MPC5554AZP132 - 32-Bit 132MHz Power MCU, 2MB Flash, 416-PBGA | NXP
Référence : MPC5554AZP132 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $324.21 | $324,21 |
| 10 | $305.5 | $3 055,00 |
| 100 | $280 | $28 000,00 |
| 500 | $252 | $126 000,00 |
| 1 000 | $228 | $228 000,00 |
MPC5554AZP132 Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and a rich set of peripherals (timers, ADCs, communication controllers) on one silicon die. The MPC5554AZP132 belongs to the broader product type hierarchy of: microcontroller -> embedded MCU -> 32-bit MCU -> automotive-grade MCU -> power-architecture MCU -> Qorivva MPC55xx family. Its Power Architecture e200z6 core provides deterministic interrupt response critical for engine control and chassis systems, while the large 2 MB Flash allows entire powertrain control strategies to reside on-chip.
Key features highlighted in the NXP datasheet include 132 MHz core frequency, 2 MB (2M x 8) program Flash, the 416-pin PBGA package with 27x27 mm body and 1 mm ball pitch (MS-034AAL-1, TEPBGA-416), and the Qorivva family integration of multiple communication peripherals (FlexCAN, eMIOS, eQADC) for sensor and actuator interfacing. The part ships lead-free and supports industrial and automotive temperature ranges per the manufacturer datasheet.
The MPC5554 architecture pairs the e200z6 superscalar core with a variable-length encoding (VLE) instruction set, helping reduce code footprint and improving cache efficiency. The integrated peripheral set (multiple FlexCAN modules, enhanced queued analog-to-digital converters, eMIOS timer units, and DSPI channels) lets a single MPC5554 replace several smaller MCUs in a powertrain ECU.
Typical applications include automotive engine management ECUs, transmission control modules, body controllers, industrial servo drives, and any real-time control loop demanding deterministic execution. The wide peripheral integration and large Flash also suit heavy-duty vehicle hybrid control and aerospace-grade actuator management.
When designing with the MPC5554AZP132, ensure PCB layout accounts for the 1 mm BGA pitch - escape routing requires microvia or laser-drilled via technology. Decoupling must follow the manufacturer reference manual recommendations; failure to provide sufficient bulk and high-frequency capacitance causes supply-noise-induced ADC inaccuracy.
This page synthesizes distributor pricing, drop-in replacement options, and practical design notes not found in the manufacturer datasheet alone, helping procurement and design engineers evaluate the MPC5554AZP132 against current Qorivva alternatives.
Alternatives de remplacement direct pour MPC5554AZP132 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC5554AZP132 (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC5554MVR132
✅ Remplacement direct✓ En stock
$27.25 / unité
Voir la fiche technique →MPC5554MVR80
✅ Remplacement direct✓ En stock
$43 / unité
Voir la fiche technique →MPC5554AZP80
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC5553AZP132
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC5554BZP132
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC5554AZP132 Valeurs maximales et caractéristiques électriques
| Core Architecture | Power Architecture e200z6 |
| Core Bit Width | 32-bit |
| Maximum Core Frequency | 132 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| Boîtier | 416-PBGA (TEPBGA-416), 27 x 27 mm |
| Ball Pitch | 1.0 mm |
| Type de montage | Surface Mount (BGA) |
| Lead-Free Status | Lead free (per package marking MS-034AAL-1) |
| Product Family | Qorivva MPC55xx |
| Lifecycle Stage | NRND (Not Recommended for New Designs) |
| Peripheral Integration | FlexCAN, eMIOS, eQADC, DSPI (per datasheet reference manual) |
| Instruction Set | Power Architecture with VLE extension |
| Statut RoHS | Compliant (lead-free PBGA) |
Guide de configuration des broches du MPC5554AZP132 416-pbga (tepbga-416), 27 x 27 mm
Configuration des broches du MPC5554AZP132 (boîtier 416-pbga (tepbga-416), 27 x 27 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC5554AZP132.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC5554AZP132 convient pour 6 applications: Automotive Engine Management ECU, Transmission Control Module, Industrial Servo and Motor Drive, Body and Chassis Domain Controller, Aerospace Actuator Management, Hybrid and Electric Vehicle Power Electronics.
Automotive Engine Management ECU
The NXP MPC5554AZP132 was specifically designed for engine management ECUs, where its 132 MHz e200z6 core and 2 MB Flash provide enough headroom for full powertrain control algorithms. The integrated FlexCAN modules interface with body and chassis networks, while the eQADC handles crank and cam position sensors with deterministic sampling. According to the NXP product page, the part delivers up to five times the performance of legacy MPC500 devices, making it ideal for stratified-charge and hybrid powertrain strategies where loop time budgets are tight. The 416-PBGA package also gives automotive Tier-1 suppliers enough peripheral pins for multi-injector drive and oxygen-sensor conditioning.
Recommandé
Transmission Control Module
Transmission control modules (TCMs) require deterministic real-time response and reliable CAN communication, both delivered by the MPC5554AZP132. The e200z6 core runs shift scheduling algorithms at 132 MHz, while the integrated FlexCAN interfaces with the engine ECU and the rest of the vehicle network. The 2 MB Flash stores calibration tables, transmission maps, and diagnostic routines. The eMIOS timer units synchronize shift solenoids and the eQADC samples line pressure and gear-position sensors. Engineers building 6-10 speed automatic or DCT controllers will find the peripheral mix and pin count well matched to TCM I/O requirements.
