MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP
Référence : MPC8313EVRAFFB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $65.42 | $65,42 |
| 10 | $58.1 | $581,00 |
| 100 | $51.55 | $5 155,00 |
| 500 | $47.2 | $23 600,00 |
| 1 000 | $42.85 | $42 850,00 |
MPC8313EVRAFFB Présentation
As a microprocessor (MPU), the MPC8313EVRAFFB sits within the broader taxonomy of: MPU -> embedded processor -> system-on-chip class device -> semiconductor. The PowerQUICC II Pro architecture integrates a CPU core, memory controller, communications peripherals, and optional security engine on a single die, eliminating the need for a separate companion chip. This integration reduces BOM cost, board space, and power consumption versus discrete multi-chip implementations for similar workloads.
Key differentiating features include hardware-accelerated encryption (the trailing 'E' designation indicates the integrated security engine supporting DES, 3DES, AES, and IPsec), dual 10/100/1000 Mbps Ethernet controllers with built-in MAC, a DDR1/DDR2 memory controller supporting up to 256 MB of addressable memory, PCI Express interface, USB 2.0 high-speed host/device, and a comprehensive set of timers, GPIO, and serial interfaces. The 516-TEPBGA package combines high I/O density with a thermal pad that enables efficient heat removal.
Typical applications include SOHO/SMB routers, switches, network-attached storage (NAS), industrial gateways, secure VPN appliances, and print/image processing controllers. The integrated encryption engine makes the 'E' variant particularly well suited to IPsec VPN gateways and SSL/TLS termination in low-to-mid throughput embedded networking equipment.
When designing with this MPU, designers must provision a 1.0 V core supply, 1.8 V or 2.5 V DDR2 reference, 3.3 V I/O supply, and a 33.33 MHz system reference clock; a JTAG debug header for boundary-scan and code development is also recommended. The exposed die pad requires a well-designed thermal via array under the package to ensure junction temperature stays within the operating range at full 333 MHz operation.
This page synthesizes distributor availability, drop-in alternatives within the same MPC8313E family, application contexts, and practical layout notes not found in a single manufacturer datasheet view.
Alternatives de remplacement direct pour MPC8313EVRAFFB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8313EVRAFFB (même facteur de forme et même empreinte) — différant par Memory Controller, RoHS Status, USB, Manufacturer, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8313EZQAFFB
✅ Remplacement direct✓ En stock
$36.9 / unité
Voir la fiche technique →MPC8313CZQAFFB
✅ Remplacement direct✓ En stock
$16.19 / unité
Voir la fiche technique →MPC8313CVRAFFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313EVRAGDB
✅ Remplacement direct✓ En stock
$17.9 / unité
Voir la fiche technique →MPC8313EZQAJFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8313EVRAFFB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Status | Active |
| Core Architecture | PowerPC e300c3 |
| Processor Series | MPC83xx (PowerQUICC II Pro) |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Maximum CPU Frequency | 333 MHz |
| Package Type | 516-TEPBGA (27 mm x 27 mm) with exposed die pad |
| Type de montage | Surface Mount (BGA) |
| Encryption Engine | Yes (AES, DES, 3DES, IPsec) |
| Memory Controller | DDR1/DDR2 (up to 256 MB addressable) |
| RoHS | Details per manufacturer (status not confirmed by web data snippet) |
| Supplier Device Package | 516-TEPBGA |
Guide de configuration des broches du MPC8313EVRAFFB 516-tepbga
Configuration des broches du MPC8313EVRAFFB (boîtier 516-tepbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8313EVRAFFB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8313EVRAFFB convient pour 6 applications: SOHO/SMB Router and Gateway, Secure VPN/SSL Appliance, Industrial Control and Modbus Gateway, Network-Attached Storage (NAS) Controller, Print and Image Processing Controller, Smart Grid / Energy Management Gateway.
SOHO/SMB Router and Gateway
The MPC8313EVRAFFB targets small-to-medium business and home-office routers, combining a 333 MHz PowerPC e300c3 core, dual Gigabit Ethernet MACs, and the integrated IPsec/AES encryption engine on a single die. This integration delivers VPN throughput of approximately 200-400 Mbps for AES-256 IPsec tunnels - sufficient for branch-office interconnects - without off-chip crypto silicon. The DDR2 controller supports up to 256 MB of addressable RAM, fitting mainstream Linux router distributions (e.g., OpenWrt, VyOS) and SSL VPN stacks. Designers route one MAC to the WAN PHY, the second to a multi-port LAN switch, and the PCIe lane to a Wi-Fi or LTE modem controller, achieving a bill of materials around $40-60 per board. The 516-TEPBGA 27x27 mm package fits cleanly inside fanless router chassis with chassis-mounted thermal dissipation via the exposed die pad.
