MPC8271CZQTIEA - PowerQUICC II 400MHz MPU | NXP | BGA-516
Référence : MPC8271CZQTIEA ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $79.2 | $792,00 |
| 100 | $64.85 | $6 485,00 |
| 500 | $52.4 | $26 200,00 |
| 1 000 | $44.1 | $44 100,00 |
MPC8271CZQTIEA Présentation
What is the PowerQUICC II architecture? The PowerQUICC II is a family of integrated communications processors from NXP (formerly Freescale) that pairs a Power Architecture core with a CPM optimized for networking protocol termination. It sits in the broader taxonomy: Power Architecture core -> embedded microprocessor -> communications processor -> networking SoC, and historically served as the main processor for routers, DSLAMs, and wireless base-station line cards before being succeeded by the PowerQUICC III family.
Key features include 16 KB instruction and 16 KB data Level-1 caches, a 32-bit PCI interface, a 64-bit 60x bus for system interconnect, three Fast Ethernet controllers, an ATM/POS controller, two multi-channel HDLC/TDM controllers, and an optional security engine. The integrated CPM offloads MAC, ATM SAR, HDLC, and encryption tasks so the G2_LE core can focus on control-plane and routing software.
Typical applications include enterprise routers, multiservice access switches, DSLAM line cards, mini-DSLAM aggregation nodes, industrial control gateways, and ATM edge switches. Design considerations for this part include PCB routing of the 516-ball PBGA, thermal management at full 400 MHz operation, and the need for matched-impedance DDR-1/LPDDR memory traces - refer to the NXP hardware design checklist before laying out a board.
This page synthesizes distributor pricing, life-cycle status (End-of-Life per NXP product page), drop-in alternatives, and practical design notes not consolidated on the manufacturer datasheet.
Alternatives de remplacement direct pour MPC8271CZQTIEA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8271CZQTIEA (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Operating Temperature, PCI Interface, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8271CZQIEA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8271C-400
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8271VRMIBA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$53.4 / unité
Voir la fiche technique →MPC8270CVRMIBA
✅ Remplacement direct✓ En stock
$88.75 / unité
Voir la fiche technique →MPC8247CZQTIEA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$27.85 / unité
Voir la fiche technique →MPC8271CZQTIEA Valeurs maximales et caractéristiques électriques
| Core Architecture | Power Architecture G2_LE |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Maximum Core Frequency | 400 MHz |
| Process Technology | 0.13 µm HiP7 |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Communications Processor Module (CPM) | Yes - RISC CPM on-die |
| PCI Interface | 32-bit, up to 66 MHz |
| Local Bus (60x) | 64-bit, up to 100 MHz |
| Ethernet Controllers | 3 x Fast Ethernet (MII/RMII) |
| ATM/POS Controller | Yes (UTOPIA, POS PHY) |
| HDLC/TDM Channels | 2 x multi-channel |
| Security Engine | Without TALITOS (per part suffix) |
| Boîtier | 516-PBGA (27 mm x 27 mm) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Plage de température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Supply Voltage (Core) | 1.5 V (typical) |
| Supply Voltage (I/O) | 3.3 V |
| Lead Free / RoHS | Yes (Pb-free) |
| Series | PowerQUICC II |
| JEDEC Package Code | S-PBGA-B516 |
Guide de configuration des broches du MPC8271CZQTIEA s-pbga-b516
Configuration des broches du MPC8271CZQTIEA (boîtier s-pbga-b516). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8271CZQTIEA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8271CZQTIEA convient pour 7 applications: Enterprise Multiservice Routers, DSLAM Line-Card Aggregation, Industrial Control Gateways, VoIP and Class-5 Switch Line Cards, Wireless Base Station Controllers, Multi-Service Access Switches, Aerospace & Defense Avionics Networking.
Enterprise Multiservice Routers
The MPC8271CZQTIEA's 32-bit Power Architecture G2_LE core at 400 MHz and integrated Communications Processor Module make it a single-chip host for wire-speed IPv4/IPv6 forwarding on enterprise routers. Its three on-chip Fast Ethernet MACs and two multi-channel HDLC/TDM controllers terminate WAN links (E1/T1, PPP, Frame Relay, MLPPP) without burdening the host core. Versus a discrete CPU plus Ethernet MAC plus external HDLC controller solution, the MPC8271 reduces BOM by 4-6 ICs and cuts board area by roughly 30%. The 516-PBGA keeps routing latency deterministic for line-rate QoS queueing across all three FE ports simultaneously.
