MPC566MVR56 - 32-Bit PowerPC MCU, 1MB Flash, 56MHz | NXP
Référence : MPC566MVR56 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $163.57 | $163,57 |
| 10 | $158.4 | $1 584,00 |
| 100 | $152.1 | $15 210,00 |
| 500 | $145.75 | $72 875,00 |
| 1 000 | $139.5 | $139 500,00 |
MPC566MVR56 Présentation
A microcontroller (MCU) is a single-chip computer that combines a CPU core, volatile and non-volatile memory, and a rich set of on-chip peripherals behind a standard bus matrix. The PowerPC MPC5xx family sits at the upper end of the 32-bit embedded MCU hierarchy, between simple ARM Cortex-M parts and higher-performance application processors. Its defining role is real-time deterministic control of complex electromechanical systems such as engine management units, body controllers, and industrial drives where a hard real-time response and floating-point math are both required in one die.
Key features include 1 MB of embedded flash with code compression (approximately 40% effective density improvement over the predecessor MPC565), 36 KB of SRAM, an integrated dual floating-point unit, and the rich MPC5xx peripheral set: dual CAN, SPI, SCI, a 32-channel ADC, and a 48-channel enhanced I/O subsystem. The 56 MHz core combined with the on-chip FPU accelerates closed-loop control math used in powertrain and chassis ECUs.
Architecturally, the MPC566 keeps the classic MPC5xx peripheral ring with the RCPU core, BDM/JTAG debug, a TPU3 time processor unit, and QADC modules. Code compression is optimized for non-cached automotive code, allowing 1 MB of compressed flash to address firmware that would otherwise exceed 1.4 MB of uncompressed storage. Hardware ECC on flash plus memory protection enables ISO 26262-class safety integration when paired with the standard NXP safety manuals.
Typical applications include automotive engine management ECUs, transmission control units, body and chassis controllers, industrial servo drives, and any high-temperature embedded control system that needs PowerPC code compatibility. The combination of FPU, large flash, and automotive temperature grade makes it well-suited for powertrain-class work.
When designing with this device, plan the PCB layout for the 1.27 mm pitch BGA and budget for the 388-ball socket or reflow profile. The MPC566 is rated NRND/EOL on NXP's product page, so confirm long-term supply and review migration options to MPC55xx/MPC56xx successors before committing to a new design.
This page synthesizes distributor pricing, drop-in Qorivva-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MPC566MVR56 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC566MVR56 (même facteur de forme et même empreinte) — différant par Operating Temperature, Code Compression, Floating Point Unit, Mounting Type, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC565MVR56
✅ Remplacement direct✓ En stock
$27.1 / unité
Voir la fiche technique →MPC566MZP56
✅ Remplacement direct✓ En stock
$24.5 / unité
Voir la fiche technique →MPC565MZP56
✅ Remplacement direct✓ En stock
$39.8 / unité
Voir la fiche technique →MPC565CZP56
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC565MVR56
✅ Remplacement direct✓ En stock
$27.1 / unité
Voir la fiche technique →MPC566MVR56 Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC MPC5xx (Qorivva, Power Architecture) |
| Core Width | 32-Bit |
| Maximum Clock Speed | 56 MHz |
| Program Memory Size | 1 MB (1M x 8) FLASH |
| RAM Size | 36 KB |
| Floating Point Unit | Dual precision FPU + BCC (Burst Code Compression) |
| Boîtier | 388-PBGA (27x27 mm) |
| Température de fonctionnement | -40 °C to +125 °C (Automotive Grade) |
| Type de montage | Surface Mount (BGA) |
| On-chip Peripherals | Dual CAN, SPI, SCI, TPU3, QADC, EIO |
| ADC Channels | 32-channel QADC (qualifier ADC) |
| Debug Interface | BDM / JTAG |
| Code Compression | Yes (BCC), optimized for non-cached automotive code |
| Statut RoHS | Compliant (per distributor listings) |
| Series | MPC566 / Qorivva MPC5xx |
Guide de configuration des broches du MPC566MVR56 388-pbga (27x27 mm)
Configuration des broches du MPC566MVR56 (boîtier 388-pbga (27x27 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC566MVR56.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC566MVR56 convient pour 6 applications: Automotive Engine Management ECU, Transmission Control Unit (TCU), Body and Chassis Controller, Industrial Servo Drive, Agricultural / Off-Highway Vehicle ECU, Aerospace Flight Control Subsystem (Non-Primary).
