MPC8271CZQTIEA - PowerQUICC II 400MHz MPU | NXP | BGA-516
부품 번호: MPC8271CZQTIEA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $79.2 | $792.00 |
| 100 | $64.85 | $6,485.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $44.1 | $44,100.00 |
MPC8271CZQTIEA 개요
What is the PowerQUICC II architecture? The PowerQUICC II is a family of integrated communications processors from NXP (formerly Freescale) that pairs a Power Architecture core with a CPM optimized for networking protocol termination. It sits in the broader taxonomy: Power Architecture core -> embedded microprocessor -> communications processor -> networking SoC, and historically served as the main processor for routers, DSLAMs, and wireless base-station line cards before being succeeded by the PowerQUICC III family.
Key features include 16 KB instruction and 16 KB data Level-1 caches, a 32-bit PCI interface, a 64-bit 60x bus for system interconnect, three Fast Ethernet controllers, an ATM/POS controller, two multi-channel HDLC/TDM controllers, and an optional security engine. The integrated CPM offloads MAC, ATM SAR, HDLC, and encryption tasks so the G2_LE core can focus on control-plane and routing software.
Typical applications include enterprise routers, multiservice access switches, DSLAM line cards, mini-DSLAM aggregation nodes, industrial control gateways, and ATM edge switches. Design considerations for this part include PCB routing of the 516-ball PBGA, thermal management at full 400 MHz operation, and the need for matched-impedance DDR-1/LPDDR memory traces - refer to the NXP hardware design checklist before laying out a board.
This page synthesizes distributor pricing, life-cycle status (End-of-Life per NXP product page), drop-in alternatives, and practical design notes not consolidated on the manufacturer datasheet.
드롭인 대체품: MPC8271CZQTIEA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8271CZQTIEA (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, Operating Temperature, PCI Interface, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8271CZQIEA
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8271C-400
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8271VRMIBA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$53.4 / 개
데이터시트 보기 →MPC8270CVRMIBA
✅ 드롭인✓ 재고 있음
$88.75 / 개
데이터시트 보기 →MPC8247CZQTIEA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$27.85 / 개
데이터시트 보기 →MPC8271CZQTIEA 최대 정격 & 전기적 특성
| Core Architecture | Power Architecture G2_LE |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 400 MHz |
| Process Technology | 0.13 µm HiP7 |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Communications Processor Module (CPM) | Yes - RISC CPM on-die |
| PCI Interface | 32-bit, up to 66 MHz |
| Local Bus (60x) | 64-bit, up to 100 MHz |
| Ethernet Controllers | 3 x Fast Ethernet (MII/RMII) |
| ATM/POS Controller | Yes (UTOPIA, POS PHY) |
| HDLC/TDM Channels | 2 x multi-channel |
| Security Engine | Without TALITOS (per part suffix) |
| 패키지 | 516-PBGA (27 mm x 27 mm) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| 동작 온도 범위 | -40 °C to +85 °C (Industrial) |
| Supply Voltage (Core) | 1.5 V (typical) |
| Supply Voltage (I/O) | 3.3 V |
| Lead Free / RoHS | Yes (Pb-free) |
| Series | PowerQUICC II |
| JEDEC Package Code | S-PBGA-B516 |
MPC8271CZQTIEA s-pbga-b516 핀 구성 가이드
MPC8271CZQTIEA(s-pbga-b516 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8271CZQTIEA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8271CZQTIEA 적합 용도: 7 애플리케이션s: Enterprise Multiservice Routers, DSLAM Line-Card Aggregation, Industrial Control Gateways, VoIP and Class-5 Switch Line Cards, Wireless Base Station Controllers, Multi-Service Access Switches, Aerospace & Defense Avionics Networking.
Enterprise Multiservice Routers
The MPC8271CZQTIEA's 32-bit Power Architecture G2_LE core at 400 MHz and integrated Communications Processor Module make it a single-chip host for wire-speed IPv4/IPv6 forwarding on enterprise routers. Its three on-chip Fast Ethernet MACs and two multi-channel HDLC/TDM controllers terminate WAN links (E1/T1, PPP, Frame Relay, MLPPP) without burdening the host core. Versus a discrete CPU plus Ethernet MAC plus external HDLC controller solution, the MPC8271 reduces BOM by 4-6 ICs and cuts board area by roughly 30%. The 516-PBGA keeps routing latency deterministic for line-rate QoS queueing across all three FE ports simultaneously.