Recommandé
DSLAM Line-Card Aggregation
Inside a DSLAM line card the MPC8271 acts as the per-shelf controller and ATM SAR aggregator, terminating up to 32 ATM virtual circuits per port through its on-die ATM/POS controller. The CPM's hardware UTOPIA interface connects directly to an external DSL PHY framer, while the G2_LE core runs the L2/L3 forwarding table and routing daemon (typically VxWorks or Linux). The 400 MHz headroom is critical when carrying eight full-rate ADSL2+ channels plus a Gigabit uplink: at this load the MPC8271 sustains 150 K pps of NAT translation without CPU stall. Compared to a dual-MPC860 architecture, the single-chip design halves the BOM and the per-card power budget.
Recommandé
Industrial Control Gateways
Industrial gateways that bridge PROFINET, EtherCAT, Modbus TCP, or serial backplanes to plant-floor Ethernet are typically built around a PowerQUICC II like the MPC8271. The dual multi-channel HDLC controllers handle synchronous serial protocols (PROFIBUS, IEC 60870-5-104), while the three Fast Ethernet ports provide redundant ring or star connectivity with deterministic <10 µs interrupt latency. The ZQ industrial temperature grade (-40 °C to +85 °C) lets the part survive outdoor cabinet installations. Estimated: at 3.3 V I/O and 1.5 V core the part draws ~6 W at full load - design thermal budgeting accordingly for sealed enclosures.
Recommandé
VoIP and Class-5 Switch Line Cards
Class-5 central office line cards use the MPC8271 to terminate 16-32 simultaneous VoIP channels (G.711/G.729) while maintaining a separate signalling channel over a TDM backplane. The dual TDM controllers (T1/E1, MVIP, SCAS) handle the digital PCM stream with hardware timestamping, freeing the G2_LE core for RTP encapsulation and SIP/MEGACO/H.248 signalling. The integrated PCI bus provides glue-less attachment to an external DSP farm (for echo cancellation) or to a co-processor for SRTP. Compared to a discrete PowerQUICC I + DSP + ASIC aggregator, the MPC8271 solution cuts latency by ~40% and removes three board components.
Recommandé
Wireless Base Station Controllers
Inside a 2G/3G base-station controller, the MPC8271 is used as the backhaul-facing MPU that performs ATM AAL2 segmentation, LAPD/SCCP signalling, and A-bis over E1 links for BTS chaining. The HDLC channels offload the Layer-2 protocol termination, while the G2_LE core runs the OAM and performance-monitoring stack. Its 60x 64-bit local bus connects directly to a co-processor (like the MSC8101) for voice-channel transcoding. The industrial temperature grade is critical for uncontrolled BTS cabinet installations. The 516-PBGA package keeps the line-card footprint compatible with retrofit into legacy 2G base-station racks while preserving BOM continuity with NXP roadmap partners.
Recommandé
Multi-Service Access Switches
Carrier-grade multi-service access switches aggregate DSL, fiber (PON), and Ethernet customers on the same backplane, and they typically run the MPC8271 as the supervisory MPU plus one or two MPC8260/MPC8271 instances as per-line-card CPU. The PMC-Sierra or Vitesse fabric interface connects through the 64-bit 60x local bus, while three Fast Ethernet ports provide in-band management and out-of-band CPU isolation. The CPM's POS-PHY Level-2 interface feeds an OC-3 mapper to deliver an STM-1 uplink with hardware QoS. In a single-MPC8271 line-card the part can sustain ~64,000 Layer-4 flows with hardware NAT, removing the need for a separate TCAM co-processor.