Automotive Engine Management ECU
The MPC566MVR56 fits engine management ECUs because it combines a PowerPC core at 56 MHz, a dual precision floating-point unit, and 1 MB of code-compressed flash with 36 KB of SRAM. According to NXP's product documentation, the on-chip TPU3 time processor unit handles crank/cam timing without CPU intervention, while the QADC module digitizes injector and oxygen-sensor feedback at the rates needed for closed-loop air-fuel control. AEC-Q100-class automotive temperature grade (-40 °C to +125 °C) is required under-hood. Compared to a switching-power alternative LDO topology, the MPC566MVR56 fits here because the engine ECU demands deterministic real-time latency rather than the lowest quiescent current; the same package footprint also allows engineers to A/B between MPC566 and MPC565 silicon during NXP's last-time-buy window.
Recommandé
Transmission Control Unit (TCU)
The MPC566MVR56 is a strong fit for automatic transmission control units, where the dual precision floating-point unit accelerates the complex clutch-pressure and shift-scheduling math. The Power Architecture core runs the supervisory real-time loop while the FPU offloads vector math in a single cycle. On-chip dual-CAN interfaces connect to the powertrain CAN bus, and 1 MB of code-compressed flash holds multi-gear calibration maps. NXP rates the part for the automotive -40 °C to +125 °C range required for transmission housings. Compared with the MPC565MVR56 predecessor, the MPC566MVR56's BCC compression allows roughly 40% larger calibration datasets without external memory - critical for modern 8-10 speed transmissions.
Recommandé
Body and Chassis Controller
The MPC566MVR56's combination of 56 MHz PowerPC core, 36 KB SRAM, dual CAN, SPI, and SCI, plus a 32-channel QADC, fits body and chassis controllers where multiple sensor inputs and actuator outputs must be coordinated. Automotive temperature grade ensures it survives under-hood and chassis-mounted environments. The on-chip TPU3 unit can manage PWM-driven electric power-steering valves or active suspension actuators with sub-microsecond jitter. Compared to smaller ARM Cortex-M MCUs, the MPC566MVR56 offers more deterministic interrupt latency and the floating-point unit that engineers often need for advanced stability-control math, at the cost of higher active current and a 388-ball BGA footprint.
Recommandé
Industrial Servo Drive
The MPC566MVR56 suits industrial servo drives because the dual precision floating-point unit accelerates the Park/Clarke transforms and PID loops used in vector control of three-phase motors. The PowerPC core provides deterministic interrupt response, which is critical for high-speed current-loop sampling in servo drives. The 32-channel QADC digitizes phase currents and DC-bus voltage at the rates needed for field-oriented control. Although the part is qualified to the automotive -40 °C to +125 °C range, the same silicon functions well in industrial cabinets. Compared with smaller Cortex-M microcontrollers, the MPC566MVR56 offers the FPU and the larger flash footprint for advanced motion-control firmware.
Recommandé
Agricultural / Off-Highway Vehicle ECU
The MPC566MVR56's automotive-grade -40 °C to +125 °C rating, dual CAN bus interfaces, and 1 MB of code-compressed flash fit ECUs for off-highway and agricultural equipment that must endure harsh temperature, vibration, and humidity environments. The TPU3 timer unit can drive injection and hydraulic solenoid timing with microsecond accuracy, while the dual FPU handles the engine-mapping math. Compared to consumer-grade Cortex-M parts, the MPC566MVR56's automotive-grade qualification and BGA package provide the ruggedness that off-highway OEMs expect. Power-rail design should use an automotive SBC such as the MC33903 for 5 V and CAN bus supply.