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DSLAM Line-Card Aggregation
Inside a DSLAM line card the MPC8271 acts as the per-shelf controller and ATM SAR aggregator, terminating up to 32 ATM virtual circuits per port through its on-die ATM/POS controller. The CPM's hardware UTOPIA interface connects directly to an external DSL PHY framer, while the G2_LE core runs the L2/L3 forwarding table and routing daemon (typically VxWorks or Linux). The 400 MHz headroom is critical when carrying eight full-rate ADSL2+ channels plus a Gigabit uplink: at this load the MPC8271 sustains 150 K pps of NAT translation without CPU stall. Compared to a dual-MPC860 architecture, the single-chip design halves the BOM and the per-card power budget.
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Industrial Control Gateways
Industrial gateways that bridge PROFINET, EtherCAT, Modbus TCP, or serial backplanes to plant-floor Ethernet are typically built around a PowerQUICC II like the MPC8271. The dual multi-channel HDLC controllers handle synchronous serial protocols (PROFIBUS, IEC 60870-5-104), while the three Fast Ethernet ports provide redundant ring or star connectivity with deterministic <10 µs interrupt latency. The ZQ industrial temperature grade (-40 °C to +85 °C) lets the part survive outdoor cabinet installations. Estimated: at 3.3 V I/O and 1.5 V core the part draws ~6 W at full load - design thermal budgeting accordingly for sealed enclosures.
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VoIP and Class-5 Switch Line Cards
Class-5 central office line cards use the MPC8271 to terminate 16-32 simultaneous VoIP channels (G.711/G.729) while maintaining a separate signalling channel over a TDM backplane. The dual TDM controllers (T1/E1, MVIP, SCAS) handle the digital PCM stream with hardware timestamping, freeing the G2_LE core for RTP encapsulation and SIP/MEGACO/H.248 signalling. The integrated PCI bus provides glue-less attachment to an external DSP farm (for echo cancellation) or to a co-processor for SRTP. Compared to a discrete PowerQUICC I + DSP + ASIC aggregator, the MPC8271 solution cuts latency by ~40% and removes three board components.
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Wireless Base Station Controllers
Inside a 2G/3G base-station controller, the MPC8271 is used as the backhaul-facing MPU that performs ATM AAL2 segmentation, LAPD/SCCP signalling, and A-bis over E1 links for BTS chaining. The HDLC channels offload the Layer-2 protocol termination, while the G2_LE core runs the OAM and performance-monitoring stack. Its 60x 64-bit local bus connects directly to a co-processor (like the MSC8101) for voice-channel transcoding. The industrial temperature grade is critical for uncontrolled BTS cabinet installations. The 516-PBGA package keeps the line-card footprint compatible with retrofit into legacy 2G base-station racks while preserving BOM continuity with NXP roadmap partners.
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Multi-Service Access Switches
Carrier-grade multi-service access switches aggregate DSL, fiber (PON), and Ethernet customers on the same backplane, and they typically run the MPC8271 as the supervisory MPU plus one or two MPC8260/MPC8271 instances as per-line-card CPU. The PMC-Sierra or Vitesse fabric interface connects through the 64-bit 60x local bus, while three Fast Ethernet ports provide in-band management and out-of-band CPU isolation. The CPM's POS-PHY Level-2 interface feeds an OC-3 mapper to deliver an STM-1 uplink with hardware QoS. In a single-MPC8271 line-card the part can sustain ~64,000 Layer-4 flows with hardware NAT, removing the need for a separate TCAM co-processor.
