MPC7410VS500LE - PowerPC G4 MPU, 500MHz, 360-FCCLGA | NXP
MPN: MPC7410VS500LE ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $223.84 | $223.84 |
| 10 | $215 | $2,150.00 |
| 100 | $195 | $19,500.00 |
| 500 | $178 | $89,000.00 |
| 1,000 | $162 | $162,000.00 |
MPC7410VS500LE Overview
A PowerPC microprocessor is a reduced instruction set computing (RISC) CPU family originally developed by the Apple-IBM-Motorola alliance (AIM) and later managed by Freescale and NXP. The G4 generation extends the classic PowerPC instruction set with AltiVec, a 128-bit single-instruction multiple-data (SIMD) engine that accelerates parallel arithmetic on vector workloads. Within the broader taxonomy, the MPC7410VS500LE sits as: PowerPC G4 -> PowerPC MPC74xx -> Power Architecture MPU -> 32-bit embedded microprocessor -> IC. This hierarchy matters when engineers search parametric databases by architecture family.
Key features include a 500 MHz core frequency, full 128-bit AltiVec execution units, hardware double-precision FPU, dual 32 KB L1 caches (instruction + data), a high-bandwidth MPX system bus, and 0.13 µm process technology. The "VS" speed grade denotes 500 MHz operation at typical core voltages around 1.8 V with I/O at 2.5 V, and the "LE" suffix indicates lead-free / Pb-free terminal finish compliant with RoHS. The device supports industrial temperature operation to 105 °C under the NITRO product line.
Architecturally, the MPC7410VS500LE implements the BookE-enhanced PowerPC ISA, a 32-bit physical address space with MMU, and integrates the AltiVec vector engine on the same die as the scalar core. This single-die integration reduces latency between scalar and vector execution units, which is critical for DSP-style algorithms such as FIR filters, FFT butterflies, and color-space conversions. The 128-bit AltiVec datapath sustains up to eight 16-bit MAC operations per cycle in vector mode.
Typical applications include leading-edge embedded computing, network control and routing, telecom baseband signal processing, industrial imaging and printing pipelines, aerospace command-and-control computers, and long-life military/aerospace programs that demand extended supplier continuity. NXP markets this part under the NITRO brand specifically for industrial and extended-temperature designs.
When designing with this device, engineers should treat the 360-FCCLGA as a flip-chip ceramic land-grid array requiring a matched PCB land pattern, underfill consideration, and a controlled-impedance MPX bus layout. Thermal management must account for the ceramic BGA thermal resistance; use the manufacturer's IBIS and BSDL models for signal-integrity verification.
This page synthesizes current distributor pricing, end-of-life status indicators, and drop-in MPC74xx family alternatives that share the same FCCLGA-360 footprint - data the manufacturer's short-form product page does not aggregate in one place.
Drop-in alternatives for MPC7410VS500LE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC7410VS500LE (same form factor and footprint) — differing in Process Technology, Data Bus Width, Maximum Clock Frequency, Core Architecture, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesMPC7410VS500LE Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP USA Inc. (formerly Freescale, originally Motorola) |
| Product Type | 32-bit Embedded Microprocessor (MPU) |
| Series | MPC74xx (NITRO) |
| Core | PowerPC G4, 1 Core |
| Architecture | Power Architecture with AltiVec SIMD |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 500 MHz |
| Silicon Revision | R1.4 |
| Operating Temperature | 0 °C to 105 °C (NITRO industrial) |
| Process Technology | 0.13 µm CMOS |
| Core / I/O Voltage | 1.8 V core / 2.5 V I/O (typical) |
| L1 Cache | 32 KB instruction + 32 KB data |
| SIMD Engine | AltiVec 128-bit vector unit |
| FPU | Hardware double-precision floating-point |
| MMU | Yes (BookE-enhanced PowerPC) |
| System Bus | MPX high-bandwidth bus |
| Package | 360-FCCLGA, 25 x 25 mm, flip-chip ceramic BGA |
| Lead-Free (Pb-Free) | Yes (LE suffix) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
MPC7410VS500LE 360-fcclga, 25 x 25 mm, flip-chip ceramic bga Pin Configuration Guide
Pin configuration for MPC7410VS500LE (360-fcclga, 25 x 25 mm, flip-chip ceramic bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC7410VS500LE.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC7410VS500LE is suitable for 6 applications: Embedded Network Control and Routing, Telecom Baseband Signal Processing, Industrial Imaging and Printing Pipelines, Aerospace and Defense Command Computers, Medical Imaging Processing Subsystems, Industrial Robotics and Motion Control.