Recommandé
Secure VPN/SSL Appliance
The integrated hardware IPsec engine of the MPC8313EVRAFFB is the dominant reason for choosing this part over the non-E variant in secure VPN appliances. The accelerator supports AES-128/192/256, DES/3DES, and IPsec ESP/SR at line rates up to several hundred Mbps, while leaving the e300c3 core free to manage routing tables, firewall policy, and management-plane HTTPS. Typical designs run a hardened Linux (e.g., OpenWrt or a vendor BSD derivative) on top of the DDR2 memory, with the encryption engine accessed through a Linux kernel crypto offload driver. The 333 MHz core is overkill for housekeeping but provides headroom for DPI, intrusion-prevention signatures, or VoIP signaling during light VPN load. The 516-TEPBGA package delivers the I/O density needed to keep PCI Express, USB 2.0, and dual GbE MAC interfaces on a single 4-layer board.
Recommandé
Industrial Control and Modbus Gateway
For industrial automation backbones, the MPC8313EVRAFFB serves as a serial-to-Ethernet gateway controller that converts RS-485/RTU Modbus or CANopen traffic to Modbus TCP or OPC-UA. The 333 MHz e300c3 core executes a deterministic real-time Linux or a bare-metal scheduler while the integrated Ethernet MACs bridge fieldbus segments to factory-level SCADA servers. The DDR2 controller supports moderate messaging buffers and the on-chip timers deliver accurate sub-millisecond scheduling needed for industrial control loops. Hardware encryption on the 'E' variant lets the same gateway manage secure VPN links back to a plant MES without adding a separate security processor. The wide operating range characteristic of PowerQUICC II Pro parts suits outdoor control cabinets and substation environments.
Recommandé
Network-Attached Storage (NAS) Controller
NAS appliances for SOHO/small-business use the MPC8313EVRAFFB as their central processor. The 333 MHz core plus DDR2 controller drives SMB/NFS file services and the dual GbE MACs support link aggregation to upstream switches. SATA connectivity through an external PCIe SATA controller handles 2-4 hot-swap drive bays, while the on-chip USB 2.0 high-speed interface provides front-panel copy-to-USB ports. The encryption engine of the 'E' variant is used for AES-256 disk-volume encryption, offloading CPU overhead during encrypted read/write sequences. The exposed die pad of the 516-TEPBGA package handles sustained ~3-5 W thermal envelope comfortably in a 1U chassis.
Recommandé
Print and Image Processing Controller
The PowerQUICC II Pro MPC8313EVRAFFB has historically been adopted in mid-range office multifunction printers and document image processing platforms. The 333 MHz core executes PostScript/PDF interpreters and raster image processing (RIP) pipelines with acceptable throughput at 20-30 ppm. The PCI Express lane pairs with a hardware JPEG/MJB2 codec ASIC for scan-to-email functions, while DDR2 holds the image frame buffer. The encryption engine provides secure boot and disk-encryption for confidential-print jobs in regulated environments (HIPAA or finance workflows). The high pin count of the 516-TEPBGA gives connectivity headroom for dual USB hosts, a parallel RGB LCD panel link, and several UARTs for engine and scanner control.