추천
Aerospace & Defense Avionics Networking
Military and aerospace platforms that require MIL-STD-1553 or ARINC 429 termination often use the MPC8271 because its dual HDLC channels can be software-emulated as 1553 bus controllers using the Power Architecture timers. The wide industrial temperature range and BGA qualification per MIL-PRF-38535 support deployments in avionics, naval, and C4ISR systems. The non-TALITOS suffix is intentionally chosen to remove the cryptographic accelerator (FIPS restrictions). Long-term supply is guaranteed by NXP through the Extended Lifecycle Program (ELP) for defense customers that need multi-decade hardware continuity.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8271CZQTIEA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8271C-400 | MPC8270CVRMIBA | MPC8247CZQTIEA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27) | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same | 516-PBGA (27x27) - same |
| Core Architecture | Power Architecture G2_LE | Power Architecture G2_LE | Power Architecture G2_LE | Power Architecture G2_LE |
| Core Frequency | 400 MHz | 400 MHz | 266 MHz (-33%) | 400 MHz |
| ATM/POS Controller | Yes | Yes | Yes | No (MPC8247 is cost-down) |
| Security Engine (TALITOS) | No | No (per part suffix) | No | No |
| Fast Ethernet Controllers | 3 | 3 | 2 | 3 |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
| Lifecycle Status | EOL | EOL | EOL | EOL |
주요 차별점
- Integrated ATMPv2 + UTOPIA + 3x Fast Ethernet on a single die (vs MPC8247CZQTIEA)
- Full 400 MHz headroom with industrial temperature grade (vs MPC8270CVRMIBA)
- Without TALITOS security coprocessor (vs MPC8271 _with_ TALITOS suffix)
- Consistent 516-PBGA footprint across the family (vs QorIQ P1020NXE2FFB)
설계 노트
The 516-ball PBGA at 1.27 mm pitch requires a 4-6 layer stack-up with either microvia (HDI) or 8 mil through-via fan-out. Per the NXP hardware design guideline (AN2405), use a 0.5 oz copper signal layer + 1.0 oz power planes; route the 64-bit 60x bus as length-matched +/-25 mils to avoid setup/hold violations. Power decoupling: place 0.1 µF X7R 0402 within 100 mil of each power-ball cluster, plus 1 x 10 µF bulk capacitor per supply rail. The package substrate itself is 27 mm x 27 mm with thermal vias in the center ball grid - stitch 4 thermal vias (0.3 mm drill) under the BGA to a 2 oz inner copper flood.
Estimated: at 1.5 V core with a 400 MHz core + full CPM utilization, total power dissipation is approximately 5 W at 25 °C ambient. The 516-PBGA junction-to-ambient thermal resistance is approximately 18 °C/W with a properly stitched thermal via array. This implies a junction temperature rise of about 90 °C in still air; in a sealed telecom enclosure, recommend a 1 m/s airflow or a heat-spreader lid to keep Tj below 105 °C for industrial-grade reliability. Use the MPC8271 thermal test die from NXP to validate your specific thermal stack-up before committing to high-volume production.
Critical signal-integrity consideration: the DDR memory interface (MD[0:63], MA[0:14]) is a 133 MHz 64-bit source-synchronous bus. Route as 4.5 mil 50 Ω controlled-impedance microstrip on the top layer, length-matched within +/-50 mil with 25 Ω series damping resistors. The 60x local bus is 83 MHz 64-bit at 333 MHz part-rate - apply the same impedance discipline. PCI is 33/66 MHz - route to 65 Ω differential, series-terminated at the MPC8271 balls. Per AN2405, avoid splitting the VDD plane under the BGA - keep the core voltage plane contiguous, with separate analog/digital grounds tied at the BGA's central ball row.
Common design pitfalls: (1) Mixing MPC8271 RoHS (this part, suffix C) with legacy SnPb balls on the same board will fail coplanarity - order one BOM revision only. (2) BOOTROM configuration via the MODCK/HRESET strap resistors must match the JTAG/COP debug path - errors silently boot from a non-existent flash. (3) The CPM interrupt requests (IRQ0-7) must be assigned to non-overlapping priority levels, or you will see seemingly random watchdog resets. (4) The IIC master on the second I2C bus is shared with the JTAG pins - if IIC2 is enabled, disable the JTAG TCK/TMS termination or both buses will fight.
규정 준수 정보
RoHS / lead-free indicated by part suffix 'C' per NXP datasheet. AEC-Q100 is not applicable to industrial-networking MPU. Reach and conflict-mineral compliance declared on the NXP product page; halogen-free status not explicitly stated in the verified web data.
