MPC7410VS400LE - PowerPC G4 MPU 400MHz 360-FCCLGA | NXP
Référence : MPC7410VS400LE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $39.5 | $39,50 |
| 10 | $35.2 | $352,00 |
| 100 | $29.8 | $2 980,00 |
| 500 | $24.5 | $12 250,00 |
| 1 000 | $21 | $21 000,00 |
MPC7410VS400LE Présentation
A microprocessor (MPU) is an integrated circuit that contains the central processing unit (CPU) of a computer system on a single chip. Within the embedded semiconductor hierarchy, an MPU sits below an application processor but above a microcontroller (MCU) in terms of raw compute throughput, and it typically relies on external memory (DDR, SRAM) and external peripherals rather than integrating them on-die. The MPC74xx family belongs to the PowerPC architecture lineage (originally AIM alliance: Apple-IBM-Motorola) and is positioned as a high-performance embedded RISC platform for non-PC workloads. Compared to ARM Cortex-A embedded MPUs, PowerPC G4 cores offer a 32-bit datapath with strong branch prediction and AltiVec-style SIMD extensions on select family members.
Key differentiating features of the MPC7410VS400LE include 400 MHz core clock, 32-bit data path, 64-bit external bus (as referenced by FindIC parametric records), integrated L1 cache, hardware MMU, and a 360-ball ceramic LGA package qualified for extended industrial temperature ranges. The -LE suffix in the ordering code denotes an industrial temperature grade (typically -40C to +105C), as also evidenced by Mouser product records labeling this part "NITRO R1.4 105C PB FREE". Compared to earlier MPC7400 parts, the MPC7410 adds an enhanced AltiVec vector unit, branch prediction improvements, and power-management hooks, while sharing the same pinout footprint as other MPC7410 VS-speed-grade variants.
Typical applications include enterprise networking line cards, industrial automation controllers, military and aerospace embedded platforms, legacy PowerPC-based single-board computers (VME, cPCI), and medical imaging controllers. The wide temperature grade also makes it suitable for outdoor telecom and rail-signaling equipment.
When designing with the MPC7410VS400LE, verify that the PCB land pattern matches the 360-ball FCCLGA 25 x 25 mm footprint exactly. Designers should follow NXP hardware reference manual recommendations for DDR memory topology, JTAG boundary-scan chain, and decoupling capacitor placement. Stencil aperture design and reflow profile must be qualified for ceramic LGA packages to avoid warpage-related reliability issues.
This page synthesizes distributor pricing, drop-in alternatives within the MPC74xx family, and design notes tailored to long-lifecycle embedded PowerPC designs not found in the datasheet alone.
Alternatives de remplacement direct pour MPC7410VS400LE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC7410VS400LE (même facteur de forme et même empreinte) — différant par Data Bus Width, Manufacturer, Maximum Clock Frequency, Mounting Type, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC7410VS500LE
✅ Remplacement direct✓ En stock
$162 / unité
Voir la fiche technique →MPC7410HX400LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC7410THX400LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7410VU500LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7410VU400LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC7410VS400LE Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC74xx PowerPC G4 |
| Core Architecture | PowerPC G4 RISC |
| Core Count | 1 |
| Largeur du bus de données | 32-bit (64-bit external per parametric records) |
| Fréquence d'horloge maximale | 400 MHz |
| Process Technology | 0.18 um CMOS |
| Tension d'alimentation | 1.8 V / 2.5 V / 3.3 V |
| Boîtier / Format | 360-FCCLGA (Flip-Chip Ceramic LGA), 25 x 25 mm |
| Pin / Ball Count | 360 |
| Température de fonctionnement | -40C to +105C (industrial "LE" grade per Mouser listing) |
| Type de montage | Surface Mount (LGA socket or solder) |
| Tray Packaging | Tray (per FindIC parametric record) |
| Lead-Free / PB-Free | Yes (per Mouser description: "PB FREE") |
| Instruction Set | PowerPC RISC |
| On-Chip Cache | L1 (instruction + data); L2 (per family datasheet) |
Guide de configuration des broches du MPC7410VS400LE 360-fcclga (flip-chip ceramic lga), 25 x 25 mm
Configuration des broches du MPC7410VS400LE (boîtier 360-fcclga (flip-chip ceramic lga), 25 x 25 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC7410VS400LE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC7410VS400LE convient pour 6 applications: Enterprise Networking Line Cards, VME / cPCI Single-Board Computers, Military and Aerospace Embedded Controllers, Industrial Automation PLCs, Medical Imaging Controllers, Rail-Signaling and Outdoor Telecom.