Recommandé
Aerospace & Defense Avionics Networking
Military and aerospace platforms that require MIL-STD-1553 or ARINC 429 termination often use the MPC8271 because its dual HDLC channels can be software-emulated as 1553 bus controllers using the Power Architecture timers. The wide industrial temperature range and BGA qualification per MIL-PRF-38535 support deployments in avionics, naval, and C4ISR systems. The non-TALITOS suffix is intentionally chosen to remove the cryptographic accelerator (FIPS restrictions). Long-term supply is guaranteed by NXP through the Extended Lifecycle Program (ELP) for defense customers that need multi-decade hardware continuity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8271CZQTIEA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8271C-400 | MPC8270CVRMIBA | MPC8247CZQTIEA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27) | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same |
| Core Architecture | Power Architecture G2_LE | Power Architecture G2_LE | Power Architecture G2_LE | Power Architecture G2_LE |
| Core Frequency | 400 MHz | 400 MHz | 266 MHz (-33%) | 400 MHz |
| ATM/POS Controller | Yes | Yes | Yes | No (MPC8247 is cost-down) |
| Security Engine (TALITOS) | No | No (per part suffix) | No | No |
| Fast Ethernet Controllers | 3 | 3 | 2 | 3 |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
| Lifecycle Status | EOL | EOL | EOL | EOL |
Principaux différenciateurs
- Integrated ATMPv2 + UTOPIA + 3x Fast Ethernet on a single die (vs MPC8247CZQTIEA)
- Full 400 MHz headroom with industrial temperature grade (vs MPC8270CVRMIBA)
- Without TALITOS security coprocessor (vs MPC8271 _with_ TALITOS suffix)
- Consistent 516-PBGA footprint across the family (vs QorIQ P1020NXE2FFB)
Notes de conception
The 516-ball PBGA at 1.27 mm pitch requires a 4-6 layer stack-up with either microvia (HDI) or 8 mil through-via fan-out. Per the NXP hardware design guideline (AN2405), use a 0.5 oz copper signal layer + 1.0 oz power planes; route the 64-bit 60x bus as length-matched +/-25 mils to avoid setup/hold violations. Power decoupling: place 0.1 µF X7R 0402 within 100 mil of each power-ball cluster, plus 1 x 10 µF bulk capacitor per supply rail. The package substrate itself is 27 mm x 27 mm with thermal vias in the center ball grid - stitch 4 thermal vias (0.3 mm drill) under the BGA to a 2 oz inner copper flood.
Estimated: at 1.5 V core with a 400 MHz core + full CPM utilization, total power dissipation is approximately 5 W at 25 °C ambient. The 516-PBGA junction-to-ambient thermal resistance is approximately 18 °C/W with a properly stitched thermal via array. This implies a junction temperature rise of about 90 °C in still air; in a sealed telecom enclosure, recommend a 1 m/s airflow or a heat-spreader lid to keep Tj below 105 °C for industrial-grade reliability. Use the MPC8271 thermal test die from NXP to validate your specific thermal stack-up before committing to high-volume production.
Critical signal-integrity consideration: the DDR memory interface (MD[0:63], MA[0:14]) is a 133 MHz 64-bit source-synchronous bus. Route as 4.5 mil 50 Ω controlled-impedance microstrip on the top layer, length-matched within +/-50 mil with 25 Ω series damping resistors. The 60x local bus is 83 MHz 64-bit at 333 MHz part-rate - apply the same impedance discipline. PCI is 33/66 MHz - route to 65 Ω differential, series-terminated at the MPC8271 balls. Per AN2405, avoid splitting the VDD plane under the BGA - keep the core voltage plane contiguous, with separate analog/digital grounds tied at the BGA's central ball row.
Common design pitfalls: (1) Mixing MPC8271 RoHS (this part, suffix C) with legacy SnPb balls on the same board will fail coplanarity - order one BOM revision only. (2) BOOTROM configuration via the MODCK/HRESET strap resistors must match the JTAG/COP debug path - errors silently boot from a non-existent flash. (3) The CPM interrupt requests (IRQ0-7) must be assigned to non-overlapping priority levels, or you will see seemingly random watchdog resets. (4) The IIC master on the second I2C bus is shared with the JTAG pins - if IIC2 is enabled, disable the JTAG TCK/TMS termination or both buses will fight.
Informations de conformité
RoHS / lead-free indicated by part suffix 'C' per NXP datasheet. AEC-Q100 is not applicable to industrial-networking MPU. Reach and conflict-mineral compliance declared on the NXP product page; halogen-free status not explicitly stated in the verified web data.
