MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP
Référence : MPC8255AVVMHBB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $128.75 | $1 287,50 |
| 100 | $110.4 | $11 040,00 |
| 500 | $92.15 | $46 075,00 |
| 1 000 | $78.8 | $78 800,00 |
MPC8255AVVMHBB Présentation
A PowerQUICC II processor is a member of the PowerPC G2 microprocessor family targeted at communications infrastructure. In the broader taxonomy it sits as an embedded MPU -> 32-bit microprocessor -> communications processor, where the integrated CPM offloads DMA, HDLC, ATM, Ethernet MAC, and serial channel handling from the core, freeing the CPU for higher-layer routing, signalling, and protocol processing. This integration eliminates the need for a companion ASIC and reduces both BOM cost and board area in networking line cards.
Key features include a 32-bit PowerPC G2 core with 16 Kbyte instruction and 16 Kbyte data caches, a 266 MHz core-to-memory bus, an integrated 64-bit 60x-compatible system bus, and a CPM that supports fast Ethernet (MII/RMII), HDLC/SDLC, UART, I2C, SPI, and PCI interface. Memory is supported through a 32/64-bit SDRAM controller and a general-purpose chip-select machine, and the device includes dual 10/100 Ethernet MACs, a PCI interface, and a flexible interrupt controller.
The MPC8255AVVMHBB is implemented in a 0.18 micrometre CMOS process and operates from a 1.8 V core supply with 3.3 V I/O. It is qualified for industrial / extended operating temperature ranges and is supplied in a 37.5 mm x 37.5 mm TBGA480 with 1.27 mm ball pitch. The 'VVM' infix in the part number indicates 266 MHz core, 133 MHz bus, and standard power/performance tier.
Typical applications include enterprise routers and LAN switches, DSLAM line cards, wireless base-station controllers, industrial networking gateways, and protocol-conversion appliances where the CPM's multi-channel serial handling reduces or replaces external glue logic.
When designing with this MPU, the 480-ball BGA requires 4-layer or 6-layer PCB stack-up with controlled-impedance traces on the 60x bus and SDRAM lines. Power sequencing (1.8 V core before 3.3 V I/O) and proper JTAG boundary-scan bring-up should be considered early in the layout; reference NXP application note AN2803 for PowerQUICC II hardware design guidance.
This page synthesises distributor stock, drop-in same-package alternatives within the MPC82xx family, and practical hardware design notes that go beyond the brief summary on the NXP product page.
Alternatives de remplacement direct pour MPC8255AVVMHBB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8255AVVMHBB (même facteur de forme et même empreinte) — différant par Core Architecture, Manufacturer, Mounting Type, Process Technology, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8255AVRIHBB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8255ACZUMHBB
✅ Remplacement direct✓ En stock
$97.5 / unité
Voir la fiche technique →MPC8255AVVRLPB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8255ACVVHBB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8255AZUHMHBB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8255AVVMHBB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC II (MPC82xx) |
| Core Architecture | PowerPC G2, 32-bit |
| Core Frequency | 266 MHz |
| Bus Frequency | 133 MHz (core-to-memory bus) |
| Number of Cores | 1 |
| Cache (I/D) | 16 Kbyte instruction / 16 Kbyte data |
| Boîtier | 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 3.3 V |
| Integrated Ethernet MAC | 2x 10/100 Mbit/s (MII/RMII) |
| PCI Interface | Yes (32-bit, 66 MHz capable) |
| CPM Serial Controllers | HDLC/SDLC, UART, I2C, SPI, SCC/SMC |
| Température de fonctionnement | -40C to +105C (extended, per 'MH' suffix) |
| Process Technology | 0.18 micrometre CMOS |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Non-compliant (NO-PB suffix - lead-bearing) |
| Lifecycle | No Longer Manufactured (NXP) |
Guide de configuration des broches du MPC8255AVVMHBB 480-tbga (37.5 x 37.5 mm, 1.27 mm pitch)
Configuration des broches du MPC8255AVVMHBB (boîtier 480-tbga (37.5 x 37.5 mm, 1.27 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8255AVVMHBB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8255AVVMHBB convient pour 6 applications: Enterprise Router Line Card, DSLAM / Access Multiplexer, Industrial Networking Gateway, Wireless Base-Station Controller, Protocol Conversion Appliance, Voice-over-IP (VoIP) Gateway.
Enterprise Router Line Card
The MPC8255AVVMHBB's PowerPC G2 core at 266 MHz, dual 10/100 Ethernet MACs, and CPM with HDLC channel offload are purpose-built for enterprise router line cards. It pairs directly with external PHY transceivers over MII and lets the CPM handle ATM, PPP, and frame-relay segmentation while the core runs routing-table lookups. The TBGA480 footprint fits standard 6-layer router PCBs, and the integrated 60x bus eases SDRAM and Flash expansion. Engineers should budget ~7 W typical dissipation and use NXP AN2803 power-sequencing guidance.
Recommandé
DSLAM / Access Multiplexer
In DSLAM line cards, the MPC8255AVVMHBB acts as the aggregation processor: ATM SAR and HDLC channels on the CPM terminate multiple DSL subscribers in parallel while the PowerPC core runs bridging and PPPoE. The 266 MHz core and 16 Kbyte instruction cache deliver sufficient headroom for typical 24-port DSL line-card workloads. The 32-bit PCI interface enables connection to framer or line-interface ICs, and the TBGA480 footprint keeps per-port board area low.
