MPC561MVR56 - 56MHz PowerPC Qorivva MCU, ROMless 388-PBGA | NXP
Référence : MPC561MVR56 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $62.72 | $62,72 |
| 10 | $58.4 | $584,00 |
| 100 | $54.1 | $5 410,00 |
| 500 | $49.85 | $24 925,00 |
| 1 000 | $45.2 | $45 200,00 |
MPC561MVR56 Présentation
An automotive microcontroller (MCU) is a microprocessor unit engineered for the harsh electrical, thermal, and vibration environments of vehicle electronics. Within the broader taxonomy, an MCU is a subset of microprocessors -> embedded processors -> semiconductors. The Qorivva family sits under NXP's automotive 32-bit MCU lineup and inherits Power Architecture instruction set compatibility from the PowerPC lineage, providing deterministic interrupt response and strong bit-manipulation performance that real-time control loops require.
Key features include a 32-bit PowerPC core, 32 analog-to-digital input channels for sensor interfacing, ROMless program memory architecture for maximum firmware flexibility, and a 56 MHz maximum clock frequency. The 388-PBGA package provides extensive I/O with 388 balls, suitable for high-pin-count automotive body, chassis, and powertrain applications. Per the NXP/Freescale datasheet summary, the device integrates powerful peripheral subsystems combining high-performance data manipulation capabilities.
Typical applications include engine management units, transmission control modules, body controllers, chassis electronics, and industrial real-time control systems. Its automotive qualification and rich peripheral set make it well suited to safety-relevant control loops where deterministic execution matters more than raw clock speed.
When designing with this part, allocate sufficient PCB area for the 27x27 mm BGA footprint and plan external program memory (NOR flash or similar) since the part is ROMless. Validate thermal design for the -40C to +125C operating envelope and review the BGA ballout before committing to a layout revision.
This page synthesizes distributor stock, drop-in same-package alternatives, parametric comparisons, and practical design notes that complement the manufacturer datasheet.
Alternatives de remplacement direct pour MPC561MVR56 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC561MVR56 (même facteur de forme et même empreinte) — différant par Program Memory Type, RoHS Status, Mounting Type, Package, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC563MVR56
✅ Remplacement direct✓ En stock
$64.1 / unité
Voir la fiche technique →MPC565MVR56
✅ Remplacement direct✓ En stock
$27.1 / unité
Voir la fiche technique →MPC561MVR56R2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC561MVR56 Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC MPC5xx (Qorivva) |
| Core Width | 32-bit |
| Fréquence d'horloge maximale | 56 MHz |
| Program Memory Type | ROMless (external memory required) |
| A/D Channels | 32 |
| Largeur du bus de données | 32-bit |
| Boîtier | 388-PBGA (27x27 mm) |
| Package Height | 1.95 mm |
| Type de montage | Surface Mount (BGA) |
| Plage de température de fonctionnement | -40C to +125C (Automotive Grade) |
| Processor Series | MPC500 / Qorivva |
| Terminal Form | Ball |
| Number of Terminals | 388 |
| Package Code / Shape | BGA / Square |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
Guide de configuration des broches du MPC561MVR56 bga / square
Configuration des broches du MPC561MVR56 (boîtier bga / square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC561MVR56.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC561MVR56 convient pour 6 applications: Engine Management Unit (ECU), Transmission Control Module, Body Control Module, Chassis Electronics (ABS/ESC), Industrial Real-Time Control, Automotive Gateway / Network Node.
Engine Management Unit (ECU)
The MPC561MVR56's 32-bit PowerPC core at 56 MHz and 32 A/D channels suit it to engine management ECUs where multiple crank, cam, oxygen, and pressure sensors must be sampled each control loop. The ROMless architecture lets OEMs pair the MCU with automotive-qualified NOR flash sized to their calibration strategy. Deterministic interrupt latency from the Power Architecture supports the real-time fuel-injection and ignition-timing loops that engine management demands. Automotive-grade temperature rating (-40C to +125C) and the 388-PBGA's high I/O count accommodate the underhood wiring harness without derating.
