MPC8241LVR200D - PowerPC 603e MPU 200MHz 357-BGA | NXP
Référence : MPC8241LVR200D ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $51.95 | $51,95 |
| 10 | $49.36 | $493,60 |
| 100 | $44.16 | $4 416,00 |
| 500 | $39.97 | $19 985,00 |
| 1 000 | $36.78 | $36 780,00 |
MPC8241LVR200D Présentation
An integrated host processor (IHP) is a system-on-chip (SoC) class device that combines a CPU core, memory controller, and peripheral bridges into a single BGA package, eliminating the need for separate northbridge/southbridge ICs in cost-sensitive embedded designs. The MPC8241 belongs to the PowerQUICC II hierarchy: PowerQUICC II -> MPC82xx family -> integrated host processor -> embedded microprocessor -> semiconductor IC.
Key features include a 32-bit PowerPC 603e core at 200 MHz, integrated PCI bridge (32-bit/33 MHz PCI 2.2 compliant), DDR memory controller supporting up to 1 GB of PC1600/PC2100 DDR SDRAM, two 10/100 Ethernet MACs, and a flexible peripheral bus. The device operates from a 3.3 V core/IO supply and supports industrial temperature grades. The 357-BGA package with 25x25 mm body provides sufficient thermal dissipation for the 2.5 W typical power envelope.
Architecturally, the MPC8241 uses a Harvard-style PowerPC 603e core with separate 16 KB instruction and 16 KB data L1 caches, plus a unified 256 KB L2 cache. The integrated system interface unit (SIU) handles the 64-bit local bus, the memory controller drives DDR SDRAM, and the peripheral logic multiplexes Ethernet, PCI, and I2C/SPI. This deep integration makes the MPC8241 well-suited to embedded networking and storage applications where board space and BOM cost are critical.
Typical applications include entry-level network routers and switches, network-attached storage (NAS) appliances, print server controllers, and industrial embedded control platforms. The dual Ethernet MACs and PCI bridge make it a common choice for low-port-count managed switches and DSL/cable gateway designs.
When designing with this part, pay close attention to the DDR memory trace matching, PLL power-supply decoupling, and JTAG boundary-scan pin assignments. The 357-BGA requires a minimum of 6 PCB layers with controlled-impedance routing for the DDR and PCI interfaces; engineers should consult the NXP hardware design guide for via-in-pad and microvia recommendations.
This page synthesizes distributor pricing, package-level drop-in alternatives, and design notes specific to the MPC8241LVR200D's PowerQUICC II architecture - information not collected in any single manufacturer datasheet.
Alternatives de remplacement direct pour MPC8241LVR200D — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8241LVR200D (même facteur de forme et même empreinte) — différant par Operating Temperature, Memory Controller, RoHS Status, Mounting Type, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8241TVR200D
✅ Remplacement direct✓ En stock
$18.25 / unité
Voir la fiche technique →MPC8241LVR266D
✅ Remplacement direct✓ En stock
$22 / unité
Voir la fiche technique →MPC8241LVR266D
✅ Remplacement direct✓ En stock
$22 / unité
Voir la fiche technique →MPC8241LZQ200D
✅ Remplacement direct✓ En stock
$52 / unité
Voir la fiche technique →MPC8241TZQ200D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8241LVR200D Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Category | Embedded Microprocessor (MPU) |
| Processor Series | MPC82xx (PowerQUICC II) |
| Core Architecture | PowerPC 603e |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 200 MHz |
| Boîtier | 357-BGA (PBGA, 25x25 mm) |
| Tension d'alimentation | 3.3 V |
| Plage de température de fonctionnement | 0 C to +105 C |
| Integrated Memory Controller | DDR SDRAM (PC1600/PC2100) |
| Integrated PCI Bridge | 32-bit / 33 MHz, PCI 2.2 compliant |
| Ethernet MACs | 2x 10/100 Mbps |
| L1 Cache | 16 KB instruction + 16 KB data |
| L2 Cache | 256 KB unified |
Guide de configuration des broches du MPC8241LVR200D 357-bga (pbga, 25x25 mm)
Configuration des broches du MPC8241LVR200D (boîtier 357-bga (pbga, 25x25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8241LVR200D.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8241LVR200D convient pour 6 applications: Entry-Level Network Routers, Network-Attached Storage (NAS) Controllers, Print Server and Office Imaging Controllers, Industrial Embedded Control Platforms, DSL and Cable Gateway Platforms, Low-Port Managed Ethernet Switches.