Enterprise Networking Line Cards
The MPC7410VS400LE fits enterprise networking line cards because its PowerPC G4 core delivers deterministic interrupt latency and 400 MHz throughput for packet classification, ACL lookups, and forwarding-plane tasks. With a 32-bit datapath, integrated MMU, and L1/L2 caches, it sustains line-rate processing at gigabit speeds when paired with external DDR memory and a network PHY. The -40C to +105C industrial temperature grade (LE suffix) also enables deployment in outdoor telecom cabinets and base-station equipment. Compared to ARM Cortex-A equivalents, the G4 core offers stronger branch prediction, which is critical for deep-packet-inspection firmware that walks hierarchical data structures on every packet. Designers should follow NXP hardware reference manual recommendations for DDR trace length matching and JTAG boundary-scan chain placement.
Recommandé
VME / cPCI Single-Board Computers
The MPC7410VS400LE is widely deployed in legacy VMEbus and CompactPCI single-board computers used in military, aerospace, and industrial automation systems. The 360-FCCLGA ceramic LGA package provides robust thermal performance and mechanical reliability for conduction-cooled slot-card environments, while the -40C to +105C industrial temperature grade matches MIL-STD-810 expectations. The PowerPC G4 instruction set is also widely supported by VxWorks, LynxOS, and Green Hills INTEGRITY real-time operating systems, easing firmware reuse. The 32-bit datapath is adequate for legacy VMEbus transfers, and the integrated MMU supports partitioned multi-process RTOS workloads. Designers should pair the MPU with ECC-protected DDR memory for high-reliability applications.
Recommandé
Military and Aerospace Embedded Controllers
The MPC7410VS400LE is well-suited for military and aerospace embedded controllers because of its industrial temperature grade, ceramic LGA package, and long product lifecycle. Aerospace programs favor PowerPC G4 because the architecture has extensive RTOS support and a stable software ecosystem spanning decades of deployment. The 400 MHz core clock and 32-bit datapath deliver ample throughput for flight-control peripherals, sensor fusion, and command/telemetry handling. Compared to consumer ARM Cortex parts, the MPC7410VS400LE offers deterministic interrupt response times that are critical for hard real-time control loops. Designers should add radiation-hardening or conformal coating at the PCB assembly step for high-altitude or space applications.
Recommandé
Industrial Automation PLCs
The MPC7410VS400LE fits industrial automation PLC platforms because its 400 MHz PowerPC G4 core can execute IEC 61131-3 logic scans, motion-control loops, and HMI rendering on a single chip. The 32-bit datapath and on-chip MMU support protected-mode RTOS execution (VxWorks, INTEGRITY) for safety-certified designs up to SIL-2/SIL-3. The -40C to +105C temperature grade and ceramic LGA package survive factory-floor vibration, humidity, and thermal cycling. Compared to microcontrollers, the MPU's MMU and larger address space make it easier to run a full Linux or RTOS stack alongside deterministic real-time firmware. Designers should follow IEC 61131-2 ESD and surge immunity guidelines at the I/O interface.
Recommandé
Medical Imaging Controllers
The MPC7410VS400LE is used in medical imaging controllers such as ultrasound front-ends, patient-monitoring gateways, and X-ray detector interfaces. Its 400 MHz core clock and PowerPC G4 SIMD extensions accelerate image pre-processing, beamforming, and FFT routines in real time. The -40C to +105C industrial temperature grade and ceramic LGA package support hospital and ambulatory deployment. Compared to low-power ARM Cortex MCUs, the MPU offers deterministic interrupt latency that is essential for safety-critical IEC 62304 software. Designers should add medical-grade isolation barriers and follow IEC 60601-1 EMI/ESD guidance at the I/O boundary.
