MPC564CZP66 - 66MHz 32-bit PowerPC MCU, 512KB Flash, 388-BGA | NXP
Référence : MPC564CZP66 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.62 | $256,20 |
| 100 | $22.78 | $2 278,00 |
| 500 | $19.95 | $9 975,00 |
| 1 000 | $17.4 | $17 400,00 |
MPC564CZP66 Présentation
An automotive-grade microcontroller (MCU) is a high-reliability 32-bit or 16-bit processor designed and qualified for the harsh electrical, thermal, and vibration environments of vehicles. Within the system hierarchy, an MCU sits at the control tier above simple analog ICs and below application processors - coordinating sensor inputs, actuator outputs, and communication buses. The MPC564 family belongs to the Qorivva lineup, which is NXP's PowerPC-based automotive MCU portfolio positioned between the low-end S08/S12 families and the higher-end MPC5xx/MPC56xx multi-core devices.
Key differentiating specifications include 512 KB Flash, 66 MHz CPU clock, integrated FlexCAN module for CAN 2.0B networking, ETPU co-processor for high-resolution engine timing, 388-ball PBGA package at 27x27 mm, and 2.6V / 5V mixed-voltage I/O. The device targets -40 C to +85 C industrial/automotive under-hood thermal range and combines high-performance data manipulation with powerful peripheral subsystems.
The architecture pairs an e200 RISC core with dedicated timer processing hardware, allowing deterministic sub-microsecond event handling for crank/cam sensing, injection control, and anti-lock braking. Internal CMF_A (256 KB) and CMF_B (192 KB) Flash arrays provide partitioned code storage for safety and calibration separation, a common automotive safety pattern.
Typical applications include engine management units, electronic stability control, anti-lock braking systems, transmission controllers, and industrial real-time control nodes. Its FlexCAN and ETPU make it especially well-suited to drivetrain ECUs that demand deterministic bus arbitration and precise actuator timing.
When designing with this part, allocate adequate PCB area for the 27x27 mm BGA and follow NXP's recommended decoupling scheme to meet automotive EMC requirements. Designers should also evaluate migration paths to active Qorivva successors before committing to new designs, as the MPC564 family is in long-term support.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical BGA-layout design notes that go beyond the manufacturer datasheet overview.
Alternatives de remplacement direct pour MPC564CZP66 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC564CZP66 (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Mounting Type, Code Compression, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC563MZP56
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →MPC565MZP56
✅ Remplacement direct✓ En stock
$39.8 / unité
Voir la fiche technique →MPC563MZP66
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC564CZP66 Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC e200 RISC |
| Core Count | 1 (single-core) |
| Largeur du bus de données | 32-bit |
| Maximum CPU Clock | 66 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| Operating Voltage | 2.6 V / 5 V (mixed I/O) |
| Boîtier | 388-pin PBGA (27x27 mm) |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | -40 C to +85 C (industrial/automotive) |
| CAN Controller | FlexCAN (CAN 2.0B) |
| Time Processing Unit | Enhanced TPU (eTPU) co-processor |
| Automotive Qualification | AEC-Q100 / automotive grade |
Guide de configuration des broches du MPC564CZP66 388-pin pbga (27x27 mm)
Configuration des broches du MPC564CZP66 (boîtier 388-pin pbga (27x27 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC564CZP66.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC564CZP66 convient pour 6 applications: Engine Management Unit (ECU), Anti-Lock Braking System (ABS) Controller, Electronic Transmission Control Unit, Industrial Real-Time Control Node, Body Control Module (BCM), Chassis Domain Controller / Gateway.
Engine Management Unit (ECU)
The MPC564CZP66's 66 MHz e200 core, eTPU co-processor, and FlexCAN 2.0B make it a strong fit for gasoline and diesel engine ECUs. The eTPU delivers sub-microsecond timing resolution for crank/cam sensing, fuel injection pulse-width control, and knock-detection event capture, offloading these critical tasks from the CPU. At 66 MHz the e200 core has sufficient headroom for torque-based and model-based air-charge estimation loops. With 512 KB partitioned Flash (CMF_A + CMF_B), the MCU supports safety isolation between calibration data and application code per ISO 26262 patterns. FlexCAN enables integration into the vehicle powertrain CAN bus alongside transmission and ABS nodes.
Recommandé
Anti-Lock Braking System (ABS) Controller
ABS and electronic stability control require deterministic wheel-speed sampling and rapid solenoid actuation - precisely the workload the MPC564CZP66's eTPU is optimized for. The 66 MHz CPU handles slip-ratio calculation and brake-pressure modulation loops while the eTPU manages 4-channel wheel-speed input capture and PWM output to hydraulic valves. The -40 C to +85 C operating range and AEC-Q100 automotive qualification cover under-hood thermal stress. FlexCAN links the ABS ECU to the vehicle chassis network for yaw-rate sensor sharing with the steering and engine modules.
Recommandé
Electronic Transmission Control Unit
Modern automatic transmissions depend on the MPC564CZP66's combination of eTPU-driven shift solenoid timing and CAN-based gear-cluster networking. The e200 core runs shift scheduling and torque-converter clutch control algorithms, while the eTPU precisely sequences shift solenoids with microsecond accuracy to minimize shift shock. The 388-ball BGA exposes the external memory and peripheral buses required to interface with transmission pressure sensors and PWM valve drivers. FlexCAN integration allows the TCU to share engine torque requests and wheel-speed data with the ECU and ABS modules in real time.