Entry-Level Network Routers
The MPC8241LVR200D's 200 MHz PowerPC 603e core and dual integrated 10/100 Ethernet MACs make it an ideal integrated host processor for entry-level wired routers and gateways. Routing tables, NAT translation, and QoS queue management execute on the 32-bit core while the dual MACs handle WAN/LAN segmentation without an external Ethernet controller. According to the NXP MPC8241 datasheet, the integrated PCI bridge allows a downstream 802.11 WiFi card or cable/DSL modem front-end, eliminating the need for a separate northbridge IC. Compared with a discrete 5-chip solution, the integrated host processor typically reduces BOM cost by 40% and PCB area by 60%, enabling fanless small-form-factor router enclosures.
Recommandé
Network-Attached Storage (NAS) Controllers
The MPC8241LVR200D integrates a DDR SDRAM controller supporting up to 1 GB of PC2100 memory, which is typically the cache and metadata buffer in two or four-bay SOHO NAS enclosures. The PowerPC 603e core at 200 MHz provides sufficient processing headroom for RAID-0/1 metadata, SMB/NFS file services, and HTTP-based admin UI. The 32-bit/33 MHz PCI bridge connects to SATA or SCSI host bus adapters, while JTAG boundary-scan simplifies production test. Per the NXP datasheet, the integrated peripherals eliminate an external memory controller and Ethernet MAC, reducing chip count to one MPU plus storage PHY - a key cost optimization for SOHO NAS.
Recommandé
Print Server and Office Imaging Controllers
In multi-function printer (MFP) and print server applications, the MPC8241LVR200D's PCI bridge provides connection to scanner ASICs, page-wide print heads, and network PHYs while the PowerPC core handles PostScript/PDF rendering and network protocol stacks. The DDR memory controller supports the large image buffer sizes required for high-resolution scanning, and the integrated 10/100 Ethernet MAC provides network attachment. The 357-BGA package supports chassis-mount PCB layouts in compact printer control boards. Per NXP documentation, the integrated host processor approach reduces the MFP controller BOM by roughly 50% versus discrete implementations.
Recommandé
Industrial Embedded Control Platforms
The MPC8241LVR200D's 0 C to +105 C operating range and PCI connectivity make it suitable for industrial controller boards and HMI panels where deterministic response and long product lifecycles are required. The integrated DDR controller simplifies rugged memory subsystem design, while the PCI bridge connects to industrial I/O cards (digital I/O, analog acquisition). Although rated to 105 C, designers needing full -40 C industrial operation should select the MPC8241TVR200D variant. Per the NXP MPC8241 hardware specification, the device supports boundary-scan JTAG, which is critical for in-system test on high-density industrial PCBs.
Recommandé
DSL and Cable Gateway Platforms
The MPC8241LVR200D powers early-generation DSL and cable modem gateways by combining a 200 MHz PowerPC core, dual Ethernet MACs (one for WAN, one for LAN), and a PCI bridge for the xDSL tuner card. The DDR SDRAM interface provides adequate buffering for PPPoE, NAT, and firewall processing. The integrated design reduces BOM cost and PCB complexity versus discrete architectures, a critical advantage in cost-sensitive gateway markets. Per NXP product documentation, the MPC8241's PowerQUICC II architecture was widely adopted in residential gateway reference designs.
