MPC8250ACZUMHBC vs MPC8255ACZUMHBB Comparaison
Comparaison détaillée côte à côte de MPC8250ACZUMHBC par NXP Semiconductors et MPC8255ACZUMHBB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ Dernier achatNXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoleteComparaison des spécifications
| Paramètre | MPC8250ACZUMHBC | MPC8255ACZUMHBB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $85,00 | $97,50 |
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) | NXP Semiconductors |
| Series | MPC82xx (PowerQUICC II) | PowerQUICC II HIP4 |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Co-Processors / DSP | Communications; RISC CPM | — |
| Speed | 266 MHz | — |
| Process Technology | 0.25 micron | 0.25 micron (HiP4) silicon revision |
| Supply Voltage (I/O) | 3.3 V | — |
| Core Voltage | 1.8 V | — |
| Boîtier / Format | 480-TBGA (37.5 x 37.5 mm) | — |
| Nombre de broches | 480 | — |
| Largeur du bus de données | 32-bit internal / 64-bit external | 64-Bit |
| Architecture | RISC | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut du cycle de vie | Last Time Buy (NXP EOL announced) | — |
| Lead Free | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Core Architecture | — | PowerPC G2 |
| Core Supply Voltage | — | 1.8 V |
| Maximum Clock Speed | — | 266 MHz |
| Instruction Set | — | 32-Bit RISC |
| Core | — | MPC82xx |
| Package Type | — | T-BGA |
| Pin/Ball Count | — | 480 |
| Package Size | — | 37.50 x 37.50 mm |
| Package Height | — | 1.55 mm |
| Ball Pitch | — | 1.27 mm |
| Integrated CPM | — | Yes (dual communications processor modules) |
| Ethernet MACs | — | Dual 10/100 MAC |