MPC8313VRADDB - PowerPC e300c3 MPU 267MHz 516-BGA | NXP
Référence : MPC8313VRADDB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.8 | $3 180,00 |
| 500 | $28.4 | $14 200,00 |
| 1 000 | $25.1 | $25 100,00 |
MPC8313VRADDB Présentation
What is an MPU (Microprocessor Unit)? An MPU is an integrated circuit that contains the central processing unit of a computer system. The MPC83xx family from NXP extends the PowerPC architecture into communications and embedded control, occupying the hierarchy: PowerPC -> RISC processor -> 32-bit MPU -> embedded microprocessor -> semiconductor. PowerPC, originally developed by IBM and Freescale (now NXP), is widely used in routers, storage, and aerospace due to its deterministic performance and mature toolchain.
Key features include a single e300c3 core with 32-bit data path, 267MHz core clock, integrated dual Gigabit Ethernet MACs (via the QUICC Engine), DDR1/DDR2 memory controller, PCI Express interface, and a 516-TEPBGA package. The 'VR' designator in the part number denotes a specific speed grade (266-333 MHz) and feature set within the MPC8313 family. The 'ADDB' suffix indicates the temperature grade (typically -40C to +105C extended industrial) and encryption-disabled variant per NXP's ordering scheme.
The MPC8313 architecture combines a PowerPC e300c3 core with NXP's QUICC Engine technology, providing hardware-accelerated networking protocol handling. This heterogeneous approach offloads packet processing from the CPU, enabling wire-speed routing and bridging without external co-processors. The device integrates a high-bandwidth DDR memory controller, multiple serial interfaces, USB 2.0, and security engines, allowing designers to build complete networking appliances from a single chip.
Typical applications include industrial routers, network attached storage (NAS), DSL/cable modems, smart grid gateways, and embedded industrial control. The integrated QUICC Engine and dual Gigabit Ethernet make it particularly suited for branch-office routers and managed switches requiring wire-speed packet processing.
When designing with this device, ensure the 27x27 mm BGA footprint has adequate PCB layer count (typically 8+ layers) and that thermal vias are placed beneath the exposed die area. Power sequencing of the core and I/O voltage rails must follow NXP's reference design; failure to do so can cause latch-up. Programming the QUICC Engine firmware requires NXP's SDK or third-party RTOS support.
This page synthesizes distributor availability, drop-in alternatives from the same MPC8313 family, and PCB thermal guidance not found in the standalone datasheet.
Alternatives de remplacement direct pour MPC8313VRADDB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8313VRADDB (même facteur de forme et même empreinte) — différant par USB, Memory Controller, RoHS Status, Core Architecture, Ethernet.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8313CVRADDB
✅ Remplacement direct✓ En stock
$24.6 / unité
Voir la fiche technique →MPC8313VRAGDB
✅ Remplacement direct✓ En stock
$51.75 / unité
Voir la fiche technique →MPC8313ECVRAFFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313EVRAFFB
✅ Remplacement direct✓ En stock
$42.85 / unité
Voir la fiche technique →MPC8313VRAGDC
✅ Remplacement direct✓ En stock
$32.4 / unité
Voir la fiche technique →MPC8378VRALGA
✅ Remplacement direct✓ En stock
$23.5 / unité
Voir la fiche technique →MPC8313VRADDB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. (formerly Freescale) |
| Part Series | MPC8313 / PowerQUICC II Pro |
| Core | PowerPC e300c3 |
| Number of Cores | 1 |
| Largeur du bus de données | 32 bit |
| Core Clock Speed | 267 MHz |
| Instruction Set Architecture | PowerPC |
| Boîtier | 516-TEPBGA (27x27 mm) |
| Type de montage | Surface Mount (BGA) |
| Memory Controller | DDR1/DDR2 SDRAM |
| Integrated Ethernet | Dual Gigabit Ethernet MACs (via QUICC Engine) |
| USB | USB 2.0 |
| PCI Express | PCIe interface present |
| Encryption | Without encryption ('VRADDB' suffix) |
| Statut RoHS | Details vary by distributor listing |
Guide de configuration des broches du MPC8313VRADDB 516-tepbga (27x27 mm)
Configuration des broches du MPC8313VRADDB (boîtier 516-tepbga (27x27 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8313VRADDB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8313VRADDB convient pour 7 applications: Industrial Branch-Office Router, Network Attached Storage (NAS) Controller, DSL / Cable Modem Residential Gateway, Smart Grid / Substation Gateway, Industrial Serial-to-Ethernet Gateway, Embedded Print Server / Imaging Appliance, Automotive Telematics / Fleet Gateway (Non-Safety).