Embedded Network Control and Routing
The MPC7410VS500LE's 500 MHz PowerPC G4 core with 128-bit AltiVec SIMD and the high-bandwidth MPX system bus makes it a strong fit for embedded router/switch control planes where packet headers, route lookup tables, and QoS classification need to be processed per packet in tight latency budgets. Placed as the management CPU on a network appliance, the part accelerates AES/SHA transform primitives via AltiVec rotates and XORs, while the FPU handles traffic-shaping polynomial math. The 360-FCCLGA footprint integrates cleanly into a single-board appliance PCB; unlike an FPGA soft core, it delivers deterministic throughput without off-chip memory bottlenecks. Industrial 0-105C NITRO rating supports fanless chassis. Power is typically 5-10 W at 500 MHz, well within passive-heatsink thermal envelopes.
Recommended
Telecom Baseband Signal Processing
The 128-bit AltiVec vector engine accelerates DSP kernels central to telecom baseband: FIR filters, FFT butterflies, Viterbi trellis updates, and CRC calculations all benefit from the eight 16-bit MAC per cycle vector rate. Coupled with the hardware double-precision FPU for channel estimation, the MPC7410VS500LE delivers the single-thread throughput required for low-density base stations and small-cell modems. The MPX bus allows a 64-bit-wide attachment to a companion ASIC or FPGA fabric with cycle-accurate bus arbitration. Compared to a generic ARM Cortex-A9, the AltiVec SIMD provides a measurable advantage on parallel MACs without an OS offload. NITRO temperature grade suits outdoor base-station housings.
Recommended
Industrial Imaging and Printing Pipelines
Industrial imaging pipelines rely on per-pixel processing: demosaicing, color-space conversion, gamma correction, JPEG/MJPEG encode, halftone screening, and edge detection. AltiVec's 32 single-precision float ops per cycle or eight 16-bit MACs per cycle maps cleanly onto these kernels, offloading vectorizable stages from the scalar core. The MPC7410VS500LE in a 360-FCCLGA delivers this throughput alongside deterministic interrupt response, unlike a graphics-class SoC. In a printing pipeline, the part coordinates RIP, color match, and motor-control timing; the FPU handles spline interpolation for color tables. Long-term availability makes it a preferred choice for multi-decade printer production runs.
Recommended
Aerospace and Defense Command Computers
Aerospace and defense command-and-control computers prioritize deterministic performance, wide temperature tolerance, and multi-decade supplier continuity. The MPC7410VS500LE (NITRO 0-105C) and its ruggedized e2v siblings (PC7410VG500LE, PC7410MG500LE) trace the same FCCLGA-360 footprint, allowing a single PCB layout to be deployed across commercial, rugged, and full MIL-PRF-38535 screened BOM tiers. The PowerPC G4 architecture is well established in avionics and naval combat systems with mature RTOS support (VxWorks, INTEGRITY, LynxOS-178). AltiVec handles radar tracking filters, sonar beamforming, and SIGINT front-end preprocessing without burdening the OS scheduler.
Recommended
Medical Imaging Processing Subsystems
Medical imaging modalities (ultrasound beamforming, endoscopy video, dental X-ray, MRI back-end reconstruction) require sustained processing of streaming pixel data and reconstructed slices. The MPC7410VS500LE's AltiVec SIMD enables parallel processing of ultrasound beamforming convolution sums and color-Doppler autocorrelation, which directly reduces per-frame latency in ultrasound systems. The hardware FPU handles 3D MRI reconstruction and CT back-projection kernels efficiently. The 360-FCCLGA integrates into compact embedded medical PCBs; the NITRO industrial temperature rating supports medical-cart chassis. Long lifecycle supports 10-15 year medical equipment program sustainability requirements.