Recommandé
Aerospace Flight Control Subsystem (Non-Primary)
The MPC566MVR56 is occasionally used in non-primary aerospace subsystems such as auxiliary power-unit controllers, landing-gear position controllers, and environmental-control ECUs where deterministic real-time response and a wide temperature range are required. The 56 MHz PowerPC core with FPU handles sensor-fusion and PID loops, while dual CAN enables redundant bus communication. NXP's automotive qualification provides confidence in harsh thermal environments, though designers must add radiation-mitigation for any orbit-grade deployment. Compared with radiation-hardened aerospace MCUs, the MPC566MVR56 trades rad-tolerance for cost and floating-point performance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC566MVR56 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC565MVR56 | MPC566MZP56 | MPC565MZP56 | MPC565CZP56 | MPC565MVR56 (Rochester) |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (via Rochester) |
| Package | 388-PBGA (27x27 mm) | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same |
| Core Architecture | PowerPC MPC5xx (Qorivva) | PowerPC MPC5xx (same) | PowerPC MPC5xx (same) | PowerPC MPC5xx (same) | PowerPC MPC5xx (same) | PowerPC MPC5xx (same) |
| Maximum Clock Speed | 56 MHz | 56 MHz | 56 MHz | 56 MHz | 56 MHz | 56 MHz |
| Program Memory (Flash) | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| RAM Size | 36 KB | 36 KB | 36 KB | 36 KB | 36 KB | 36 KB |
| Burst Code Compression (BCC) | Yes | No (predecessor) | Yes | No (predecessor) | No (predecessor) | No (predecessor) |
| Operating Temperature | -40 °C to +125 °C (Automotive) | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| Lifecycle Status | NRND / EOL | NRND / EOL | NRND / EOL | NRND / EOL | NRND / EOL | Active (authorized long-term support) |
Principaux différenciateurs
- Burst Code Compression (BCC) for ~40% larger effective flash (vs MPC565MVR56)
- Higher density flash without external memory (vs MPC565MVR56)
- Pin-compatible ordering variants allow Pb-free/Pb-ball A/B sourcing (vs MPC566MZP56)
- Rochester Electronics authorized long-term stock for EOL silicon (vs MPC565MVR56 (Rochester))
Notes de conception
The MPC566MVR56 is rated to a junction temperature of +150 °C (typical for automotive AEC-Q100-grade MPC5xx MCUs) and an ambient operating range of -40 °C to +125 °C. Estimated: at full CPU activity on the 56 MHz core and typical 1.8 V core supply (~250 mA) plus 3.3 V I/O current, total package dissipation is roughly 1.5 W. Use a 4-layer PCB with a continuous ground pour stitched under the BGA and 8-12 thermal vias under the die to keep the junction-to-ambient thermal resistance in the datasheet's 15-20 °C/W range. Always measure delta_TJA on the final board.
The 388-PBGA 27x27 mm package uses 1.27 mm ball pitch and is designed for 4-layer PCB stack-up with microvia-in-pad recommended for escape routing. Decouple the 1.8 V core rail with 100 nF X7R placed within 5 mm of each VDD/VSS pair, plus a 4.7 µF bulk near the package. Keep the JTAG/BDM trace length under 50 mm and series-terminate at 33 Ω to avoid ringing. NXP's MPC566 hardware design guide contains the full reference layout.
Because the MPC566MVR56 is NRND/EOL on NXP's product page, the most common pitfall is committing to it for a new long-life design without a documented last-time-buy. Always order with a multi-year safety stock from authorized distributors (Heisener, DigiKey Marketplace/Rochester, Mouser) and qualify a migration target such as the NXP MPC56xx or S32K3xx family in parallel. Avoid generic broker sources for this part - counterfeit risk is elevated for EOL automotive MCUs.
The MPC566's external memory bus, if used, can run at 56 MHz with MCLK-synchronized bursts. Route address and data lines in matched-length groups (target skew < 200 ps) with series 33 Ω source termination. Place 50 Ω microstrip impedance to keep reflections below 10%. When migrating firmware from MPC565, recompute any cycle-count-dependent timing loops because BCC decompression introduces variable fetch latency that can change worst-case execution time.
Informations de conformité
RoHS and REACH compliance per NXP product page and distributor listings (as of 2026-10-18). AEC-Q100 qualified at the -40 °C to +125 °C automotive grade per NXP's MPC566 datasheet. Lead-free reflow profile standard for Pb-free 388-PBGA. Halogen-free status not explicitly stated in the provided data - confirm with NXP material declaration.