Industrial Branch-Office Router
The MPC8313VRADDB is purpose-built for industrial branch-office routers thanks to its integrated dual Gigabit Ethernet MACs and the QUICC Engine packet offload hardware. At 267 MHz the e300c3 core handles routing table lookups (BGP/OSPF) and management-plane tasks while the QUICC Engine processes wire-speed IPv4 packet forwarding, classification, and policing. The device's industrial temperature grade (-40C to +105C junction per the 'ADDB' suffix) supports factory-floor and outdoor cabinet deployments. Reference designs from NXP show typical designs achieving 1+ Gbps of forwarding throughput. Place two 10/100/1000 PHYs (e.g., Vitesse or Marvell) on the RGMII interfaces and add 64 MB-256 MB of DDR2 for routing tables. The QUICC Engine firmware is supplied as a binary blob from NXP's SDK, with optional source for OEM customization.
Recommandé
Network Attached Storage (NAS) Controller
The MPC8313VRADDB's integrated DDR1/DDR2 controller and PCIe interface make it suitable as a low-power NAS controller SoC. The e300c3 core at 267 MHz runs embedded Linux distributions such as OpenWrt or custom PowerPC builds to manage SATA drives attached via PCIe-to-SATA bridges (e.g., Silicon Image SiI3132 or Marvell 88SX7042). The QUICC Engine's DMA channels accelerate block I/O. The 516-TEPBGA package provides adequate thermal dissipation for fanless enclosures with proper PCB thermal design. For RAID functionality, attach an external RAID controller over PCIe. Boot typically uses a small SPI NOR flash (8-32 MB) for the bootloader and a SATA DOM for the root filesystem. Power consumption is approximately 3-5W under typical NAS workloads, enabling compact passive-cooled designs.
Recommandé
DSL / Cable Modem Residential Gateway
The MPC8313VRADDB integrates the building blocks of a DSL or cable modem residential gateway: PowerPC core for routing/NAT, QUICC Engine for QoS classification, USB 2.0 for printer/storage sharing, and dual Gigabit Ethernet for LAN. The 267 MHz core is sufficient to run an embedded Linux stack with iptables/NAT and a simple web management UI. The 'VR' speed grade and industrial temperature suffix support outdoor installation in customer premises equipment (CPE). Reference designs pair the MPC8313 with a separate DSL PHY (Broadcom or Ikanos) or DOCSIS MAC chip via the local bus or SPI. Typical designs deliver 100 Mbps NAT throughput with hardware-accelerated QoS queues for IPTV traffic.
Recommandé
Smart Grid / Substation Gateway
The MPC8313VRADDB's industrial temperature grade and PowerPC determinism suit smart grid substation gateways requiring IEC 61850 protocol support. The e300c3 core runs real-time Linux or RTOS to aggregate DNP3 / IEC 61850 / Modbus traffic from field devices over Ethernet and serial interfaces. The QUICC Engine offloads GOOSE message processing, while the integrated DDR2 controller handles large data buffers for substation event logs. The 516-TEPBGA package with proper thermal vias supports convection-cooled substation rack mounting. Security features can be enabled by migrating to the MPC8313E variant. NXP provides a power-line communication (PLC) software stack that pairs with companion physical-layer transceivers.
Recommandé
Industrial Serial-to-Ethernet Gateway
The MPC8313VRADDB's multiple serial interfaces and dual Gigabit Ethernet make it a fit for industrial serial-to-Ethernet protocol gateways (Modbus TCP, EtherNet/IP, PROFINET). The PowerPC e300c3 core at 267 MHz runs protocol conversion stacks while the QUICC Engine handles TCP/IP offload, freeing CPU for application logic. The industrial temperature grade (-40C to +105C per the 'ADDB' suffix) supports factory floor deployment. Reference designs typically include 4-8 UART channels via external multiplexers, plus RS-485 transceivers. The device's low power consumption allows fanless DIN-rail mounting. Open-source protocol stacks are available from the PowerPC community, and NXP provides an MQX RTOS BSP for deterministic real-time behavior.
Recommandé
Embedded Print Server / Imaging Appliance
The MPC8313VRADDB's USB 2.0, dual Gigabit Ethernet, and 267 MHz PowerPC core suit embedded print server and imaging appliance designs. The e300c3 core handles print job parsing (PostScript / PCL / PDF rasterization), while the QUICC Engine accelerates network traffic and the DDR2 controller buffers image data. The 516-TEPBGA package supports compact designs where the MPU connects to a discrete ASIC for image processing over the local bus or PCIe. Industrial temperature grade variants enable commercial-grade printer deployments. Power consumption typically 3-7W with active USB traffic, enabling passive cooling. Reference designs from NXP include the necessary bootloader for network boot via PXE for centralized image management.