Recommandé
Industrial Real-Time Control Node
Beyond automotive, the MPC564CZP66 serves in industrial PLC and motion-control nodes where deterministic event timing is critical. The eTPU can be programmed as a generic high-resolution timer/counter to drive stepper motor pulse trains or synchronized PWM inverters for AC drives. The 66 MHz e200 core runs the IEC 61131-3 application logic and Modbus/TCP or CANopen fieldbus stack. The wide -40 C to +85 C temperature range and BGA-based high-pin-count package suit harsh factory-floor deployments. FlexCAN provides CANopen master/slave connectivity for distributed I/O.
Recommandé
Body Control Module (BCM)
Body control modules aggregate lighting, door, mirror, and accessory control; the MPC564CZP66's FlexCAN and rich peripheral set support this integration role. At 66 MHz the e200 core handles LIN/CAN gateway logic, central body compute, and PWM-driven lighting dimming. The 512 KB Flash accommodates BCM application code plus diagnostics and UDS services required for OEM end-of-line programming. The wide-temperature PBGA package suits under-dash mounting where thermal stress is moderate but vibration is significant.
Recommandé
Chassis Domain Controller / Gateway
The MPC564CZP66 can serve as a CAN-to-CAN gateway bridging powertrain, chassis, and body CAN buses at different data rates. Its FlexCAN instances support simultaneous 500 kbps and 125 kbps networks with independent filtering. The 66 MHz CPU is sufficient for message routing tables, network management, and limited diagnostic aggregation. The 512 KB Flash fits UDS/OSEK network stack plus OEM calibration data. BGA packaging allows compact gateway module placement behind the dashboard.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC564CZP66 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC563MZP56 | MPC565MZP56 | MPC563MZP66 |
|---|---|---|---|---|
| Package | 388-PBGA (27x27) | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Clock | 66 MHz | 56 MHz | 56 MHz | 66 MHz |
| Core Architecture | PowerPC e200 | PowerPC e200 | PowerPC e200 | PowerPC e200 |
| FlexCAN | Yes (CAN 2.0B) | Yes | Yes | Yes |
| eTPU Co-Processor | Yes (Enhanced TPU) | Yes | Yes | Yes |
| Automotive Qualified | Yes (-40C to +85C) | Yes | Yes | Yes |
| Operating Voltage | 2.6V / 5V | 2.6V / 5V | 2.6V / 5V | 2.6V / 5V |
Principaux différenciateurs
- Highest speed grade in the MPC564 family at 66 MHz (vs MPC563MZP56)
- Larger 512 KB Flash with safety partitioning (vs MPC565MZP56)
- eTPU co-processor with deterministic event timing (vs Generic ARM Cortex-M automotive MCUs)
Notes de conception
The 388-ball PBGA at 27x27 mm requires via-in-pad or microvia technology for reliable breakout routing. Follow NXP's reference PCB layout with at least 4 PCB layers: one ground plane directly beneath the BGA to provide a low-impedance return path, plus dedicated power planes for 2.6V core and 5V I/O. Decouple each VDD/VSS pair with 100 nF X7R ceramic capacitors placed within 2 mm of the BGA balls. Unused balls should be connected to their assigned power or ground per the pinout table - do not leave floating, as this can affect BGA coplanarity during reflow.
Estimated: at 66 MHz and full peripheral activity, the MPC564CZP66 dissipates approximately 1.0-1.5 W. With the 388-PBGA package the theta_JA is approximately 20-25 C/W on a 4-layer JEDEC test board, giving a 30-40 C junction rise above ambient at typical automotive under-hood operating points. For under-hood placement at 85 C ambient, ensure adequate PCB copper pour on the top layer tied to the central ground balls to spread heat. Do not rely on the BGA alone for heat dissipation - a thermal pad or copper spreader may be required for fully sealed enclosures.
The MPC564CZP66 dual-bank Flash (CMF_A and CMF_B) requires careful partition management when erasing or programming at runtime; simultaneous access to both banks is restricted per the memory map. Ensure the eTPU microcode is loaded into the dedicated TPU RAM region, not the main system SRAM, and that the eTPU scheduler is initialized before the engine timer channels are enabled. FlexCAN mailboxes must be configured with explicit ID filtering - leaving mailboxes in default pass-all mode is a common source of bus-off errors during EMC transients.
The external memory bus on the MPC564CZP66 can drive high-edge-rate signals into the 388-ball BGA. Route address and data traces with matched impedance (typically 50 ohm single-ended to ground) and keep trace length matching within 25 mils for the byte groups. Use series damping resistors on heavily loaded address lines to reduce overshoot. For FlexCAN, the transceiver-to-MCU TXD/RXD traces should be kept under 50 mm and routed away from switching power and eTPU output traces to minimize conducted noise coupling.
When laying out the 388-ball PBGA, use NXP's recommended escape pattern with 0.5 mm pitch and dog-bone fan-out on inner layers, or alternatively a via-in-pad microvia structure with filled and plated-over vias for BGA pad flatness. Place the JTAG debug header (TDI/TDO/TCK/TMS/TRST) at the board edge with a 14-pin or 20-pin standard ARM/COP header to support NXP's CodeWarrior and Lauterbach TRACE32 debug probes. Leave a keep-out zone under the BGA thermal balls free of signal vias.
Informations de conformité
AEC-Q100 / automotive qualification is confirmed via NXP product page and DigiKey listing (automotive grade 'CZP' suffix). RoHS, REACH, lead-free, halogen-free, and conflict-mineral status were not present in the verified web data and are marked unknown - confirm with NXP RoHS/REACH declarations before compliance-critical designs.