Recommended
Industrial Robotics and Motion Control
Industrial robots and CNC machines require deterministic multi-axis motion control, vision-guided pick-and-place, and real-time network protocols (EtherCAT, PROFINET, EtherNet/IP). The MPC7410VS500LE's 500 MHz scalar core sustains the 1 kHz multi-axis servo loop with AltiVec accelerating the inverse-kinematics matrix math for 6-DOF robot arms. The MPX bus attaches cleanly to FPGA-based EtherCAT MAC, keeping the cycle budget deterministic. The 360-FCCLGA is compatible with the ruggedized e2v variants for harsh factory-floor environments. NITRO rating suits chassis mounted near motors and VFDs without active cooling.
Recommended
Recommended Products Summary
Engineering reference data for MPC7410VS500LE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC7410VS400LE | MPC7410VS450LE | MPC7410VT500LE | PC7410VG500LE | PC7410MG500LE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | e2v Technologies | e2v Technologies |
| Package | 360-FCCLGA (25x25) | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same |
| Core Frequency | 500 MHz | 400 MHz (-20%) | 450 MHz (-10%) | 500 MHz (same) | 500 MHz (same) | 500 MHz (same) |
| Operating Temperature | 0 to 105 °C (NITRO) | 0 to 105 °C (NITRO) | 0 to 105 °C (NITRO) | 0 to 70 °C (commercial) | -40 to +110 °C (e2v rugged) | -40 to +110 °C (e2v military) |
| AltiVec SIMD | Yes, 128-bit | Yes, 128-bit | Yes, 128-bit | Yes, 128-bit | Yes, 128-bit | Yes, 128-bit |
| Architecture | PowerPC G4, 32-bit | PowerPC G4, 32-bit | PowerPC G4, 32-bit | PowerPC G4, 32-bit | PowerPC G4, 32-bit | PowerPC G4, 32-bit |
| Screening Level | Commercial / NITRO industrial | Commercial / NITRO industrial | Commercial / NITRO industrial | Commercial | e2v Rugged | MIL-PRF-38535 military |
| Lead-Free / RoHS | Yes (LE suffix) | Yes (LE suffix) | Yes (LE suffix) | Yes (LE suffix) | Yes (e2v) | Yes (e2v) |
Key Differentiators
- Industrial NITRO temperature rating (vs MPC7410VT500LE)
- Drops onto the same 360-FCCLGA footprint as e2v aerospace/military variants (vs PC7410MG500LE)
- Fully populated AltiVec 128-bit SIMD engine on die (vs MC7447AVU1000LB)
Design Notes
The 360-FCCLGA is a flip-chip ceramic BGA; thermal management typically requires a thermal interface material (TIM) coupled to a heatsink or chassis spreader. Estimated: at 500 MHz with typical 1.8 V core, power dissipation is approximately 5-8 W; designers should reference the manufacturer's theta_JA and theta_JC values, derate for ambient chassis temperature, and verify junction temperature stays below 105 °C in NITRO designs. Use multiple thermal vias under the die region of the land pattern to spread heat into inner copper planes.
The 360-FCCLGA requires a matched land-pattern footprint per the manufacturer mechanical drawing. Reference designators should be defined in PCB libraries before placing decoupling capacitors, and the MPX bus should be routed as a controlled-impedance bus with 50 Ω single-ended traces using the manufacturer's IBIS simulation models. Lead-free (LE) reflow requires compliance with JEDEC J-STD-020 peak reflow profile (typically 245 °C ±5 °C for SnAgCu alloys).
Do not assume the MPC7410VS500LE drop-pin compatible with later Freescale MPC744x/MPC745x families - those use a different package and bus protocol. Verify the BSDL/BSCAN boundary-scan file matches the silicon revision (R1.4) when planning in-system programming. Last-time-buy parts require proactive forecasting: initiate a 12-24 month buffer buy before formal EOL channel exhaustion, and qualify a drop-in second source (e.g. PC7410MG500LE from e2v) at the BOM tier.
Compliance Information
Lead-free (LE suffix) confirms RoHS compliance; AEC-Q100 is not applicable (MPU, not automotive IC); full REACH and conflict-minerals declarations available from NXP environmental compliance portal. Last-time-buy status per NXP product page; halogen-free status not explicitly published for this part - request from NXP environmental compliance if required.