Recommandé
Rail-Signaling and Outdoor Telecom
The MPC7410VS400LE fits rail-signaling controllers (interlocking, axle-counter, ATP) and outdoor telecom base-station controllers because of its industrial -40C to +105C temperature grade and ceramic LGA package. These applications demand 15-20 year product availability, deterministic real-time response, and high reliability under wide thermal swings; the PowerPC G4 architecture's long lifecycle and stable firmware ecosystem directly support these requirements. The 32-bit datapath is sufficient for SCADA, interlocking logic, and telemetry stream handling. Compared to commercial-grade ARM Cortex parts, the MPC7410VS400LE offers longer manufacturer support windows and more conservative silicon process nodes that resist single-event upset. Designers should add surge protection and conformal coating for trackside or outdoor cabinet installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC7410VS400LE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC7410VS500LE | MPC7410HX400LE | MPC7410THX400LE | MC7410VU500LE | MC7410VU400LE |
|---|---|---|---|---|---|---|
| Package | 360-FCCLGA (25x25) | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Frequency | 400 MHz | 500 MHz (+25%) | 400 MHz (same) | 400 MHz (same) | 500 MHz (+25%) | 400 MHz (same) |
| Core Architecture | PowerPC G4 RISC | PowerPC G4 RISC | PowerPC G4 RISC | PowerPC G4 RISC | PowerPC G4 RISC | PowerPC G4 RISC |
| Process Technology | 0.18 um CMOS | 0.18 um CMOS | 0.18 um CMOS | 0.18 um CMOS | 0.18 um CMOS | 0.18 um CMOS |
| Pin Count | 360 | 360 | 360 | 360 | 360 | 360 |
Principaux différenciateurs
- Industrial -40C to +105C temperature grade in ceramic LGA (vs MPC7410VS500LE)
- Long product lifecycle support (vs MC7448VU800ND)
- Same 360-FCCLGA package across speed grades (vs MC7410VU500LE)
Notes de conception
The 360-FCCLGA ceramic LGA package offers improved thermal conductivity over plastic BGA, but at 400 MHz with three supply rails the die still dissipates several watts under load. Designers should mount the part on a thermal pad or copper-invar heat spreader and verify junction temperature against the -40C to +105C ambient envelope. Estimated: at 1.8 V core and 400 MHz, assume ~3-4 W typical dissipation with worst-case derating; confirm with NXP hardware reference manual before finalizing thermal solution.
The ceramic LGA land pattern must exactly match the datasheet footprint, including pad diameter, pitch, and solder-mask defined (SMD) vs non-solder-mask defined (NSMD) pad choice. Stencil aperture design should target 0.9-1.0 of pad diameter for the 360-ball array, and reflow profile must be qualified for ceramic packages (ramp rate, soak, peak temperature) to avoid warpage-induced solder defects. Bulk + ceramic decoupling should be placed within 5 mm of each supply pin group.
Do not assume the MPC7410VS500LE is a transparent drop-in for the MPC7410VS400LE just because both share the same package: the +100 MHz core clock (+25%) requires re-qualifying oscillator selection, DDR timing closure, and any firmware that depends on cycle-accurate delays. Similarly, do not confuse the -LE industrial grade (-40C to +105C) with the -VX extended grade or commercial grade - all share the same package but have different operating envelopes and PCN lifecycles.
The DDR address, data, and clock signals on the MPC7410VS400LE require strict length matching per the NXP hardware reference manual. Estimated: typical DDR trace matching tolerance is +/-25 mils for clock vs DQS, with reference impedance 50 ohm single-ended and 100 ohm differential for clocks. Series-termination resistors on the address/command lines are typically required; route address/command on the same layer to minimize skew.
For the 32-bit (or 64-bit external) data bus operating at 400 MHz, the MPC7410VS400LE's signal-integrity margin is sensitive to via stubs, layer transitions, and connector parasitics. Use a stack-up with a dedicated ground plane adjacent to the DDR routing layer, minimize via count on high-speed signals, and place series damping resistors within 300 mils of the driver when SI simulation indicates overshoot/ringing above VDD * 0.3.
Informations de conformité
Lead-free (PB FREE) confirmed per Mouser product description. RoHS, REACH, halogen-free, and conflict-minerals declarations are not explicitly stated in the verified web data; request directly from NXP via the product compliance portal before production release.