Recommandé
Industrial Networking Gateway
For industrial gateways (PROFINET, EtherNet/IP, serial-to-Ethernet bridges), the MPC8255AVVMHBB provides deterministic serial handling via the CPM and dual Ethernet MACs for redundant ring topologies. The -40C to +105C extended operating temperature ('MH' suffix) handles factory-floor environments. Its 32-bit PCI bus accepts expansion cards for fieldbus or wireless modems, and its on-chip DMA engine minimises CPU load during bulk protocol conversion, making it ideal for sustained industrial traffic.
Recommandé
Wireless Base-Station Controller
In 2G/3G base-station controllers and baseband aggregation nodes, the MPC8255AVVMHBB handles Abis/Ater signalling, ATM AAL2 soft-handoffs, and E1/T1 transport via its CPM HDLC channels. The PowerPC G2 core executes Layer-2/3 protocol stacks, while the integrated dual Ethernet MACs backhaul to the BSC. Industrial-grade temperature range and TBGA480 packaging suit the 1U/2U shelf-mount form factor common in BTS cabinets.
Recommandé
Protocol Conversion Appliance
Multi-protocol conversion appliances (serial-to-Ethernet, Fieldbus-to-Ethernet, legacy-to-Modbus-TCP) benefit from the MPC8255AVVMHBB's mix of UART, I2C, SPI, and HDLC channels on the CPM, plus its dual Ethernet MACs. The 266 MHz core runs protocol translation stacks in real time without breaking a sweat, while the 60x bus connects to large DDR-style SDRAM buffers. The TBGA480 keeps a compact BOM suitable for DIN-rail mounted converters.
Recommandé
Voice-over-IP (VoIP) Gateway
In legacy PBX-to-VoIP gateways, the MPC8255AVVMHBB's CPM handles DS0/HDLC time-slot multiplexing while the PowerPC core runs RTP/RTCP and SIP stacks over Ethernet. Its PCI interface accepts DSP cards for echo cancellation and codec transcoding, and the integrated DMA minimises jitter for sustained voice quality. The industrial-temperature rating suits carrier-grade edge equipment installed in uncontrolled environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8255AVVMHBB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8255AVRIHBB | MPC8255ACZUMHBB | MPC8255AVVRLPB | MPC8255ACVVHBB | MPC8255AZUHMHBB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same |
| Lead-Free | No (NO-PB suffix) | Yes (RI suffix) | Yes (ZU suffix) | Yes (RL suffix) | Yes | Yes (ZU reflow) |
| Operating Temperature | -40 to 105 C (extended, MH) | -40 to 105 C | -40 to 105 C | -40 to 105 C | -40 to 105 C | -40 to 105 C |
| Core Architecture | PowerPC G2 32-bit | PowerPC G2 32-bit | PowerPC G2 32-bit | PowerPC G2 32-bit | PowerPC G2 32-bit | PowerPC G2 32-bit |
| Integrated Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 |
| Lifecycle Status | Obsolete (No Longer Manufactured) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Only 266 MHz lead-bearing variant with 'VV' infix (vs MPC8255ACZUMHBB)
- Highest drop-in availability among PowerQUICC II 266 MHz TBGA480 SKUs (vs MPC8255AVVRLPB)
- Same silicon as all sibling 8255 variants (vs MPC8250ACVVMHBC)
Notes de conception
The 480-ball TBGA with 1.27 mm pitch requires a 4-layer or 6-layer PCB stack-up. Use microvia-in-pad construction if the design height is constrained. Reference NXP AN2803 (PowerQUICC II Hardware Design Considerations) for the recommended stack-up, decoupling scheme, and trace-length matching rules for the 60x bus and DDR SDRAM interface. Decoupling: place 0.1 uF X7R capacitors within 5 mm of every power ball, with bulk 10 uF tantalum at each voltage rail entry.
Estimated: at typical 1.8 V core / 3.3 V I/O supplies and 266 MHz activity, the MPC8255AVVMHBB dissipates approximately 4-7 W. Power sequencing (1.8 V core must ramp before 3.3 V I/O, with monotonic edges) is required - otherwise internal I/O structures can latch-up. Use a supervisory sequencer such as NXP's MC33908 or similar PMIC with sequenced outputs. Add a POR circuit to the HRESET pin.
Route the 60x bus with 50 ohm controlled impedance, length-matched within 25 ps across the byte lanes. SDRAM clocks and DQS pairs must also be length-matched. Keep PHY differential pairs (MII/RMII) on the top layer or stripline with continuous ground reference. Avoid routing high-speed traces across BGA antipads - use laser-drilled microvias if escape routing is tight. JTAG boundary-scan bring-up is mandatory before firmware load; route TMS, TCK, TDI, TDO to a 2.54 mm header for debug.
The TBGA480 package has no exposed top heatsink path; thermal management relies on the internal ball grid and board copper. Use a 4-oz copper inner plane stitched to the BGA ground balls via thermal vias (12 mil pads, 8 mil holes, ~25 vias under the die shadow). Without this, theta-JA exceeds 25 C/W and the device will throttle or shut down at upper-temperature industrial operation.
Common pitfalls with the MPC8255AVVMHBB: (1) ignoring the NO-PB lead-bearing termination - it is not RoHS-compatible, so lead-free reflow profiles will damage it; (2) using a 300 MHz firmware image on the 266 MHz silicon causes timing errors - check the PVR (Processor Version Register) before OS boot; (3) the 'MH' suffix is extended-temp (-40 to +105 C) - do not assume commercial temp range; (4) obsolete lifecycle means long-term reliability data may be from old fabrication runs - derate storage temperature and clock frequency in safety-critical designs.
Informations de conformité
NO-PB suffix confirms lead-bearing (non-RoDSOL) termination per NXP ordering information. Industrial / extended operating temperature range per 'MH' suffix. Not AEC-Q100 (this is an MPU for networking, not automotive).
