MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
Référence : MPC8255ACZUMHBB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1 325,00 |
| 100 | $121 | $12 100,00 |
| 500 | $108.75 | $54 375,00 |
| 1 000 | $97.5 | $97 500,00 |
MPC8255ACZUMHBB Présentation
PowerQUICC II is NXP's family of integrated communications processors (a category of microprocessors/MPUs). It evolved from the earlier MPC860 PowerQUICC line by replacing the single communications processor module (CPM) with dual CPMs and adding a high-performance PowerPC core. In the broader taxonomy, PowerQUICC II belongs to: microprocessor (MPU) -> communications processor -> networking SoC -> semiconductor. These devices target routers, switches, DSLAMs, and telecom line cards where protocol processing and control-plane tasks coexist on one die.
Key features of the MPC8255ACZUMHBB include a 64-bit data bus, 1.8 V core supply, an integrated DMA controller, dual 10/100 Ethernet MACs, an ATM/POS PHY interface, USB, I2C, and a 32-bit local bus. The HIP4 (0.25 micron) silicon revision delivers the 266 MHz top frequency for this MPN family. The 480-TBGA package exposes the full peripheral set including PCI, UTOPIA, and dedicated time-slot assigners for TDM traffic.
Architecturally, the device pairs a PowerPC G2 core with a separate, firmware-driven CPM that offloads serial/ATM/Ethernet work. The CPM uses RISC micro-engines programmed via microcode stored in on-chip ROM, freeing the host core from bit-banging protocols. This split-architecture delivers deterministic throughput on WAN/edge interfaces at lower MHz than comparable monolithic SoCs.
Typical applications include enterprise routers, multiservice access concentrators, DSLAM line cards, and industrial control platforms. The wide peripheral mix and integrated PCI bridge make it attractive for legacy telecom designs where deterministic CPM behavior outweighs the appeal of newer Cortex-A based SoCs.
When designing with the MPC8255, treat the 1.8 V core rail as the dominant thermal contributor and respect the simultaneous switching limits of the 480-ball BGA during layout. This part has been marked 'No Longer Manufactured' by NXP, so lifecycle planning and last-time-buy stock checks are essential before committing to new designs.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives in the same 480-TBGA footprint, and a comparative parameter table across the PowerQUICC II family not found in the datasheet alone.
Alternatives de remplacement direct pour MPC8255ACZUMHBB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8255ACZUMHBB (même facteur de forme et même empreinte) — différant par Process Technology, Manufacturer, Series, Architecture, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8255AVVMHBB
✅ Remplacement direct✓ En stock
$78.8 / unité
Voir la fiche technique →MPC8250ACZUMHBC
✅ Remplacement direct✓ En stock
$85 / unité
Voir la fiche technique →MPC8260ACZUMIBB
✅ Remplacement direct✓ En stock
$200 / unité
Voir la fiche technique →MPC8255ACZUMHBB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II HIP4 |
| Core Architecture | PowerPC G2 |
| Largeur du bus de données | 64-Bit |
| Core Supply Voltage | 1.8 V |
| Maximum Clock Speed | 266 MHz |
| Number of Cores | 1 |
| Instruction Set | 32-Bit RISC |
| Core | MPC82xx |
| Package Type | T-BGA |
| Pin/Ball Count | 480 |
| Package Size | 37.50 x 37.50 mm |
| Package Height | 1.55 mm |
| Ball Pitch | 1.27 mm |
| Process Technology | 0.25 micron (HiP4) silicon revision |
| Integrated CPM | Yes (dual communications processor modules) |
| Ethernet MACs | Dual 10/100 MAC |
| Type de montage | Surface Mount |
Guide de configuration des broches du MPC8255ACZUMHBB 1.55 mm
Configuration des broches du MPC8255ACZUMHBB (boîtier 1.55 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8255ACZUMHBB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8255ACZUMHBB convient pour 6 applications: Enterprise Routers, DSLAM Line Cards, Multiservice Access Concentrators, Industrial Control Platforms, Telecom Line Cards, Legacy Networking Switches.
Enterprise Routers
The MPC8255ACZUMHBB is well suited to enterprise router control-plane design. Its dual on-chip Ethernet MACs and ATM/POS PHY interfaces feed traffic directly into the CPM, offloading per-packet work from the PowerPC G2 core. The integrated PCI bridge lets designers attach WAN framer ASICs without an external chipset, while the 480-TBGA package provides the routing density required for wide memory buses and parallel flash.
