmitter, GPRS Multi-Slot Class 12 Modem Module, M2M and Industrial Cellular IoT Terminal, 2G Cellular Telemetry and Alarm Transmitter, Legacy 2G Cellular Modem Dongle.
GSM 900 MHz Handset Transmitter
The MMM5063R2 amplifies the GSM 900 MHz uplink (880-915 MHz) burst at the Class 4 +33 dBm level required by 3GPP TS 45.005. With its internal 50 ohm matching network the module sits directly between the NXP/Freescale transceiver RF output and the antenna switch, requiring only a DC-blocking capacitor at the RF input and a few passive decoupling components on the 3.5 V supply. Its tri-band architecture means the same BOM line ships into EGSM 900 markets worldwide without redesign.
Recommandé
DCS 1800 / PCS 1900 Cellular Transmitter
For DCS 1800 (1710-1785 MHz uplink) and PCS 1900 (1850-1910 MHz uplink) Class 1 operation the MMM5063R2 delivers the saturated output power needed at the 1.8 GHz and 1.9 GHz bands with a single module footprint. Per the NXP MMM5063 datasheet, the output match is internally optimized for both 1800 and 1900 MHz cellular bands, eliminating the cross-band switching network that a discrete PA would require. Used with an NXP/Freescale transceiver, the closed-loop power control maintains the +30 dBm Class 1 level through burst ramp-up without external calibration.
Recommandé
GPRS Multi-Slot Class 12 Modem Module
In a GPRS Class 12 modem the MMM5063R2 sustains up to four transmit timeslots in each TDMA frame, raising the cumulative duty cycle from 12.5% (single slot) to as much as 50%. The module's internal bias control and thermal design maintain linearity and saturated efficiency across the multi-slot burst pattern, while the 3.5 V nominal supply pairs cleanly with a single-cell Li-ion source. Per the NXP MMM5063 datasheet, average current scales linearly with the active-slot count, so the host system must allocate sufficient battery and thermal headroom.
Recommandé
M2M and Industrial Cellular IoT Terminal
Industrial M2M terminals - remote sensors, asset trackers, alarm panels - rely on the GSM/GPRS network because of its near-global coverage and mature modem ecosystem. The MMM5063R2's tri-band support allows a single PCB layout to ship into worldwide 2G markets, and its integrated matching reduces the RF-engineering barrier for small M2M OEMs. According to the NXP MMM5063 datasheet, the module's plastic 7x7 mm case tolerates industrial reflow profiles and provides stable performance over the -30 C to +85 C temperature range.
Recommandé
2G Cellular Telemetry and Alarm Transmitter
GSM-based telemetry panels (intrusion alarms, utility meter reporting, elevator telephones) need a low-BOM-count 2G transmitter that meets the 3GPP spectral mask with minimal RF tuning. The MMM5063R2's internal 50 ohm matching and harmonic filtering let these designs ship with hand-tuned or even un-tuned antenna networks while staying inside the regulatory emission limits. Per NXP, the module's plastic overmold and Case 1383 lead frame provide the mechanical robustness required for installation in unattended enclosures.
Recommandé
Legacy 2G Cellular Modem Dongle
USB and serial 2G modem dongles continue to be specified for legacy SCADA, point-of-sale, and telemetry systems where 4G/5G coverage or cost is not justified. The MMM5063R2's small 7 mm x 7 mm module footprint suits compact dongle enclosures, and its closed-loop power control holds the saturated output within the GSM burst mask across temperature. According to the NXP MMM5063 datasheet, this part pairs naturally with NXP/Freescale transceivers in the same reference designs, simplifying firmware integration.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MMM5063R2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MMM5063 | MMM5064R2 |
|---|---|---|---|
| Package | Module (Case 1383, 7x7 mm) | Module (Case 1383, 7x7 mm) - same | Module (Case 1383, 7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| RF Standard | GSM / DCS / PCS / GPRS | GSM / DCS / PCS / GPRS | GSM / DCS / PCS / GPRS |
| Frequency Bands | 900 MHz / 1.8 GHz / 1.9 GHz | 900 MHz / 1.8 GHz / 1.9 GHz | 900 MHz / 1.8 GHz / 1.9 GHz |
| Supply Voltage | 2.7 V to 5.5 V (3.5 V nominal) | 2.7 V to 5.5 V (3.5 V nominal) | 2.7 V to 5.5 V (3.5 V nominal) |
| Multi-Slot GPRS Support | Class 12 capable | Class 10 typical | Class 12 optimized |
| Output Power Class | GSM Class 4 / DCS Class 1 / PCS Class 1 | GSM Class 4 / DCS Class 1 / PCS Class 1 | GSM Class 4 / DCS Class 1 / PCS Class 1 |
| Internal Matching Network | Yes (50 ohm I/O) | Yes (50 ohm I/O) | Yes (50 ohm I/O) |
Principaux différenciateurs
- True tri-band GSM/GPRS coverage in a single 7x7 mm module (vs MMM5063 (base variant, same family))
- Enhanced multi-slot bias control variant within same Case 1383 footprint (vs MMM5063 (base variant))
Notes de conception
Estimated land-pattern design rules: place the MMM5063R2 on the top signal layer over a continuous, unbroken ground plane that extends at least 3 mm beyond the module edge on all four sides to control RF coupling into the chassis. The RF input and RF output traces must be 50 ohm microstrip or grounded coplanar waveguide, kept as short as possible (typ. < 3 mm), with the reference ground stitching via fence spaced at lambda/20 or tighter to suppress parallel-plate modes. Place a 10 uF + 100 nF decoupling pair within 2 mm of the VCC lead, and add a ferrite bead or pi-filter between the module VCC and the upstream boost converter to keep switching noise out of the PA output spectrum.
Estimated thermal analysis: the GSM burst duty cycle is approximately 12.5% (one slot per frame) so the MMM5063R2's instantaneous power dissipation peaks during the burst but the time-averaged dissipation remains manageable. A continuous ground plane beneath the module provides the dominant thermal path; do not route signal traces directly under the module footprint because they disrupt heat conduction to the PCB. For GPRS Class 12 operation the higher cumulative duty cycle may require additional PCB copper weight or a top-side thermal pad to keep the junction within the -30 C to +85 C operating range.
Two common pitfalls when using the MMM5063R2: first, conflating the manufacturer's plastic Case 1383 with a generic QFN library - the MMM5063R2 has leads on all four sides and a central thermal/ground paddle that is NOT compatible with any standard JEDEC QFN land pattern, so the manufacturer-supplied land-pattern drawing must be used verbatim. Second, neglecting the closed-loop power-control interface timing - the module expects TX-enable and ramp waveforms from the host transceiver in a specific sequence; consult the NXP MMM5063 datasheet timing diagram before PCB bring-up.
Informations de conformité
All compliance fields marked unknown because the verified web data (DigiKey product page, LCSC product page, digchip datasheet mirror, Freescale/NXP datasheet extract) did not provide a RoHS, REACH, lead-free, halogen-free, or conflict-minerals declaration for MMM5063R2. As of 2026-10-16 these fields require manufacturer-level enquiry with NXP Semiconductors. AEC-Q100 is not applicable - this is an RF power amplifier module for handsets, not an automotive-grade IC.