Recommandé
Transmission Control Module
Transmission control modules require deterministic real-time response for shift scheduling, torque management, and solenoid drive. The MPC561MVR56's PowerPC core delivers predictable interrupt latency, while the 32 A/D inputs accept multiple speed, pressure, and temperature sensor channels. The 388-PBGA package supports the large pin count needed for multi-speed transmission solenoids and CAN/LIN communication to the rest of the powertrain. ROMless boot lets OEMs encrypt calibration data in external flash for anti-tamper protection.
Recommandé
Body Control Module
Body control modules aggregate lighting, door, seat, mirror, and HVAC functions across many LIN/CAN nodes. The MPC561MVR56's 388 I/O balls accept the many PWM and digital outputs required for lighting drivers and actuator control, while the 56 MHz core executes body-network stacks comfortably. ROMless architecture lets the OEM load a single calibration across vehicle variants by switching external flash contents. The automotive -40C to +125C rating covers cabin and underhood mounting positions.
Recommandé
Chassis Electronics (ABS/ESC)
ABS and electronic stability control loops run at sub-millisecond cadence with strict determinism. The MPC561MVR56's PowerPC core and fast interrupt response meet this requirement, while its 32 A/D inputs handle wheel-speed, steering-angle, yaw-rate, and pressure sensors. The 388-PBGA exposes enough I/O for the multiple PWM channels driving hydraulic modulators. ROMless boot supports OEM-specific safety libraries loaded from certified external flash.
Recommandé
Industrial Real-Time Control
Outside automotive, the MPC561MVR56 suits industrial drives, robotics, and process control where deterministic response, abundant A/D channels, and the 388-BGA I/O are valued. The PowerPC core executes PID loops and fieldbus stacks at 56 MHz with low jitter. Industrial-grade PCB design and external memory selection allow the part to operate in factory automation environments. The wide -40C to +125C range covers most industrial cabinet and outdoor installations.
Recommandé
Automotive Gateway / Network Node
CAN, LIN, and FlexRay gateway nodes benefit from the MPC561MVR56's rich peripheral set and 388-BGA I/O for multiple bus interfaces. The PowerPC core runs AUTOSAR stacks and network management at 56 MHz with predictable latency. ROMless boot lets OEMs secure gateway firmware in tamper-resistant external flash. The automotive temperature range and NXP's long-term silicon support make it a fit for production gateway ECUs that must operate for 15+ years in the field.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC561MVR56 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC563MVR56 | MPC565MVR56 | MPC561MVR56R2 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 388-PBGA (27x27 mm) | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same |
| Core Architecture | PowerPC MPC5xx (32-bit) | PowerPC MPC5xx (32-bit) | PowerPC MPC5xx (32-bit) + FPU | PowerPC MPC5xx (32-bit) |
| Maximum Clock Frequency | 56 MHz | 56 MHz | 56 MHz | 56 MHz |
| Program Memory | ROMless (external) | Integrated flash | 1 MB integrated flash | ROMless (external) |
| A/D Channels | 32 | 32 | 32 | 32 |
| FPU | No | No | Yes | No |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
Principaux différenciateurs
- ROMless architecture for maximum firmware flexibility (vs MPC565MVR56)
- Lower BOM cost for memory-scalable programs (vs MPC563MVR56)
- Same-family silicon with predictable toolchain (vs Cross-brand automotive MCU)
Notes de conception
The 388-ball PBGA at 27x27 mm requires a 4+ layer PCB with matched-length routing for the external memory bus. Use 0.8 mm or 1.0 mm pitch escape routing and follow NXP's recommended BGA land pattern. Power planes should be placed adjacent to the ground plane to supply the transient current demands of the core without IR drop.
Because the MPC561MVR56 is ROMless, code cannot execute from internal memory on reset. Designers must boot from a pre-configured external flash device selected via reset configuration pins - omitting these pull resistors or mis-wiring the boot mode is a common bring-up failure. Validate the boot mode against the external memory datasheet before first power-up.
At 56 MHz the MPC561MVR56 dissipates meaningful power through the BGA balls; the 1.95 mm seated height limits the thermal path to PCB copper. Place thermal vias in the BGA land pattern and connect the inner power/ground planes directly under the package. For continuous -40C to +125C operation, derate clock frequency if junction temperature approaches the silicon limit.
Informations de conformité
RoHS, REACH, and conflict-minerals status were not explicitly listed in the verified distributor data and should be confirmed with NXP or the distributor of record. AEC-Q100 grade not specified in the verified web data.