Recommandé
DSLAM Line Cards
DSLAM line cards benefit from the MPC8255ACZUMHBB's deterministic CPM and TDM time-slot assigners. The device handles ATM AAL2/AAL5 segmentation in microcoded engines at full 266 MHz core speed, leaving the host core free for traffic shaping and OAM functions. The 64-bit data bus sustains backplane bursts to SDRAM line-side buffers at rates above 800 MB/s.
Recommandé
Multiservice Access Concentrators
Multiservice access platforms require simultaneous TDM, Ethernet, and ATM processing, all of which the MPC8255ACZUMHBB delivers through its dual CPMs. The 266 MHz core can run control-plane routing stacks while the CPM engines manage the wire-side traffic, ensuring consistent latency on voice and video services. The 480-TBGA package exposes all UTOPIA, MII, and time-slot interfaces without external muxes.
Recommandé
Industrial Control Platforms
Long-life industrial platforms benefit from the MPC8255ACZUMHBB's mature firmware ecosystem and stable PowerPC architecture. The integrated 10/100 Ethernet MACs, USB, and I2C peripherals connect directly to HMI panels, sensors, and motion controllers. Because production is discontinued, this part is best reserved for retrofitting existing fielded systems rather than new industrial designs.
Recommandé
Telecom Line Cards
The MPC8255ACZUMHBB integrates the bridges and serial interfaces needed for telecom line cards, including UTOPIA, TDM, and PCI. The dual CPM provides protocol offload for HDLC channels, ATM adaptation, and 10/100 Ethernet aggregation. At 266 MHz the PowerPC G2 core can run routing stacks and SNMP agents while the CPM handles real-time channelized traffic.
Recommandé
Legacy Networking Switches
Layer-2/Layer-3 enterprise switches built around PowerQUICC II continue to use the MPC8255ACZUMHBB as a control processor. The 64-bit memory bus sustains forwarding-table lookups, while the integrated Ethernet MAC and PCI are sufficient for switch-management interfaces. For greenfield designs, NXP QorIQ parts offer better performance, but for functional replacement in legacy switches the 8255 remains a valid option.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8255ACZUMHBB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8255AVVMHBB | MPC8250ACZUMHBC | MPC8260ACZUMIBB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) |
| Core Architecture | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 |
| Core Clock Speed | 266 MHz | 266 MHz | 266 MHz | 266 MHz |
| Data Bus Width | 64-Bit | 64-Bit | 64-Bit | 64-Bit |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Silicon Revision | HIP4 | HIP3 | HIP4 | HIP4 |
| FPU | No | No | No | Yes |
| Lifecycle Status | No Longer Manufactured | No Longer Manufactured | No Longer Manufactured | No Longer Manufactured |
Principaux différenciateurs
- Drop-in 480-TBGA footprint across the PowerQUICC II family (vs MPC8250ACZUMHBC)
- Superset feature set at the same pinout (vs MPC8260ACZUMIBB)
- Silicon revision HIP4 versus HIP3 (vs MPC8255AVVMHBB)
Notes de conception
The 480-TBGA package of the MPC8255ACZUMHBB concentrates heat near the die center. Estimated: at 266 MHz with the CPM fully loaded, total dissipation can reach 3-4 W. Provide at least a 4-layer PCB with a continuous ground/power plane under the BGA and engineered thermal vias to keep junction temperature within the rated range.
Route the 64-bit data bus with matched-length groups (byte lane skew under 50 ps) and isolate CPM clocks on inner layers. The 480-TBGA 1.27 mm pitch requires microvia-in-pad or HDI stack-up; dog-bone fan-out is unreliable above 0.5 Gbps on the DDR-style memory interface of this part.
Estimated: at VIN 3.3 V I/O and 1.8 V core, configure independent LDOs with bulk decoupling of 22 uF ceramic plus 0.1 uF near each power pin. Power sequencing requires 1.8 V core before 3.3 V I/O to avoid latch-up; use a tracker or sequencer IC if a simple RC ramp is insufficient for your tolerances.
Informations de conformité
Compliance status not provided in the verified web data; RoHS and lead-free status for the legacy PowerQUICC II family should be confirmed via the NXP product page or PCN documentation.