Recommandé
Smart Grid / Energy Management Gateway
Smart energy gateways and IEC 61850 substation controllers use the MPC8313EVRAFFB for its combination of deterministic CPU performance, multiple Ethernet interfaces, and integrated hardware security. The 333 MHz core runs the IEC 61850/GOOSE protocol stack and DLMS/COSEM metering handlers. Hardware AES-256 acceleration on the encryption engine secures PLC (Power Line Communication) channels and protects metering telemetry during transport to utility backhaul networks. The DDR2 controller holds both metering database tables and runtime protocol state. The wide operating temperature envelope typical of PowerQUICC II Pro devices allows deployment in unprotected outdoor metering and substation cabinets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8313EVRAFFB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8313EZQAFFB | MPC8313CZQAFFB | MPC8313CVRAFFB | MPC8313EVRAGDB | MPC8313EZQAJFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Core Architecture | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| Maximum CPU Frequency | 333 MHz | 333 MHz | 333 MHz | 333 MHz | 333 MHz | 333 MHz |
| Encryption Engine (AES/3DES/IPsec) | Yes | Yes | No (omitted) | No (omitted) | Yes | Yes |
| Memory Controller | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) | DDR1/DDR2 (up to 256 MB) |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| External Reference Clock | 33.33 MHz | 33.33 MHz | 33.33 MHz | 33.33 MHz | 33.33 MHz | 33.33 MHz |
Principaux différenciateurs
- Integrated hardware encryption engine (vs MPC8313CZQAFFB)
- Industry-standard 516-TEPBGA 27x27 mm package (vs MPC8321VRAFDC)
- Lead-free / RoHS-compatible terminal finishes available (vs MPC8313EVRAGDB)
Notes de conception
The MPC8313EVRAFFB requires three DC rails: 1.0 V (VDD) for the core, 1.8 V or 2.5 V for the DDR2 memory controller/interface reference (VDDDR), and 3.3 V for I/O. The 1.0 V core rail must be sequenced to come up last (1.0 V after 3.3 V) or simultaneously with the DDR2 rail if desired. Use a multi-rail PMIC such as NXP's MMPF0100 family or a discrete solution with sequencing supervisors. Estimated: at full 333 MHz operation with all peripherals active, typical power dissipation is in the 1.5-2.5 W range, well within the 516-TEPBGA junction envelope when the exposed die pad carries a 6x6 thermal via array stitching to inner ground planes.
For the 516-ball TE-PBGA at 1.27 mm pitch, ball land pads should be non-solder-mask-defined (NSMD) for best reliability. The exposed die pad must carry at least a 6x6 array of 0.3 mm thermal vias on a 1.0-1.2 mm pitch, stitched to internal copper ground planes. Use 0.8-1.2 oz copper on outer layers to handle the GbE and DDR2 switching currents. Place the 33.33 MHz reference clock oscillator within 250 mm of the XTAL/EXTCLK ball pair and guard-trace both sides of the differential clock traces on the top-layer microstrip. Match DDR2 address/command trace lengths within 50 ps, and DQ/DQS within 25 ps; failure to do this typically causes bit-error rates in the 1e-6 to 1e-9 range that pass basic POST but fail sustained file transfers.
Estimate: The dual Gigabit Ethernet MACs (eTSEC) require their PHY interfaces routed as 50 ohm controlled-impedance pairs with via stubs kept under 0.15 mm using back-drilling where the board thickness exceeds 1.6 mm. The PCI Express lane uses the standard 85 ohm differential impedance; keep the length below 80 mm and place the AC-coupling caps exactly mid-trace. The USB 2.0 high-speed D+/D- pair must also be 90 ohm differential, matched within 150 ps; a common-mode choke is recommended at the connector to suppress conducted emissions to EN 55022/CISPR 22 Class B.
Three common pitfalls bite first-time designers of this part: (1) omitting the JTAG TAP at the boundary-scan header, which makes prototype bring-up blind - always bring TMS, TCK, TDI, TDO, and TRST to a 14-pin IDC header; (2) skipping the e300 watchdog window, which can brick the board during bootloader failures - assert HRESET via the reset configuration word; (3) under-provisioning the DDR2 decoupling (place one 0402 0.1 uF X7R cap per VDD pin within 1 mm). Each of these is a documented power-sequencing or layout miss that is hard to recover from without a respin.
Estimated: At 333 MHz with both Ethernet MACs active, the junction temperature rise above ambient is approximately 15-20 C on a 4-layer board with the recommended thermal via array under the exposed die pad. In fanless industrial enclosures with 50 C ambient, the junction stays well below Tj_max. For sealed enclosures without airflow, attach a 25 mm x 25 mm aluminum spreader to the exposed die pad using a 0.25 W/mK gap pad - this adds 4-6 C margin that often determines the difference between industrial-grade and commercial-grade qualification.
Informations de conformité
RoHS status was listed as 'Details' (status not confirmed) in the Freescale/NXP datasheet snippet. AEC-Q100 is not applicable - this MPU is not qualified to automotive standards. For exact lead-free / halogen-free / REACH compliance, request a RoHS declaration letter from NXP via your authorized distributor; the -J suffix on the EZQAJFB variant indicates lead-free terminals, but this should be confirmed against the manufacturer's certificate of conformance for production orders.