Recommandé
Industrial Servo and Motor Drive
Outside automotive, the MPC5554AZP132 suits industrial servo drives and heavy-equipment motor controllers that benefit from the e200z6's deterministic interrupt response. With 132 MHz core speed and 2 MB Flash, the MCU can execute field-oriented control (FOC) loops at sub-10 kHz PWM frequencies while leaving bandwidth for EtherCAT or CANopen stacks on the FlexCAN peripherals. The 416-BGA package provides enough I/O for multi-axis quadrature encoder inputs and resolver excitation. According to the NXP datasheet, the part supports industrial temperature ranges and is designed for harsh electrical environments typical of factory automation.
Recommandé
Body and Chassis Domain Controller
Body controllers integrate lighting, HVAC, and chassis subsystems into one ECU; the MPC5554AZP132 has the Flash, peripheral mix, and CAN bandwidth to consolidate multiple smaller MCUs. Its 2 MB Flash holds VIN-specific calibration and OTA-capable firmware. The integrated FlexCAN modules bridge to powertrain and chassis CAN buses, while the DSPI peripherals drive LED matrix controllers. Designers appreciate the deterministic interrupt latency of the e200z6 core for safety-relevant features such as electronic stability control pre-processing. The 416-BGA package gives enough pinout for body-controller I/O without external bus expanders.
Recommandé
Aerospace Actuator Management
Aerospace actuator control units (ACUs) benefit from the MPC5554AZP132's real-time deterministic core and large Flash for flight-control law storage. The e200z6 core executes redundant control loops, while the eQADC samples redundant position feedback from LVDTs and RVDTs. The 416-PBGA package supports the high pin count needed for multi-channel actuator drive feedback. While the part is automotive-grade, the same architecture is reused in aerospace applications requiring deterministic interrupt response. Designers should verify radiation tolerance and certification against DO-178/DO-254 requirements before deployment.
Recommandé
Hybrid and Electric Vehicle Power Electronics
Hybrid and battery-electric vehicles need MCUs that can manage inverter switching at high PWM rates while executing supervisory state machines. The MPC5554AZP132's 132 MHz e200z6 core runs motor-control algorithms and CAN diagnostics simultaneously, while the 2 MB Flash stores lookup tables and fault logs. The eMIOS timer units generate complementary PWM with dead-time insertion, and the eQADC samples DC-link current and phase voltages. The 416-BGA package provides enough I/O for inverter gate-driver interfaces and isolated CAN transceivers. Engineers targeting ISO 26262 ASIL-C/D systems will find the deterministic core a strong starting point.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC5554AZP132 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC5554MVR132 | MPC5554MVR80 | MPC5554AZP80 | MPC5553AZP132 | MPC5554BZP132 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 416-PBGA (TEPBGA-416, 27x27 mm, 1 mm pitch) | 416-PBGA - same | 416-PBGA - same | 416-PBGA - same | 416-PBGA - same | 416-PBGA - same |
| Core Architecture | Power Architecture e200z6 | e200z6 | e200z6 | e200z6 | e200z6 | e200z6 |
| Core Frequency | 132 MHz | 132 MHz | 80 MHz (-39%) | 80 MHz (-39%) | 132 MHz | 132 MHz |
| Program Flash | 2 MB (2M x 8) | 2 MB | 2 MB | 2 MB | 1.5 MB (-25%) | 2 MB |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Tray/Packaging Suffix | AZP132 | MVR132 (alternate tray code) | MVR80 (80 MHz bin) | AZP80 (80 MHz bin) | AZP132 (Flash reduced) | BZP132 (alternate tray code) |
| Pin/Ball Count | 416 | 416 | 416 | 416 | 416 | 416 |
Principaux différenciateurs
- Highest-speed 132 MHz e200z6 bin in the MPC5554 family (vs MPC5554MVR80)
- Larger 2 MB Flash vs sibling MPC5553 (vs MPC5553AZP132)
- Same 416-BGA package as AZP132 variants (vs MPC5554BZP132)
Notes de conception
The 416-PBGA package uses a 1 mm ball pitch on a 27 x 27 mm body, which requires microvia or laser-drilled via technology for escape routing. Use a 4-6 layer PCB stack-up with the top layer dedicated to fan-out and a dedicated ground plane one layer below to control impedance and reduce crosstalk. NXP recommends thermal via arrays directly under the package center balls to provide a low-impedance path to the inner ground plane; without these vias, junction temperature can rise 15-20 C above datasheet figures.
Decoupling the MPC5554AZP132 requires both bulk and high-frequency capacitance placed as close as possible to each supply pin group (VDD, VDDA, VDDPLL). A typical reference design uses 10 uF bulk tantalum or ceramic plus 100 nF X7R per supply cluster; the PLL supply pin in particular needs a ferrite bead and 10 nF to prevent jitter from coupling into the e200z6 core clock. Per the manufacturer reference manual, insufficient decoupling manifests as ADC inaccuracy and CAN bus error frames under dynamic loads.
Do not assume all MPC5554 family parts are bit-identical at the silicon level - the Flash size differs between MPC5553 (typically 1.5 MB) and MPC5554 (2 MB), and the speed bin (80 vs 132 MHz) changes the maximum core frequency. Always verify the part marking against the NXP datasheet ordering table before PCBA. Also, the NRND lifecycle status means NXP will not accept new designs; engineers should plan a migration to a current Qorivva successor before committing to long-life production.
Informations de conformité
Lead-free PBGA per package marking MS-034AAL-1; AEC-Q100 status not confirmed in provided web data. NRND per NXP product page.