Recommandé
Automotive Telematics / Fleet Gateway (Non-Safety)
While not AEC-Q100 qualified, the MPC8313VRADDB can serve non-safety automotive telematics applications where industrial temperature grade and PowerPC determinism are needed, such as fleet management gateways and in-vehicle infotainment adjunct processors. The dual Gigabit Ethernet supports back-haul and in-vehicle network bridging; USB 2.0 interfaces with cellular modems and Wi-Fi chipsets; DDR2 provides headroom for telemetry buffering. Operating temperature per the 'ADDB' suffix supports under-dash mounting in commercial vehicles. Designers should consult NXP's automotive-grade catalog (QorIQ LS1021A family) for safety-critical applications requiring AEC-Q100 qualification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8313VRADDB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8313CVRADDB | MPC8313VRAGDB | MPC8313ECVRAFFB | MPC8313EVRAFFB | MPC8378VRALGA |
|---|---|---|---|---|---|---|
| Brand | NXP | NXP | NXP | NXP | NXP | NXP |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Core Architecture | PowerPC e300c3, 32-bit | PowerPC e300c3, 32-bit | PowerPC e300c3, 32-bit | PowerPC e300c3, 32-bit | PowerPC e300c3, 32-bit | PowerPC e300c4, 32-bit |
| Encryption Engine | Without encryption (VR suffix) | Without encryption | Without encryption | With encryption (E suffix) | With encryption (E suffix) | Without encryption |
| Gigabit Ethernet MACs | 2 (via QUICC Engine) | 2 (via QUICC Engine) | 2 (via QUICC Engine) | 2 (via QUICC Engine) | 2 (via QUICC Engine) | 2 (via QUICC Engine) |
| Memory Controller | DDR1/DDR2 SDRAM | DDR1/DDR2 SDRAM | DDR1/DDR2 SDRAM | DDR1/DDR2 SDRAM | DDR1/DDR2 SDRAM | DDR1/DDR2 SDRAM (extended) |
| Temperature Grade | Industrial (-40C to +105C junction per ADDB suffix) | Commercial (0C to +70C) | Industrial (per suffix) | Industrial (per FFB suffix) | Industrial (per FFB suffix) | Industrial (per LGA suffix) |
Principaux différenciateurs
- Industrial temperature grade with encryption-disabled (vs MPC8313CVRADDB)
- Balanced 267 MHz core clock for power/performance trade-off (vs MPC8313VRAGDB)
- Integrated QUICC Engine packet offload (vs MPC8378VRALGA)
Notes de conception
The 516-TEPBGA package requires careful thermal management. Place a thermal via array (0.3 mm pitch, 0.2 mm drill) directly under the exposed die area to conduct heat to inner ground planes. Estimated: at typical 4W power dissipation and 1 oz copper on both sides of an 8-layer PCB, theta_JA is approximately 15-20 C/W, giving 60-80C rise above ambient. For fanless industrial enclosures, add a 1-2 mm copper coin or external heatsink. Junction temperature must remain below 105C for the industrial temperature grade per the 'ADDB' suffix.
The 27x27 mm BGA with 1.0 mm ball pitch requires an 8-layer PCB minimum, with microvia-in-pad or laser-drilled stacked vias recommended for breakout. Trace width to escape 4-row deep BGA should be 0.075 mm (3 mil) outer / 0.1 mm inner with 0.4 mm via pitch. Use the NXP reference design layout files (RDQ) as a starting point - hand routing without impedance control will fail DDR2 timing. Differential pairs for PCIe must be length-matched within 0.13 mm. Per JEDEC MO-192, the BGA substrate can absorb moisture; bake at 125C for 24 hours prior to reflow if the package has been exposed for >72 hours.
Power sequencing must follow the NXP reference design exactly: the core voltage (typically 1.0V or 1.2V) must be established BEFORE or simultaneously with the I/O voltage (typically 3.3V), with a maximum delta of 200 mV during ramp. Reverse sequencing can trigger latch-up and destroy the device. The DDR2 reference voltage (VREF) must track VTT to avoid timing violations - use a dedicated reference divider, not a simple resistor pair. JTAG pins TMS, TCK, TDI, TDO must be pulled to known states during reset to prevent the BSCAN from holding the device in test mode; add 10 kohm pull-ups to TDI/TMS and series to TCK.
The DDR2 controller pins drive very fast edges (typical slew rate 1.5 V/ns). Keep trace lengths matched within +/- 3 KB between byte lanes and +/- 6 KB within a byte lane. Place the DDR2 chip(s) within 50 mm of the MPC8313 to keep reflections manageable without on-die termination (ODT). For source-synchronous interfaces (PCIe, RGMII), maintain 100 ohm differential impedance +/- 10% and 50 ohm single-ended. Use IBIS models from NXP for simulation - SPICE-only models are not published. Per JEDEC JESD8-15, DDR2 VTT termination must be a single regulator per byte lane; do not share VTT across bytes.
Informations de conformité
RoHS compliance indicated by 'NB' ordering code in Freescale/NXP legacy scheme (per Octopart listing snippet referring to 'NOPB PBGA W/O ENCR'). For automotive applications requiring AEC-Q100, NXP's automotive-grade catalog (QorIQ LS1021A family) should be evaluated. Reach SVHC and conflict mineral declarations should be requested directly from NXP via IPC-1752A material declaration.