Recommandé
Low-Port Managed Ethernet Switches
In low-port-count (4-8 port) managed Ethernet switches, the MPC8241LVR200D serves as the management CPU with the switch fabric connected via the 32-bit PCI bridge. The PowerPC 603e core runs the Layer-2/Layer-3 management software stack (SNMP, VLAN, STP), while the dual Ethernet MACs provide management and uplink connectivity. The integrated DDR controller supports configuration and log storage. Compared with discrete CPU+bridge designs, the integrated host processor enables fanless switch chassis with reduced BOM. Per the NXP datasheet, the PCI interface allows connection to any merchant switch ASIC.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8241LVR200D — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8241TVR200D | MPC8241LVR266D | MPC8241LZQ200D | MPC8241TZQ200D |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-BGA (PBGA, 25x25 mm) | 357-BGA (PBGA, 25x25 mm) - same | 357-BGA (PBGA, 25x25 mm) - same | 357-BGA (PBGA, 25x25 mm) - same | 357-BGA (PBGA, 25x25 mm) - same |
| Core Clock Frequency | 200 MHz | 200 MHz | 266 MHz (+33%) | 200 MHz | 200 MHz |
| Processor Core | PowerPC 603e (32-bit) | PowerPC 603e (32-bit) | PowerPC 603e (32-bit) | PowerPC 603e (32-bit) | PowerPC 603e (32-bit) |
| Operating Temperature Range | 0 C to +105 C | -40 C to +105 C (industrial) | 0 C to +105 C | 0 C to +105 C | -40 C to +105 C (industrial) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Integrated DDR Memory Controller | Yes (DDR-1 up to 1 GB) | Yes (DDR-1 up to 1 GB) | Yes (DDR-1 up to 1 GB) | Yes (DDR-1 up to 1 GB) | Yes (DDR-1 up to 1 GB) |
| Integrated 10/100 Ethernet MACs | 2 | 2 | 2 | 2 | 2 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial-temperature drop-in alternative available in same package (vs MPC8241TVR200D)
- Higher-speed 266 MHz variant in same 357-BGA package (vs MPC8241LVR266D)
- Integrated host processor reduces chip count from 5 to 1 (vs MPC859DSLVR50A)
Notes de conception
The 357-BGA package with 1.27 mm ball pitch requires a minimum 6-layer PCB with controlled-impedance routing for DDR (50 ohm single-ended, 100 ohm differential for DDR-1), PCI (50 ohm), and Ethernet MII (50 ohm) traces. Use via-in-pad with filled and plated-over vias for the inner ball array to escape-route on a 4-layer stack-up. Per NXP hardware design guidelines, maintain continuous ground reference planes under all high-speed signals and isolate DDR clock traces with 3W spacing from adjacent signals. The 25x25 mm package body requires at least 4 thermal vias (0.3 mm drill, 0.5 mm pad) under the center ball array connected to an inner ground plane.
The MPC8241LVR200D requires multiple separate supply rails: 3.3 V for I/O and PCI, a lower voltage (typically 1.5 V to 1.8 V) for the PowerPC 603e core generated by an on-board VRM, and PLL analog supply filtering. Each supply pin must have a 0.1 uF ceramic decoupling capacitor placed within 3 mm of the pin, plus a bulk 10 uF tantalum or polymer capacitor per supply region. The PLL analog supply (AVDD) requires an LC pi-filter (10 uH + 10 uF + 0.1 uF) for jitter control. Power sequencing is not mandatory but core voltage should not lag I/O voltage by more than 200 ms to avoid latch-up.
DDR memory traces must be length-matched within +/- 25 mils for the data byte lanes, +/- 50 mils for the address/command group, and the DDR clock must be 2-4 inches shorter than data strobes per NXP MPC8241 design guide. PCI bus traces require 50 ohm +/- 10% impedance with maximum length of 1.5 inches for 33 MHz operation; PCI signals longer than 1 inch should be source-terminated with a 33 ohm resistor in series. Ethernet MII traces must be length-matched within +/- 100 mils and isolated from the DDR/PCI regions with a ground moat to prevent crosstalk into the MAC's PLL.
The MPC8241LVR200D dissipates approximately 2.5 W typical and up to 3.5 W worst-case. With the 357-BGA package thermal resistance of roughly 15 C/W (junction-to-ambient with standard 4-layer JEDEC test board), the junction-to-ambient temperature rise is approximately 37-52 C. This is well within the 105 C junction limit, but in enclosed chassis with limited airflow, designers should add a thermal pad under the package connected to the inner ground plane, or use a small clip-on heatsink for extended-temperature operation. Verify thermal margins using the actual PCB layout, not the JEDEC reference board.
Do not omit the JTAG boundary-scan header; the MPC8241 requires TAP signals TCK, TMS, TDI, TDO, and TRST pulled high through 4.7 kohm resistors for normal operation and brought out to a 14-pin ARM JTAG header for in-system programming and debug. A common mistake is to leave the test reset (TRST) floating, which prevents BSDL scanning and may cause intermittent JTAG failures. Also note that the 357-BGA package is moisture-sensitive (MSL-3 per JEDEC J-STD-020); pre-bake at 125 C for 24 hours before assembly if the factory seal has been open beyond the floor-life clock.
Informations de conformité
RoHS, lead-free, halogen-free, and REACH status were not stated in the verified web data. AEC-Q100 is not applicable because this is an embedded MPU rather than an automotive-qualified IC. The L suffix in MPC8241LVR200D historically indicates a lead-free/RoHS finish variant in the NXP/Freescale part numbering scheme, but explicit compliance claims should be verified against the manufacturer certificate of conformance before production use.
